CN106793716B - The radiator and robot of robot control mainboard - Google Patents
The radiator and robot of robot control mainboard Download PDFInfo
- Publication number
- CN106793716B CN106793716B CN201710112850.4A CN201710112850A CN106793716B CN 106793716 B CN106793716 B CN 106793716B CN 201710112850 A CN201710112850 A CN 201710112850A CN 106793716 B CN106793716 B CN 106793716B
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- CN
- China
- Prior art keywords
- control mainboard
- cooling fin
- robot control
- radiator
- heater
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
Abstract
The embodiment of the invention discloses the radiators and robot of a kind of robot control mainboard, comprising: cooling fin and thermal grease.Wherein, cooling fin is offered for storing protrusion in the storage space of the robot control mainboard surface heater；Thermal grease is filled in the connection heater and the cooling fin in the storage space, and by the heat transfer in the cooling fin into the thermal grease.By attaching cooling fin in robot control mainboard, increase the heat dissipation area of robot control mainboard, and it is opened up on a heat sink for storing protrusion in the storage space of robot control mainboard surface heater, it is connected between storage space and heater by thermal grease, the connection between cooling fin and robot control mainboard can be made more close, and the thermal conduction rate between heater and cooling fin can be made higher, increase the radiating efficiency of radiator.
Description
Technical field
The present embodiments relate to heat transfer field, the especially a kind of radiator and machine of robot control mainboard
People.
Background technique
With the development of mobile communication, computer and Internet technology, intelligent robot is due to its small volume, processing
Ability is strong, is widely used in the fields such as education, scientific research or safety, and the approval by user.Along with intelligent robot
Development, the higher robot of degree of intelligence requires the processing capacity of its CPU more powerful, and the processing speed of CPU has with it
The rate of heat dispation of radiator is closely bound up.
In the prior art, there are mainly two types of the radiating principles of the radiator provided: one kind is water cooled heat radiating, in addition one
Kind is air-cooled heat dissipation.Wherein, water cooled heat radiating is to be set to the pipeline paving for filling heat absorption liquid to be equipped on the mainboard of CPU,
It is radiated by making heat absorption liquid carry out flowing, water cooled heat radiating has stronger heat-sinking capability, but needs biggish dissipate
Heat space can make it play a role；Air-cooled heat dissipation is equipped with by the way that cooling fin made of heat sink material to be attached at
On the mainboard of CPU, and by fan drive inner space air-flow carry out flowing radiate, air-cooled heat dissipation can be suitable for compared with
Heat dissipation in small space, but since air-cooled heat dissipation is radiated by the way of fan rotation, it is unfavorable to be easy to produce noise
In the intelligent robot controlled using phonetic order.
The inventor of the invention has found that water-cooled power converter in the prior art is due to occupied space under study for action
It is larger, it can not be mounted on inside the limited intelligent robot in space and radiate；And air-cooled radiator when work due to producing
Raw noise is larger, can not be suitable for the intelligent robot by voice command control.Therefore, inventor needs to develop one kind
It can be used in small space, not generate noise and the radiator with good heat radiating function.
Summary of the invention
The embodiment of the present invention is mainly solving the technical problems that provide the radiator and machine of a kind of robot control mainboard
Device people is able to use the radiator in intelligent robot.
In order to solve the above technical problems, the technical solution that the embodiment of the invention uses is: providing a kind of machine
The radiator of the radiator of device people's control mainboard, the robot control mainboard includes:
Cooling fin is offered for storing protrusion in the storage space of the robot control mainboard surface heater；
Thermal grease, is filled in the connection heater and the cooling fin in the storage space, and by the heat dissipation
Heat transfer in piece is into the thermal grease.
Optionally, the storage space is that the cooling fin invaginates the accommodating groove to be formed towards the heater side, institute
When stating cooling fin and being attached at the robot control mainboard, the heater is accommodated in the accommodating groove.
Optionally, the thermal grease is filled in the gap between the accommodating groove and the heater.
Optionally, the storage space is the glove hole being opened on the cooling fin, and the cooling fin is attached at described
When robot control mainboard, the heater is located at or is pierced by the glove hole.
Optionally, the thermal grease is filled in the gap between the glove hole and the heater, and is raised in
The fin surface.
