CN106799884A - A kind of compound low temperature resistant handling process of sunlight board - Google Patents
A kind of compound low temperature resistant handling process of sunlight board Download PDFInfo
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- CN106799884A CN106799884A CN201611125980.3A CN201611125980A CN106799884A CN 106799884 A CN106799884 A CN 106799884A CN 201611125980 A CN201611125980 A CN 201611125980A CN 106799884 A CN106799884 A CN 106799884A
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- Prior art keywords
- sunlight board
- low temperature
- temperature resistant
- compound
- pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04C—STRUCTURAL ELEMENTS; BUILDING MATERIALS
- E04C2/00—Building elements of relatively thin form for the construction of parts of buildings, e.g. sheet materials, slabs, or panels
- E04C2/54—Slab-like translucent elements
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Laminated Bodies (AREA)
Abstract
A kind of compound low temperature resistant handling process of sunlight board, concretely comprises the following steps:Grinding process, pneumatic conveying drying treatment, sunlight board surface coarsening, prepare low temperature resistant layer, plate low temperature resistant layer, vacuum drying treatment, first pressing is compound and high pressure is compound.Therefore beneficial effects of the present invention are:Handling process is simple, and process time is short, required processing cost is low, both improve the lower temperature resistance of sunlight board, reduces its black brittleness, the stability of composite sunlight board is in turn ensure that, with preferable market prospects.
Description
Technical field
The present invention relates to the handling process technical field of sunlight board, more particularly to a kind of sunlight board compound low temperature resistant treatment
Technique.
Background technology
Sunlight board is mainly used in Modern Greenhouse of Agriculture construction, and the north such as Beijing some are then mainly used in China
City.In terms of Greenhouse Construction, have all greenhouses built using sunlight board, have gable use sunlight board construction greenhouse,
There is the greenhouse that gable and side wall application sunlight board are built;In terms of greenhouse effect, there is the type of production greenhouse based on production, have with
Trade type greenhouse based on flowers trade center, and the greenhouse based on scientific research, sunlight board are a kind of with extensive building
Material, can also be used in shading tent and awning.
Sunlight board material easily becomes fragile at low temperature, and produces contraction distortion, and this can not only influence outward appearance, and may go out
Now cracking, brittle failure, the phenomenon of the penalty such as come off.
The content of the invention
To solve the above problems, the invention discloses a kind of compound low temperature resistant handling process of sunlight board.
In order to reach object above, the present invention provides following technical scheme:
A kind of compound low temperature resistant handling process of sunlight board, it is characterised in that:Concretely comprise the following steps:
(1)Grinding process:Sunlight board is polished;
(2)Pneumatic conveying drying treatment:Sunlight board after grinding process is carried out into high pressure air-blowing with pure nitrogen gas, point 3~5 air-blowings, often
Secondary 0.5~3s, air-blowing number of times is more, and each air-blowing time is shorter;
(3)Sunlight board surface coarsening:Sunlight board after pneumatic conveying drying is processed is immersed in micro-corrosion liquid, according to 2~5 DEG C/min's
Micro-corrosion liquid is warming up to 35~50 DEG C by speed, and is incubated taking-up after 25~30min;Neutralizer is prepared, neutralizer is warming up to 35
~50 DEG C, sunlight board is put into neutralizer, is taken out after 10~15min of immersion;Plastics are irradiated using uviol lamp finally,
Take out standby after continuing 20~30min;
(4)Prepare low temperature resistant layer:Prepare raw material according to following mass percent:PET resin:60~80%, low temperature resistant auxiliary agent:10
~35%, nucleator:8~12%;During PET resin is put into mixer, heats, stir;It is stirring evenly and then adding into low temperature resistant
Auxiliary agent and nucleator;Through extruding machine extrusion, to be cooled to particle standby after stirring;
(5)Plate low temperature resistant layer:By step(5)Middle particle is sprayed on what is processed by surface coarsening using HVOF technology
The surface of sunlight board, and it is cooled to room temperature;
(6)Vacuum drying treatment:By step(6)The sunlight board for obtaining is placed into pressurized tank, by pressurized tank suction extremely
0.08Mpa~0.09Mpa, is kept for 30~60 minutes;
(7)First pressing is combined:Need compound sunlight board carries out cold taking out on first line ball;Being sent to afterwards carries out heat in heating chamber
Take out;
(8)High pressure is combined:Sunlight board of the first pressing after compound is placed in high-temperature high-pressure tank, temperature 110 DEG C is risen to, with temperature
Degree is raised, and pressure rises to 3.5~5bar, and hereafter temperature rises to 130~150 DEG C, and ftercompction is to 10~13bar;Then by high temperature
Temperature and pressure in pressure pan is controlled at 130~150 DEG C and 10~13bar respectively, is kept for 30~50 minutes;Finally by temperature
40~50 DEG C are down to, and carry out pressure release, composite sunlight board is taken out afterwards.
