CN106810820A - A kind of thermosetting alkyl polyols glycidyl ether resin composition and its application - Google Patents
A kind of thermosetting alkyl polyols glycidyl ether resin composition and its application Download PDFInfo
- Publication number
- CN106810820A CN106810820A CN201510882430.5A CN201510882430A CN106810820A CN 106810820 A CN106810820 A CN 106810820A CN 201510882430 A CN201510882430 A CN 201510882430A CN 106810820 A CN106810820 A CN 106810820A
- Authority
- CN
- China
- Prior art keywords
- resin
- anhydride
- epoxy resin
- alkyl polyols
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005862 polyol Polymers 0.000 title claims abstract description 56
- 125000000217 alkyl group Chemical group 0.000 title claims abstract description 50
- 150000003077 polyols Chemical class 0.000 title claims abstract description 48
- 239000011342 resin composition Substances 0.000 title claims abstract description 41
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 title claims abstract description 33
- 229920001187 thermosetting polymer Polymers 0.000 title claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 73
- 239000011347 resin Substances 0.000 claims abstract description 73
- 239000000203 mixture Substances 0.000 claims abstract description 65
- 239000003822 epoxy resin Substances 0.000 claims abstract description 62
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 62
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 28
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000011159 matrix material Substances 0.000 claims abstract description 25
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- -1 methylphenol phenol aldehyde Chemical class 0.000 claims description 53
- 239000002904 solvent Substances 0.000 claims description 37
- 239000003795 chemical substances by application Substances 0.000 claims description 27
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 claims description 24
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 21
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 19
- 239000003063 flame retardant Substances 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 150000002148 esters Chemical class 0.000 claims description 14
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 13
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 12
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 11
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical group CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 claims description 10
- 239000004305 biphenyl Substances 0.000 claims description 10
- 235000010290 biphenyl Nutrition 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 10
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 10
- 239000000347 magnesium hydroxide Substances 0.000 claims description 10
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 9
- 229910019142 PO4 Inorganic materials 0.000 claims description 9
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 150000008064 anhydrides Chemical group 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- HECLRDQVFMWTQS-UHFFFAOYSA-N Dicyclopentadiene Chemical compound C1C2C3CC=CC3C1C=C2 HECLRDQVFMWTQS-UHFFFAOYSA-N 0.000 claims description 6
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 claims description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 6
- UQSHIDHNLKIYGN-UHFFFAOYSA-N diphenoxyphosphoryl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OP(=O)(OC=1C=CC=CC=1)OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 UQSHIDHNLKIYGN-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 229960000549 4-dimethylaminophenol Drugs 0.000 claims description 5
- 239000005995 Aluminium silicate Substances 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 5
- 150000008065 acid anhydrides Chemical class 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 5
- 235000012211 aluminium silicate Nutrition 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 5
- 239000010452 phosphate Substances 0.000 claims description 5
- 150000003003 phosphines Chemical class 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 4
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- WFDIJRYMOXRFFG-UHFFFAOYSA-N acetic acid anhydride Natural products CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 claims description 4
- 125000002723 alicyclic group Chemical group 0.000 claims description 4
- 229940106691 bisphenol a Drugs 0.000 claims description 4
- 229910001593 boehmite Inorganic materials 0.000 claims description 4
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims description 4
- 238000002485 combustion reaction Methods 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 4
- RPHYLOMQFAGWCD-UHFFFAOYSA-N ethane;phenol Chemical compound CC.OC1=CC=CC=C1 RPHYLOMQFAGWCD-UHFFFAOYSA-N 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 4
- FAHBNUUHRFUEAI-UHFFFAOYSA-M hydroxidooxidoaluminium Chemical compound O[Al]=O FAHBNUUHRFUEAI-UHFFFAOYSA-M 0.000 claims description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 4
- 239000003112 inhibitor Substances 0.000 claims description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 4
- 239000004843 novolac epoxy resin Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 150000002989 phenols Chemical class 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 150000003222 pyridines Chemical class 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 claims description 4
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- ZSTLPJLUQNQBDQ-UHFFFAOYSA-N azanylidyne(dihydroxy)-$l^{5}-phosphane Chemical compound OP(O)#N ZSTLPJLUQNQBDQ-UHFFFAOYSA-N 0.000 claims description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 3
- 229930195733 hydrocarbon Natural products 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 claims description 2
- HHEHWCIYDICHCG-ODZAUARKSA-N (z)-but-2-enedioic acid;methoxyethene Chemical compound COC=C.OC(=O)\C=C/C(O)=O HHEHWCIYDICHCG-ODZAUARKSA-N 0.000 claims description 2
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 claims description 2
- URJFKQPLLWGDEI-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=[C]N1CC1=CC=CC=C1 URJFKQPLLWGDEI-UHFFFAOYSA-N 0.000 claims description 2
- ICQLQVWXFUWFRI-UHFFFAOYSA-N 2-(2-methylimidazol-1-yl)propanenitrile Chemical class N#CC(C)N1C=CN=C1C ICQLQVWXFUWFRI-UHFFFAOYSA-N 0.000 claims description 2
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 claims description 2
- LEHNQGSPRXHYRT-UHFFFAOYSA-N 2-dodecyl-1h-imidazole Chemical class CCCCCCCCCCCCC1=NC=CN1 LEHNQGSPRXHYRT-UHFFFAOYSA-N 0.000 claims description 2
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 claims description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 2
- 150000004941 2-phenylimidazoles Chemical class 0.000 claims description 2
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 claims description 2
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical class CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 2
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 claims description 2
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- IWBUYGUPYWKAMK-UHFFFAOYSA-N [AlH3].[N] Chemical compound [AlH3].[N] IWBUYGUPYWKAMK-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzenetetracarboxylic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 claims description 2
- 239000012965 benzophenone Substances 0.000 claims description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 2
- ZCILODAAHLISPY-UHFFFAOYSA-N biphenyl ether Natural products C1=C(CC=C)C(O)=CC(OC=2C(=CC(CC=C)=CC=2)O)=C1 ZCILODAAHLISPY-UHFFFAOYSA-N 0.000 claims description 2
- 235000012241 calcium silicate Nutrition 0.000 claims description 2
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 2
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 claims description 2
- OQRWAMBQGTYSRD-UHFFFAOYSA-N dipotassium;oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[K+].[K+].[Ti+4].[Ti+4].[Ti+4].[Ti+4] OQRWAMBQGTYSRD-UHFFFAOYSA-N 0.000 claims description 2
- 239000000428 dust Substances 0.000 claims description 2
- 229910052731 fluorine Inorganic materials 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- VANNPISTIUFMLH-UHFFFAOYSA-N glutaric anhydride Chemical compound O=C1CCCC(=O)O1 VANNPISTIUFMLH-UHFFFAOYSA-N 0.000 claims description 2
- MUTGBJKUEZFXGO-UHFFFAOYSA-N hexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21 MUTGBJKUEZFXGO-UHFFFAOYSA-N 0.000 claims description 2
- 229910001701 hydrotalcite Inorganic materials 0.000 claims description 2
- 229960001545 hydrotalcite Drugs 0.000 claims description 2
- 150000002460 imidazoles Chemical group 0.000 claims description 2
- 239000000395 magnesium oxide Substances 0.000 claims description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052863 mullite Inorganic materials 0.000 claims description 2
- 125000001624 naphthyl group Chemical group 0.000 claims description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 2
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 claims description 2
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 claims description 2
- 239000010695 polyglycol Substances 0.000 claims description 2
- 229920000151 polyglycol Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- RINCXYDBBGOEEQ-UHFFFAOYSA-N succinic anhydride Chemical compound O=C1CCC(=O)O1 RINCXYDBBGOEEQ-UHFFFAOYSA-N 0.000 claims description 2
- 229940014800 succinic anhydride Drugs 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 claims description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 8
- 238000002360 preparation method Methods 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 33
- 238000003475 lamination Methods 0.000 description 31
- 239000003292 glue Substances 0.000 description 29
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 22