Optionally, the cooling fin is equipped with several deformations, institute backwards to a side surface of the robot control mainboard
It states deformations one end to be connected on the cooling fin, the deformations other end is hanging；
The deformations are made of memory metal material, when the deformations temperature reaches default deformation temperature, the shape
The hanging one end in change portion carries out deformation to the direction far from the cooling fin.
Optionally, several described deformations are regularly arranged forms deformation heat dissipation matrix in the fin surface.
Optionally, the deformations are obliquely installed, so that adjacent two column deformations width side in deformation heat dissipation matrix
To extended line formed angle be acute angle；
The flow channel of air-flow displacement is formed between the adjacent two column deformations.
Optionally, the air-flow flowing between the two neighboring flow channel is contrary, to accelerate the deformation to dissipate
The air of hot internal matrix flows.
Optionally, the thermal grease includes following weight: 2-5 parts of silane coupling agent, 2-3 parts of graphene, two
2-6 parts of silica, 2-6 parts of cumyl peroxide, 70-100 parts of vinyl silicone oil, 3-5 parts of reinforcing agent and 3-6 parts of plasticizer.
Optionally, thermal dispersant coatings are coated on the cooling fin.
Optionally, the thermal dispersant coatings include following weight: 5-10 parts of nanometer heat sink material, 1-3 parts of graphene
With 20-100 parts of carrier material.
Optionally, the nanometer heat sink material is silica, antimony trichloride, cobalt dioxide, ferrous oxide, copper dioxide
One or more mixtures in the middle.
Optionally, the carrier material is polyurethane series, epoxy resin, polyurethane resin system, polyester or fluoroolefins-second
Alkene ether (ester) copolymer coating.
In order to solve the above technical problems, the embodiment of the present invention also provides a kind of robot, it is provided in the robot
State the radiator of the robot control mainboard in technical solution.
The beneficial effect of the embodiment of the present invention is: by attaching cooling fin in robot control mainboard, increasing machine
The heat dissipation area of people's control mainboard, and opened up on a heat sink for storing protrusion in robot control mainboard surface heater
Storage space is connected between storage space and heater by thermal grease, can make cooling fin and robot control mainboard it
Between connection it is more close, and the thermal conduction rate between heater and cooling fin can be made higher, increase radiator
Radiating efficiency.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those skilled in the art, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the construction for heat radiating device schematic diagram of robot of embodiment of the present invention control mainboard；
Fig. 2 is the first embodiment schematic diagram of cooling fin in the embodiment of the present invention；
Fig. 3 is second of embodiment schematic diagram of cooling fin in the embodiment of the present invention；
Fig. 4 is the third embodiment schematic diagram of cooling fin in the embodiment of the present invention；
Fig. 5 is the heat sink structure illustration that the invention of this reality applies that example is formed with deformation heat dissipation matrix；
Fig. 6 is a kind of embodiment of air-flow flow channel in deformation of embodiment of the present invention heat dissipation matrix；
Fig. 7 is the overall schematic of air-flow flow channel in deformation of embodiment of the present invention heat dissipation matrix.
Description of symbols: 100, robot control mainboard；200, cooling fin；210, accommodation space；211, glove hole；
212, accommodating groove；220, deformations；230, deformation heat dissipation matrix.
Specific embodiment
To facilitate the understanding of the present invention, in the following with reference to the drawings and specific embodiments, the present invention will be described in more detail.
It should be noted that be expressed " being fixed on " another element when element, it can directly on the other element or therebetween
There may be one or more elements placed in the middle.When an element is expressed " connection " another element, it, which can be, directly connects
It is connected to another element or there may be one or more elements placed in the middle therebetween.Term used in this specification is " vertical
", " horizontal ", "left", "right" and similar statement for illustrative purposes only.
Unless otherwise defined, technical and scientific term all used in this specification is led with technology of the invention is belonged to
The normally understood meaning of the technical staff in domain is identical.Used term is only in the description of the invention in this specification
The purpose of description specific embodiment is not intended to the limitation present invention.Term "and/or" used in this specification includes one
Any and all combinations of a or multiple relevant listed items.
Embodiment 1
Referring to Fig. 1, Fig. 1 is the construction for heat radiating device schematic diagram of robot of embodiment of the present invention control mainboard 100.
As shown in Figure 1, a kind of radiator of robot control mainboard 100, the radiator of robot control mainboard 100
It include: cooling fin 200 and thermal grease.Wherein, cooling fin 200 is offered for storing protrusion in robot control mainboard 100
The storage space of surface heater；Thermal grease is filled in connection heater and cooling fin 200 in storage space, and by cooling fin
Heat transfer in 200 is into thermal grease.
