CN106793680A - A kind of TEC heat-exchanger rigs for rack - Google Patents
A kind of TEC heat-exchanger rigs for rack Download PDFInfo
- Publication number
- CN106793680A CN106793680A CN201611094603.8A CN201611094603A CN106793680A CN 106793680 A CN106793680 A CN 106793680A CN 201611094603 A CN201611094603 A CN 201611094603A CN 106793680 A CN106793680 A CN 106793680A
- Authority
- CN
- China
- Prior art keywords
- heat
- tec
- installing plate
- heat dissipation
- rack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a kind of TEC heat-exchanger rigs for rack, including the heat-exchanger rig in one end insertion cabinet and the installing plate being fixed on casing, heat-exchanger rig is by cold end cooling mechanism, hot-side heat dissipation mechanism outside cabinet, and heat-insulated foam and TEC the chips composition between cold end cooling mechanism and hot-side heat dissipation structure, cold end cooling mechanism is connected with rack by heat-insulated foam, hot-side heat dissipation mechanism is with rack by isolating the connected cold end cooling mechanism of installing plate and hot-side heat dissipation mechanism respectively by wind scooper, centrifugal blower and radiator are constituted, proper alignment is provided with the side of wind scooper and end face for the intensive air vent of air circulation.The present invention provides a kind of TEC heat-exchanger rigs for rack, it is intended to solve the problems, such as that existing TEC heat-exchanger rigs are occupied larger space due to structure and radiated uneven in itself.
Description
Technical field
The present invention relates to industrial heat abstractor, more particularly to a kind of TEC heat-exchanger rigs for rack.
Background technology
Machinery, chemical industry, light industry, processing and other fields, it will usually use electric power equipment cabinet, these industrial electric power equipment cabinets or
Communications industry rack typically puts open air for a long time, usually produces substantial amounts of thermal losses when component works in rack, these heat wastes
Consumption needs are distributed, but due to there is many dusts in outside air, and humidity and temperature are continually changing, so extraneous
Air directly can not be directly inputted in rack by fan equal power device, therefore radiating is needed to use on radiator structure
Device, and TEC heat-exchanger rigs are in practice with quite varied.
Existing TEC heat-exchanger rigs, generally clamp TEC chips using strip section bar, are installed at the top of section bar and take out stream wind
Fan, it is larger that the TEC heat-exchanger rigs of this mode generally take up space, and after blower fan air intake, wind is with 90 ° of directions in blower fan
Turn from upper and lower both direction air-out, the service efficiency of fan is not high, using non-uniform temperature in temperature machine cabinet after a period of time, dissipate
It is hot uneven.
Therefore, prior art is also to be developed.
The content of the invention
In view of above-mentioned the deficiencies in the prior art part, it is an object of the invention to provide a kind of TEC heat exchange for rack
Device, it is intended to solve the problems, such as that existing TEC heat-exchanger rigs are occupied larger space due to structure and radiated uneven in itself.
In order to achieve the above object, this invention takes following technical scheme：
A kind of TEC heat-exchanger rigs for rack, including one end insertion cabinet in heat-exchanger rig and be fixed on case
Isolation installing plate on body, the heat-exchanger rig includes that the cold end cooling mechanism being arranged in cabinet is adjacent with cold end cooling mechanism
Heat-insulated foam, the hot-side heat dissipation mechanism that is arranged at outside cabinet and the TEC being arranged between heat-insulated foam and isolation installing plate
Chip；
Cold end cooling mechanism is arranged at cabinet inside, and the mechanism includes the first wind-guiding of the hollow cylindrical of one end open
Cover, be arranged at the first wind scooper inner hollow for accelerating first centrifugal blower and the hollow cylindrical first of radiating to lead
The first radiator composition of fan housing inner annular, cold end cooling mechanism is connected with rack by heat-insulated foam；
Hot-side heat dissipation mechanism is arranged at outside cabinet, and the mechanism includes the second wind-guiding of the hollow cylindrical of one end open
Cover, be arranged at the second wind scooper inner hollow for accelerating second centrifugal blower and the hollow cylindrical second of radiating to lead
The second radiator composition of fan housing inner annular, hot-side heat dissipation mechanism is connected with rack by isolating installing plate；
Proper alignment is provided with the side and end face of first wind scooper and the second wind scooper for air circulation
Intensive air vent.