- 239000004744 fabric Substances 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 239000011889 copper foil Substances 0.000 description 17
- 238000007711 solidification Methods 0.000 description 16
- 230000008023 solidification Effects 0.000 description 16
- 239000007787 solid Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000123 paper Substances 0.000 description 7
- 235000021317 phosphate Nutrition 0.000 description 7
- 239000012779 reinforcing material Substances 0.000 description 7
- 239000012745 toughening agent Substances 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 4
- 229920006380 polyphenylene oxide Polymers 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical class C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 150000001335 aliphatic alkanes Chemical group 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 125000006267 biphenyl group Chemical group 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 150000003009 phosphonic acids Chemical class 0.000 description 3
- 238000002411 thermogravimetry Methods 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- CYXGBTZYTXLVDN-UHFFFAOYSA-N 1-octoxyphosphonoyloxyoctane Chemical class CCCCCCCCOP(=O)OCCCCCCCC CYXGBTZYTXLVDN-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 description 1
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical class C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical class C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- 125000000143 2-carboxyethyl group Chemical group [H]OC(=O)C([H])([H])C([H])([H])* 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- FDFUDZVGGRIXEX-UHFFFAOYSA-N 2-methyl-1-(2-methylpropoxyphosphonoyloxy)propane Chemical class CC(C)COP(=O)OCC(C)C FDFUDZVGGRIXEX-UHFFFAOYSA-N 0.000 description 1
- HLMXUWAUCZMWOG-UHFFFAOYSA-N 2-methyl-2-[(2-methylpropan-2-yl)oxyphosphonoyloxy]propane Chemical class CC(C)(C)OP(=O)OC(C)(C)C HLMXUWAUCZMWOG-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 241001614291 Anoplistes Species 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- RONCINUIHMGWQL-UHFFFAOYSA-N CCCCCOP(=O)OCCCCC Chemical class CCCCCOP(=O)OCCCCC RONCINUIHMGWQL-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- HZCDANOFLILNSA-UHFFFAOYSA-N Dimethyl hydrogen phosphite Chemical class COP(=O)OC HZCDANOFLILNSA-UHFFFAOYSA-N 0.000 description 1
- 241000790917 Dioxys <bee> Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910003978 SiClx Inorganic materials 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PTOIEUWJQMEUQM-UHFFFAOYSA-N [2-(aminomethyl)phenyl]phosphonic acid Chemical class NCC1=CC=CC=C1P(O)(O)=O PTOIEUWJQMEUQM-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000010 aprotic solvent Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- BLKXLEPPVDUHBY-UHFFFAOYSA-N bis(propan-2-yl) phosphonate Chemical class CC(C)OP(=O)OC(C)C BLKXLEPPVDUHBY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- DLIJPAHLBJIQHE-UHFFFAOYSA-N butylphosphane Chemical compound CCCCP DLIJPAHLBJIQHE-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- NFJPGAKRJKLOJK-UHFFFAOYSA-N chembl1901631 Chemical class CCCCOP(=O)OCCCC NFJPGAKRJKLOJK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- BQWISXYMCKRFKS-UHFFFAOYSA-N cyclobutylphosphane Chemical compound PC1CCC1 BQWISXYMCKRFKS-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- MJUJXFBTEFXVKU-UHFFFAOYSA-N diethyl phosphonate Chemical class CCOP(=O)OCC MJUJXFBTEFXVKU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- FFXFVWSZUMGPNE-UHFFFAOYSA-N ethoxymethylphosphonic acid Chemical compound CCOCP(O)(O)=O FFXFVWSZUMGPNE-UHFFFAOYSA-N 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical class CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- GTTBQSNGUYHPNK-UHFFFAOYSA-N hydroxymethylphosphonic acid Chemical class OCP(O)(O)=O GTTBQSNGUYHPNK-UHFFFAOYSA-N 0.000 description 1
- 238000005213 imbibition Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- MFGCWSYRYXMYKY-UHFFFAOYSA-N methoxymethylphosphonic acid Chemical compound COCP(O)(O)=O MFGCWSYRYXMYKY-UHFFFAOYSA-N 0.000 description 1
- YACKEPLHDIMKIO-UHFFFAOYSA-N methylphosphonic acid Chemical compound CP(O)(O)=O YACKEPLHDIMKIO-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical compound [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- CDXVUROVRIFQMV-UHFFFAOYSA-N oxo(diphenoxy)phosphanium Chemical compound C=1C=CC=CC=1O[P+](=O)OC1=CC=CC=C1 CDXVUROVRIFQMV-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000036314 physical performance Effects 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- ATLPLEZDTSBZQG-UHFFFAOYSA-N propan-2-ylphosphonic acid Chemical class CC(C)P(O)(O)=O ATLPLEZDTSBZQG-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000718 radiation-protective agent Substances 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Abstract
The invention provides a kind of thermosetting alkyl polyols glycidyl ether resin composition and its application, the resin combination is using epoxy resin as matrix resin composition, the epoxy resin includes alkyl polyols glycidol ether, and the alkyl polyols glycidol ether shared mass percent in matrix resin composition is 50-100%.Composition of the present invention is used to prepare prepreg, laminate and printed circuit board etc., by using molecular structure of the present invention alkyl polyols glycidol ether structure epoxy resin as matrix resin composition, so that obtained laminate is while preferable hot property and adhesive property is kept, with low-dielectric energy, and preparation cost is low, method is simple, has a extensive future.
Description
Technical field
The invention belongs to composition epoxy resin, it is related to a kind of thermosetting alkyl polyols glycidyl ether resin
Composition and its application.
Background technology
With the leap of the booming and high-frequency transmission technology for being wirelessly transferred product, to the dielectric properties of material
The material of proposition requirement higher, existing epoxy resin and phenolic resin systems cannot meet advanced application,
The requirement of high frequency printed circuit board cannot particularly be met.As the substrate of the printed circuit board (PCB) of low-dielectric loss
Material has fluorine-type resin, but this kind of resin high cost, processing are difficult, and is led using military and space flight is confined to
Domain.In addition, polyphenylene oxide resin has good mechanical property and superior dielectric performance, high frequency is increasingly becomed
The first-selected resin material of printed circuit board base board, but, the polyphenylene oxide with double bond is high for manufacturing high frequency at present
Fast sheet material is by radical reaction, it is necessary to special production equipment, and prepreg storage life is short, raw
The regulation of production. art condition is difficult, high cost.
CN101684191B is proposed and is combined using benzoxazine, phenylethylene-maleic anhydride, phosphorus curing agent
Cured epoxy resin can obtain a kind of solidfied material with compared with low-k and dielectric loss, but only
The dielectric properties that material is reduced with phenylethylene-maleic anhydride inevitably occur a lot of other aspects
Problem, influences especially pronounced, because non-pole in phenylethylene-maleic anhydride (SMA) molecular structure to caking property
The styrol structural unit of property reduces the polarity of modified matrix resin, weakens the phase between resin and Copper Foil
Interreaction force；Meanwhile, because substantial amounts of benzene ring structure increases the fragility of resin crosslinks network in SMA,
Have a negative impact to the adhesive property under dynamic condition, so as to reduce between base material and base material and Copper Foil
Adhesion strength.
CN100523081C proposes compound using benzoxazine, phenylethylene-maleic anhydride and other curing agent
Solidifying phosphorous and non-halogen non-phosphate epoxy composite can obtain a kind of with compared with low-k and dielectric loss
Solidfied material, but using phosphorous epoxy resin as matrix resin, although excellent anti-flammability, but phosphorus can be reached
Excessive introducing, extreme influence necessarily is produced to the water imbibition of base material, this will certainly be many to other of sheet material
Performance has negative effect.
Japanese Patent Laid-Open 2003-252958 discloses a kind of biphenyl type epoxy resin and active ester composition,
There is excellent dielectric constant and dielectric loss angle tangent after said composition solidification, but due to using one kind
Difunctional biphenyl epoxy resin, and active ester crosslink density is low, the glass transition temperature that there is solidfied material
The relatively low shortcoming of low, heat resistance.
The A of CN 102689463 disclose a kind of Flexible copper-clad plate, and the Flexible copper-clad plate includes adhesive layer, gathers
Acid imide base material and copper foil layer, according to the weight percentage of raw materials, the adhesive layer is composed of the following components：
Solvent epoxy varnish 30-40 parts, 10-20 parts of solvent type epoxy toughener, 6~25 parts of halogen-free flame retardants,
Antiradiation agent 1-3 parts, additive 1-3 parts, 20-40 parts of solvent I, the in the invention solvent type epoxy
Toughener can be polypropylene glycol glycidol ether, but polypropylene glycol glycidol ether described in the invention is only
Used as toughener, it applies content relatively low.
At present, for the performance of improvement thermosetting epoxy resin composition, major part research is concentrated on from solid
Agent or toughener etc. improve resin combination physical performance, and for by the selection to matrix resin composition and
Transformation is but rarely reported improving composition properties.