Cooling fin 200 be particularly configured to the 100 consistent panel of appearance profile of robot control mainboard, cooling fin 200 with
100 appearance profile of robot control mainboard is consistent, under the premise of cooling fin 200 can be made to be not take up additional physical space, to the greatest extent
It is possible to increase the heat dissipation area of cooling fin 200, to accelerate the heat dissipation area of cooling fin 200, be conducive to quickly reduce control
The temperature of mainboard.In some preferred embodiments, cooling fin 200 is particularly configured to rectangular faceplate, but cooling fin 200 is outer
Shape shape is not limited to and this, can select cooling fin 200 of different shapes, main selection according to different application scenarios
Standard is that the concrete shape of cooling fin 200 is consistent with robot 100 appearance profiles of control mainboard.
Its main body of robot control mainboard 100 is printed circuit board, and cpu chip on a printed circuit is arranged,
Wherein CPU is the control centre of entire robot control mainboard 100, also the main hair in robot control mainboard 100
Hot body.Main heater (not shown) in present embodiment in robot control mainboard 100 is not limited to this, in some selections
In property embodiment, the heater in robot control mainboard 100 includes but is not limited to: north bridge chips, South Bridge chip, network interface card core
The electronic components heaters such as piece, sound card chip, resistance, capacitor or transistor.Heater distribution in robot control mainboard 100
In the different zones of printed circuit board, specific location is different according to the wire laying mode of various boards.
It is provided with the accommodation space 210 for storing heater in robot control mainboard 100 on cooling fin 200, accommodates
The specific form in space 210 includes that invaginate the groove profile to be formed storage sky for 200 object manipulator control mainboard of cooling fin, 100 side
Between, or the pass storage space being opened on cooling fin 200.Storage space is specifically located at cooling fin 200 corresponding to machine
The position of the heater of people's control mainboard 100, i.e., when cooling fin 200 is attached in robot control mainboard 100, storage space position
In the top of heater, and heater can be accommodated in storage space.The specific profile of storage space needs to be suitable for not
Shape with heater is adjusted, such as when the chip that heater is square, the cross section of corresponding storage space
Also it is square；When heater is rectangular chip, the cross section of corresponding storage space is rectangle；Similarly
The cross section of the cylindrical corresponding storage space of heater is circle.The cross-sectional area of accommodation space 210 is greater than heater
Cross-sectional area, therefore, after accommodation space 210 accommodates heater, there are certain skies between heater and accommodation space 210
Gap, in order to fill thermal grease in the gap.
It is connected between heater and cooling fin 200 by thermal grease, specifically, thermal grease is filled in heater and holds
In the gap received between space 210, to solve heater and 200 contact surface limited area of cooling fin, thermal conduction rate is slower
Problem.Thermal grease is a kind of low thermal resistance and high thermal conductivity, the Heat Conduction Material of high flexibility.The high flexibility having can subtract
Pressure needed between few component, while the surface of microcosmic out-of-flatness is covered to make component come into full contact with and improve hot biography
Efficiency is led, the heat transfer demand of limited space is particularly suitable for.Therefore, using thermal grease filling cooling fin 200 and radiator it
Between gap, the area of effective heat transfer between heater and cooling fin 200 can either be increased, additionally it is possible to make cooling fin 200
It is more secured with the connection of robot control mainboard 100, it will not be shaken when driving because of robot and cooling fin 200 is caused to fall off
The problem of, while buffering can also be played the role of.
Above embodiment increases robot control master by attaching cooling fin 200 in robot control mainboard 100
The heat dissipation area of plate 100, and open up on cooling fin 200 for storing protrusion in 100 surface heater of robot control mainboard
Storage space, connected between storage space and heater by thermal grease, cooling fin 200 and robot can be made to control and led
Connection between plate 100 is more close, and the thermal conduction rate between heater and cooling fin 200 can be made higher, increases
The radiating efficiency of radiator.
Referring to Fig. 2, Fig. 2 is the first embodiment schematic diagram of cooling fin 200 in the embodiment of the present invention.
As shown in Fig. 2, storage space is cooling fin 200 towards in heater side in some selective embodiments
The accommodating groove 212 formed is fallen into, when cooling fin 200 is attached at robot control mainboard 100, heater is accommodated in accommodating groove 212,
Thermal grease is filled in the gap between accommodating groove 212 and heater.
