CN106777718A - A kind of PCB gerber files processing method and processing system - Google Patents
A kind of PCB gerber files processing method and processing system Download PDFInfo
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- CN106777718A CN106777718A CN201611204260.6A CN201611204260A CN106777718A CN 106777718 A CN106777718 A CN 106777718A CN 201611204260 A CN201611204260 A CN 201611204260A CN 106777718 A CN106777718 A CN 106777718A
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- gerber files
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
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Abstract
The invention provides a kind of PCB gerber files processing method, wherein, the treating method comprises：PCB gerber files are pre-processed；Whether detection pad is connected with cabling copper sheet, is then to perform step S3；The welding resistance shape of modification gerber files solder mask and pad connected component.Present invention also offers a kind of PCB gerber files processing system, by technical solution of the present invention, modified by the PCB gerber files for having designed, in solder mask, pad and cabling junction, along pad circular arc shape, excavate one piece of welding resistance, the windowing area of the cabling that is connected with pad is reduced again, so that the increased area of pad is minimized, new pad is closer to shape during design, by the above method, can under a pad tin amount fix in the case of, reduce the rosin joint rate of the pin in welding, the low precision of welding resistance technique is lifted simultaneously, reduce because of the wasting of resources caused by problem of faulty soldering.
Description
Technical field
The present invention relates to EPON communication technical field, more particularly to a kind of PCB gerber files processing method and place
Reason system.
Background technology
Industry of printed circuit boards development is at full speed, two-sided from one side, to four laminates, six laminates, no matter from complexity with it is accurate
Degree, is all qualitative leap.Printed circuit board (PCB) is the critical piece of various electronic products, is that any electronic product realizes that its function sets
The basis of meter, the quality of its performance largely has influence on the quality of electronic product.In the actual production of electronic product
Cheng Zhong, because some of the manufacturing process of printed circuit board (PCB) problem in itself or design details are it is possible that deviation, leads
Finished product is caused not meet design requirement.Wherein, the whether accurate correctness for being directly connected to new printed circuit board plate-making of gerber files.
In the manufacturing process of existing gerber files, because a pad may generally connect a plurality of copper sheet cabling,
And making sheet welding resistance has individual accuracy tolerance, the welding resistance unilateral about 2mil bigger than pad in design, to prevent solder mask on business poor dirt
Dye pad.When pad connects a cabling, circular when pad is by designing becomes similar round.By that analogy, when pad connects
When connecing many cablings, pad will become abnormity.Pad real area increases, and in the case that tin amount is fixed under pad, will cause BGA
Pin rosin joint during welding.
Accordingly, it would be desirable to be improved to prior art.
It should be noted that the introduction of technical background is intended merely to above it is convenient technical scheme is carried out it is clear,
Complete explanation, and facilitate the understanding of those skilled in the art and illustrate.Can not be merely because these schemes be of the invention
Background section is set forth and thinks that above-mentioned technical proposal is known to those skilled in the art.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of PCB gerber files processing method and processing system, in solder mask,
Pad and cabling junction, along pad circular arc shape, excavate one piece of welding resistance, then the windowing area of the cabling that is connected with pad is subtracted
Few so that the increased area of pad is minimized, new pad tin amount can so be fixed closer to shape during design under a pad
In the case of, the rosin joint rate of the pin in welding is reduced, while lifting the low precision of welding resistance technique.
What a kind of PCB gerber files processing method provided in an embodiment of the present invention and processing system were realized in：
A kind of PCB gerber files processing method, including：
S1, PCB gerber files are pre-processed；
Whether S2, detection pad are connected with cabling copper sheet, are then to perform step S3；
The welding resistance shape of S3, modification gerber files solder mask and pad connected component.
Further, the S1 is pre-processed to PCB gerber files, is specifically included：
Obtain the top layer copper sheet layer information of the PCB gerber files；
Obtain the information of the drilling layer of the PCB gerber files；
Obtain the information of the top layer silk-screen layer of the PCB gerber files.