Therefore, it is desirable to prepare resin combination by the selection for matrix resin composition in this area,
So that there is low-k and good hot property and caking property by sheet material prepared by the resin combination
Energy.
The content of the invention
In view of the shortcomings of the prior art, shunk it is an object of the invention to provide a kind of thermosetting alkyl polyols
Glycerin ether resin combination and its application.The resin combination can effectively reduce sheet material dielectric constant, while protecting
Hold preferable hot property and adhesive property.
It is that, up to this purpose, the present invention uses following technical scheme：
In a first aspect, the present invention provides a kind of thermosetting alkyl polyols glycidyl ether resin composition, institute
Resin combination is stated using epoxy resin as matrix resin composition, the epoxy resin is comprising with following structure
Alkyl polyols glycidol ether in any one or at least two combination：
Wherein, n=1-10 (such as 2,3,4,5,6,7,8 or 9), m=1-10 (such as 2,3,4,
5th, 6,7,8 or 9), q=2,4 or 6, R=H, CH3- or CH3-CH2-；
The alkyl polyols glycidol ether shared mass percent in matrix resin composition is
50-100%.
In the present invention, the matrix resin composition refer in resin combination as resinous principle, without
It is as toughener, curing agent of resinous principle etc..In the present invention, only using epoxy resin as main body tree
Fat composition, if containing other resins in addition to epoxy resin, described other resins are used as except main body tree
Composition outside fat composition, is used for example as toughener or curing agent etc..
The matrix resin composition of resin combination of the present invention selects alkyl polyols glycidol ether, alkyl
There is alkane segment in polyol shrinkaging glycerin ether, the advantage of its low dielectric can be assigned, and its cost also compares
It is less expensive, while the flexible chain length between network epoxy group can be increased after solidification, so as to improve resin group
The pliability of compound, possesses more cheap price, more excellent adhesive property compared with fluororesin；With
Polyphenylene oxide resin is compared to having more excellent production technology processing characteristics, and production equipment and production technology are easy,
While enabling the characteristics of resin combination of the invention has low-dielectric.
Preferably, alkyl polyols glycidol ether of the present invention is In any one；
Wherein, q=2,4 or 6.
In thermosetting alkyl polyols glycidyl ether resin composition of the present invention, the alkyl is polynary
Alcohol glycidol ether in matrix resin composition shared mass percent be 50-100%, such as 53%, 55%,
58%th, 60%, 64%, 68%, 70%, 73%, 75%, 78%, 80%, 84%, 88%, 90%,
93%th, 95% or 98%, preferably 50-70%.Alkyl polyols glycidol ether is in matrix resin composition
Shared mass percent is excessive or very few can all have influence on dielectric properties and hot property.
In thermosetting alkyl polyols glycidyl ether resin composition of the present invention, the matrix resin
Composition is also comprising other epoxy resin in addition to alkyl polyols glycidol ether, herein alkyl polyols contracting
Water glycerin ether is the alkyl polyols glycidol ether described in first aspect present invention.
Preferably, described other epoxy resin are selected from phenol novolak type epoxy, methylphenol phenol aldehyde type ring
Oxygen tree fat, bisphenol A-type novolac epoxy resin, DCPD-containing epoxy resin, biphenyl epoxy resin, naphthalene system
Epoxy resin, diglycidyl ether type epoxy resin, alicyclic based epoxy resin, polyglycol type epoxy resins,
Any one in the glycidyl ether resin of four phenol ethane four or triphenol methane type epoxy resin or at least two
Mixture.For example, the mixture can be but be not limited to phenol novolak type epoxy and methylphenol
The mixture of phenol aldehyde type epoxy resin, bisphenol A-type novolac epoxy resin and DCPD-containing epoxy resin it is mixed
Compound, the mixture of bisphenol A-type novolac epoxy resin, DCPD-containing epoxy resin and biphenyl epoxy resin,
The mixture of biphenyl epoxy resin, naphthalene system epoxy resin and diglycidyl ether type epoxy resin, glycidol ether
The mixture of type epoxy resin and alicyclic based epoxy resin, alicyclic based epoxy resin, polyethylene glycol type ring
The composition of oxygen tree fat and the glycidyl ether resin of four phenol ethane four, the glycidol ether tree of four phenol ethane four
The composition of fat and triphenol methane type epoxy resin.
Preferably, described other epoxy resin can be for phosphorous epoxy resin and/or containing epoxy silicone.
In thermosetting alkyl polyols glycidyl ether resin composition of the present invention, the thermosetting tree
Oil/fat composition also includes curing agent.
Preferably, the curing agent is selected from anhydride curing agent, active ester curing agent or benzoxazine colophony
Any one or at least two mixture.
Preferably, the anhydride curing agent is common selected from maleic anhydride of styrene, methyl vinyl ether-maleic acid
Polymers, methyl hexahydrophthalic anhydride, HHPA, phenylsuccinic acid acid anhydride, succinic anhydride, oxa- acid anhydrides, diformazan
Base maleic anhydride, glutaric anhydride, 2- methyl succinics acid anhydrides, phthalic anhydride, ENB dianhydride,
The acid anhydride of benzene four, 1,2- cyclohexyl dicarboxylic acids acid anhydride, 4- difluorophthalic anhydrides, 3- difluorophthalic anhydrides, 2,2- diformazans
Base succinyl oxide, 1,1- cyclohexanediacetic acids acid anhydride, phenyl cis-butenedioic anhydride, citraconic anhydride, 1,8- naphthalic anhydrides, 4,4 '-
Biphenyl ether dianhydride, 3,3'4,4'- bibenzene tetracarboxylic dianhydrides, equal benzene dianhydride, 3,3'4,4'- dianhydrides diphenyl ether, 4,4'- (six
Fluorine isopropyl alkene) two anhydride phthalic acids, 1,2,3,4- cyclobutanetetracarboxylics dianhydride, 3,3'4,4'- benzophenone tetracarboxylic dianhydrides,
1,4,5,8- benzene tetracarboxylic acid Gan, perylene -1,4,9,10- tetrabasic carboxylic acids acetic anhydride, 3,4,5,6- THPAs or cis- 1,2,3,6- tetrahydrochysenes
In phthalic anhydride any one or at least two mixture.
Preferably, the active ester curing agent be a kind of phenolic compound connected by aliphatic acyclic hydrocarbon structure,
Solidify obtained by two degree of functionality carboxylic acid aromatic compounds or acid halides and a kind of reaction of monohydroxy compound
Agent, the two functional carboxylic acids aromatic compound or acid halide consumption are 1mol, by aliphatic acyclic hydrocarbon knot
The phenolic compound consumption of structure connection is 0.05-0.75mol, and monohydroxy compound consumption is 0.25-0.95mol.
Preferably, the structural formula of the active ester curing agent is as follows：
Wherein, X is phenyl or naphthyl, and j is 0 or 1, k are 0 or 1, n are 0.25-1.25.
Preferably, thermosetting alkyl polyols glycidyl ether resin composition of the present invention is also comprising catalysis
Agent.
Preferably, the catalyst is imidazoles or pyridine compounds and their.
Preferably, the glyoxaline compound is selected from 2-methylimidazole, the methylimidazole of 2- ethyls -4,2- phenyl
Imidazoles, 2- undecyl imidazoles, 1 benzyl 2 methyl imidazole, 2- heptadecyl imidazoles, 2 isopropyl imidazole,
In 2- phenyl -4-methylimidazole, 2- dodecyl imidazoles or 1- 1-cyanoethyl-2-methylimidazoles any one or extremely
Few two kinds mixture.
Preferably, the pyridine compounds and their is DMAP.
The usage amount of catalyst of the present invention depending on epoxy resin species, the species of curing agent and catalyst type,
A use of principle of catalyst is that the gelation time of glue is not lower than 120s.
Preferably, the consumption of the catalyst accounts for the thermosetting alkyl polyols glycidyl ether resin combination
The 0.001-5.0% of amount of substance, such as 0.002%, 0.005%, 0.01%, 0.015%, 0.02%, 0.04%,
0.06%th, 0.08%, 0.1%, 1%, 1.5%, 1.8%, 2%, 2.3%, 2.5%, 2.8%, 3%, 3.3%,
3.5%th, 3.8%, 4%, 4.2%, 4.5%, 4.7% or 4.9%, preferably 0.02-4.0%, further preferably
It is 0.005-3.0%.The consumption of catalyst excessive (more than 5.0%) will cause the reaction of thermoset composition
Property it is too fast, the generation of accessory substance can be increased and harmful effect is produced to the uniformity of the conversion ratio of curing reaction；
If the consumption of catalyst is less than 0.001% in composition, reactivity is excessively slow, is unfavorable for the making of prepreg.
