CN106793699B

CN106793699B - Heat dissipation module and electrical equipment

Info

Publication number: CN106793699B
Application number: CN201611249100.3A
Authority: CN
Inventors: 林志颖
Original assignee: Qisda Suzhou Co Ltd; Qisda Corp
Current assignee: Qisda Suzhou Co Ltd; Qisda Corp
Priority date: 2016-12-29
Filing date: 2016-12-29
Publication date: 2020-07-31
Anticipated expiration: 2036-12-29
Also published as: CN106793699A

Abstract

The invention provides a heat dissipation module and electrical equipment, wherein the electrical equipment comprises: a housing having a first outer surface, an interior space, and a first opening communicating the first outer surface with the interior space; a heat generating unit located in the inner space of the case; and a heat dissipation module, comprising: a heat conducting pipe; the heat absorption block is connected to the first end of the heat conduction pipe; and the radiating fin is connected to the second end of the heat conducting pipe; the heat sink is fixedly arranged on the first outer surface of the shell, and the heat absorption block is fixed in the inner space from the first opening of the shell corresponding to the heating unit by means of deformation of the heat conduction pipe during installation. Therefore, the heat dissipation structure is convenient to assemble and stable in heat dissipation effect.

Description

Heat dissipation module and electrical equipment

Technical Field

The invention relates to the field of heat dissipation modules and electrical equipment, in particular to an improved assembly structure of a heat dissipation module of electrical equipment.

Background

In general, a small electrical device (e.g., a computer) with low power consumption can be designed without a fan, a common method is to add a large-sized heat sink to a Central Processing Unit (CPU), and form a large number of air holes in a casing to dissipate heat by passive heat convection, but in actual operation, due to the limitation of the appearance and function of the casing, the proportion of the area of the opening in the casing is limited, so the small electrical device is often used for electrical devices with less than 10W of CPU power consumption.

In the conventional design, referring to fig. 1, in order to ensure that the heat conducting paste (or pad) 22a of the heat dissipation block 2a and the cpu 4a are continuously pressed together, the heat dissipation structure needs to be designed by fastening the motherboard 5a and the housing 1a via the fastening device 3a, and therefore, the motherboard 5a has many joints, which are required to be fastened together first and then the motherboard 5a is fastened to the housing 1a in reverse, which increases the trouble of the assembly process.

Referring to fig. 2 again, the motherboard 5a is fixed to the lower housing 12a of the housing 1a, and the protrusion 22b is disposed on the upper housing 11a made of metal facing the cpu 4a to transfer heat of the cpu 4a, and this assembly method makes it difficult to control the gap distance between the cpu 4a and the protrusion 22b, and only the protrusion 22b can be formed by a thicker heat conductive pad to absorb assembly tolerance, which may cause a decrease in heat conductive performance, and after long-term use, the heat conductive pad may be hardened to generate a gap, which may affect the heat conductive effect. Or referring to fig. 3, providing the heat conductive pipes 23a between the case 1a and the protrusions 22b also has a problem that assembly tolerance needs to be overcome.

Therefore, it is necessary to design a new heat dissipation module and an electrical apparatus to overcome the above-mentioned drawbacks.

Disclosure of Invention

The invention aims to provide a heat dissipation module and electrical equipment, which can be conveniently assembled and have stable heat dissipation effect.

To achieve the above object, the present invention provides an electric apparatus including: a housing having a first outer surface, an interior space, and a first opening communicating the first outer surface with the interior space; a heat generating unit located in the inner space of the case; and a heat dissipation module, comprising: a heat conducting pipe; the heat absorption block is connected to the first end of the heat conduction pipe; and the radiating fin is connected to the second end of the heat conducting pipe; the heat sink is fixedly arranged on the first outer surface of the shell, and the heat absorption block is fixed in the inner space from the first opening of the shell corresponding to the heating unit by means of deformation of the heat conduction pipe during installation.

Preferably, the electrical equipment further comprises a locking element, when installed, the locking element can be operated at the first opening, the heat absorption block is fixed relative to the heating unit by the locking element, and heat of the heating unit can be transferred from the heat absorption block to the heat dissipation fin through the heat conduction pipe.