Further, the isolation installing plate is identical with the heat-insulated foam size shape.
Further, the edge of the heat-insulated foam is provided with several for the first mounting hole for installing and fix, this every
One week of thermal cotton is also provided with several for fixing the first mounting groove of TEC chips, the size shape of first mounting groove with
TEC chips are identical；
The edge of the isolation installing plate is provided with several the second mounting holes for being used to install and fix, the isolation installing plate
Be also provided with one week several for fixing the second mounting groove of TEC chips, size shape and the TEC chips of second mounting groove
It is identical；
Further, the heat-insulated foam is fixed with installing plate is isolated by the adaptation of the first mounting hole and the second mounting hole
Connection, the both ends of the surface of the TEC chips are respectively embedded into the first mounting groove and the second mounting groove.
Further, the heat-insulated foam is pasted onto on isolation installing plate, and is fixed using fixed screw, described solid
Determine screw size shape to match with the first mounting hole and the second mounting hole.
Further, first radiator is placed by circular first heat dissipation base and many cross arrangements not of uniform size
The first groups of fins on circular first heat dissipation base is into first heat dissipation base is connected with foam is isolated；
Second radiator is placed on annular shape by circular second heat dissipation base and many cross arrangements not of uniform size
The second groups of fins on second heat dissipation base is into second heat dissipation base is connected with installing plate is isolated；
It is described to leave space between the fin placed.
Beneficial effect：TEC heat-exchanger rigs for rack of the invention, the heat-exchanger rig is using circular configuration and TEC cores
Piece is combined, and centrifugal blower is built in inside radiator, and centrifugation wind is improved while the structure space for saving product
The operating efficiency of machine, and the wind scooper of hot-side heat dissipation mechanism and cold end cooling mechanism side and end face on be provided with intensive row
The air vent of row causes the radiating of heat abstractor by the way of surrounding air-out, and the more uniform temperature in another rack, radiating is fast
Degree is faster.
Brief description of the drawings
Fig. 1 is the decomposing schematic representation of the TEC heat-exchanger rigs for rack provided in an embodiment of the present invention；
Fig. 2 is the side view of the TEC heat-exchanger rigs for rack provided in an embodiment of the present invention.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can
To be directly to another element or may be simultaneously present centering elements.
Only it is relative concept each other also, it should be noted that the orientation term such as left and right, upper and lower in the embodiment of the present invention
Or with the normal operating condition of product be reference, and should not be regarded as restrictive.