Preferably, the resin combination also includes fire retardant.
Preferably, the fire retardant is selected from organic fire-retardant and/or inorganic combustion inhibitor.
Organic fire-retardant of the present invention can be organic phosphorus flame retardant, for example, substituted or unsubstituted
Alkyl phosphonic acid, such as di alkyl phosphonic acid (alkyl described herein is preferably C1-10 alkyl), including but do not limit
In dimethyl phosphonic acids, Methylethyl phosphonic acids, diethyl phosphonic acids, ethyl (n-, iso- or tert-) butyl phosphine
Acid, diη-propyl phosphonic acids, diisopropyl phosphonic acids, di-n-butyl phosphonic acids, diisobutyl phosphonic acids, di-t-butyl
Phosphonic acids, diamyl phosphonic acids, dioctyl phosphonic acids etc.；The di alkyl phosphonic acid of hydroxyl, such as (methylol) first
Base phosphonic acids, (ethoxy) methylphosphonic acid, double (methylol) phosphonic acids, double (ethoxy) phosphonic acids etc.；Contain
The Acidic phosphates of carboxyl, such as (2- carboxyethyls) methylphosphonic acid etc.；Di alkyl phosphonic acid containing alkoxy,
Such as (methoxy) methylphosphonic acid etc.；Arylphosphonic acid, (such as phenyl for example, C6-10 arylphosphonic acids
Phosphonic acids), two-C6-10 arylphosphonic acids (such as diphenyl phosphonic acid), alkylaryl phosphonic acids is (for example, C1-4 alkane
Base-C6-10 aryl-phosphonic acids, such as aminomethyl phenyl phosphonic acids), and these organic phospho acids salt.
The organic fire-retardant can also be substituted or unsubstituted alkylene phosphonic acids (preferred C3-8 alkylidenes
Phosphonic acids etc.), such as 1- hydroxyls -1H- phosphorane -1- oxides, 2- carboxyl -1- hydroxyl -1H- phosphorane -1- oxides；
Substituted or unsubstituted alkenylene phosphonic acids (preferably C3-8 alkenylenes phosphonic acids), such as 1- hydroxyls phosphorane -1-
Oxide etc.；Cycloalkylidene phosphonic acids (preferably C4-10 cycloalkylidenes phosphonic acids), such as 1,3- Asias cyclobutyl phosphine
Acid, 1,3- cyclopentylenes phosphonic acids, 1,4- cyclooctylenes phosphonic acids, 1,5- cyclooctylene phosphonic acids etc.；Or they
Salt.
Preferably, the organic fire-retardant is selected from three (2,6- 3,5-dimethylphenyl) phosphines, resorcinol double [two (2,6-
3,5-dimethylphenyl) phosphate], resorcinol tetraphenyldiphosphate, triphenyl phosphate, the double (hexichol of bisphenol-A
Base phosphate), phosphonitrile fire retardant, 10- (2,5- dihydroxy phenyls) -10- hydrogen -9- oxa- -10- phosphine phenanthrene -10- oxides,
10- (2,5- dihydroxy naphthyl) -10- hydrogen -9- oxa-s -10- phosphines phenanthrene -10- oxides or the miscellaneous -10- phosphorus of 9,10- dihydro-9-oxies
In miscellaneous phenanthrene -10- oxide fire retardants any one or at least two mixture.For example, the mixture can
Think but be not limited to three (2,6- 3,5-dimethylphenyls) phosphines and resorcinol double [two (2,6- 3,5-dimethylphenyls) phosphates]
Mixture, three (2,6- 3,5-dimethylphenyl) phosphines, resorcinol double [two (2,6- 3,5-dimethylphenyl) phosphates] and isophthalic
The mixture of diphenol tetraphenyldiphosphate, resorcinol tetraphenyldiphosphate, triphenyl phosphate and bis-phenol
The mixture of A double (diphenyl phosphoesters), phosphonitrile fire retardant, 10- (2,5- dihydroxy phenyl) -10- hydrogen -9- oxa-s
- 10- phosphine phenanthrene -10- oxides, 10- (2,5- dihydroxy naphthyl) -10- hydrogen -9- oxa-s -10- phosphines phenanthrene -10- oxides and
The mixture of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide fire retardant, three (2,6- 3,5-dimethylphenyl) phosphines,
Resorcinol double [two (2,6- 3,5-dimethylphenyls) phosphates], resorcinol tetraphenyldiphosphate and phosphoric acid triphen
The mixture of ester and bisphenol-A double (diphenyl phosphoesters), double [two (2, the 6- 3,5-dimethylphenyl) phosphoric acid of resorcinol
Ester], resorcinol tetraphenyldiphosphate, triphenyl phosphate, bisphenol-A double (diphenyl phosphoester), phosphonitriles
Fire retardant and 10- (2,5- dihydroxy phenyls) -10- hydrogen -9- oxa- -10- phosphine phenanthrene -10- hopcalites.
Preferably, the inorganic combustion inhibitor is selected from red phosphorus, aluminium hydroxide, magnesium hydroxide or antimony trioxide
Any one or at least two mixture.The mixture can be but not limited to red phosphorus and aluminium hydroxide
The mixture of mixture, aluminium hydroxide and magnesium hydroxide, the mixture of red phosphorus, aluminium hydroxide and magnesium hydroxide,
The mixture of aluminium hydroxide, magnesium hydroxide and antimony trioxide.
Preferably, the resin combination also includes filler.
Preferably, described filler be selected from silica, kaolin, talcum powder, magnesium hydroxide, aluminium hydroxide,
Boehmite, hydrotalcite, titanium oxide, calcium silicates, beryllium oxide, boron nitride, glass dust, Firebrake ZB, aluminium nitrogen
Compound, silicon nitride, carborundum, magnesia, zirconium oxide, mullite, titanium dioxide, potassium titanate, in
Empty glass microballoon, polytetrafluorethylepowder powder, polystyrene powder, potassium titanate fibre, carborundum mono-crystal fiber,
In silicon nitride fiber, alumina single crystal fiber or staple glass fibre any one or at least two mixture.
For example, the mixture can be but be not limited to silica and kaolinic mixture, talcum powder, hydrogen-oxygen
The mixture of change magnesium and aluminium hydroxide, the mixture of magnesium hydroxide, aluminium hydroxide and boehmite, kaolin,
The mixture of talcum powder, magnesium hydroxide and aluminium hydroxide, silica, kaolin, talcum powder, hydroxide
The mixture of magnesium and aluminium hydroxide, silica, kaolin, talcum powder, magnesium hydroxide, aluminium hydroxide and
The mixture of boehmite.
Silica of the present invention can be powdered quartz, fusion silica or ball-type dioxy
SiClx etc..
Preferably, the resin combination also includes curing accelerator.Those skilled in the art can be according to need
Select suitable curing accelerator.
As the preferred technical solution of the present invention, thermosetting alkyl polyols glycidyl ether resin of the invention
Composition alkyl polyols glycidol ether, other epoxy resin comprising structure described in first aspect present invention
And curing agent, wherein the alkyl polyols glycidol ether shared mass percent in matrix resin composition
It is more than 50%.
Alkyl polyols glycidol ether of the present invention can coordinate with described other epoxy resin and curing agent
Use, act synergistically so that product has low-dielectric energy, and ensure that hot property and adhesive property.
Of the present invention " including ", it is intended that it can also include other components in addition to the component, these
Other components assign the composition epoxy resin different characteristics.In addition, " bag of the present invention
Include ", may be replaced by enclosed " being " or " by ... constitute ".No matter thermosetting of the present invention
Alkyl polyols glycidyl ether resin composition include which kind of composition, the resin combination, in addition to the solvents,
The mass percent sum of each component is 100%.
Second aspect, the present invention provides a kind of resin adhesive liquid, and the resin adhesive liquid is by heat of the present invention
Solidity alkyl polyols glycidyl ether resin composition is obtained in being dissolved or dispersed in solvent.