Preferably, the housing has an upper housing and a lower housing, the upper housing has the first outer surface, and when the upper housing is assembled with respect to the lower housing, the first opening faces the heat generating unit.

Preferably, the electrical equipment further includes a cover disposed on the first outer surface and covering the first opening.

Preferably, the heat sink has a plurality of fins and a heat dissipation substrate, one surface of the heat dissipation substrate is disposed on the first outer surface, and the other surface of the heat dissipation substrate is disposed with the plurality of fins.

Preferably, the heat absorbing block is attached to the heat generating unit or a gap is formed between the heat absorbing block and the heat generating unit.

Preferably, the heat absorbing block is made of a metal material.

Preferably, the first end of the heat conducting pipe is embedded in the heat absorbing block, and the second end of the heat conducting pipe is embedded in the heat dissipating fin.

Preferably, the heat conducting pipe has a plurality of pipes.

In order to achieve the above object, the present invention provides a heat dissipation module for dissipating heat of an electrical device, the electrical device having a housing and a heat generating unit, the heat generating unit being located in an inner space of the housing, the heat dissipation module comprising: a heat conducting pipe; the heat absorption block is connected to the first end of the heat conduction pipe; and the radiating fin is connected to the second end of the heat conducting pipe; the heat sink is disposed on the first outer surface of the housing, and the heat sink is fixed in the inner space from the first opening of the housing corresponding to the heat generating unit by deformation of the heat pipe.

Compared with the prior art, the heat dissipation module and the electrical equipment provided by the invention have the advantages that the first opening is formed in the shell, the heat dissipation sheet is connected with the heat absorption block through the heat conduction pipe, when the heat dissipation sheet is fixed on the first outer surface of the shell, the heat absorption block can be fixed in the inner space of the shell relative to the heating unit at the first opening through the deformation of the heat conduction pipe, the assembly is convenient, the heat absorption block and the heating unit cannot be displaced, and the stability of the heat dissipation efficiency is ensured.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of an electrical apparatus in the prior art;

FIG. 2 is a schematic structural diagram of another embodiment of an electrical apparatus of the prior art;

FIG. 3 is a schematic structural diagram of another embodiment of an electrical apparatus of the prior art;

FIG. 4 is a schematic perspective view of an electrical apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic perspective view of an electrical apparatus according to an embodiment of the present invention without a side wall of the housing;

fig. 6 is a schematic sectional view along the direction a-a in fig. 4.

Detailed Description

In order to further understand the objects, structures, features and functions of the present invention, the following embodiments are described in detail.

Certain terms are used throughout the description and following claims to refer to particular components. As one of ordinary skill in the art will appreciate, manufacturers may refer to a component by different names. The present specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to.

Referring to fig. 4 to 6, which illustrate schematic structural diagrams of an electrical apparatus according to a first embodiment of the present invention, an electrical apparatus 001 includes: the heat dissipation module comprises a shell 1, a heating unit 2 and a heat dissipation module 3, wherein the heat dissipation module 3 is used for dissipating heat of the heating unit 2. The housing 1 has an upper housing 11 and a lower housing 12, the upper housing 11 and the lower housing 12 can be assembled and clamped together to form the housing 1, the housing 1 has a first outer surface 111, an inner space S and a first opening 13, the first opening 13 is formed on the first outer surface 111, the first opening 13 communicates the first outer surface 111 with the inner space S, in this embodiment, the upper housing 11 has a first outer surface 111 and a sidewall 112, and the first outer surface 111 is located at the upper housing 11.

The heating unit 2 is located in the internal space S of the housing 1, that is, the heating unit 2 is located inside the housing 1 of the electrical equipment 001; in practical applications, the electrical apparatus 001 further includes a circuit board 4, the circuit board 4 is fixed on the inner surface of the lower housing 12, the heat generating unit 2 is disposed on the circuit board 4, and the heat generating unit 2 can be a Central Processing Unit (CPU) or an electrical component. Of course, the heat generating unit 2 may also be directly a circuit board, but not limited thereto.