A kind of compound low temperature resistant handling process of sunlight board of the invention, carries out grinding process to sunlight board first, it is ensured that
Sunlight board smoothness of the surface and shape specification are neat, and then take pneumatic conveying drying to process, convenient follow-up to sunlight plate surface
Working process.
Roughening treatment then is carried out to sunlight plate surface, sunlight board is immersed in micro-corrosion liquid, then by neutralizer
With, to be irradiated finally by ultraviolet, the sunlight board treated by surface coarsening can effectively be adsorbed and be sprayed on the resistance to low of its surface
Warm layer, with preferable adsorptivity, it is to avoid plate after low temperature resistant layer and the phenomenons such as loose, bubbling, decortication occur.
Then low temperature resistant layer is prepared, and the sunlight board processed by surface coarsening is sprayed on using HVOF technology
Surface, and be cooled to room temperature, then take vacuum drying treatment, obtaining adsorption has the sunlight board of low temperature resistant layer, this hair
It is primary raw material that bright low temperature resistant layer uses PET resin so that sunlight board after low temperature resistant layer on surface spraying, still with compared with
Good translucency.
To finally need compound sunlight board to carry out first pressing successively to be combined and high pressure Combined Processing, compound cold the taking out of first pressing makes
The air between compound adjacent about two sunlight board must be needed to pump 70%, then taken out by heat and extracted the air around sunlight board, will
Sunlight board is combined with each other, and high pressure is combined so that the sunlight board after first pressing Combined Processing is further combined, and improves sun
The plyability and stability of tabula rasa.
Further, the step(3)In the constituent of micro-corrosion liquid and the percent by volume of each composition be respectively:
Sulfuric acid:10~15%, sodium sulphate high:35~60%, ammonium permanganate:15~20%, oxalic acid:15~18%, glycerine:10~20%;It is described
Neutralizer is:The mass percent concentration of NaOH is 35~40% sodium hydroxide solution.
Further, the step(7)In the cold pressure taken out with heat of taking out be -0.08~-0.1MPa.
Compared with prior art, the beneficial effects of the present invention are:It is of the invention to be combined low temperature resistant place with traditional sunlight board
Science and engineering skill is compared, and pre-treatment is carried out to sunlight board by polishing, pneumatic conveying drying and surface coarsening, is then sprayed by high-speed flame
Painting technology to rational proportion on sunlight board surface spraying low temperature resistant layer, and be finally vacuum dried, first pressing is compound and high pressure
It is compound, obtain the thicker sunlight board of compound multilayer, it is ensured that the stability and lower temperature resistance of composite sunlight board.Therefore it is of the invention
Have the beneficial effect that:(1)Handling process is simple, and process time is short;(2)Required processing cost is low;(3)Both improve sunlight board
Lower temperature resistance, reduces its black brittleness, in turn ensure that the stability of composite sunlight board, with preferable market prospects.
Specific embodiment
With reference to specific embodiment, the present invention is furture elucidated, it should be understood that following specific embodiments are only used for
The bright present invention rather than limitation the scope of the present invention.