Further, the S3 modification gerber files solder masks and the welding resistance shape of pad connected component, specifically include：
S31, the shading ring width information for obtaining pad and welding resistance；
S32, determine that welding resistance hollows out position；
S33, solder mask is hollowed out according to preset threshold value.
Further, the S3 modification gerber files solder masks and the welding resistance shape of pad connected component, also include：
S34, basis hollows out the isolation ring width butt welding disk after solder mask and the junction of copper sheet is opened a window.
A kind of PCB gerber files processing system, the processing system includes：
PCB gerber files read modules, for reading PCB gerber files information；
Connection judgment module, is connected to the PCB gerber files read module, and mould is read according to the PCB gerber files
The PCB gerber files information that block reads, judges whether pad is connected with copper sheet；
Solder mask hollows out module, is connected to the PCB gerber files read module and the connection judgment module, uses
Text is painted to the PCB light that the PCB gerber files read module reads in the judged result according to the connection judgment module
Part information is modified.
Further, the PCB gerber files read module, specifically includes：
Import unit, for importing the PCB gerber files；
Resolution unit, the PCB gerber files information is obtained for the PCB gerber files to be carried out with parsing.
Further, the PCB gerber files information of the reading includes：
The top layer copper sheet layer information of the PCB gerber files；
The information of the drilling layer of the PCB gerber files；
The information of the top layer silk-screen layer of the PCB gerber files.
Further, the solder mask hollows out module, specifically includes：
Computing unit, the shading ring width information for calculating pad and welding resistance；
Positioning unit, the position positioning welding resistance being connected with pad according to copper sheet hollows out position；
Unit is hollowed out, is calculated to hollow out width information and carry out welding resistance according to the shading ring width information and is hollowed out.
Further, it is described to hollow out unit, specifically include：
Areal calculation unit is hollowed out, for calculate hollowing out width information to isolation ring width according to predetermined threshold value；
Execution unit, the welding resistance for being positioned according to the positioning unit hollows out position and described hollows out areal calculation unit
Hollowing out width information described in calculating carries out that the welding resistance is carried out to hollow out treatment.
Further, the solder mask hollows out module, also includes：
Windowing unit, is carried out at windowing according to the isolation ring width butt welding disk hollowed out after solder mask with the junction of copper sheet
Reason.
A kind of PCB gerber files processing method provided in an embodiment of the present invention and system, by the PCB to having designed
Gerber files are modified, and in solder mask, pad and cabling junction, along pad circular arc shape, excavate one piece of welding resistance, then will be with
The be connected windowing area of cabling of pad is reduced so that the increased area of pad is minimized, new pad closer to shape during design,
By the above method, can under a pad tin amount fix in the case of, reduce welding when pin rosin joint rate, while lifted welding resistance
The low precision of technique, reduces because of the wasting of resources caused by problem of faulty soldering.
Brief description of the drawings
Fig. 1 is a kind of PCB gerber files process flow schematic diagram provided in an embodiment of the present invention；
Fig. 2 carries out hollowing out process flow schematic diagram for provided in an embodiment of the present invention to welding resistance；
Fig. 3 is a kind of processing system structural representation of PCB gerber files provided in an embodiment of the present invention.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, in order to just
Part rather than entire infrastructure related to the present invention is illustrate only in description, accompanying drawing.
What a kind of PCB gerber files processing method provided in an embodiment of the present invention and processing system were realized in：
Refering to a kind of Fig. 1 PCB gerber files process flow schematic diagrames provided in an embodiment of the present invention, as illustrated,
The method is specifically included：
S1, PCB gerber files are pre-processed；
Whether S2, detection pad are connected with cabling copper sheet, are then to perform step S3；
The welding resistance shape of S3, modification gerber files solder mask and pad connected component.