Specifically, storage space is that cooling fin 200 invaginates the accommodating groove 212 to be formed towards heater side, accommodating groove 212
Invagination, which is formed, makes protuberance on cooling fin 200 form hat protrusion, and accommodating groove 212 is specifically located at cooling fin 200 corresponding to machine
The position of the heater of people's control mainboard 100, i.e., when cooling fin 200 is attached in robot control mainboard 100, accommodating groove 212
Positioned at the top of heater, and heater can be accommodated in accommodating groove 212.The specific profile of accommodating groove 212 needs to be applicable in
It is adjusted in the shape of different heat body, such as when the chip that heater is square, the cross of corresponding accommodating groove 212
Section is also square；When heater is rectangular chip, the cross section of corresponding accommodating groove 212 is rectangle；
The cross section of the same cylindrical corresponding accommodating groove 212 of heater is circle.The cross-sectional area of accommodation space 210 is greater than hair
The cross-sectional area of hot body, therefore, after accommodation space 210 accommodates heater, there are certain between heater and accommodation space 210
Gap, in order to fill thermal grease in the gap.
It is connected between heater and accommodating groove 212 by thermal grease, specifically, thermal grease is filled in heater and receives
In the gap received between slot 212, to solve heater and 200 contact surface limited area of cooling fin, thermal conduction rate is slower to be asked
Topic.Thermal grease is injected into the gap between heater and accommodating groove 212 by way of heat injection molding, can not only be increased
Heat transfer area between heater and accommodating groove 212, and the stabilization connected between heater and accommodating groove 212 can be enhanced
Property.
Referring to Fig. 3, Fig. 3 is second of embodiment schematic diagram of cooling fin 200 in the embodiment of the present invention.
As shown in figure 3, storage space is that accommodation space 210 is to be opened in cooling fin in some selective embodiments
Glove hole 211 on 200, when cooling fin 200 is attached at robot control mainboard 100, heater is located at or is pierced by glove hole
211, thermal grease is filled in the gap between glove hole and heater, and is raised in 200 surface of cooling fin.
Specifically, storage space is the glove hole 211 opened up on cooling fin 200, and heater is placed in the glove hole 211
When, it is located inside glove hole 211, i.e., heater is not raised in the surface of cooling fin 200 or heater is pierced by glove hole 211, i.e.,
Heater is raised in the surface of cooling fin 200.Glove hole 211 is specifically located at cooling fin 200 corresponding to robot control mainboard
The position of 100 heater, i.e., when cooling fin 200 is attached in robot control mainboard 100, glove hole 211 is located at heater
Top, and heater can be accommodated in glove hole 211.The specific profile of glove hole 211 needs to be suitable for different heat
The shape of body is adjusted, and such as when the chip that heater is square, the cross section of corresponding glove hole 211 is also positive
It is rectangular；When heater is rectangular chip, the cross section of corresponding glove hole 211 is rectangle；Same cylinder
The cross section of the corresponding glove hole 211 of the heater of shape is circle.The cross-sectional area of accommodation space 210 is greater than the transversal of heater
Area, therefore, after accommodation space 210 accommodates heater, there are certain gap between heater and accommodation space 210, with
Convenient for filling thermal grease in the gap.
It is connected between heater and glove hole 211 by thermal grease, specifically, thermal grease is filled in heater and sets
In gap between object hole 211, and to make preferably to connect heater and glove hole 211, thermal grease deviates from cooling fin 200
The side of heater forms silica gel protrusion, and the cross-sectional area of silica gel protrusion is greater than the cross-sectional area of glove hole 211, to solve to generate heat
Body and 200 contact surface limited area of cooling fin, the slower problem of thermal conduction rate.Thermal grease is infused by way of heat injection molding
Enter into the gap between heater and glove hole 211, the heat transfer face between heater and glove hole 211 can not only be increased
Product, and the stability connected between heater and glove hole 211 can be enhanced.
The heat dissipation area of cooling fin 200 is limited to the image of the surface area of cooling fin 200, and the surface of cooling fin 200
Product is limited by 200 place space size of cooling fin again, and the space that intelligent robot is used to be arranged cooling fin 200 is limited, therefore
The heat dissipation area of cooling fin 200 inside intelligent robot is limited, is unable to get effective promotion.
