CN106752911B - Bus joint cooling treatment method - Google Patents
Bus joint cooling treatment method Download PDFInfo
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- CN106752911B CN106752911B CN201611141120.9A CN201611141120A CN106752911B CN 106752911 B CN106752911 B CN 106752911B CN 201611141120 A CN201611141120 A CN 201611141120A CN 106752911 B CN106752911 B CN 106752911B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2518/00—Other type of polymers
- B05D2518/10—Silicon-containing polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2601/00—Inorganic fillers
- B05D2601/20—Inorganic fillers used for non-pigmentation effect
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Abstract
The invention provides a bus joint cooling treatment method, which comprises the following steps: pretreating SiC, namely heating the SiC for 4-5 h at 1000-1100 ℃; preparing a heat dissipation cooling coating, namely mixing isopropanol with organic silicon resin, then mixing with SiC and a dispersing agent, and stirring for 2-3 hours under a certain condition; spraying heat dissipation and cooling coating, polishing and cleaning the bus joint insulating partition, spraying the heat dissipation and cooling coating, and then heating for 0.5-3 h at the temperature of 100-190 ℃. According to the invention, the heat dissipation and cooling performance of the bus joint is enhanced and the operation safety of the bus is protected by spraying the heat dissipation and cooling coating on the bus joint insulating partition. Through continuous optimization, the bus joint cooling treatment method provided by the invention has the advantages of good heat dissipation effect, high thermal stability, small dielectric coefficient and good insulativity of the heat dissipation and cooling coating, and meanwhile, the effect of the coating can be greatly improved in the aspect of process.
Description
Technical Field
The invention belongs to the technical field of bus treatment in power transmission and transformation, and particularly relates to a bus joint cooling treatment method.
Background
The bus refers to the connection of voltage distribution devices at all levels in a substation and the connection of electrical equipment such as a transformer and the like and corresponding distribution devices, and mostly adopts a bare conductor or a stranded wire with a rectangular or circular cross section, which is collectively called as the bus. The bus bars function to collect, distribute and transfer electrical energy.
The bus line is a product made of copper (copper bar) and aluminum materials with high conductivity, which is used for transmitting electric energy and has the capability of collecting and distributing electric power. The power station or the transformer substation is used for transmitting the main lead for electric energy. Through which the electrical energy output by the generator, transformer or rectifier is delivered to the individual users or other substations. Mathematically, a straight line that moves under certain conditions to produce a surface.
With the emergence of modern engineering facilities and equipment, the power consumption of various industries is increased rapidly, particularly, the appearance of numerous high-rise buildings and large-scale factory workshops, the traditional cable serving as a power transmission lead cannot meet the requirement in a large-current transmission system, and the parallel connection of multiple cables brings inconvenience to on-site installation, construction and connection. The plug-in type bus duct is produced as a novel distribution wire, compared with the traditional cable, the plug-in type bus duct fully shows the superiority of the plug-in type bus duct when large current is transmitted, simultaneously, because of adopting a new technology and a new process, the contact resistance and the temperature rise of the joint of two end parts of the bus duct and the plug-in part of a branching port are greatly reduced, and high-quality insulating materials are used in the bus duct, thereby improving the safety and reliability of the bus duct and improving the whole system.
The joint of the enclosed bus is mainly fixedly connected by bolts. If the bolt is not screwed down or even if the bolt is screwed down, the creep of the electric conductor is caused by expansion and contraction after operation, the bolt can be loosened to cause the oxidation of the contact part, the contact resistance is increased, the temperature rise is increased, the contact resistance is increased when the temperature is higher, the circulating temperature rise is formed, local fusion welding or spark or even arc discharge is generated, surrounding insulating materials are affected, and finally electric equipment is damaged.
Disclosure of Invention
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. In this section, as well as in the abstract and the title of the invention of this application, simplifications or omissions may be made to avoid obscuring the purpose of the section, the abstract and the title, and such simplifications or omissions are not intended to limit the scope of the invention.