Preferably, the solvent be ketone, hydro carbons, ethers, esters or aprotic solvent in one kind or
At least two combination, preferably acetone, methyl ethyl ketone, methyl iso-butyl ketone (MIBK), toluene, dimethylbenzene, first
Alcohol, ethanol, primary alconol, glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, acetic acid second
A kind of in ester, N,N-dimethylformamide or N, N- DEF or at least two mixture.
The solvent can be used alone, and can also be used in mixed way.The addition of solvent can by those skilled in the art according to
The viscosity of selected resin determines, so as to get thermosetting alkyl polyols glycidyl ether resin composition
The modest viscosity of glue, is easy to solidification, and this is not limited by the present invention.
The third aspect, is contracted the invention provides a kind of using thermosetting alkyl polyols as described in relation to the first aspect
The prepreg that water glycerin ether resin combination makes.Alkyl polyols glycidyl ether resin of the present invention
Composition is attached to after being dried by impregnation and prepreg is made on reinforcing material.
The method for manufacturing prepreg using alkyl polyols glycidyl ether resin composition of the invention is enumerated
It is as follows, but make the method not limited to this of prepreg.By thermosetting alkyl polyols glycidyl ether resin
Combination composition glue liquid (using solvent adjustment viscosity herein) is immersed on reinforcing material, and to being impregnated with the tree
The preliminary-dip piece of oil/fat composition is thermally dried so that the composition epoxy resin in preliminary-dip piece is in semi-solid preparation
Stage (B-Stage), you can obtain prepreg.Heating-up temperature to preliminary-dip piece is 80-250 DEG C, for example
90℃、100℃、110℃、120℃、130℃、140℃、150℃、160℃、170℃、180℃、
190 DEG C, 200 DEG C, 210 DEG C, 220 DEG C, 230 DEG C or 240 DEG C, the time is 1-30min, such as 3min,
5min、7min、10min、12min、15min、18min、20min、22min、25min、28min
Or 29min.The reinforcing material for wherein using can be inorganic or organic material.Inorganic material can there are：
The woven fabric or non-woven fabrics or paper of glass fibre, carbon fiber, boron fibre, metal etc..Wherein described glass
Fiber cloth or non-woven fabrics can use E-glass, Q type cloth, NE cloth, D types cloth, S types cloth, silica cloth high
Deng.Organic fiber such as polyester, polyamine, polyacrylic acid, polyimides, aramid fiber, polytetrafluoroethylene (PTFE), a rule
The manufactures such as polystyrene are weaved cotton cloth or non-woven fabrics or paper, but reinforcing material not limited to this, and others can be used for
The reinforcing material of resin tooth can equally realize the present invention.Resin content in prepreg is in 30-80wt%
Between, such as 32%, 35%, 38%, 40%, 45%, 48%, 50%, 53%, 55%, 58%, 60%,
63%th, 65%, 68%, 70%, 72%, 75%, 78% or 79%.
Fourth aspect, the invention provides a kind of laminate for printed circuits, the laminate for printed circuits
Including the prepreg described in or at least two third aspect for overlapping.
Laminate for printed circuits of the present invention includes the prepreg of or at least two overlappings, and
The metal foil of the one or both sides of the prepreg after overlapping, each prepreg comprising reinforcing material and
The alkyl polyols glycidyl ether resin of the present invention on reinforcing material is attached to after being dried by impregnation
Composition.
Resin combination of the invention is also used as making resin sheet or prepreg, resin complexes gold
Category Copper Foil, laminate, printed wiring board.Laminate, copper-clad laminate, printed wiring board can be used
Above-mentioned resin sheet, resin laminated metal paper tinsel and prepreg make.Illustrated by taking copper-clad laminate as an example
This production method, but it is not limited only to this.Using prepreg make copper-clad laminate when, by one or
Multiple prepregs are cut into during certain size send into after lamination laminating apparatus and are laminated, while by gold
Category paper tinsel is placed on the one or both sides of prepreg, suppresses semi-solid preparation to form clad with metal foil by hot-forming
Laminate.The alloy of copper, brass, aluminium, nickel and these metals or compound gold can be used as metal foil
Category paper tinsel.As the pressing conditions of laminate, should be suitable according to the selection of the actual conditions of invention resin composition
Lamination condition of cure.If pressing pressure is too low, can make there is space in laminate, its electrical property can under
Drop；Lamination pressure crosses conference makes there is excessive internal stress in laminate so that the dimensional stability of laminate
Can decline, these are required for reaching required requirement come pressed sheet by the suitable pressure for meeting molding.
Usual guideline for conventional compacting laminate is that laminating temperature is in 130-250 DEG C, pressure：
3-50kgf/cm2, hot pressing time：60-240min.For example, the hot pressing temperature can for 140 DEG C, 150 DEG C,
160 DEG C, 170 DEG C, 180 DEG C, 190 DEG C, 200 DEG C, 210 DEG C, 220 DEG C, 230 DEG C or 240 DEG C.It is described
Pressure can be 5kgf/cm2、8kgf/cm2、11kgf/cm2、14kgf/cm2、17kgf/cm2、24kgf/
cm2、28kgf/cm2、32kgf/cm2、37kgf/cm2、42kgf/cm2、45kgf/cm2Or 48kgf/cm2.Institute
State hot pressing time can for 70min, 90min, 110min, 130min, 150min, 170min, 190min,
210min, 230min or 240min.
Using resin sheet, resin laminated metal paper tinsel, prepreg, metal-coated laminated board by laminating method or
Subtract the multilayer circuit board that layer legal system makees printed wiring board or complexity.
Compositions of thermosetting resin of the invention is except can serve as making resin sheet, resin complexes metallic copper
Outside paper tinsel, prepreg, laminate, copper-clad laminate, printed wiring board, it may also be used for for making
Adhesive, coating or composite, in can also be applied to the fields such as building, aviation, ship or auto industry.
Relative to prior art, the present invention has the advantages that：
In resin combination of the invention, using epoxy resin as matrix resin composition, and by using
The alkyl polyols of the molecular structure of the present invention that mass percent is 50-100% are accounted in matrix resin composition
The epoxy resin of glycidol ether structure so that while preferable hot property and adhesive property is kept, tool
There is low-dielectric energy, and low cost, preparation method are simple.This overcomes the defect of prior art well,
For example fluororesin binder is low, the high shortcoming of price, and polyphenylene oxide resin manufacturing condition difficulty
Shortcoming etc..The present invention while using alkyl polyols tetraglycidel ether epoxy resin as matrix resin composition,
Using active ester or acid anhydrides as curing agent, active ester and anhydride curing agent have been given full play to anti-with epoxy resin
The characteristic of polar group should not be generated, makes solidfied material that there is excellent dielectric constant, dielectric loss factor.This
Invention is by the use of alkyl polyols glycidol ether as matrix resin composition so that resin combination of the invention
The prepreg of making, laminate and printed circuit board, with low-k (10GHz ,≤3.64),
The low dielectric loss factor (10GHz ,≤0.0083), preferable glass transition temperature (151.1-165.5 DEG C),
Heat decomposition temperature (361.5-382.3 DEG C) and peel strength (0.81-0.93N/mm), and add with good
Work performance and obvious cost advantage, have broad application prospects.
Specific embodiment
Technical scheme is further illustrated below by specific embodiment.Those skilled in the art
It will be clearly understood that the embodiment is only to aid in understanding the present invention, it is not construed as to concrete restriction of the invention.
Embodiment 1
By 27 parts of 1,4- butanediol diglycidyl ethers (carat Ma Er reagents) and 73 parts of EF40 (styrene
Copolymer-maleic anhydride, U.S.'s Sartomer) add beaker, plus 50 parts of MEK (butanone) or it is any this
The solvent dissolving above-claimed cpd that invention is mentioned, with appropriate 2E4MI (2-ethyl-4-methylimidazole, Japan four
State is melted into) make curing accelerator, it is made the glue of solid content 60-70%.This is infiltrated using 2116 glass-fiber-fabrics
Glue, and in 155 DEG C of baking ovens, solvent is removed, obtain prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 1.
Embodiment 2
By 18 parts of BDDEs, 18 parts of HP7200H (DCPD-containing epoxy resin,
Japanese DIC) and during 64 parts of EF40 add beakers, plus the solvent that 50 parts of MEK or any present invention are mentioned
Dissolving, curing accelerator is made with appropriate 2E4MI, is made the glue that solid content is 60-70%.Use 2116
Glass-fiber-fabric infiltrates this glue, and in 155 DEG C of baking ovens, removes solvent, obtains prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 1.