The heat dissipation module 3 includes a heat pipe 31, a heat absorption block 32 and a heat dissipation plate 33, the heat pipe 31 has a first end 311 and a second end 312, the heat absorption block 32 is connected to the first end 311 of the heat pipe 31, the heat dissipation plate 33 is connected to the second end 312 of the heat pipe 31, the heat dissipation plate 33 is fixed on the first outer surface 111 of the housing 1 so that the end of the heat dissipation plate 33 of the heat dissipation module 3 is fixed relative to the housing 1, the heat pipe 31 can be bent and deformed to change from the first shape to the second shape, so that the position of the heat absorption block 32 relative to the heat dissipation plate 33 changes, and when the heat dissipation module is installed, the heat absorption block 32 can be fixed in the internal space S1 of the housing 1 corresponding to the heat generating unit 2. That is, when the heat sink 33 of the heat dissipation module 3 is fixedly mounted on the first outer surface 111 of the housing 1, the heat absorption block 32 at the first end 311 of the heat pipe 31 can fall into the internal space S1 from the first opening 13, and at this time, the position of the heat absorption block 32 corresponds to the heat generating unit 2, so that the heat of the heat generating unit 2 can be transferred from the heat absorption block 32 to the heat sink 33 through the heat pipe 31; the position of the heat absorbing block 32 relative to the heat generating unit 2 is determined by the heat absorbing block 32 closely attached to the heat generating unit 2 or the gap between the heat absorbing block 32 and the heat generating unit 2, but not limited thereto.

In the present embodiment, the heat sink 33 has a heat dissipating substrate 331 and a plurality of fins 332, one surface of the heat dissipating substrate 331 is disposed on the first outer surface 111 to fix the heat dissipating module 3 relative to the housing 1, and the plurality of fins 332 are disposed on the other surface of the heat dissipating substrate 331 away from the first outer surface 111 of the housing 1, so that the heat dissipating efficiency is better. The heat absorbing block 32 is made of a metal material to prevent deformation due to long-term use, and preferably, the heat absorbing block 32 may be a copper block or an aluminum block. Preferably, the first end 311 of the heat conducting pipe 31 is embedded in the heat absorbing block 32, and the second end 312 of the heat conducting pipe 31 is embedded in the heat dissipating fin 33, so as to increase the rate of heat conduction. In the implementation, referring to fig. 4 and 5, the heat pipe 31 may have a plurality of pipes to improve the heat dissipation efficiency.

Further, the electrical apparatus 001 further includes a locking element 5, which is operable at the first opening 13 during installation, and the locking element 5 fixes the heat absorbing block 32 relative to the heat generating unit 2 to limit the heat absorbing block 32 from being far away from the heat generating unit 2, thereby preventing the heat dissipation efficiency from being unstable.

In the assembling process, the circuit board 4 having the heat generating unit 2 can be mounted on the lower housing 12, the upper housing 11 is assembled to the lower housing 12 to form the housing 1, at this time, the first opening 13 faces the heat generating unit 2, the heat sink 33 is fixed on the first outer surface 111 of the housing 1, so that the end of the heat sink 33 of the heat dissipation module 3 is fixed relative to the housing 1, at this time, the heat absorbing block 32 at the first end 311 of the heat conducting pipe 21 can enter the inner space S of the housing 1 from the first opening 13 and approach the heat generating unit 2, the installer can fix the fixing portion 51 of the locking component 5 on the circuit board 4 to press the heat absorbing block 32 to approach the heat generating unit 2, at this time, during the process that the locking component 5 presses the heat absorbing block 32, the heat conducting pipe 31 is bent and deformed, specifically, the portion of the heat conducting pipe 31 between the heat absorbing block 32 and the heat sink 33 is bent and, so that the heat absorbing block 32 is displaced relative to the heat dissipating fin 33. In this way, the heat absorbing block 32 is fixed in the internal space S1 of the housing 1 corresponding to the heat generating unit 2 from the first opening 13 of the housing 1 by the deformation of the heat transfer pipe 31. The heat of the heat generating unit 2 is transferred from the heat transfer block 32 to the heat sink 33 through the heat transfer pipe 31, thereby dissipating the heat of the heat generating unit 2. In practice, the electrical apparatus 001 further includes a protecting cover, which is disposed on the first outer surface 111 to shield the first opening 13, that is, after the above process is completed, the protecting cover can be used to form the first opening 13 into a complete surface, and certainly, the protecting cover can also be provided with a plurality of fins to form a complete surface heat dissipation structure with the plurality of fins 332, so that the appearance is beautiful and the heat dissipation efficiency is better.