Embodiment 1
A kind of compound low temperature resistant handling process of sunlight board, concretely comprises the following steps:
(1)Grinding process:Sunlight board is polished;
(2)Pneumatic conveying drying treatment:Sunlight board after grinding process is carried out into high pressure air-blowing with pure nitrogen gas, point 3 air-blowings, every time
3s;
(3)Sunlight board surface coarsening:Sunlight board after pneumatic conveying drying is processed is immersed in micro-corrosion liquid, the constituent of micro-corrosion liquid
And the percent by volume of each composition is respectively:Sulfuric acid:15%th, sodium sulphate high:42%th, ammonium permanganate:15%th, oxalic acid:18%th, it is sweet
Oil:10%;Micro-corrosion liquid is warming up to 35 DEG C by the speed according to 2 DEG C/min, and is incubated taking-up after 25min;Neutralizer is prepared, by
35 DEG C are warming up to liquid, sunlight board is put into the sodium hydroxide solution that the mass percent concentration of NaOH is 35%, soaked
Taken out after 10min;Plastics are irradiated using uviol lamp finally, take out standby after continuing 20min;
(4)Prepare low temperature resistant layer:Prepare raw material according to following mass percent:PET resin:80%th, low temperature resistant auxiliary agent:10%th, into
Core agent:10%;During PET resin is put into mixer, heats, stir;It is stirring evenly and then adding into low temperature resistant auxiliary agent and nucleation
Agent;Through extruding machine extrusion, to be cooled to particle standby after stirring;
(5)Plate low temperature resistant layer:By step(5)Middle particle is sprayed on what is processed by surface coarsening using HVOF technology
The surface of sunlight board, and it is cooled to room temperature;
(6)Vacuum drying treatment:By step(6)The sunlight board for obtaining is placed into pressurized tank, by pressurized tank suction extremely
0.08Mpa, is kept for 30 minutes;
(7)First pressing is combined:Need compound sunlight board carries out cold taking out on first line ball;Being sent to afterwards carries out heat in heating chamber
Take out;Wherein, the cold pressure taken out with heat of taking out is -0.08MPa;
(8)High pressure is combined:Sunlight board of the first pressing after compound is placed in high-temperature high-pressure tank, temperature 110 DEG C is risen to, with temperature
Degree is raised, and pressure rises to 3.5bar, and hereafter temperature rises to 150 DEG C, and ftercompction is to 10bar;Then by the temperature in high-temperature high-pressure tank
Degree and pressure are controlled at 150 DEG C and 10bar respectively, are kept for 30 minutes;50 DEG C are finally cooled the temperature to, and carries out pressure release, afterwards
Take out composite sunlight board.
Embodiment 2
A kind of compound low temperature resistant handling process of sunlight board, concretely comprises the following steps:
(1)Grinding process:Sunlight board is polished;
(2)Pneumatic conveying drying treatment:Sunlight board after grinding process is carried out into high pressure air-blowing with pure nitrogen gas, point 4 air-blowings, every time
2s, air-blowing number of times is more, and each air-blowing time is shorter;
(3)Sunlight board surface coarsening:Sunlight board after pneumatic conveying drying is processed is immersed in micro-corrosion liquid, the constituent of micro-corrosion liquid
And the percent by volume of each composition is respectively:Sulfuric acid:14%th, sodium sulphate high:40%th, ammonium permanganate:16%th, oxalic acid:17%th, it is sweet
Oil:13%;Micro-corrosion liquid is warming up to 40 DEG C by the speed according to 3 DEG C/min, and is incubated taking-up after 28min;Neutralizer is prepared, by
40 DEG C are warming up to liquid, sunlight board is put into the sodium hydroxide solution that the mass percent concentration of NaOH is 38%, soaked
Taken out after 12min;Plastics are irradiated using uviol lamp finally, take out standby after continuing 25min;
(4)Prepare low temperature resistant layer:Prepare raw material according to following mass percent:PET resin:70%th, low temperature resistant auxiliary agent:20%th, into
Core agent:10%;During PET resin is put into mixer, heats, stir;It is stirring evenly and then adding into low temperature resistant auxiliary agent and nucleation
Agent;Through extruding machine extrusion, to be cooled to particle standby after stirring;
(5)Plate low temperature resistant layer:By step(5)Middle particle is sprayed on what is processed by surface coarsening using HVOF technology
The surface of sunlight board, and it is cooled to room temperature;
(6)Vacuum drying treatment:By step(6)The sunlight board for obtaining is placed into pressurized tank, by pressurized tank suction extremely
0.085Mpa, is kept for 45 minutes;
(7)First pressing is combined:Need compound sunlight board carries out cold taking out on first line ball;Being sent to afterwards carries out heat in heating chamber
Take out;Wherein, the cold pressure taken out with heat of taking out is -0.085MPa;
(8)High pressure is combined:Sunlight board of the first pressing after compound is placed in high-temperature high-pressure tank, temperature 110 DEG C is risen to, with temperature
Degree is raised, and pressure rises to 4.5bar, and hereafter temperature rises to 145 DEG C, and ftercompction is to 12bar;Then by the temperature in high-temperature high-pressure tank
Degree and pressure are controlled at 145 DEG C and 12bar respectively, are kept for 45 minutes;45 DEG C are finally cooled the temperature to, and carries out pressure release, afterwards
Take out composite sunlight board.