In the embodiment of the present invention, when pcb board is made, because the copper sheet for being actually connected to pad is possible to have multiple,
The area increase of the pcb board pad after causing to be finally made, in the case where soldering tin amount is fixed, is easily caused and the feelings of rosin joint occurs
PCB gerber files, for the technical scheme that the above, the present invention are provided, are pre-processed by condition first, obtain PCB gerber files
Top layer copper sheet layer information, the information of the top layer silk-screen layer of the information and PCB gerber files of the drilling layer of PCB gerber files.
Then whether copper sheet cabling is connected with pad in PCB gerber files are judged, in the connected situation, according to default threshold value pair
Solder mask carries out hollowing out treatment, if copper sheet cabling is no and pad is connected, can not further perform process step.
Welding resistance is carried out to hollow out process flow schematic diagram refering to Fig. 2 is provided in an embodiment of the present invention, as shown in the figure should
Method is specifically included：
S31, the shading ring width information for obtaining pad and welding resistance；
S32, determine that welding resistance hollows out position；
S33, solder mask is hollowed out according to preset threshold value.
S34, basis hollows out the isolation ring width butt welding disk after solder mask and the junction of copper sheet is opened a window.
In the embodiment of the present invention, specifically solder mask is being carried out to hollow out before processing, the isolation of pad and welding resistance is being calculated first
Ring width information, the link position according to copper sheet cabling and pad determines the position that solder mask is hollowed out, and hollows out position and is located at, pad
With the junction of copper sheet cabling, along pad circular arc distribution of shapes in the both sides of copper sheet cabling, it is determined that after hollowing out position, then basis
Predetermined threshold value, such as 1/2 isolation ring width, carry out calculating and hollow out width, such as when the isolation ring width for calculating is 2mil, then hollow out
Width is 2mil.
Refering to a kind of Fig. 3 processing system structural representations of PCB gerber files provided in an embodiment of the present invention, such as figure institute
Show, the processing system includes：
PCB gerber files read module 1, for reading PCB gerber files information；
Connection judgment module 2, is connected to the PCB gerber files read module, and mould is read according to the PCB gerber files
The PCB gerber files information that block reads, judges whether pad is connected with copper sheet；
Solder mask hollows out module 3, is connected to the PCB gerber files read module and the connection judgment module,
The PCB light that the PCB gerber files read module reads is painted for the judged result according to the connection judgment module
Fileinfo is modified.
In the embodiment of the present invention, when PCB gerber files are modified with treatment, read by PCB gerber files first
Module 1 reads gerber files, with continued reference to Fig. 1, especially by import unit 11, imports the PCB gerber files；Then logical
Resolution unit 12 is crossed, the PCB gerber files are carried out with the top layer copper sheet layer information that parsing obtains PCB gerber files, PCB light is painted
File drilling layer information, and the top layer silk-screen layer of PCB gerber files information.
After the information for obtaining above PCB gerber files, whether copper sheet cabling connects with pad in gerber files are judged
Connect, when both connect, then hollow out module by stating solder mask carries out hollowing out treatment to solder mask, and with continued reference to Fig. 3, its is specific
Processing procedure include：First by computing unit 31, the shading ring width information of pad and welding resistance is calculated；Then by fixed
Bit location 32, the position positioning welding resistance being connected with pad according to copper sheet hollows out position；The width of shading ring and hollowed out when determining
After position, by hollowing out unit 33, calculated to hollow out width information and carry out welding resistance according to shading ring width information and hollowed out.Its
In, areal calculation unit specifically is hollowed out by hollow out unit 33, isolation ring width is calculated according to predetermined threshold value
Hollow out width information；Then having execution unit to hollow out positional information according to the welding resistance for calculating and hollow out width information again is carried out to resistance
Layer hollows out treatment.After completing to hollow out treatment, then by the unit 34 that opens a window, according to hollowing out the isolation ring width after solder mask
Spend carries out windowing treatment to the junction of pad and copper sheet.
