CN106751674A - A kind of heat sinking moulding compound for Portable electronic product outer casing - Google Patents
A kind of heat sinking moulding compound for Portable electronic product outer casing Download PDFInfo
- Publication number
- CN106751674A CN106751674A CN201611191642.XA CN201611191642A CN106751674A CN 106751674 A CN106751674 A CN 106751674A CN 201611191642 A CN201611191642 A CN 201611191642A CN 106751674 A CN106751674 A CN 106751674A
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- CN
- China
- Prior art keywords
- portable electronic
- outer casing
- electronic product
- heat conduction
- moulding compound
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L69/00—Compositions of polycarbonates; Compositions of derivatives of polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/04—Thermoplastic elastomer
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of heat sinking moulding compound for Portable electronic product outer casing,Comprising makrolon or/and polyestercarbonate,Heat Conduction Material,Impact modifier,Additive,Described makrolon and/or polyestercarbonate are 34.5 87.5wt.%,Described Heat Conduction Material is 10 35 wt.%,Described impact modifier is 2 30 wt.%,And comprising at least 0.1% additive,During processing by raw material after high speed is mixed,Melting extrusion is carried out through Screw Extrusion,Again through pelletizer,The pellet of generation is dried in an oven,Then injection moulding is passed through,Selected material of the present invention,Preparation method science,By the heat conduction glass fibre for being added with Graphene coat,Or add a small amount of carbon fiber in heat conduction glass fibre,While making material that there is thermal conductivity,Keep good intensity,Suitable for thin-wall product,And economically feasible,Oxidant TPSIV and TPU are added simultaneously,Increase the strength of materials with toughness simultaneously,Sense of touch is slight,There is good feel,Bring more preferable customer experience.
Description
Technical field
The invention belongs to polymeric material field, and in particular to a kind of heat sinking for Portable electronic product outer casing
Moulding compound.
Background technology
Portable electric appts have an effect on many industries in addition to changing our life, improve and are set to consumer
Standby quality and experience requirements, portable electric appts are at the aspect such as miniaturization, robust design, aesthetic property to component
Propose new requirement, the requirement of low-profile is to be try to all components and parts assembling Cheng Geng little, more slim and more intelligent
The company of portable electric appts bring challenge, while the potential safety hazard that heating can bring during product use, while
Reduce the comfort experience of client.
Improve electronic product casing material property, including improve material heat dispersion and improve the aspect of material feel two, its
Middle improvement material heat dispersion can add Heat Conduction Material, form it into thermal conducting path, conventional heat filling aluminum oxide etc., have
The characteristics of having addition big, this can cause intensity very poor, it is impossible to make thin-wall product；Also have and used using asphalt base carbon fiber product
In heat conduction, preferably, but carbon fiber is costly for the material conducts heat effect, causes to popularize and uses；Improve the side of material feel
Formula, typically product outer layer using thermoplastic elastomer (TPE) it is encapsulated or spraying elastomer paint mode, it is necessary to improve.
The content of the invention
To solve the above problems, the invention discloses a kind of heat sinking molding group for Portable electronic product outer casing
Compound, while improving thermal conductivity, keeps good intensity, low cost while having good feel, to bring client more preferable
Experience.
To reach above-mentioned purpose, technical scheme is as follows：
A kind of heat sinking moulding compound for Portable electronic product outer casing, comprising makrolon or/and polyester carbonic acid
Ester (A), Heat Conduction Material (B), impact modifier (C), additive（D）, it is characterised in that described makrolon and/or polyester
Carbonic ester is 34.5-87.5wt.%, and described Heat Conduction Material is 10-35 wt.%, and described impact modifier is 2-30 wt.%,
And comprising at least 0.1% additive.
A kind of preparation method of above-mentioned heat sinking moulding compound for Portable electronic product outer casing is：
（1）Raw material is well mixed on high mixer, time 20-25min, rotating speed 1500-1800/min；
（2）Melting extrusion is carried out on screw extruder, extrusion temperature is 260-310 DEG C, pressure 6-8MPa；
（3）Pelletizer, particle size 1-2mm；
（4）The pellet of generation is dried 3-4 hours in 80 ± 5 DEG C of baking ovens；
（5）Then by injection moulding, 250-285 DEG C of injection temperature, injection pressure is 80-120bar, and last test is physical
Energy.
Component A of the present invention can be a kind of makrolon or polyestercarbonate compositions, or different viscosities
Various makrolon or polyestercarbonate, can be synthesized by methods such as ester exchange, interfacial polymerization, polymerisation in solution, polymerisation in bulks.