Embodiment 3
A kind of compound low temperature resistant handling process of sunlight board, concretely comprises the following steps:
(1)Grinding process:Sunlight board is polished;
(2)Pneumatic conveying drying treatment:Sunlight board after grinding process is carried out into high pressure air-blowing with pure nitrogen gas, point 5 air-blowings, every time
0.5s, air-blowing number of times is more, and each air-blowing time is shorter;
(3)Sunlight board surface coarsening:Sunlight board after pneumatic conveying drying is processed is immersed in micro-corrosion liquid, the constituent of micro-corrosion liquid
And the percent by volume of each composition is respectively:Sulfuric acid:10%th, sodium sulphate high:50%th, ammonium permanganate:15%th, oxalic acid:15%th, it is sweet
Oil:10%;Micro-corrosion liquid is warming up to 50 DEG C by the speed according to 5 DEG C/min, and is incubated taking-up after 30min;Neutralizer is prepared, by
50 DEG C are warming up to liquid, sunlight board is put into the sodium hydroxide solution that the mass percent concentration of NaOH is 40%, soaked
Taken out after 15min;Plastics are irradiated using uviol lamp finally, take out standby after continuing 30min;
(4)Prepare low temperature resistant layer:Prepare raw material according to following mass percent:PET resin:60%th, low temperature resistant auxiliary agent:28%th, into
Core agent:12%;During PET resin is put into mixer, heats, stir;It is stirring evenly and then adding into low temperature resistant auxiliary agent and nucleation
Agent;Through extruding machine extrusion, to be cooled to particle standby after stirring;
(5)Plate low temperature resistant layer:By step(5)Middle particle is sprayed on what is processed by surface coarsening using HVOF technology
The surface of sunlight board, and it is cooled to room temperature;
(6)Vacuum drying treatment:By step(6)The sunlight board for obtaining is placed into pressurized tank, by pressurized tank suction extremely
0.09Mpa, is kept for 60 minutes;
(7)First pressing is combined:Need compound sunlight board carries out cold taking out on first line ball;Being sent to afterwards carries out heat in heating chamber
Take out;Wherein, the cold pressure taken out with heat of taking out is -0.1MPa;
(8)High pressure is combined:Sunlight board of the first pressing after compound is placed in high-temperature high-pressure tank, temperature 110 DEG C is risen to, with temperature
Degree is raised, and pressure rises to 5bar, and hereafter temperature rises to 130 DEG C, and ftercompction is to 13bar;Then by the temperature in high-temperature high-pressure tank
Controlled respectively with pressure at 130 DEG C and 13bar, kept for 30 minutes;50 DEG C are finally cooled the temperature to, and carries out pressure release, Zhi Houqu
Go out composite sunlight board.