A kind of PCB gerber files processing method provided in an embodiment of the present invention and system, by the PCB to having designed
Gerber files are modified, and in solder mask, pad and cabling junction, along pad circular arc shape, excavate one piece of welding resistance, then will be with
The be connected windowing area of cabling of pad is reduced so that the increased area of pad is minimized, new pad closer to shape during design,
By the above method, can under a pad tin amount fix in the case of, reduce welding when pin rosin joint rate, while lifted welding resistance
The low precision of technique, reduces because of the wasting of resources caused by problem of faulty soldering.
Although various aspects of the invention are given in the independent claim, other side of the invention includes coming from
The combination of the dependent claims of the feature of described implementation method and/or the feature with independent claims, and not only
It is the combination be clearly given in claim.
Example embodiment of the invention is the foregoing described, but these descriptions should not be managed in a limiting sense
Solution.Conversely, several changing and modifications without departing from the model of the invention as defined in appended claims can be carried out
Enclose.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment above-mentioned here, can carry out for a person skilled in the art various obvious changes,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although the present invention is carried out by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
More other Equivalent embodiments can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (10)
1. a kind of PCB gerber files processing method, it is characterised in that the treating method comprises：
S1, PCB gerber files are pre-processed；
Whether S2, detection pad are connected with cabling copper sheet, are then to perform step S3；
The welding resistance shape of S3, modification gerber files solder mask and pad connected component.
2. PCB gerber files processing method according to claim 1, it is characterised in that the S1 enters to PCB gerber files
Row pretreatment, specifically includes：
Obtain the top layer copper sheet layer information of the PCB gerber files；
Obtain the information of the drilling layer of the PCB gerber files；
Obtain the information of the top layer silk-screen layer of the PCB gerber files.
3. PCB gerber files processing method according to claim 1, it is characterised in that the S3 modifications gerber files resistance
Layer and the welding resistance shape of pad connected component, specifically include：
S31, the shading ring width information for obtaining pad and welding resistance；
S32, determine that welding resistance hollows out position；
S33, solder mask is hollowed out according to preset threshold value.
4. PCB gerber files processing method according to claim 3, it is characterised in that the S3 modifications gerber files resistance
Layer and the welding resistance shape of pad connected component, also include：
S34, basis hollows out the isolation ring width butt welding disk after solder mask and the junction of copper sheet is opened a window.
5. a kind of PCB gerber files processing system, it is characterised in that the processing system includes：
PCB gerber files read modules, for reading PCB gerber files information；
Connection judgment module, is connected to the PCB gerber files read module, is read according to the PCB gerber files read module
The PCB gerber files information for taking, judges whether pad is connected with copper sheet；
Solder mask hollows out module, the PCB gerber files read module and the connection judgment module is connected to, for root
The PCB gerber files read to the PCB gerber files read module according to the judged result of the connection judgment module are believed
Breath is modified.
6. PCB gerber files processing system according to claim 5, it is characterised in that the PCB gerber files read mould
Block, specifically includes：
Import unit, for importing the PCB gerber files；
Resolution unit, the PCB gerber files information is obtained for the PCB gerber files to be carried out with parsing.
7. PCB gerber files processing system according to claim 5, it is characterised in that the PCB gerber files of the reading
Information includes：
The top layer copper sheet layer information of the PCB gerber files；
The information of the drilling layer of the PCB gerber files；
The information of the top layer silk-screen layer of the PCB gerber files.
8. PCB gerber files processing system according to claim 5, it is characterised in that the solder mask hollows out module, tool
Body includes：
Computing unit, the shading ring width information for calculating pad and welding resistance；
Positioning unit, the position positioning welding resistance being connected with pad according to copper sheet hollows out position；
Unit is hollowed out, is calculated to hollow out width information and carry out welding resistance according to the shading ring width information and is hollowed out.