The present invention has been made in view of the above and/or other problems associated with the prior art methods of cooling a bus bar joint.
Therefore, the invention aims to solve the defects of the prior art and provide a bus bar joint cooling treatment method.
In order to solve the technical problems, the invention provides the following technical scheme: a bus joint cooling treatment method is characterized by comprising the steps of SiC pretreatment, wherein SiC is heated for 4-5 hours at the temperature of 1000-1100 ℃; preparing a heat dissipation cooling coating, namely mixing isopropanol with organic silicon resin, then mixing with SiC and a dispersing agent, and stirring for 2-3 hours under a certain condition; spraying heat dissipation and cooling coating, polishing and cleaning the bus joint insulating partition, spraying the heat dissipation and cooling coating, and then heating for 0.5-3 h at the temperature of 100-190 ℃.
As a preferable scheme of the bus joint cooling treatment method, the method comprises the following steps: and preparing the heat dissipation and cooling coating, wherein the addition amount of the SiC accounts for 10-40% of the mass of the organic silicon resin.
As a preferable scheme of the bus joint cooling treatment method, the method comprises the following steps: and preparing the heat dissipation and cooling coating, wherein the addition amount of the dispersing agent is 1.0-2.5% of the mass of the mixed solution.
As a preferable scheme of the bus joint cooling treatment method, the method comprises the following steps: the spraying heat dissipation and cooling coating is characterized in that the particle size of the heat dissipation and cooling coating is less than 25 micrometers.
As a preferable scheme of the bus joint cooling treatment method, the method comprises the following steps: and spraying the heat dissipation and cooling coating, wherein the thickness of the coating is 30-60 mu m.
As a preferable scheme of the bus joint cooling treatment method, the method comprises the following steps: stirring under the certain condition, wherein the stirring speed is 200-300 r/min.
As a preferable scheme of the bus joint cooling treatment method, the method comprises the following steps: the isopropyl alcohol and the silicone resin are mixed by adding the silicone resin to the isopropyl alcohol until saturated.
As a preferable scheme of the bus joint cooling treatment method, the method comprises the following steps: the temperature is 170-190 ℃ at 100-190 ℃.
As a preferable scheme of the bus joint cooling treatment method, the method comprises the following steps: the particle size of the heat dissipation and cooling coating is 60-200 nm.
As a preferable scheme of the bus joint cooling treatment method, the method comprises the following steps: heating SiC at 1100 ℃ for 4h, adding organic silicon resin into isopropanol until saturation, then adding SiC accounting for 25% of the mass of the organic silicon resin, then adding a dispersing agent accounting for 2.5% of the mass of the mixed solution, stirring for 3h under the condition of 250r/min, polishing and cleaning the bus joint insulating partition, spraying heat dissipation cooling coating, keeping the spraying thickness at 50 mu m, and then heating the sprayed bus side plate at 180 ℃ for 2 h.
The invention has the following beneficial effects:
according to the invention, the heat dissipation and cooling performance at the bus joint is enhanced and the operation safety of the bus is protected by spraying the heat dissipation and cooling coating on the bus joint insulating partition. Through continuous optimization, the bus joint cooling treatment method provided by the invention has the advantages of good heat dissipation effect, high thermal stability, small dielectric coefficient and good insulativity of the heat dissipation and cooling coating, and meanwhile, the effect of the coating can be greatly improved in the aspect of process.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with examples are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Furthermore, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
In order to provide excellent heat dissipation performance, the coating should have high radiation performance and heat conductivity. The SiC is selected as the heat dissipation functional filler in the invention because the SiC has excellent performances of low price, high thermal conductivity coefficient (100-125W/(m.K)), high hardness, high toughness, abrasion resistance, high temperature resistance and the like. Generally, the heat dissipation capability of a coating is expressed in terms of the difference in temperature of a heating plate coated with a heat-dissipating coating and the temperature of a heating plate not coated with the coating at equilibrium, i.e., the coating temperature drop. If the temperature difference is large, the heat dissipation capability is strong, otherwise, the heat dissipation capability is weak.