In some selective embodiments, a kind of technical side that can effectively expand 200 heat dissipation area of cooling fin is provided
Case.
Referring to Fig. 4, Fig. 4 is the third embodiment schematic diagram of the present embodiment cooling fin 200.
As shown in figure 4, cooling fin 200 is equipped with several deformations 220, deformations 220 backwards to a side surface of robot
One end is connected on cooling fin 200, and 220 other end of deformations is hanging；Deformations 220 are made of memory metal material, deformations
When 220 temperature reach default deformation temperature, the hanging one end of deformations 220 carries out deformation to the direction far from cooling fin 200.
Specifically, cooling fin 200 is equipped with deformations 220, deformations backwards to a side surface of robot control mainboard 100
220 be specifically to be made of memory metal material, and the characteristic of memory metal material is the material internal when temperature reaches a certain numerical value
Crystal structure can change, so as to cause the variation of shape.The high-temperature-phase of marmem structure with higher
Symmetry, usually orderly cubic structure.Below Ms (initial temperature of martensite transfor mation) temperature, single-orientated high-temperature-phase
It is transformed into the martensite variants with different orientation.When making this material deformation element is made below Ms temperature, material
It is interior constantly to cut down with the disadvantaged martensite variants of stress direction；The then constantly growth being on a good wicket.Finally turn
Become the element for the orderly martensite for having single-orientated.As being heated to critical deformation temperature spot or more, this symmetry once again
Low, single-orientated martensite takes a turn for the worse when becoming, and forms previous single-orientated high-temperature-phase.Corresponding to this microcosmic
The reversible sex reversal of structure has just restored the macroshape of material at high temperature, and here it is so-called one-way shape memories.
Deformations 220 are particularly configured to four prisms cylinder, and one end of deformations 220 is connected to the surface of cooling fin 200, another
End is hanging.Deformations 220 at normal temperature when with the relative position of cooling fin 200 are as follows: 220 one end of deformations and cooling fin 200
Surface connects, and the angle formed between 200 surface of deformations 220 and cooling fin is less than 30 degree of acute angle.Deformations 220 exist
Relative position when reaching deformation temperature and issuing after deformation with cooling fin 200 are as follows: 220 one end of deformations and cooling fin 200
Surface connects, and the angle formed between 200 surface of deformations 220 and cooling fin is 90 degree.The concrete shape of deformations 220 is not
Be confined to four prisms cylinder, according to the difference of concrete application scene, the shape of deformations 220 can are as follows: cylindrical body, Elliptic Cylinder,
Triangular prism or other polygon prisms.
In some selective embodiments, the concrete shape of resettlement groove (not shown) resettlement groove is offered on cooling fin 200
Consistent with the concrete shape of deformations 220, when the temperature of deformations 220 is not up to deformation critical-temperature, deformations 220 are placed
In in resettlement groove, when the temperature in deformations 220 reaches deformation temperature, deformations 220 are placed perpendicular to resettlement groove.This implementation
Mode stores deformations 220, at room temperature by setting resettlement groove in order to install under room temperature to cooling fin 200.
Referring to Fig. 5, Fig. 5 is 200 structural schematic diagram of cooling fin that the present embodiment is formed with deformation heat dissipation matrix 230.
As shown in figure 5, several deformations 220 are regularly arranged on 200 surface of cooling fin in some selective embodiments
Form deformation heat dissipation matrix 230.
Specifically, the deformation heat dissipation matrix 230 of 5 specification of 6x, the composition of deformation heat dissipation matrix 230 are formed on cooling fin 200
It can make deformations 220 after deformation occurs, in the air communication channel of 200 surface formation rule of cooling fin, avoid deformations
220 disordered arrangements cause the phenomenon that hindering air circulation, effectively improve the radiating efficiency of cooling fin 200.By deformations 220
The specification for being formed in the deformation heat dissipation matrix 230 on 200 surface of cooling fin is not limited to above-mentioned cited specification, according to concrete application
The specification of the difference of scene, deformation heat dissipation matrix 230 also can be other different types of specifications.
Referring to Fig. 6, Fig. 6 is a kind of embodiment of air-flow flow channel in the present embodiment deformation heat dissipation matrix 230.
As shown in fig. 6, deformations 220 are obliquely installed in some selectivity embodiments, the matrix 230 so that deformation is radiated
In adjacent two column deformations, 220 width direction extended line formed angle be acute angle；It is formed between adjacent two column deformations 220
The flow channel of air-flow displacement.