As depicted in figs. 1 and 2, it is a kind of TEC heat-exchanger rigs for rack of the specific embodiment of the invention,
Including the heat-exchanger rig in one end insertion cabinet and the isolation installing plate 4 being fixed on casing, the heat exchange
Device includes the hot-side heat dissipation mechanism 10 being arranged at outside cold end cooling mechanism 9 and cabinet in cabinet, and cooling mechanism is divided into two
Be placed in inside and outside cabinet the structure space that can be saved in casing, the heat-exchanger rig also include being connected with cold end cooling mechanism every
Thermal cotton 5 and the TEC chips 8 being arranged between heat-insulated foam 5 and isolation installing plate 4, when heat-insulated foam and isolation installing plate are thought
Linking, TEC chips will be embedded between isolation foam and isolation installing plate and realize closure；
Cold end cooling mechanism 9 is arranged at cabinet inside, and the mechanism includes the first wind-guiding of the hollow cylindrical of one end open
Cover 1, it is arranged at the inner hollow of the first wind scooper 1 and is used for the first centrifugal blower 2 for accelerating radiating and the hollow cylindrical the
First radiator 3 of the inner annular of one wind scooper 1 is constituted, and is used for radiating using the first centrifugal blower 2 and is radiated not with conventional fan
Together, by the effect of the second centrifugal blower 2, the hot blast absorbed in rack from the first wind scooper 1 is more uniform, and circle
The first radiator 3 that first centrifugal blower 2 is built in annular shape has saved structure space, and the first radiator 3 uses annular design,
Centrifugal blower 2 passes through the first radiator 3 so that the surrounding air-out of the first radiator 3 is uniform, and cold end cooling mechanism 9 passes through with rack
Heat-insulated foam 5 is connected, it is to avoid rack and the directly contact of cold end cooling mechanism 9；
Hot-side heat dissipation mechanism 10 is arranged at outside cabinet, and the mechanism includes the second wind-guiding of the hollow cylindrical of one end open
Cover 16, be arranged at the inner hollow of the second wind scooper 16 the second centrifugal blower 15 and the hollow cylindrical for being used for accelerating to radiate
Second radiator 14 of the inner annular of the second wind scooper 16 is constituted, and be used for radiating using the second centrifugal blower 15 dissipates with conventional fan
Hot different, the heat of absorption passes through the effect of the second centrifugal blower 15, can uniformly be dissipated to surrounding from the second wind scooper 16
Send out, and circle the second centrifugal blower 15 be built in annular shape the second radiator 14 saved structure space first dissipate
Hot device 3 uses annular design, and centrifugal blower 3 blows over the first radiator 3 so that the surrounding air-out of the second radiator 14 is uniform, hot junction
Cooling mechanism 10 is connected with rack by isolating installing plate 4；
Proper alignment is provided with the side of the wind scooper 16 of above-mentioned first wind scooper 1 and second and end face for air stream
The air vent of logical intensive air vent, side and end face can ensure surrounding air-out, make the temperature in temperature machine cabinet more uniform.
Specifically, the isolation installing plate 4 is identical with the size shape of heat-insulated foam 5, it is ensured that installation accurate and
Simplicity.
Specifically, the edge of the heat-insulated foam 5 is provided with several for the first mounting hole 6 for installing and fix, this every
One week of thermal cotton 5 is also provided with several is used to fix the first mounting groove 7 of TEC chips 8, the size shape of first mounting groove 7
Shape is identical with TEC chips 8, and the first mounting hole 6 is used for and isolate installing plate 4 and be connected, and the first mounting groove 7 is used for and the phase of TEC chips 8
With reference to；
The edge of the isolation installing plate 4 is provided with several the second mounting holes 13 for being used to install and fix, isolation peace
Dress plate 4 is also provided with several for one week for fixing the second mounting groove 12 of TEC chips 8, the size shape of second mounting groove 12
Shape is identical with TEC chips 8, and the second mounting hole 13 is used for mutually being connected with heat-insulated foam 5, and the second mounting groove 12 is used for and TEC chips 8
It is combined.
Specifically, the heat-insulated foam 5 with isolate adaptation of the installing plate 4 by the first mounting hole 6 and the second mounting hole 13
It is fixedly connected, the both ends of the surface of the TEC chips 8 are respectively embedded into the first mounting groove 7 and the second mounting groove 12, and TEC chips is embedding
Enter between heat-insulated foam 5 and isolation installing plate 4 in both the first mounting grooves 7 and the second mounting groove 12, realization closure.
Specifically, the heat-insulated foam 5 is pasted in isolation installing plate 4, and it is fixed using fixed screw 11, it is described solid
Determine the size shape of screw 11 to match with the first mounting hole 6 and the second mounting hole 13, fixed screw 11 is pacified by be adapted to first
The dress mounting hole 13 of hole 6 and second fixes heat-insulated foam 5 and isolation installing plate 4.