Claims (3)
1. the compound low temperature resistant handling process of a kind of sunlight board, it is characterised in that:Concretely comprise the following steps:
(1)Grinding process:Sunlight board is polished;
(2)Pneumatic conveying drying treatment:Sunlight board after grinding process is carried out into high pressure air-blowing with pure nitrogen gas, point 3~5 air-blowings, often
Secondary 0.5~3s, air-blowing number of times is more, and each air-blowing time is shorter;
(3)Sunlight board surface coarsening:Sunlight board after pneumatic conveying drying is processed is immersed in micro-corrosion liquid, according to 2~5 DEG C/min's
Micro-corrosion liquid is warming up to 35~50 DEG C by speed, and is incubated taking-up after 25~30min;Neutralizer is prepared, neutralizer is warming up to 35
~50 DEG C, sunlight board is put into neutralizer, is taken out after 10~15min of immersion;Plastics are irradiated using uviol lamp finally,
Take out standby after continuing 20~30min;
(4)Prepare low temperature resistant layer:Prepare raw material according to following mass percent:PET resin:60~80%, low temperature resistant auxiliary agent:10
~35%, nucleator:8~12%;During PET resin is put into mixer, heats, stir;It is stirring evenly and then adding into low temperature resistant
Auxiliary agent and nucleator;Through extruding machine extrusion, to be cooled to particle standby after stirring;
(5)Plate low temperature resistant layer:By step(5)Middle particle is sprayed on what is processed by surface coarsening using HVOF technology
The surface of sunlight board, and it is cooled to room temperature;
(6)Vacuum drying treatment:By step(6)The sunlight board for obtaining is placed into pressurized tank, by pressurized tank suction extremely
0.08Mpa~0.09Mpa, is kept for 30~60 minutes;
(7)First pressing is combined:Need compound sunlight board carries out cold taking out on first line ball;Being sent to afterwards carries out heat in heating chamber
Take out;
(8)High pressure is combined:Sunlight board of the first pressing after compound is placed in high-temperature high-pressure tank, temperature 110 DEG C is risen to, with temperature
Degree is raised, and pressure rises to 3.5~5bar, and hereafter temperature rises to 130~150 DEG C, and ftercompction is to 10~13bar;Then by high temperature
Temperature and pressure in pressure pan is controlled at 130~150 DEG C and 10~13bar respectively, is kept for 30~50 minutes;Finally by temperature
40~50 DEG C are down to, and carry out pressure release, composite sunlight board is taken out afterwards.
2. the compound low temperature resistant handling process of a kind of sunlight board according to claim 1, it is characterised in that:The step
(3)In the constituent of micro-corrosion liquid and the percent by volume of each composition be respectively:Sulfuric acid:10~15%, sodium sulphate high:35
~60%, ammonium permanganate:15~20%, oxalic acid:15~18%, glycerine:10~20%;The neutralizer is:The quality of NaOH
Percent concentration is 35~40% sodium hydroxide solution.
3. the compound low temperature resistant handling process of a kind of sunlight board according to claim 1, it is characterised in that:The step
(7)In the cold pressure taken out with heat of taking out be -0.08~-0.1MPa.
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CN201611125980.3A CN106799884A (en) | 2016-12-09 | 2016-12-09 | A kind of compound low temperature resistant handling process of sunlight board |
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CN201611125980.3A CN106799884A (en) | 2016-12-09 | 2016-12-09 | A kind of compound low temperature resistant handling process of sunlight board |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102093679A (en) * | 2011-01-24 | 2011-06-15 | 上海自立塑料制品有限公司 | Low temperature resistant poly(ethylene terephthalate) (PET) plastic pack belt and preparation method thereof |
CN102503189A (en) * | 2011-10-31 | 2012-06-20 | 北京北玻安全玻璃有限公司 | Film clamping method of oversized laminated glass |
CN103726052A (en) * | 2013-11-27 | 2014-04-16 | 苏州市丰盛塑业有限公司 | Surface treatment technology of engineering plastic |
CN104017231A (en) * | 2014-06-16 | 2014-09-03 | 滁州市宏源喷涂有限公司 | Plastic surface treatment technique |
CN104045844A (en) * | 2014-06-16 | 2014-09-17 | 滁州市宏源喷涂有限公司 | Surface treatment process for enhancing low-temperature resistance of plastic |
-
2016
- 2016-12-09 CN CN201611125980.3A patent/CN106799884A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102093679A (en) * | 2011-01-24 | 2011-06-15 | 上海自立塑料制品有限公司 | Low temperature resistant poly(ethylene terephthalate) (PET) plastic pack belt and preparation method thereof |
CN102503189A (en) * | 2011-10-31 | 2012-06-20 | 北京北玻安全玻璃有限公司 | Film clamping method of oversized laminated glass |
CN103726052A (en) * | 2013-11-27 | 2014-04-16 | 苏州市丰盛塑业有限公司 | Surface treatment technology of engineering plastic |
CN104017231A (en) * | 2014-06-16 | 2014-09-03 | 滁州市宏源喷涂有限公司 | Plastic surface treatment technique |
CN104045844A (en) * | 2014-06-16 | 2014-09-17 | 滁州市宏源喷涂有限公司 | Surface treatment process for enhancing low-temperature resistance of plastic |
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Application publication date: 20170606 |