Embodiment 3
By 23 parts of BDDEs, 10 parts of NC3000H (biphenyl epoxy resins, Japan
DIC) and in 67 parts of EF40 addition beakers, plus the solvent dissolving that 50 parts of MEK or any present invention are mentioned
Above-claimed cpd, curing accelerator is made with appropriate 2E4MI, is made the glue of solid content 60-70%.Use
2116 glass-fiber-fabrics infiltrate this glue, and in 155 DEG C of baking ovens, remove solvent, obtain prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 1.
Embodiment 4
By 31 parts of BDDEs and 69 parts of HPC-8000-65T (active ester crosslinking agent,
Japanese DIC) add beaker, plus the solvent that 50 parts of MEK or any present invention are mentioned dissolves above-mentioned chemical combination
Thing, curing accelerator is made with appropriate DMAP (DMAP, wide Rong Huaxue), is made solid content
The glue of 60-70%.This glue is infiltrated using 2116 glass-fiber-fabrics, and in 155 DEG C of baking ovens, removes solvent,
Obtain prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 1.
Embodiment 5
30 parts of 1,6 hexanediol diglycidylethers (carat Ma Er reagents) are added into beaker with 70 parts of EF40
In, plus the solvent dissolving above-claimed cpd that 50 parts of MEK or any present invention are mentioned, with appropriate 2E4MI
Make curing accelerator, be made the glue of solid content 60-70%.This glue is infiltrated using 2116 glass-fiber-fabrics, and
In 155 DEG C of baking ovens, solvent is removed, obtain prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 1.
Embodiment 6
20 parts of 1,6 hexanediol diglycidylethers, 20 parts of HP7200H and 58 part of EF40 are added into beaker
In, plus the solvent dissolving above-claimed cpd that 60 parts of MEK or any present invention are mentioned, with appropriate 2E4MI
Make accelerator, be made the glue of solid content 60-70%.This glue is infiltrated using 2116 glass-fiber-fabrics, and at 155 DEG C
In baking oven, solvent is removed, obtain prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 1.
Embodiment 7
22 parts of 1,6 hexanediol diglycidylethers, 15 parts of NC3000H and 63 part of EF40 are added into beaker
In, plus the solvent dissolving above-claimed cpd that 50 parts of MEK or any present invention are mentioned, with appropriate 2E4MI
Make accelerator, be made the glue of solid content 60-70%.This glue is infiltrated using 2116 glass-fiber-fabrics, and at 155 DEG C
In baking oven, solvent is removed, obtain prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 1.
Embodiment 8
By 25 parts of ethylene glycol diglycidylethers (carat Ma Er reagents) and 75 parts of EF40 (styrene Malaysias
Acid anhydride copolymer, U.S.'s Sartomer) add beaker, plus 50 parts of MEK (butanone) or any present invention
The solvent dissolving above-claimed cpd mentioned, with appropriate 2E4MI (2-ethyl-4-methylimidazole, Japanese four countries
Into) make curing accelerator, it is made the glue of solid content 60-70%.This glue is infiltrated using 2116 glass-fiber-fabrics,
And in 155 DEG C of baking ovens, solvent is removed, obtain prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 1.
Embodiment 9
By 43 parts of polyethyleneglycol diglycidylethers (carat Ma Er reagents) and 57 parts of EF40 (styrene horses
Come acid anhydride copolymer, U.S.'s Sartomer) add beaker, plus 50 parts of MEK (butanone) or any this hair
The bright solvent dissolving above-claimed cpd mentioned, with appropriate 2E4MI (2-ethyl-4-methylimidazole, Japanese four countries
Chemical conversion) make curing accelerator, it is made the glue of solid content 60-70%.This glue is infiltrated using 2116 glass-fiber-fabrics
Liquid, and in 155 DEG C of baking ovens, solvent is removed, obtain prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 1.
Comparative example 1
During 52 parts of HP7200H and 48 part of EF40 are added into beakers, plus 50 parts of MEK or any present invention
The solvent dissolving above-claimed cpd mentioned, curing accelerator is made with appropriate 2E4MI, is made solid content 60-70%
Glue.This glue is infiltrated using 2116 glass-fiber-fabrics, and in 155 DEG C of baking ovens, removes solvent, obtain half
Cured sheets sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Press obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature heats up at 80-120 DEG C
Speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 2.
Comparative example 2
During 53 parts of NC3000H and 47 part of EF40 are added into beakers, plus 50 parts of MEK or any present invention
The solvent dissolving above-claimed cpd mentioned, curing accelerator is made with appropriate 2E4MI, is made solid content 60-70%
Glue.This glue is infiltrated using 2116 glass-fiber-fabrics, and in 155 DEG C of baking ovens, removes solvent, obtain half
Cured sheets sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 2.
Comparative example 3
During 56 parts of HP7200H and 44 part of HPC-8000-65T are added into beakers, plus 50 parts of MEK or appoint
The solvent dissolving above-claimed cpd that the meaning present invention is mentioned, curing accelerator is made with appropriate DMAP, is made and is contained admittedly
Measure the glue of 60-70%.This glue is infiltrated using 2116 glass-fiber-fabrics, and in 155 DEG C of baking ovens, removes solvent,
Obtain prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 2.
Comparative example 4
By 12 parts of BDDEs, 30 parts of HP7200H (DCPD-containing epoxy resin,
Japanese DIC) and during 58 parts of EF40 add beakers, plus the solvent that 50 parts of MEK or any present invention are mentioned
Dissolving, curing accelerator is made with appropriate 2E4MI, is made the glue that solid content is 60-70%.Use 2116
Glass-fiber-fabric infiltrates this glue, and in 155 DEG C of baking ovens, removes solvent, obtains prepreg sample.
Using 4 2116 prepreg laminations, each 0.5 ounce of electrolytic copper foil up and down, by hot press
Be laminated obtaining doublesided copperclad laminate.Lamination is as follows：(1) material temperature rises at 80-120 DEG C
Warm speed control is at 1.0-3.0 DEG C/min；(2) pressure is set to 20kg/cm2；(3) solidification temperature is at 200 DEG C,
And keep this temperature 90 minutes.Respective performances are shown in Table 2.
The examination criteria or method of involved parameter are as follows in table 1：
(1) glass transition temperature (Tg)：Tested using DSC, according to IPC-TM-6502.4.25 institutes
The DSC method of testings of regulation are measured.
(2) dielectric constant and dielectric loss factor：Method according to IPC-TM-6502.5.5.13 is tested,
Test frequency is 10GHz.
(3) resistance to dip solderability evaluation：By copper-clad laminate be immersed in the tin stove that temperature is 288 DEG C until
Plate material lamination bubbles, and writes down the time of plate material lamination foaming, and this is the resistance to dip solderability limit of the sheet material.
(4) peel strength (N/mm)：Method according to IPC-TM-6502.4.8 is tested.
(5) heat decomposition temperature (Td)：According to thermogravimetry (TGA), according to IPC-TM-6502.4.24
The TGA methods of defined are measured.
Table 1
Table 2
As it can be seen from table 1 the resin combination of embodiment of the present invention 1-7 has low-k and low Jie
The electrical loss factor, with excellent low-dielectric energy, and preferably glass transition temperature Tg and thermal decomposition
Temperature Td and peel strength.Embodiment 1 is not when other epoxy resin are added, it is also possible to ensure resin combination
Laminate prepared by thing has dielectric constant and the low-dielectric loss factor, while keeping preferable glass transition
Temperature and heat decomposition temperature, embodiment 2 is compared with comparative example 1, or embodiment 3 is compared with comparative example 2,
Can illustrate after addition alkyl polyols glycidol ether, to significantly reduce thermosetting resin in system
The dielectric constant and dielectric loss factor of composition, while preferable hot property and caking property can also be kept.By
Embodiment 1,2,3,4 and embodiment 5,6,7,8 contrast the alkane it is also seen that alkyl polyols respectively
Base segment is more long, and the dielectric properties for possessing are also better.From the contrast of embodiment 1,2,3,4 and comparative example 4
As can be seen that the present invention is by the use of alkyl polyols glycidol ether as matrix resin composition, and by its content
Control can effectively reduce compositions of thermosetting resin in the range of the 50-100% of matrix resin composition
Dielectric constant and dielectric loss factor, keep preferable hot property and caking property, but if its content is 50%
Hereinafter, then the dielectric properties and hot property and adhesive property of resin combination can not show a candle to content and exist
The performance of resin combination during 50-100%.