Specifically, first radiator 3 is put by circular first heat dissipation base 31 and many cross arrangements not of uniform size
The first fin 32 put on circular first heat dissipation base 31 is constituted, first heat dissipation base 31 with isolate the phase of foam 5
Connection, the first finned radiator 3 can make the wind speed that the first centrifugal blower 2 blows over the first fin 32 consistent, and first dissipates
The service efficiency that the first radiator 3 can be improved not of uniform size of hot device 3；
Second radiator 14 is placed on circle by circular second heat dissipation base 141 and many cross arrangements not of uniform size
The second fin 142 on the second heat dissipation base of ring-type 141 is constituted, and second heat dissipation base 141 is connected with installing plate 4 is isolated
Connect, the second finned radiator 14 can make the wind speed that the second centrifugal blower 15 blows over the second fin 142 consistent, and second dissipates
The service efficiency that the second radiator 142 can be heightened not of uniform size of backing 142；
It is described that space is left between the fin placed, improve the service efficiency of radiator.
The design is used and is assembled into heat-exchanger rig using peltier effect refrigeration TEC chips 8, when the two ends of TEC chips 8
When applied voltage, the both ends of the surface of TEC chips 8 can produce temperature difference, the both ends of the surface of TEC chips 8 to be fitted in cold end radiating respectively
In mechanism 9 and hot-side heat dissipation mechanism 10, by heat transfer, the second radiator 14 of hot-side heat dissipation mechanism 10 is set to heat up or cold end
First radiator 3 of heat abstractor 9 is lowered the temperature, then nationality promotes cross-ventilation by the first centrifugal blower 2 and the second centrifugal blower 15, real
The radiating of existing hot-side heat dissipation mechanism 10 and the heat absorption of cold end cooling mechanism 9.
As one embodiment of the present of invention, on the first mounting hole 6 and isolation installing plate 4 on the isolation foam 5
Second mounting hole 13 is circle, it will be understood that in other embodiments of the invention, and the first mounting hole 6 and second is installed
Hole 13 can also be other shapes, such as square or polygon.In embodiments of the present invention, the earphone placement material of plate 4 is
Plastics or metal material.
In a kind of TEC heat-exchanger rigs for rack provided in an embodiment of the present invention, including one end insertion cabinet
Heat-exchanger rig and the installing plate being fixed on casing, heat-exchanger rig by the hot-side heat dissipation mechanism outside cold end cooling mechanism, cabinet, with
And heat-insulated foam and TEC the chips composition between cold end cooling mechanism and hot-side heat dissipation structure, cold end cooling mechanism and rack lead to
Cross heat-insulated foam to be connected, hot-side heat dissipation mechanism is with rack by isolating installing plate connected cold end cooling mechanism and hot-side heat dissipation mechanism
It is made up of wind scooper, centrifugal blower and radiator respectively, proper alignment is provided with the side of wind scooper and end face for air
The intensive air vent of circulation.The heat-exchanger rig is combined using circular configuration with TEC chips, and centrifugal blower is built in into radiating
Inside device, improve the operating efficiency of centrifugal blower while the structure space for saving product, and hot-side heat dissipation mechanism and
The air vent of dense arrangement is provided with the side of the wind scooper of cold end cooling mechanism and end face so that the radiating of heat abstractor is adopted
With the mode of surrounding air-out, the more uniform temperature in another rack, radiating rate is faster.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.
Claims (5)
1. heat-exchanger rig and be fixed on casing that a kind of TEC heat-exchanger rigs for rack, including one end are embedded in cabinet
On isolation installing plate, it is characterised in that the heat-exchanger rig includes that being arranged at cold end cooling mechanism and cold end in cabinet dissipates
On the adjacent heat-insulated foam of heat engine structure, the hot-side heat dissipation mechanism being arranged at outside cabinet and the heat-insulated foam of insertion and isolation installing plate
TEC chips；
The cold end cooling mechanism includes the first wind scooper of the hollow cylindrical of one end open, is arranged inside the first wind scooper
Middle vacancy is used for the first centrifugal blower for accelerating radiating and the first radiator for being arranged at the first wind scooper inner annular
Composition, the cold end cooling mechanism is connected with rack by heat-insulated foam；
The hot-side heat dissipation mechanism includes the second wind scooper of the hollow cylindrical of one end open, is arranged inside the second wind scooper
Middle vacancy is used to accelerate the second centrifugal blower of radiating and the second radiator composition of the second wind scooper inner annular, institute
Hot-side heat dissipation mechanism is stated to be connected by isolating installing plate with rack；
Proper alignment is provided with the side and end face of first wind scooper and the second wind scooper for the close of air circulation
Collection air vent.