Certainly, during assembly, the circuit board 4 having the heat generating unit 2 may be mounted on the lower housing 12, the heat sink 33 is fixedly disposed on the first outer surface 111 of the housing 1, so that one end of the heat sink 33 of the heat dissipation module 3 is fixed relative to the upper housing 11, at this time, the heat absorbing block 32 at the first end 311 of the heat conducting pipe 21 may enter from the first opening 13, and then the upper housing 11 fixed with the heat dissipation module 3 is assembled in cooperation with the lower housing 12, at this time, the heat absorbing block 32 at the first end 311 of the heat conducting pipe 21 is adjacent to the heat generating unit 2 in the inner space S, and then, the fixing manner is the same as the above assembling process, which is not described herein again.

Compared with the prior art, the heat sink is connected with the heat absorption block through the heat conduction pipe by arranging the first opening on the shell, and when the heat sink is fixed on the first outer surface of the shell, the heat absorption block can be fixed in the inner space of the shell relative to the heating unit at the first opening by means of deformation of the heat conduction pipe, so that the whole electrical equipment is more convenient to assemble, the heat absorption block and the heating unit cannot be displaced, and stability of heat dissipation efficiency is ensured.

The present invention has been described in relation to the above embodiments, which are only exemplary of the implementation of the present invention. It should be noted that the disclosed embodiments do not limit the scope of the invention. Rather, it is intended that all such modifications and variations be included within the spirit and scope of this invention.

Claims

1. An electrical device, comprising:

a housing having a first outer surface, an interior space, and a first opening communicating the first outer surface with the interior space, the housing having an upper housing and a lower housing;

a heat generating unit located in the inner space of the case; and

the heat dissipation module includes:

a heat conducting pipe;

the heat absorption block is connected to the first end of the heat conduction pipe; and

the radiating fin is connected to the second end of the heat conducting pipe;

the protecting cover is arranged on the first outer surface and shields the first opening;

the heat radiating fin is fixedly arranged on the first outer surface of the shell, and when the upper shell is assembled corresponding to the lower shell, the first opening is over against the heating unit; when the heat pipe is installed, when the shell, the heating unit and the radiating fin are fixed relatively, the heat pipe can be operated at the first opening, and the heat absorption block is fixed in the inner space from the first opening of the shell corresponding to the heating unit by means of the deformation of the heat pipe.

2. The electrical apparatus of claim 1, further comprising a locking member operable at the first opening when installed, the locking member being configured to secure the heat absorbing block relative to the heat generating unit, the heat of the heat generating unit being transferable from the heat absorbing block to the heat sink via the heat pipe.

3. The electrical apparatus of claim 1, wherein the heat sink has a plurality of fins and a heat-dissipating substrate, one surface of the heat-dissipating substrate is disposed on the first outer surface, and the other surface of the heat-dissipating substrate is disposed with the plurality of fins.

4. The electrical device as claimed in claim 1, wherein the heat absorbing block abuts against the heat generating unit or the heat absorbing block has a gap with the heat generating unit.

5. The electrical device of claim 1, wherein the heat sink block is made of a metallic material.

6. The electrical apparatus of claim 1, wherein the first end of the heat pipe is embedded in the heat sink block, and the second end of the heat pipe is embedded in the heat sink.

7. The electrical apparatus of claim 1, wherein the heat pipe has a plurality of heat pipes.

8. The utility model provides a heat dissipation module for electrical equipment dispels the heat, and this electrical equipment has the casing and generates heat the unit, and this casing has last casing and casing down, and the unit that should generate heat is located the inner space of this casing, and its characterized in that, this heat dissipation module includes:

a heat conducting pipe;

the radiating fin is connected to the second end of the heat conducting pipe;

the radiating fin is arranged on the first outer surface of the shell, and when the upper shell is assembled corresponding to the lower shell, the first opening of the shell is over against the heating unit; when the heat-absorbing block is installed, the heat-absorbing block is fixed in the inner space from the first opening of the shell corresponding to the heating unit by means of the deformation of the heat conduction pipe; wherein, the protecting cover of the electrical equipment is arranged on the first outer surface and shields the first opening.