Applicant states that the present invention illustrates thermosetting alkyl polyols contracting of the invention by above-described embodiment
Water glycerin ether resin combination and its application, but the invention is not limited in above-described embodiment, that is, do not mean that
The present invention has to rely on above-described embodiment could be implemented.Person of ordinary skill in the field is it will be clearly understood that right
Any improvement of the invention, it is addition to the equivalence replacement and auxiliary element of each raw material of product of the present invention, specific
Way choice etc., within the scope of all falling within protection scope of the present invention and disclosing.
Claims (10)
1. a kind of thermosetting alkyl polyols glycidyl ether resin composition, it is characterised in that the resin
Using epoxy resin as matrix resin composition, the epoxy resin includes the alkyl with following structure to composition
In polyol shrinkaging glycerin ether any one or at least two combination：
Wherein, n=1-10, m=1-10, q=2,4 or 6, R=H, CH3- or CH3-CH2-；
The alkyl polyols glycidol ether shared mass percent in matrix resin composition is
50-100%.
2. thermosetting alkyl polyols glycidyl ether resin composition according to claim 1, it is special
Levy and be, the alkyl polyols glycidol ether is： In any one or at least two combination；
Wherein, q=2,4 or 6.
3. thermosetting alkyl polyols glycidyl ether resin composition according to claim 1 and 2,
Characterized in that, the alkyl polyols glycidol ether shared mass percent in matrix resin composition is
50-70%.
4. the thermosetting alkyl polyols glycidyl ether resin group according to any one of claim 1-3
Compound, it is characterised in that the matrix resin composition is also included in addition to alkyl polyols glycidol ether
Other epoxy resin；
Preferably, described other epoxy resin are selected from phenol novolak type epoxy, methylphenol phenol aldehyde type ring
Oxygen tree fat, bisphenol A-type novolac epoxy resin, DCPD-containing epoxy resin, biphenyl epoxy resin, naphthalene system
Epoxy resin, diglycidyl ether type epoxy resin, alicyclic based epoxy resin, polyglycol type epoxy resins,
Any one in the glycidyl ether resin of four phenol ethane four or triphenol methane type epoxy resin or at least two
Mixture；
Preferably, described other epoxy resin are for phosphorous epoxy resin and/or containing epoxy silicone.
5. the thermosetting alkyl polyols glycidyl ether resin group according to any one of claim 1-4
Compound, it is characterised in that the compositions of thermosetting resin also includes curing agent；
Preferably, the curing agent is selected from anhydride curing agent, active ester curing agent or benzoxazine colophony
Any one or at least two mixture；
Preferably, the anhydride curing agent is common selected from maleic anhydride of styrene, methyl vinyl ether-maleic acid
Polymers, methyl hexahydrophthalic anhydride, HHPA, phenylsuccinic acid acid anhydride, succinic anhydride, oxa- acid anhydrides, diformazan
Base maleic anhydride, glutaric anhydride, 2- methyl succinics acid anhydrides, phthalic anhydride, ENB dianhydride,
The acid anhydride of benzene four, 1,2- cyclohexyl dicarboxylic acids acid anhydride, 4- difluorophthalic anhydrides, 3- difluorophthalic anhydrides, 2,2- diformazans
Base succinyl oxide, 1,1- cyclohexanediacetic acids acid anhydride, phenyl cis-butenedioic anhydride, citraconic anhydride, 1,8- naphthalic anhydrides, 4,4 '-
Biphenyl ether dianhydride, 3,3'4,4'- bibenzene tetracarboxylic dianhydrides, equal benzene dianhydride, 3,3'4,4'- dianhydrides diphenyl ether, 4,4'- (six
Fluorine isopropyl alkene) two anhydride phthalic acids, 1,2,3,4- cyclobutanetetracarboxylics dianhydride, 3,3'4,4'- benzophenone tetracarboxylic dianhydrides,
1,4,5,8- benzene tetracarboxylic acid Gan, perylene -1,4,9,10- tetrabasic carboxylic acids acetic anhydride, 3,4,5,6- THPAs or cis- 1,2,3,6- tetrahydrochysenes
In phthalic anhydride any one or at least two mixture；
Preferably, the active ester curing agent be a kind of phenolic compound connected by aliphatic acyclic hydrocarbon structure,
Solidify obtained by two degree of functionality carboxylic acid aromatic compounds or acid halides and a kind of reaction of monohydroxy compound
Agent, the two functional carboxylic acids aromatic compound or acid halide consumption are 1mol, by aliphatic acyclic hydrocarbon knot
The phenolic compound consumption of structure connection is 0.05-0.75mol, and monohydroxy compound consumption is 0.25-0.95mol；
Preferably, the structural formula of the active ester curing agent is as follows：
Wherein, X is phenyl or naphthyl, and j is 0 or 1, k are 0 or 1, n are 0.25-1.25.
6. the thermosetting alkyl polyols glycidyl ether resin group according to any one of claim 1-5
Compound, it is characterised in that the resin combination also includes catalyst；
Preferably, the catalyst is imidazoles or pyridine compounds and their；
Preferably, the glyoxaline compound is selected from 2-methylimidazole, the methylimidazole of 2- ethyls -4,2- phenyl
Imidazoles, 2- undecyl imidazoles, 1 benzyl 2 methyl imidazole, 2- heptadecyl imidazoles, 2 isopropyl imidazole,
In 2- phenyl -4-methylimidazole, 2- dodecyl imidazoles or 1- 1-cyanoethyl-2-methylimidazoles any one or extremely
Few two kinds mixture；
Preferably, the pyridine compounds and their is DMAP；
Preferably, the consumption of the catalyst accounts for the thermosetting alkyl polyols glycidyl ether resin combination
The 0.001-5.0% of amount of substance, preferably 0.02-4.0%, more preferably 0.005-3.0%；
Preferably, the resin combination also includes fire retardant；
Preferably, the fire retardant is selected from organic fire-retardant and/or inorganic combustion inhibitor；
Preferably, the organic fire-retardant is selected from three (2,6- 3,5-dimethylphenyl) phosphines, resorcinol double [two (2,6-
3,5-dimethylphenyl) phosphate], resorcinol tetraphenyldiphosphate, triphenyl phosphate, the double (hexichol of bisphenol-A
Base phosphate), phosphonitrile fire retardant, 10- (2,5- dihydroxy phenyls) -10- hydrogen -9- oxa- -10- phosphine phenanthrene -10- oxides,
10- (2,5- dihydroxy naphthyl) -10- hydrogen -9- oxa-s -10- phosphines phenanthrene -10- oxides or the miscellaneous -10- phosphorus of 9,10- dihydro-9-oxies
In miscellaneous phenanthrene -10- oxide fire retardants any one or at least two mixture；
Preferably, the inorganic combustion inhibitor is selected from red phosphorus, aluminium hydroxide, magnesium hydroxide or antimony trioxide
Any one or at least two mixture；
Preferably, the resin combination also includes filler；
Preferably, described filler be selected from silica, kaolin, talcum powder, magnesium hydroxide, aluminium hydroxide,
Boehmite, hydrotalcite, titanium oxide, calcium silicates, beryllium oxide, boron nitride, glass dust, Firebrake ZB, aluminium nitrogen
Compound, silicon nitride, carborundum, magnesia, zirconium oxide, mullite, titanium dioxide, potassium titanate, in
Empty glass microballoon, polytetrafluorethylepowder powder, polystyrene powder, potassium titanate fibre, carborundum mono-crystal fiber,
In silicon nitride fiber, alumina single crystal fiber or staple glass fibre any one or at least two mixture；
Preferably, the resin combination also includes curing accelerator.
7. a kind of resin adhesive liquid, it is characterised in that the resin adhesive liquid is will be any in such as claim 1-6
Thermosetting alkyl polyols glycidyl ether resin composition described in is obtained in being dissolved or dispersed in solvent.
8. a kind of thermosetting alkyl polyols glycidol ether using as any one of claim 1-7
The prepreg that resin combination makes.
9. a kind of laminate for printed circuits, it is characterised in that the laminate for printed circuits includes
Or at least two overlapping claim 8 described in prepreg.