9. PCB gerber files processing system according to claim 8, it is characterised in that described to hollow out unit, specific bag
Include：
Computing unit is hollowed out, for calculate hollowing out width information to isolation ring width according to predetermined threshold value；
Execution unit, the welding resistance for being positioned according to the positioning unit hollows out position and the institute for hollowing out computing unit calculating
State and hollow out width information and carry out that the welding resistance is carried out to hollow out treatment.
10. PCB gerber files processing system according to claim 8, it is characterised in that the solder mask hollows out module,
Also include：
Windowing unit, windowing treatment is carried out according to the isolation ring width butt welding disk hollowed out after solder mask with the junction of copper sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611204260.6A CN106777718A (en) | 2016-12-23 | 2016-12-23 | A kind of PCB gerber files processing method and processing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611204260.6A CN106777718A (en) | 2016-12-23 | 2016-12-23 | A kind of PCB gerber files processing method and processing system |
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| CN106777718A true CN106777718A (en) | 2017-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611204260.6A Pending CN106777718A (en) | 2016-12-23 | 2016-12-23 | A kind of PCB gerber files processing method and processing system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862693A (en) * | 2019-02-01 | 2019-06-07 | 奥士康精密电路（惠州）有限公司 | A kind of annular pad and its management-control method |
| CN111291530A (en) * | 2020-02-23 | 2020-06-16 | 苏州浪潮智能科技有限公司 | Method and system for avoiding overlapping of routing and solder mask in PCB |
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| CN101916753A (en) * | 2010-08-04 | 2010-12-15 | 联发软体设计(深圳)有限公司 | Printed circuit board used for multi-column quadrature flat pin-free package chip |
| CN102458046A (en) * | 2011-09-28 | 2012-05-16 | 柏承科技(昆山)股份有限公司 | Structure and method for improving shape of bonding pad and limiting diffusion of solder paste |
| CN104053310A (en) * | 2014-07-03 | 2014-09-17 | 浪潮(北京)电子信息产业有限公司 | PCB design method for preventing continuous tin electrodeposit of welding device |
| CN105517354A (en) * | 2015-11-30 | 2016-04-20 | 上海斐讯数据通信技术有限公司 | Pre-processing method and system of Gerber file, and polishing and brushing method of PCB (printed circuit board) |
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2016
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060216860A1 (en) * | 2005-03-25 | 2006-09-28 | Stats Chippac, Ltd. | Flip chip interconnection having narrow interconnection sites on the substrate |
| CN101916753A (en) * | 2010-08-04 | 2010-12-15 | 联发软体设计(深圳)有限公司 | Printed circuit board used for multi-column quadrature flat pin-free package chip |
| CN102458046A (en) * | 2011-09-28 | 2012-05-16 | 柏承科技(昆山)股份有限公司 | Structure and method for improving shape of bonding pad and limiting diffusion of solder paste |
| CN104053310A (en) * | 2014-07-03 | 2014-09-17 | 浪潮(北京)电子信息产业有限公司 | PCB design method for preventing continuous tin electrodeposit of welding device |
| CN105517354A (en) * | 2015-11-30 | 2016-04-20 | 上海斐讯数据通信技术有限公司 | Pre-processing method and system of Gerber file, and polishing and brushing method of PCB (printed circuit board) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862693A (en) * | 2019-02-01 | 2019-06-07 | 奥士康精密电路（惠州）有限公司 | A kind of annular pad and its management-control method |
| CN109862693B (en) * | 2019-02-01 | 2022-01-07 | 奥士康精密电路（惠州）有限公司 | Annular welding disk and control method thereof |
| CN111291530A (en) * | 2020-02-23 | 2020-06-16 | 苏州浪潮智能科技有限公司 | Method and system for avoiding overlapping of routing and solder mask in PCB |
| CN111291530B (en) * | 2020-02-23 | 2022-08-12 | 苏州浪潮智能科技有限公司 | Method and system for avoiding overlapping of routing and solder mask in PCB |
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Application publication date: 20170531 |