Example 1
Heating SiC filler at 1000 ℃ for 4h as pretreatment, adding organic silicon resin into isopropanol until saturation, then adding pretreated and ground SiC accounting for 10% of the mass of the organic silicon resin, then adding a commercially available dispersant accounting for 2% of the mass of the mixed solution, and stirring for 2h under the condition of 250r/min to prepare the heat dissipation and cooling coating, wherein the particle size of SiC particles is 60-200 nm.
And (3) polishing and cleaning the bus joint insulating partition plate by using abrasive paper, spraying the prepared heat dissipation and cooling coating, setting parameters of spraying equipment to ensure that the spraying thickness is 30 mu m, and then heating the sprayed bus joint insulating partition plate for 1h at 170 ℃.
And (3) testing the heat dissipation capacity of the coating, comparing the heating plate without the coating, and representing the temperature difference between the heating plate coated with the heat dissipation coating and the heating plate without the coating in balance, namely the temperature difference of the coating for reducing the temperature.
In combination with the results of the parallel tests in the example, the temperature difference of the temperature drop is 12.2-13.0 ℃.
Example 2
Heating SiC filler at 1100 ℃ for 5h as pretreatment, adding organic silicon resin into isopropanol until saturation, then adding pretreated and ground SiC accounting for 20% of the mass of the organic silicon resin, then adding a commercially available dispersant accounting for 1.5% of the mass of the mixed solution, and stirring for 3h under the condition of 300r/min to prepare the heat dissipation and cooling coating, wherein the particle size of SiC particles is 60-200 nm.
And (3) polishing and cleaning the bus joint insulating partition plate by using abrasive paper, spraying the prepared heat dissipation and cooling coating, setting spraying equipment parameters to ensure that the spraying thickness is 40 mu m, and then heating the sprayed bus joint insulating partition plate at 180 ℃ for 2 h.
And (3) testing the heat dissipation capacity of the coating, comparing the heating plate without the coating, and representing the temperature difference between the heating plate coated with the heat dissipation coating and the heating plate without the coating in balance, namely the temperature difference of the coating for reducing the temperature.
In combination with the results of the parallel tests in the example, the temperature difference of the temperature drop is 14.4-15.2 ℃.
Example 3
Heating SiC filler at 1100 ℃ for 4h as pretreatment, adding organic silicon resin into isopropanol until saturation, then adding pretreated and ground SiC accounting for 30% of the mass of the organic silicon resin, then adding a commercially available dispersant accounting for 1.5% of the mass of the mixed solution, and stirring for 2h under the condition of 300r/min to prepare the heat dissipation and cooling coating, wherein the particle size of SiC particles is 60-200 nm.
And (3) polishing and cleaning the bus joint insulating partition plate by using abrasive paper, spraying the prepared heat dissipation and cooling coating, setting spraying equipment parameters to ensure that the spraying thickness is 40 mu m, and then heating the sprayed bus joint insulating partition plate at 180 ℃ for 2 h.
And (3) testing the heat dissipation capacity of the coating, comparing the heating plate without the coating, and representing the temperature difference between the heating plate coated with the heat dissipation coating and the heating plate without the coating in balance, namely the temperature difference of the coating for reducing the temperature.
In combination with the results of the parallel tests in the example, the temperature difference of the temperature drop is 13.9-15.6 ℃.
Example 4
Heating SiC filler at 1100 ℃ for 4h as pretreatment, adding organic silicon resin into isopropanol until saturation, then adding pretreated and ground SiC accounting for 40% of the mass of the organic silicon resin, then adding a commercially available dispersant accounting for 1.5% of the mass of the mixed solution, and stirring for 3h under the condition of 200r/min to prepare the heat dissipation and cooling coating, wherein the particle size of SiC particles is 60-200 nm.