10. a kind of printed circuit board, it is characterised in that the printed circuit board includes or at least two
Prepreg described in the claim 8 of overlapping.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510882430.5A CN106810820B (en) | 2015-12-02 | 2015-12-02 | Thermosetting alkyl polyol glycidyl ether resin composition and application thereof |
| PCT/CN2016/098478 WO2017092471A1 (en) | 2015-12-02 | 2016-09-08 | Thermosetting alkyl polyol glycidyl ether resin composition and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510882430.5A CN106810820B (en) | 2015-12-02 | 2015-12-02 | Thermosetting alkyl polyol glycidyl ether resin composition and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106810820A true CN106810820A (en) | 2017-06-09 |
| CN106810820B CN106810820B (en) | 2020-07-28 |
Family
ID=58796235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510882430.5A Expired - Fee Related CN106810820B (en) | 2015-12-02 | 2015-12-02 | Thermosetting alkyl polyol glycidyl ether resin composition and application thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106810820B (en) |
| WO (1) | WO2017092471A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408004A (en) * | 2018-04-26 | 2019-11-05 | 沙特基础工业全球技术有限公司 | High fever thermoset epoxy composition |
| WO2021134951A1 (en) * | 2019-12-31 | 2021-07-08 | 广东生益科技股份有限公司 | Thermosetting resin composition and prepreg, laminate and printed circuit board using same |
| CN113322716A (en) * | 2021-06-11 | 2021-08-31 | 广州万容材料科技有限公司 | Environment-friendly coating for paper-plastic composite material and paper-plastic composite material |
| CN113844039A (en) * | 2021-09-27 | 2021-12-28 | 山东金宝电子股份有限公司 | Preparation method of novel low-dielectric-constant copper-clad plate glue solution |
| CN114953646A (en) * | 2022-06-09 | 2022-08-30 | 山东金宝电子股份有限公司 | Preparation method of copper-clad plate for mini LED backboard and copper-clad plate |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3560978A1 (en) * | 2018-04-26 | 2019-10-30 | SABIC Global Technologies B.V. | High heat thermoset epoxy compositions |
| WO2020180973A1 (en) * | 2019-03-04 | 2020-09-10 | Sabic Global Technologies B.V. | Metal-clad laminate including thermoset epoxy composition |
| CN111875781A (en) * | 2020-07-23 | 2020-11-03 | 南开大学 | Composition for preparing glass-like polymer, glass-like polymer and preparation method and application thereof |
| CN112778948B (en) * | 2020-12-23 | 2022-06-24 | 北京康美特科技股份有限公司 | Conductive silver adhesive and preparation method and application thereof |
| CN112745480A (en) * | 2020-12-25 | 2021-05-04 | 天津晶东化学复合材料有限公司 | Curing agent for ultrahigh molecular weight epoxy resin |
| CN113388092B (en) * | 2021-05-26 | 2023-01-03 | 济南大学 | Preparation and application of fluorine-containing benzoxazine epoxy resin copolymer with low dielectric constant |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102325821A (en) * | 2009-02-24 | 2012-01-18 | 陶氏环球技术有限责任公司 | Curable epoxy resin compositions and cured products therefrom |
| CN102549041A (en) * | 2009-09-25 | 2012-07-04 | 陶氏环球技术有限责任公司 | Curable epoxy resin compositions and composites made therefrom |
| CN104497271A (en) * | 2014-12-24 | 2015-04-08 | 济南圣泉集团股份有限公司 | Modified epoxy resin and modified epoxy resin composition |
| CN105238217A (en) * | 2015-10-30 | 2016-01-13 | 华南理工大学 | Permeation consolidation type solvent-free epoxy anticorrosive coating, and preparation method and application thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040082720A1 (en) * | 2000-07-18 | 2004-04-29 | Fmc Corporation | Adducts of amine-terminated polyolefins and epoxides |
| US20080039555A1 (en) * | 2006-08-10 | 2008-02-14 | Michel Ruyters | Thermally conductive material |
| CN101967267A (en) * | 2010-08-26 | 2011-02-09 | 上海同立电工材料有限公司 | Impregnating resin applied to wind driven generator insulating vacuum pressure impregnating treatment and impregnating method |
| CN102311614B (en) * | 2011-04-03 | 2013-09-18 | 广东生益科技股份有限公司 | Resin composition and prepreg prepared by using same |
-
2015
- 2015-12-02 CN CN201510882430.5A patent/CN106810820B/en not_active Expired - Fee Related
-
2016
- 2016-09-08 WO PCT/CN2016/098478 patent/WO2017092471A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102325821A (en) * | 2009-02-24 | 2012-01-18 | 陶氏环球技术有限责任公司 | Curable epoxy resin compositions and cured products therefrom |
| CN102549041A (en) * | 2009-09-25 | 2012-07-04 | 陶氏环球技术有限责任公司 | Curable epoxy resin compositions and composites made therefrom |
| CN104497271A (en) * | 2014-12-24 | 2015-04-08 | 济南圣泉集团股份有限公司 | Modified epoxy resin and modified epoxy resin composition |
| CN105238217A (en) * | 2015-10-30 | 2016-01-13 | 华南理工大学 | Permeation consolidation type solvent-free epoxy anticorrosive coating, and preparation method and application thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110408004A (en) * | 2018-04-26 | 2019-11-05 | 沙特基础工业全球技术有限公司 | High fever thermoset epoxy composition |
| WO2021134951A1 (en) * | 2019-12-31 | 2021-07-08 | 广东生益科技股份有限公司 | Thermosetting resin composition and prepreg, laminate and printed circuit board using same |
| CN113322716A (en) * | 2021-06-11 | 2021-08-31 | 广州万容材料科技有限公司 | Environment-friendly coating for paper-plastic composite material and paper-plastic composite material |
| CN113844039A (en) * | 2021-09-27 | 2021-12-28 | 山东金宝电子股份有限公司 | Preparation method of novel low-dielectric-constant copper-clad plate glue solution |
| CN114953646A (en) * | 2022-06-09 | 2022-08-30 | 山东金宝电子股份有限公司 | Preparation method of copper-clad plate for mini LED backboard and copper-clad plate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017092471A1 (en) | 2017-06-08 |
| CN106810820B (en) | 2020-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106810820A (en) | A kind of thermosetting alkyl polyols glycidyl ether resin composition and its application | |
| CN104892902B (en) | A kind of compositions of thermosetting resin and application thereof | |
| KR101814322B1 (en) | Halogen-Free Flame-Retardant Resin Composition | |
| TWI555791B (en) | A halogen-free resin composition and a prepreg and laminate produced | |
| CN102964775B (en) | A kind of compositions of thermosetting resin and uses thereof | |
| CN102226033B (en) | Epoxy resin composition as well as prepreg and metal-foil-clad laminated board manufactured by using same | |
| TWI616468B (en) | Resin composition, prepreg and laminate | |
| CN106700548B (en) | A kind of preparation method containing benzoxazine resin composition and the prepreg and laminate being made from it | |
| CN103709718B (en) | A kind of compositions of thermosetting resin and application thereof | |
| TWI555792B (en) | Halogen-free resin composition and prepreg and laminate made thereof | |
| CN102051022A (en) | Epoxy resin composition as well as prepreg and laminated board made of same | |
| WO2016049981A1 (en) | High-cti halogen-free epoxy resin composition for copper-clad plate and uses thereof | |
| CN101928444A (en) | Halogen-free thermosetting resin composition, prepreg and metal clad foil laminated plate manufactured by using same | |
| CN102020830A (en) | Halogen-free fire resistance resin composite and application thereof | |
| CN108291008A (en) | Resin combination and multilager base plate | |
| CN105585808A (en) | Low-dielectric-loss high-heat-conductivity resin composition and preparation method thereof, and prepreg and laminated board prepared from resin composition | |
| TWI716967B (en) | Resin composition, prepreg, laminate, metal-clad laminate and printed circuit board | |
| TW201627391A (en) | Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring board | |
| JP2009051978A (en) | Epoxy resin composition for printed wiring board, prepreg, metal foil clad laminated plate, and multilayer printed wiring board | |
| CN103724936B (en) | Improve the Halogen-free low dielectric epoxy resin composition of shock resistance | |
| TWI496824B (en) | Epoxy resin composition, and prepreg and printed wiring board using the same | |
| CN106751821B (en) | A kind of halogen-free flame resistance resin composite and bonding sheet and copper-clad laminate using it | |
| TW201623427A (en) | Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board | |
| TWI674288B (en) | A process for the preparation of a flame retardant modified styrene-maleic anhydride resins and a composition of epoxy resins and their applying use to copper clad laminate and prepreg | |
| CN114605779B (en) | Thermosetting resin composition, prepreg comprising thermosetting resin composition, circuit substrate and printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200728 |