Component B Heat Conduction Materials of the present invention are：
B-1：Asphalt base carbon fiber, manufacturer is Mitsubishi.
B-2：Heat conduction glass fibre：Graphene coat is provided with the outer surface of glass fibre, manufacturer is Chongqing state
Border.
Component C impact modifiers of the present invention are：
C-1：TPSIV, manufacturer is DOW CORNING.
C-2：TPU, manufacturer is BASF.
This discovery component D is：Antioxidant, manufacturer is BASF.
The beneficial effects of the invention are as follows：
It is prepared by a kind of heat sinking moulding compound for Portable electronic product outer casing of the present invention, selected material
Methodological science, by being added with the heat conduction glass fibre of Graphene coat, or adds a small amount of carbon fiber in heat conduction glass fibre
Mode, while material is had thermal conductivity, keeps good intensity, it is adaptable to thin-wall product, and economically feasible, while addition
Oxidant TPSIV and TPU, increase the strength of materials with toughness simultaneously, and sense of touch is slight, there is good feel, brings more preferable client
Experience.
Specific embodiment
Embodiment 1
A kind of heat sinking moulding compound for Portable electronic product outer casing described in the present embodiment, weight shared by each composition
Measuring percentage is：A is that 67.8%, B-1 is that 7%, B-2 is that 13%, C-1 is that 10%, C-2 is that 2%, D is 0.2%.
Each composition will mix on high mixer above, time 20min, rotating speed 1800/min；It is enterprising through double screw extruder
Row melting extrusion is granulated, and extrusion temperature is 260 DEG C, pressure 8MPa, particle size 1mm；It is 3mm's that thickness is obtained by injection machine
Batten, 280 DEG C of injection temperature, injection pressure is 120bar.
According to the tensile strength of ISO527 test materials, according to the bending property of ISO178 test materials, using DIN
52612 test thermal conductivity factors.
Test result is：Batten tensile strength is 95MPa, and Charpy notch impact strengths are 50 KJ/m2, thermal conductivity factor
It is 3.5 W/ (m K) to reach the effect of good radiating, spline surfaces sense of touch is slight, and feel is preferable.
Embodiment 2
A kind of heat sinking moulding compound for Portable electronic product outer casing described in the present embodiment, weight shared by each composition
Measuring percentage is：A is that 54.7%, B-2 is that 25%, C-1 is that 20%, D is 0.3%.
Each composition will mix on high mixer above, time 25min, rotating speed 1500/min；It is enterprising through single screw extrusion machine
Row melting extrusion is granulated, and extrusion temperature is 310 DEG C, pressure 6MPa, particle size 2mm；It is 1.5mm that thickness is obtained by injection machine
Batten, 295 DEG C of injection temperature, injection pressure is 80bar.
According to the tensile strength of ISO527 test materials, according to the bending property of ISO178 test materials, using DIN
52612 test thermal conductivity factors.
Test result is：Batten tensile strength is 110MPa, and Charpy notch impact strengths are 32.5KJ/m2, heat conduction system
Number is 1.2 W/ (m K), reaches the effect of good radiating, and spline surfaces sense of touch is slight, and feel is preferable.
Embodiment 3
A kind of heat sinking moulding compound for Portable electronic product outer casing described in the present embodiment, weight shared by each composition
Measuring percentage is：A is that 34.7%, B-1 is that 10%, B-2 is that 25%, C-1 is that 15%, C-2 is that 15%, D is 0.3%.
Each composition will mix on high mixer above, time 22min, rotating speed 1600/min；It is enterprising through double screw extruder
Row melting extrusion is granulated, and extrusion temperature is 290 DEG C, pressure 7MPa, particle size 1.5mm；It is 2mm that thickness is obtained by injection machine
Batten, 290 DEG C of injection temperature, injection pressure is 105bar.
According to the tensile strength of ISO527 test materials, according to the bending property of ISO178 test materials, using DIN
52612 test thermal conductivity factors.
Test result is：Batten tensile strength is 105MPa, and Charpy notch impact strengths are 40.3KJ/m2, heat conduction system
Number is 3.1W/ (m K), reaches the effect of good radiating, and spline surfaces sense of touch is slight, and feel is preferable.