And (3) polishing and cleaning the bus joint insulating partition plate by using abrasive paper, spraying the prepared heat dissipation and cooling coating, setting parameters of spraying equipment to ensure that the spraying thickness is 50 mu m, and then heating the sprayed bus joint insulating partition plate at 180 ℃ for 2 h.
And (3) testing the heat dissipation capacity of the coating, comparing the heating plate without the coating, and representing the temperature difference between the heating plate coated with the heat dissipation coating and the heating plate without the coating in balance, namely the temperature difference of the coating for reducing the temperature.
In combination with the results of the parallel tests in the example, the temperature difference of the temperature drop is 15.8-16.6 ℃.
Example 5
Heating SiC filler at 1100 ℃ for 4h as pretreatment, adding organic silicon resin into isopropanol until saturation, then adding pretreated and ground SiC accounting for 25% of the mass of the organic silicon resin, adding a commercially available dispersant accounting for 2.5% of the mass of the mixed solution, and stirring for 3h under the condition of 250r/min to prepare the heat dissipation and cooling coating, wherein the particle size of SiC particles is 60-200 nm.
And (3) polishing and cleaning the bus joint insulating partition plate by using abrasive paper, spraying the prepared heat dissipation and cooling coating, setting parameters of spraying equipment to ensure that the spraying thickness is 50 mu m, and then heating the sprayed bus joint insulating partition plate at 180 ℃ for 2 h.
And (3) testing the heat dissipation capacity of the coating, comparing the heating plate without the coating, and representing the temperature difference between the heating plate coated with the heat dissipation coating and the heating plate without the coating in balance, namely the temperature difference of the coating for reducing the temperature.
In combination with the results of the parallel tests in the example, the temperature difference of the temperature drop is 19.0-20.2 ℃.
SiC can generate a layer of thin, compact and firm SiO on the surface under the high-temperature condition2Film of oxygen in SiO2The diffusion coefficient in the film is very small, so that the oxidation resistance of the coating can be improved by high-temperature treatment. However, the high-temperature treatment time is too long, the temperature is too high, and excessive SiO is generated except for unstable change2And the SiC is also influenced to form a continuous network structure, so that the heat dissipation of the SiC is further influenced, and on the basis, the SiC is subjected to high-temperature pretreatment, namely the SiC is heated for 4-5 hours at the temperature of 1000-1100 ℃.
Along with the increase of the using amount of SiC, the temperature difference of the coating is increased and then reduced, when the adding amount of SiC is 25% of the mass of the organic silicon resin, the temperature difference of the coating has the maximum value, and the optimal temperature can reach 20.2 ℃. The reason is considered, mainly, the SiC is arranged gradually and tightly along with the increase of the dosage, a continuous network structure is formed on a micro scale, so that the heat is easier to transfer out, but when the dosage is increased to a certain amount, a heat conduction network is formed, and the heat transfer is not obvious by continuously increasing the filler quantity. When the amount of the SiC filler is proper, the filler is uniformly dispersed and tightly connected with each other, and the SiC microscopic radiation area is the largest. When the SiC filler is excessive, more SiC particles are agglomerated together, thereby reducing the radiation area, resulting in a decrease in heat dissipation capacity.
In the experimental process, when the thickness of the coating is less than 50 micrometers, the heat dissipation effect of the coating is gradually increased along with the increase of the thickness, and the temperature difference change value of the coating is 5-7 ℃. When the coating is too thin, the emissivity of the surface of the coating is influenced by more radiant energy, and the emissivity of the insulating partition plate of the bus joint is very low due to the material of the insulating partition plate; when the thickness of the coating is 30-60 mu m, the heat dissipation effect of the coating is good. Wherein the heat dissipation effect is best when the thickness is 50 mu m, and the temperature difference is 16-20 ℃; when the thickness of the coating is more than 60 mu m, the heat dissipation capacity of the coating is not increased any more but is reduced, because after the thickness of the coating is increased to a certain thickness, the thermal resistance generated by the coating is correspondingly increased due to the increase of the thickness of the coating, and the heat transfer of the coating is blocked.