Specifically, 220 slant setting of deformations, deformations 220 are connected to cooling fin 200 in deformation heat dissipation matrix 230
On one end and 200 length direction of cooling fin on horizontal angle be greater than 45 degree angles, deformation radiate matrix 230 in be located at
The inclined angle of deformations 220 in same row is consistent, and is located at two adjacent in same horizontal line in adjacent two column
Deformations 220 are acute angle in the angle that the extended line of its width direction is formed.
Two radiating surfaces of two deformations 220 adjacent in same horizontal line are respectively positioned on same direction in adjacent two column,
One of phenomenon in air flowing is to expand with heat and contract with cold, radiating surface towards the direction that extends of direction be the radiating surface where
The air current flow direction in space, not only 220 radiating surface of adjacent two deformations in adjacent two column in same horizontal line but also be phase
Pair, therefore air flow direction power in a longitudinal direction is cancelled, then the air-flow flowing between adjacent two column be direction for along
Airflow channel between two column is oriented movement.
Tilted-putted deformations 220 make to form air-flow displacement between adjacent two column deformations 220, can make to radiate
The air-flow flowing on 200 surface of piece has more order, and air flow rate within the identical heat dissipation time with taking away with more heat fastly
Amount improves the rate of heat dispation of cooling fin 200.
Referring to Fig. 7, Fig. 7 is the overall schematic of air-flow flow channel in the present embodiment deformation heat dissipation matrix 230.
As shown in fig. 7, in some selectivity embodiments, the direction phase of the air-flow flowing between two neighboring flow channel
Instead, to accelerate the air flowing inside deformation heat dissipation matrix 230.
Specifically, due to being located at two deformations 220 adjacent in same horizontal line in adjacent two column in its width direction
Extended line formed angle be acute angle, cause the air-flow between two neighboring flow channel to flow contrary, radiating
200 surface of piece forms cross-ventilation.
Between two neighboring flow channel air-flow flowing it is contrary, 200 surface of cooling fin formed cross-ventilation,
The air velocity that can make 200 surface of cooling fin faster, improves the rate of heat dispation of cooling fin 200.
In some selective embodiments, thermal grease used in the present embodiment includes following weight: silicon
2-5 parts of alkane coupling agent, 2-3 parts of graphene, 2-6 parts of silica, 2-6 parts of cumyl peroxide, vinyl silicone oil 70-100
Part, 3-5 parts of reinforcing agent and 3-6 parts of plasticizer.
Specifically, it is illustrated with 1 part of ratio corresponding to 1 kilogram.
In some selective embodiments, thermal grease by 2kg silane coupling agent, 2kg graphene, 2kg silica,
2kg cumyl peroxide, 70kg vinyl silicone oil, 3kg reinforcing agent and 3kg plasticizer mix, by above-mentioned material when preparation
Material is mixed, and to make it with good mixing, is placed on after stirring quiet under the ultrasonic wave that power is 1000W or more
It sets, keeps raw material mixing more uniform.
In some selective embodiments, thermal grease by 5kg silane coupling agent, 3kg graphene, 6kg silica,
6kg cumyl peroxide, 100kg vinyl silicone oil, 5kg reinforcing agent and 6kg plasticizer mix, by above-mentioned material when preparation
Material is mixed, and to make it with good mixing, is placed on after stirring quiet under the ultrasonic wave that power is 1000W or more
It sets, keeps raw material mixing more uniform.
In some selective embodiments, thermal grease is by 2.5kg silane coupling agent, 1.5kg graphene, 4kg dioxy
SiClx, 4kg cumyl peroxide, 85kg vinyl silicone oil, 4kg reinforcing agent and 4.5kg plasticizer mix, will when preparation
Above-mentioned material is mixed, and to make it with good mixing, the ultrasonic wave that power is 1000W or more is placed on after stirring
Lower standing keeps raw material mixing more uniform.
Thermal grease used in the present embodiment is modified thermal grease by using grapheme material, makes to dissipate
The rate of heat dispation of hot silica gel is highly improved, and can be 3 times of common thermal grease or more.