Claims (7)
1. a kind of heat sinking moulding compound for Portable electronic product outer casing, comprising makrolon or/and polyester carbon
Acid esters, Heat Conduction Material, impact modifier, additive, it is characterised in that：Described makrolon and/or polyestercarbonate be
34.5-87.5wt.%, described Heat Conduction Material is 10-35 wt.%, and described impact modifier is 2-30 wt.%, and comprising
At least 0.1% additive.
2. the preparation of a kind of heat sinking moulding compound for Portable electronic product outer casing according to claim 1
Method, it is characterised in that：
（1）Raw material is well mixed on high mixer, time 20-25min, rotating speed 1500-1800/min；
（2）Melting extrusion is carried out on screw extruder, extrusion temperature is 260-310 DEG C, pressure 6-8MPa；
（3）Pelletizer, particle size 1-2mm；
（4）The pellet of generation is dried 3-4 hours in 80 ± 5 DEG C of baking ovens；
（5）Then by injection moulding, 250-285 DEG C of injection temperature, injection pressure is 80-120bar, and last test is physical
Energy.
3. a kind of heat sinking moulding compound for Portable electronic product outer casing according to claim 1, it is special
Levy and be：The makrolon or/and polyestercarbonate can be a kind of makrolon or polyestercarbonate compositions, it is also possible to
It is various makrolon or polyestercarbonate of different viscosities, can be by ester exchange, interfacial polymerization, polymerisation in solution, polymerisation in bulk
Method synthesizes.
4. a kind of heat sinking moulding compound for Portable electronic product outer casing according to claim 1, it is special
Levy and be：The Heat Conduction Material is heat conduction glass fibre, and Graphene coat is provided with the outer surface of glass fibre.
5. a kind of heat sinking moulding compound for Portable electronic product outer casing according to claim 4, it is special
Levy and be：The Heat Conduction Material is the composition of heat conduction glass fibre and asphalt base carbon fiber.
6. a kind of heat sinking moulding compound for Portable electronic product outer casing according to claim 1, it is special
Levy and be：The impact modifier is TPSIV and/or TPU.
7. a kind of heat sinking moulding compound for Portable electronic product outer casing according to claim 1, it is special
Levy and be：The additive is antioxidant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611191642.XA CN106751674A (en) | 2016-12-21 | 2016-12-21 | A kind of heat sinking moulding compound for Portable electronic product outer casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611191642.XA CN106751674A (en) | 2016-12-21 | 2016-12-21 | A kind of heat sinking moulding compound for Portable electronic product outer casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106751674A true CN106751674A (en) | 2017-05-31 |
Family
ID=58896855
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611191642.XA Pending CN106751674A (en) | 2016-12-21 | 2016-12-21 | A kind of heat sinking moulding compound for Portable electronic product outer casing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111607211A (en) * | 2020-05-28 | 2020-09-01 | 宁波德伟电器有限公司 | High-heat-dissipation PC composite material and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104163578A (en) * | 2014-07-22 | 2014-11-26 | 杭州杭复新材料科技有限公司 | Preparation method of graphene coated composite glass fiber |
| CN104448758A (en) * | 2014-11-27 | 2015-03-25 | 五行材料科技（江苏）有限公司 | Flame-retardant polycarbonate enhanced high-modulus molding combination and preparation method thereof |
| CN105295344A (en) * | 2015-12-04 | 2016-02-03 | 五行材料科技（江苏）有限公司 | Polycarbonate reinforced high-modulus molding composition with flame retardance |
| CN105968813A (en) * | 2016-06-15 | 2016-09-28 | 朱森 | Heat-dissipation fouling-resistant mobile phone protection shell |
-
2016
- 2016-12-21 CN CN201611191642.XA patent/CN106751674A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104163578A (en) * | 2014-07-22 | 2014-11-26 | 杭州杭复新材料科技有限公司 | Preparation method of graphene coated composite glass fiber |
| CN104448758A (en) * | 2014-11-27 | 2015-03-25 | 五行材料科技（江苏）有限公司 | Flame-retardant polycarbonate enhanced high-modulus molding combination and preparation method thereof |
| CN105295344A (en) * | 2015-12-04 | 2016-02-03 | 五行材料科技（江苏）有限公司 | Polycarbonate reinforced high-modulus molding composition with flame retardance |
| CN105968813A (en) * | 2016-06-15 | 2016-09-28 | 朱森 | Heat-dissipation fouling-resistant mobile phone protection shell |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111607211A (en) * | 2020-05-28 | 2020-09-01 | 宁波德伟电器有限公司 | High-heat-dissipation PC composite material and preparation method thereof |
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