The inventor further researches and discovers that the cross section of the coating with the SiC grain diameter of 3-4 mu m has obvious brittle fracture, and the matrix resin and the SiC grains have obvious gaps, so that the close connection is not realized, and the heat transfer is not facilitated. In the coating with the SiC particle size of 60-200 nm, the matrix resin and the SiC particles can be well and tightly connected without obvious gaps, so that the rapid heat dissipation is facilitated. Uniform particles, tight connection, few surface defects and small gaps generated by the connection of the fillers. In addition, the smaller the filler particle diameter, the greater the number of particles per unit volume, and the easier the heat flow path therebetween can be formed at the same mass. In terms of the thermal stability of the coating, the smaller the SiC particle size of each coating at 170-190 ℃, the more particles are distributed in the coating, so that the heated motion of organic molecules is better inhibited. In terms of heat absorption efficiency, the heat absorption coefficient is determined by the chemical composition and microstructure of the coating material, which can be improved by utilizing the impurity effect. The scattering coefficient is determined by the size, shape and distribution density of microscopic grains in the material. Therefore, the reduction and the fine distribution of the SiC grain diameter can effectively reduce the scattering coefficient and improve the emissivity of the coating, thereby leading to the improvement of the heat dissipation capability.
The insulating partition plate of the bus joint has high requirement on the insulating property of the coating, wherein low dielectric constant is the most important. Theoretically, adding SiC having a large dielectric constant to a matrix resin having a low dielectric constant increases the dielectric constant of the system. Meanwhile, the dielectric constant of the coating is larger along with the reduction of the SiC grain size, because the smaller the filler size is, the more the interface between the filler and the polymer matrix is, and the more the interface polarization effect is obvious in the polarization process, thereby improving the dielectric constant of the coating. The invention tests the dielectric constant of the heat dissipation and cooling coating and can meet the requirement of insulation.
The dispersion uniformity of SiC particles gradually improves, but too high a stirring speed sharply increases the amount of entrainment of the coating liquid. Proper stirring time provides necessary conditions for full diffusion of SiC particles, and the excessive long and short stirring time is not beneficial to the dispersion of the SiC particles. Based on the invention, the stirring speed and the stirring time are further preferably 200-300 r/min, and the stirring time is preferably 2-3 h.
When the temperature was too high, the adhesion of heat dissipation cooling coating worsened to the granule easily produces inhomogeneous dispersion, makes the granule grow up and causes the coating thick uneven, and bus joint insulating barrier quality also can drop, causes the energy extravagant. Based on the above, the invention further preferably adopts the heating temperature of 170-190 ℃ to heat for 0.5-3 h.
It should be noted that the above-mentioned embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (1)
1. A bus joint cooling treatment method is characterized by comprising the following steps: comprises the steps of (a) preparing a mixture of a plurality of raw materials,
SiC pretreatment: heating SiC at 1100 ℃ for 4 h;
preparing a heat dissipation and cooling coating: adding organic silicon resin into isopropanol until the mixture is saturated, then respectively adding SiC and a dispersing agent to obtain a mixed solution, and stirring for 3 hours under the condition of 250r/min to prepare a heat-dissipation cooling coating; the heat dissipation and cooling coating comprises SiC, a dispersing agent and a heat dissipation and cooling coating, wherein the addition amount of the SiC accounts for 25% of the mass of the organic silicon resin, the addition amount of the dispersing agent accounts for 2.5% of the mass of the mixed solution, and the particle size of SiC particles is 60-200 nm;
spraying heat dissipation and cooling coating: polishing and cleaning the bus joint insulating partition, spraying the heat dissipation and cooling coating, and heating for 2 hours at 180 ℃; wherein, the thickness of the coating is 50 μm when the heat dissipation and cooling coating is sprayed.
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| CN106752911A (en) | 2017-05-31 |
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