In some selective embodiments, thermal dispersant coatings are coated on cooling fin 200.Thermal dispersant coatings are a kind of radiations heat energies
Coating, can emit the heat walked on cooling fin 200 in the form of 1-13.5 mum wavelength, reduce by 200 surface of cooling fin and inside
Temperature, radiating and cooling are obvious.Thermal dispersant coatings are not influenced by surrounding medium, can be used in vacuum environment, and thermal dispersant coatings are rising
While to radiation cooling, also there is good self-cleaning, anti-corrosive properties, waterproofness, fire line, insulating properties, antiacid alkali, easy for construction
The characteristics of.
In some selective embodiments, thermal dispersant coatings include following weight: 5-10 parts of nanometer heat sink material,
1-3 parts and carrier material 20-100 parts of graphene.
Specifically, it is illustrated with 1 part of ratio corresponding to 1 kilogram.
In some selective embodiments, thermal dispersant coatings are by 5kg nanometers of heat sink materials, 1kg graphene and 20kg carrier
Material mixes, and when preparation, above-mentioned material was mixed, and to make it with good mixing, is placed on function after stirring
It is stood under the ultrasonic wave that rate is 1000W or more, keeps raw material mixing more uniform.Wherein, nanometer heat sink material be silica,
Antimony trichloride, cobalt dioxide, ferrous oxide, one or more mixtures in copper dioxide.Carrier material is polyurethane
Any one in system, epoxy resin, polyurethane resin system, polyester or fluoroolefins-vinyl ethers (ester) copolymer coating.
In some selective embodiments, thermal dispersant coatings are carried by 10kg nanometers of heat sink materials, 3kg graphene and 100kg
Body material mixes, and when preparation, above-mentioned material was mixed, and to make it with good mixing, is placed on after stirring
It is stood under the ultrasonic wave that power is 1000W or more, keeps raw material mixing more uniform.Wherein, nanometer heat sink material is titanium dioxide
Silicon, antimony trichloride, cobalt dioxide, ferrous oxide, one or more mixtures in copper dioxide.Carrier material is poly- ammonia
It is any one in ester system, epoxy resin, polyurethane resin system, polyester or fluoroolefins-vinyl ethers (ester) copolymer coating
Kind.
In some selective embodiments, thermal dispersant coatings are carried by 7.5kg nanometers of heat sink materials, 2kg graphene and 60kg
Body material mixes, and when preparation, above-mentioned material was mixed, and to make it with good mixing, is placed on after stirring
It is stood under the ultrasonic wave that power is 1000W or more, keeps raw material mixing more uniform.Wherein, nanometer heat sink material is titanium dioxide
Silicon, antimony trichloride, cobalt dioxide, ferrous oxide, one or more mixtures in copper dioxide.Carrier material is poly- ammonia
It is any one in ester system, epoxy resin, polyurethane resin system, polyester or fluoroolefins-vinyl ethers (ester) copolymer coating
Kind.
Thermal dispersant coatings used in the present embodiment are modified thermal dispersant coatings by using grapheme material, make to dissipate
The rate of heat dispation of hot coating is highly improved, and can be the 2 times or more of common thermal grease.
In the present embodiment, the combination of main embodiment and any selective embodiment or main embodiment with
The combination of multiple selectivity embodiments, is the feasible technical solution of the present embodiment.
Embodiment 2
A kind of robot, robot include for the robot control mainboard equipped with robot C PU, robot control master
Radiator is pasted on plate, which is the radiator of robot control mainboard described in embodiment 1.
Robot is increased by attaching cooling fin in robot control mainboard using the robot of the radiator
The heat dissipation area of control mainboard, and opened up on a heat sink for storing protrusion in the receipts of robot control mainboard surface heater
It receives space, is connected, can be made between cooling fin and robot control mainboard by thermal grease between storage space and heater
Connection it is more close, and the thermal conduction rate between heater and cooling fin can be made higher, increase radiator
Radiating efficiency.
It should be noted that specification of the invention and its a better embodiment of the invention is given in the attached drawing, still,
The present invention can be realized by many different forms, however it is not limited to this specification described embodiment, these embodiments
Not as the additional limitation to the content of present invention, purpose of providing these embodiments is makes understanding to the disclosure
It is more thorough and comprehensive.Also, above-mentioned each technical characteristic continues to be combined with each other, and forms the various embodiments not being enumerated above,
It is considered as the range of description of the invention record；It further, for those of ordinary skills, can be according to the above description
It is improved or converted, and all these modifications and variations should all belong to the protection domain of appended claims of the present invention.
Claims (14)
1. a kind of radiator of robot control mainboard, which is characterized in that the radiator packet of the robot control mainboard
It includes:
Cooling fin is offered for storing protrusion in the storage space of the robot control mainboard surface heater；
Thermal grease is filled in the connection heater and the cooling fin in the storage space, and will be in the cooling fin
Heat transfer into the thermal grease；
The cooling fin is equipped with several deformations, described deformations one end backwards to a side surface of the robot control mainboard
It is connected on the cooling fin, the deformations other end is hanging；
The deformations are made of memory metal material, when the deformations temperature reaches default deformation temperature, the deformations
Hanging one end carries out deformation to the direction far from the cooling fin.
2. the radiator of robot control mainboard according to claim 1, which is characterized in that the storage space is institute
It states cooling fin to invaginate the accommodating groove to be formed towards the heater side, the cooling fin is attached at the robot control mainboard
When, the heater is accommodated in the accommodating groove.
3. the radiator of robot control mainboard according to claim 2, which is characterized in that the thermal grease filling
In gap between the accommodating groove and the heater.
4. the radiator of robot control mainboard according to claim 1, which is characterized in that the storage space is to open
Glove hole on the cooling fin, when the cooling fin is attached at the robot control mainboard, the heater is located at
Or it is pierced by the glove hole.
5. the radiator of robot control mainboard according to claim 4, which is characterized in that the thermal grease filling
In gap between the glove hole and the heater, and it is raised in the fin surface.
6. the radiator of robot control mainboard according to claim 1, which is characterized in that several described deformations
It is regularly arranged to form deformation heat dissipation matrix in the fin surface.
7. the radiator of robot control mainboard according to claim 6, which is characterized in that the deformations inclination is set
It sets, so that the angle that the extended line of adjacent two column deformations width direction is formed in deformation heat dissipation matrix is acute angle；
The flow channel of air-flow displacement is formed between the adjacent two column deformations.
8. the radiator of robot control mainboard according to claim 7, which is characterized in that the two neighboring flowing
Air-flow flowing between channel it is contrary, to accelerate the air flowing of deformation heat dissipation internal matrix.
9. the radiator of robot control mainboard described in any one according to claim 1~8, which is characterized in that described
Thermal grease includes following weight: 2-5 parts of silane coupling agent, 2-3 parts of graphene, 2-6 parts of silica, peroxidating two
2-6 parts of isopropylbenzene, 70-100 parts of vinyl silicone oil, 3-5 parts of reinforcing agent and 3-6 parts of plasticizer.
10. the radiator of robot control mainboard described in any one according to claim 1~8, which is characterized in that described
Thermal dispersant coatings are coated on cooling fin.
11. the radiator of robot control mainboard according to claim 10, which is characterized in that the thermal dispersant coatings packet
Include following weight: 5-10 parts of nanometer heat sink material, 1-3 parts of graphene and 20-100 parts of carrier material.
12. the radiator of robot control mainboard according to claim 11, which is characterized in that the nanometer heat dissipation material
Expect for one or more mixtures in silica, antimony trichloride, cobalt dioxide, ferrous oxide, copper dioxide.
13. the radiator of robot control mainboard according to claim 11, which is characterized in that the carrier material is
Polyurethane series, epoxy resin, polyurethane resin system, polyester or fluoroolefins-vinyl ethers (ester) copolymer coating.
14. a kind of robot, which is characterized in that the robot includes robot described in claim 1~13 any one
The radiator of control mainboard.
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| CN201710112850.4A CN106793716B (en) | 2017-02-28 | 2017-02-28 | The radiator and robot of robot control mainboard |
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| CN201710112850.4A CN106793716B (en) | 2017-02-28 | 2017-02-28 | The radiator and robot of robot control mainboard |
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| CN106793716B true CN106793716B (en) | 2019-05-31 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108673554A (en) * | 2018-08-30 | 2018-10-19 | 遨博（北京）智能科技有限公司 | A kind of joint of robot arm and robot |
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| CN201163857Y (en) * | 2008-03-11 | 2008-12-10 | 英业达科技有限公司 | Heat radiator |
| CN204408831U (en) * | 2015-02-04 | 2015-06-17 | 东莞市华鸿橡塑材料有限公司 | Solid conductive heat silica gel piece |
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| CN106793716A (en) | 2017-05-31 |
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