2. TEC heat-exchanger rigs for rack according to claim 1, it is characterised in that the isolation installing plate and institute
State heat-insulated foam size shape identical.
3. TEC heat-exchanger rigs for rack according to claim 1, it is characterised in that the edge of the heat-insulated foam
Several are provided with for the first mounting hole for installing and fix, the heat-insulated foam is also provided with several for one week and is used to fix
First mounting groove of TEC chips, the size shape of first mounting groove is identical with TEC chips；
The edge of the isolation installing plate is provided with several the second mounting holes for being used to install and fix, the isolation installing plate
Also being provided with one week several is used to fix the second mounting groove of TEC chips, size shape and the TEC chips of second mounting groove
It is identical；
The heat-insulated foam is fixedly connected with installing plate is isolated by the adaptation of the first mounting hole and the second mounting hole, the TEC
The both ends of the surface of chip are respectively embedded into the first mounting groove and the second mounting groove.
4. TEC heat-exchanger rigs for rack according to claim 3, it is characterised in that the heat-insulated foam is pasted onto
On isolation installing plate, and it is fixed using fixed screw, the fixed screw size shape is pacified with the first mounting hole and second
Dress hole matches.
5. TEC heat-exchanger rigs for rack according to claim 1, it is characterised in that first radiator is by justifying
The heat dissipation base of ring-type first is not of uniform size with multiple to be spaced the first fin being placed on circular first heat dissipation base
Composition, first heat dissipation base is connected with foam is isolated；
Second radiator is placed on circular second by circular second heat dissipation base and multiple not of uniform size being spaced
The second groups of fins on heat dissipation base is into second heat dissipation base is connected with installing plate is isolated；
It is described to leave space between the fin placed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611094603.8A CN106793680B (en) | 2016-12-02 | 2016-12-02 | A kind of TEC heat-exchanger rig for cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611094603.8A CN106793680B (en) | 2016-12-02 | 2016-12-02 | A kind of TEC heat-exchanger rig for cabinet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106793680A true CN106793680A (en) | 2017-05-31 |
| CN106793680B CN106793680B (en) | 2019-11-08 |
Family
ID=58884316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611094603.8A Active CN106793680B (en) | 2016-12-02 | 2016-12-02 | A kind of TEC heat-exchanger rig for cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106793680B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413941A (en) * | 2018-10-31 | 2019-03-01 | 上海江南长兴造船有限责任公司 | A kind of device for control cabinet cool-down dehumidification |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005121250A (en) * | 2003-10-14 | 2005-05-12 | Seiko Epson Corp | Cooling device, and rear projector |
| JP2006292269A (en) * | 2005-04-11 | 2006-10-26 | Matsushita Electric Ind Co Ltd | Cooling device |
| CN201039647Y (en) * | 2007-04-04 | 2008-03-19 | 杭州先行铁路工贸有限公司 | Constant temperature cabinet |
| CN101338766A (en) * | 2007-07-04 | 2009-01-07 | 富准精密工业(深圳)有限公司 | Centrifugal fan and heat sink module adopting same |
| US20110242499A1 (en) * | 2010-04-01 | 2011-10-06 | Seiko Epson Corporation | Liquid crystal projector |
| CN102548348A (en) * | 2010-12-28 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor |
| CN203561104U (en) * | 2013-10-24 | 2014-04-23 | 天津华锐源科技有限公司 | Semiconductor refrigerator |
| CN104703437A (en) * | 2013-12-09 | 2015-06-10 | 中冶长天国际工程有限责任公司 | Cooling device and cooling system |
| CN205690582U (en) * | 2016-06-21 | 2016-11-16 | 丁文凯 | Semiconductor air conditioner is fanned |
-
2016
- 2016-12-02 CN CN201611094603.8A patent/CN106793680B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005121250A (en) * | 2003-10-14 | 2005-05-12 | Seiko Epson Corp | Cooling device, and rear projector |
| JP2006292269A (en) * | 2005-04-11 | 2006-10-26 | Matsushita Electric Ind Co Ltd | Cooling device |
| CN201039647Y (en) * | 2007-04-04 | 2008-03-19 | 杭州先行铁路工贸有限公司 | Constant temperature cabinet |
| CN101338766A (en) * | 2007-07-04 | 2009-01-07 | 富准精密工业(深圳)有限公司 | Centrifugal fan and heat sink module adopting same |
| US20110242499A1 (en) * | 2010-04-01 | 2011-10-06 | Seiko Epson Corporation | Liquid crystal projector |
| CN102548348A (en) * | 2010-12-28 | 2012-07-04 | 鸿富锦精密工业（深圳）有限公司 | Heat abstractor |
| CN203561104U (en) * | 2013-10-24 | 2014-04-23 | 天津华锐源科技有限公司 | Semiconductor refrigerator |
| CN104703437A (en) * | 2013-12-09 | 2015-06-10 | 中冶长天国际工程有限责任公司 | Cooling device and cooling system |
| CN205690582U (en) * | 2016-06-21 | 2016-11-16 | 丁文凯 | Semiconductor air conditioner is fanned |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413941A (en) * | 2018-10-31 | 2019-03-01 | 上海江南长兴造船有限责任公司 | A kind of device for control cabinet cool-down dehumidification |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106793680B (en) | 2019-11-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105066507A (en) | Air-cooling semiconductor refrigeration device for circulating cooling system | |
| CN107027274A (en) | A kind of rack semiconductor cooling device | |
| CN206977887U (en) | A kind of rack semiconductor cooling device | |
| CN106793680B (en) | A kind of TEC heat-exchanger rig for cabinet | |
| CN207783402U (en) | Unmanned plane radiator structure | |
| CN105953191B (en) | Radiating lamp | |
| CN206149698U (en) | Inside refrigeration intelligent transportation display screen | |
| CN205537254U (en) | Heat transfer device and have this heat transfer device's semiconductor refrigeration refrigerator | |
| CN116771644A (en) | Heat abstractor and have its oxygenerator | |
| WO2016192298A1 (en) | Cold transfer device and semiconductor refrigeration box having cold transfer device | |
| CN104242555A (en) | Heat radiation cover plate | |
| CN204089481U (en) | A kind of heat-dissipating cover plate | |
| CN206865921U (en) | Radiator structure | |
| KR100934763B1 (en) | Thermal conduction device for hot blast heater or cold blast heater | |
| CN203024110U (en) | Composite type light-emitting diode (LED) integrated optical source radiator | |
| CN209857420U (en) | Semiconductor refrigeration equipment | |
| CN105466100B (en) | Heat-exchanger rig and semiconductor freezer with the heat-exchanger rig | |
| CN104676871A (en) | Heat dissipation device, air conditioner and assembly method of heat dissipation device | |
| CN217114368U (en) | Chip radiating assembly | |
| CN109240472A (en) | A kind of computer host box with heat dissipation wind channel structure | |
| CN109974331B (en) | Semiconductor refrigerating device | |
| CN217604739U (en) | Heat sink device | |
| WO2024019371A1 (en) | Heat radiation structure and electronic device comprising same | |
| CN211043089U (en) | Heat abstractor and have device's reagent storehouse | |
| CN209897522U (en) | Communication cavity heat dissipation module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |