CN106716315A - Flexible packaging cover plate, preparation method therefor, touch display device, and preparation method therefor - Google Patents
Flexible packaging cover plate, preparation method therefor, touch display device, and preparation method therefor Download PDFInfo
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- CN106716315A CN106716315A CN201580002181.4A CN201580002181A CN106716315A CN 106716315 A CN106716315 A CN 106716315A CN 201580002181 A CN201580002181 A CN 201580002181A CN 106716315 A CN106716315 A CN 106716315A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
Abstract
A flexible packaging cover plate (104) having a touch function comprises a substrate (106) and a touch layer (108) located on the substrate (106). The touch layer (108) comprises a filling layer (112) and a conductive pattern layer (114). The filling layer (112) covers the conductive pattern layer (114) and fills a gap of the conductive pattern layer (114). Because the flexible packaging cover plate (104) comprises the conductive pattern layer (114) configured to achieve a touch function, relevant process steps such as adhesion of a touch panel can be omitted. In addition, because the filling layer (112) covers the conductive pattern layer (114) and fills the gap of the conductive pattern layer (114), chromatic aberration of emergent light caused by the conductive pattern layer (114) is reduced, thereby improving the uniformity of the emergent light. Also disclosed are a preparation method for the flexible packaging cover plate (104), a touch display device (100), and a preparation method for the touch display device (100).
Description
The present invention relates to touch control field, more specifically, it is related to a kind of flexible package cover plate for possessing touch function and the preparation method and a kind of touch display unit of a kind of flexible package cover plate for possessing touch function and a kind of preparation method of touch display unit.
With the development of portable electronic display device, touch-screen (touch panel) provides a kind of new man-machine interaction interface, and it is using upper more direct, more humane.Touch-screen is combined with two-d display panel, touch display unit is formed, can make flat display apparatus that there is touch controllable function, input can be performed by finger, stylus etc., operation is more directly perceived, easy.
For example, TaiWan, China patent application the 201430792nd discloses a kind of bendable contact panel and uses its bendable touch control display, the touch control display includes display panel and the touch control layer on display panel.Wherein, plastic rubber substrate and gas barrier layer of the touch control layer by two layers of touch control sensor layer up and down and between two layers of touch control sensor layer are constituted.Display panel is fitted with driving flexible circuit board (FPC).
But; in touch control display disclosed in patent application the 201430792nd, touch control sensor layer is in flexible base board upper and lower surface, and upper surface sensor needs remain for protection during output of products; and sensor layer pattern gap is unfavorable for the homogeneity of light extraction without filling.
Also, Chinese patent application the CN201410734964.9th discloses a kind of OLED touch control display apparatus and its manufacture method.The touch control display apparatus includes OLED display screen 1 and transparent touch-sensitive panel 2.Wherein transparent touch-sensitive panel 2 is included in the electrode conducting layer formed on transparent enclosure cover plate 12.This electrode conducting layer at least includes two unitized electrodes 24, the first insulating barrier 26 positioned at the infall of unitized electrode 24, the auxiliary electrode 25 for connecting unitized electrode 24 and the touch drive circuit 23 being electrically connected with auxiliary electrode 25.
But, touch control display apparatus disclosed in patent application the CN201410734964.9th is needed to add OLED encapsulation cover plates, and encapsulation cover plate (Barrier Film), and the presence influence efficiency of multilayer flexible substrate are stilled need during flexible package.
The content of the invention
It is contemplated that at least solving one of technical problem present in prior art.Therefore, the present invention needs to provide a kind of flexible package cover plate and the preparation method and a kind of touch display unit of a kind of flexible package cover plate for possessing touch function and a kind of preparation method of touch display unit for possessing touch function.
Embodiments of the present invention provide a kind of flexible package cover plate for possessing touch function, it includes substrate and the touch control layer on the substrate, the touch control layer includes packed layer and conductive pattern layer, and the packed layer covers the conductive pattern layer and fills the gap of the conductive pattern layer.
Above-mentioned flexible package cover plate includes the conductive pattern layer for realizing touch function, the associated process steps such as touch panel laminating can be reduced, simultaneously, packed layer covers conductive pattern layer and fills the gap of conductive pattern layer, the light extraction aberration that conductive pattern layer is formed is reduced, is conducive to the homogeneity of light extraction.
Embodiments of the present invention also provide a kind of preparation method for the flexible package cover plate for possessing touch function, and it comprises the following steps：
S1：Substrate is provided；
S2：Touch control layer is formed on the substrate, the touch control layer includes packed layer and conductive pattern layer, the packed layer covers the conductive pattern layer and fills the gap of the conductive pattern layer；
S3：Mould release membrance is formed in the touch control layer, the touch control layer is located between the substrate and the mould release membrance.
Embodiments of the present invention also provide a kind of touch display unit, its flexible package cover plate for including display panel and possessing touch function, the flexible package cover plate includes substrate and the touch control layer on the substrate, the touch control layer includes packed layer and conductive pattern layer, the packed layer covers the conductive pattern layer and fills the gap of the conductive pattern layer, and the touch control layer is fitted with the display panel.
Embodiments of the present invention also provide a kind of preparation method of touch display unit, and it comprises the following steps：
S1：Substrate is provided；
S2：Touch control layer is formed on the substrate, the touch control layer includes packed layer and conductive pattern layer, the packed layer covers the conductive pattern layer and fills the gap of the conductive pattern layer；
S3：Mould release membrance is formed in the touch control layer, the touch control layer is located between the substrate and the mould release membrance；
S4：The mould release membrance is removed, and display panel is fitted in the touch control layer by binder course；
S5：Solidify the binder course.
The additional aspect and advantage of the present invention will be set forth in part in the description, and partly will become apparent from the description below, or be recognized by the practice of the present invention.
The above-mentioned and/or additional aspect and advantage of the present invention will be apparent and be readily appreciated that from description of the accompanying drawings below to embodiment is combined, wherein：
Fig. 1 is the structural representation of the touch display unit of better embodiment of the present invention；
Fig. 2 is that the touch display unit of better embodiment of the present invention is connected with the schematic diagram of flexible PCB；
Fig. 3 is the structural representation of the conductive pattern layer of the touch display unit of better embodiment of the present invention；
Fig. 4 is the structural representation of the touch display unit of another better embodiment of the invention；
Fig. 5 is the schematic flow sheet of the preparation method of the flexible package cover plate of better embodiment of the present invention；And
Fig. 6 is the schematic flow sheet of the preparation method of the touch display unit of better embodiment of the present invention.
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein same or similar label represents same or similar element or the element with same or like function from beginning to end.The embodiment described below with reference to accompanying drawing is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".In the description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to which explanation, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；It can be mechanical connection or electrical connection or can be in communication with each other；Can be joined directly together, can also be indirectly connected to by intermediary, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to simplify disclosure of the invention, hereinafter to the parts of specific examples and description is set for.Certainly, they are only merely illustrative, and purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter, this repetition be for purposes of simplicity and clarity, itself do not indicate discussed various embodiments and/or setting between relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be appreciated that the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the touch display unit 100 of the first better embodiment of the invention includes display panel 102 and possesses the flexible package cover plate 104 of touch function.
In present embodiment, display panel 102 is organic LED display panel (organic light emitting diode panel, OLED panel).OLED display panel has the advantages that self-luminous, driving voltage are low, luminous efficiency is high, the response time is short, definition and contrast is high, nearly 180 ° of visual angles and temperature in use scope are wide, and many advantages, such as Flexible Displays are with large area total colouring can be achieved.The periphery of display panel 102 can be connected with flexible PCB 400, and the flexible PCB 400 is used for the controller (control IC) for connecting display panel 102 and display panel, as shown in Figure 2.
The flexible package cover plate 104 includes substrate 106, the touch control layer 108 on the substrate 106 and the binder course 110 in the touch control layer 108.
In the touch display unit 100 shown in Fig. 1, substrate 106 is located at outermost layer.Preferably, the substrate 106 is flexible base board, its material can be the material such as polyethylene terephthalate (polyethylene terephthalate, PET) or PEN (polyethylene naphthalate, PEN).
The touch control layer 108 is located between the substrate 106 and the binder course 110, and the touch control layer 108 includes packed layer 112 and conductive pattern layer 114.The packed layer 112 covers the conductive pattern layer 114 and fills the gap of the conductive pattern layer 114.
In present embodiment, it is preferred that the touch control layer 108 includes the first wall 116 and the second wall 118, the first wall 116 connects the substrate 106 and the conductive pattern layer 114, and second wall 118 connects the packed layer 112 and the binder course 110.
The material of first wall 116 can be inorganic material, and the material of the second wall 118 can be inorganic material, and the first wall 116 and the second wall 118 can prevent gas, moisture from penetrating into conductive pattern layer 114 and display panel 102 from the external world.Specifically, in present embodiment, the material of first wall 116 and the second wall 118 is that inorganic material, such as nitride and/or oxide are formed, including calcium oxide, aluminum oxide, silica, titanium oxide, indium oxide, silica, silicon nitride, and/or aluminium nitride.First wall 116 and the second wall 118 can be by the formation of chemical vapor deposition (CVD) method on flexible package cover plate 104.
The conductive pattern layer 114 includes the first patterned layer 120 and the second patterned layer 122, and first patterned layer 120 and second patterned layer 122 are in same layer, the packed layer 112 are filled between first patterned layer 120 and second patterned layer 122.
Incorporated by reference to Fig. 2 and 3, the first patterned layer 120 includes the lead (not shown) of first electrode 124 and first, the first lead connection first electrode 124 and the flexible PCB 500 for connecting outside.Second patterned layer 122 includes the lead (not shown) of second electrode 126 and second, second lead connects second electrode 126 and the flexible PCB 500 for connecting outside, the connection touch control layer 108 of flexible PCB 500 of the outside and the controller (control IC) of touch control layer.
It please join Fig. 3, as an example, first electrode 124 and second electrode 126 are in comb teeth-shaped structure, first electrode 124 and the space crossings of second electrode 126 formation conductive pattern.First electrode 124 and second electrode 126 can be used as touch electrode.The material of first electrode 124 and the material of second electrode 126 can be using materials such as graphene or nano-silver threads, and in conductive film corresponding pattern can be made by way of laser-induced thermal etching, for example launch laser using pulse mode, and control the intensity of laser to be etched conductive film.The material of the material of first lead and the second lead can select the materials such as conductive silver paste, and can form on the first wall 116 and connect corresponding electrode by typography after first electrode 124 and the formation of second electrode 126.Because the first patterned layer 120 and the second patterned layer 122 are in same layer, therefore, the flexible package cover plate 104 of present embodiment can reduce film layer number, and flexible package cover plate 104 is made into more frivolous, flexible.
It is pointed out that the gap of conductive pattern layer 114 includes the gap (if having) of the first patterned layer 120 itself, second
The gap of conductive pattern layer 114 is formed needed for gap formed between the gap (if having) of patterned layer 122 itself and the first patterned layer 120 and the second patterned layer 122 etc..
Packed layer 112 can be formed in conductive pattern layer 114 and be filled the gap of conductive pattern layer 114 using chemical vapor deposition (CVD) method or printing technology.In present embodiment, packed layer 112 is organic film.The material of organic film can select acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.Compared to inoranic membrane, determine more closely fill the gap of conductive pattern layer 114 using the material character of the packed layer 112 of organic film, packed layer 112 can also preferably buffer the stress of the whole structure of flexible package cover plate 104.Further, when using organic film to fill the gap of conductive pattern layer as packed layer 112, compare the filling of inoranic membrane, can be more preferable as the flatness of packed layer 112 using organic film, in addition, due to organic film filling effect more preferably, so the packaging effect correspondence of flexible package cover plate 100 also can be more preferable.
Binder course 110 is located between display panel 102 and touch control layer 108 and connects display panel 102 and touch control layer 108.Binder course 110 is adhesive-layer, forms binder course 110 on the second wall 118 using coating or the method pasted.Binder course 110 is fitted with display panel 102.
In summary, in above-mentioned touch display unit 100, flexible package cover plate 104 includes the conductive pattern layer 114 for realizing touch function, the associated process steps such as touch panel laminating can be reduced, simultaneously, filling film 112 covers conductive pattern layer 114 and fills the gap of conductive pattern layer 114, reduces the light extraction aberration that conductive pattern layer 114 is formed, is conducive to the homogeneity of light extraction.Meanwhile, compared with out-cell or on-cell capacitance touch screen used in traditional OLED display panel, touch display unit 100 of the invention reduces the use of flexible base board, so as to add the light extraction efficiency of OLED display panel 102.
It please join Fig. 4, the second better embodiment of the invention provides a kind of touch display unit 200.The touch display unit 200 of present embodiment is roughly the same with the touch display unit 100 of the first better embodiment, and its difference is, the structure of the touch control layer 202 of present embodiment is different.
In the present embodiment, the touch control layer 202 includes the first wall 204, the second clearance layer 206, the 3rd wall 208, packed layer and conductive pattern layer, the conductive pattern layer includes the first patterned layer 210 and the second patterned layer 212, and the packed layer includes the first filling film 214 and the second filling film 216.
The connecting substrate 218 of first wall 204 and first patterned layer 210.Preferably, the first wall 204 is inorganic material, such as formed by nitride and/or oxide, including calcium oxide, aluminum oxide, silica, titanium oxide, indium oxide, silica, silicon nitride, and/or aluminium nitride.First wall 204 can be by the formation of chemical vapor deposition (CVD) method on substrate 218.
First patterned layer 210 includes first electrode and the first lead.Conductive film can be first formed on the first wall 204, then first electrode is prepared with laser (laser) engraving method, the pattern of first electrode can be preset.Afterwards, printing is passed through
Technique forms the first lead on the first wall 218 and connects first electrode.
First filling film 214 covers first patterned layer 210 and fills the gap of first patterned layer 210.It is preferred that the first filling film 214 is organic film.The gap of first patterned layer 210 needed for gap that the gap and the first lead that the pattern that the gap of first patterned layer 210 includes first electrode is formed are formed etc. is formed.The material of first filling film 214 can select acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.First filling film 214 can be by chemical gaseous phase depositing process or printing technology formation in the first patterned layer 210.
Second wall 206 covers first filling film 214 and second patterned layer 212.It is preferred that the material of the second wall 206 is inorganic material, such as formed by nitride and/or oxide, including calcium oxide, aluminum oxide, silica, titanium oxide, indium oxide, silica, silicon nitride, and/or aluminium nitride.Second wall 206 can be by the formation of chemical vapor deposition (CVD) method on the first organic film 214.
Second patterned layer 212 includes second electrode and the second lead.Conductive film can be first formed on the second wall 206, then second electrode is prepared with laser ablation method, the pattern of second electrode can be preset.Afterwards, the second lead is formed on the second wall 206 by typography and connects second electrode.
Second filling film 216 covers second patterned layer 212 and fills the gap of second patterned layer 212.It is preferred that the second filling film 216 is organic film.The gap of second patterned layer 212 needed for gap that the gap and the second lead that the pattern that the gap of second patterned layer 212 includes second electrode is formed are formed etc. is formed.The material of second filling film 216 can select acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.Second filling film 216 can be by chemical gaseous phase depositing process or printing technology formation in the second patterned layer 212.First filling film 214 and the second filling film 216 can select same material to facilitate the preparation of flexible apparatus cover plate and cost-effective.
3rd wall 208 connects second organic film 216 and binder course 220, preferably, the material of 3rd wall 208 is inorganic material, is such as formed by nitride and/or oxide, including calcium oxide, aluminum oxide, silica, titanium oxide, indium oxide, silica, silicon nitride, and/or aluminium nitride.3rd wall 208 can be by the formation of chemical vapor deposition (CVD) method on the second organic film 216.Further, the preparation of flexible apparatus cover plate and cost-effective for convenience, the first clearance layer 204, the second wall 206 and the 3rd wall 208 can select same material.
In summary, the beneficial effect of the touch display unit 200 of present embodiment and the beneficial effect of the touch display unit 100 of the first better embodiment are essentially identical.Further, in embodiments, because the first patterned layer 210 and the layering of the second patterned layer 212 are set, if the first filling film 214 and the second filling film 216 are prepared from elastomeric material, then touch display unit 200 can also realize the function of sensing pressure touch.
It please join Fig. 5, the preparation method of the flexible package cover plate for possessing touch function of the 3rd better embodiment of the invention comprises the following steps：
S1：Substrate is provided；
S2：Touch control layer is formed on the substrate, the touch control layer includes packed layer and conductive pattern layer, the packed layer covers the conductive pattern layer and fills the gap of the conductive pattern layer；
S3：Mould release membrance is formed in the touch control layer, the touch control layer is located between the substrate and the mould release membrance.
In step sl, the substrate is flexible base board, its material can be the material such as polyethylene terephthalate (polyethylene terephthalate, PET) or PEN (polyethylene naphthalate, PEN).
Flexible package cover plate 104 for preparing the first better embodiment, step S2 includes：
S21：The first wall 116 is formed on substrate 106；
S22：The first patterned layer 120 and the second patterned layer 122 are formed on first wall 116, first patterned layer 120 and second patterned layer 122 are in same layer, and first patterned layer 120 and second patterned layer 122 constitute the conductive pattern layer 114；
S23：The packed layer 112 is formed in the conductive pattern layer 114, the packed layer 112 fills the gap between the patterned layer 122 of the first patterned layer 120 and second；
S24：The second wall 118 is formed on the packed layer 112.
In the step s 21, the first wall 116 can be deposited by chemical vapor deposition (CVD) method and formed on substrate, it is preferred that the material of the first wall 116 is inorganic material.
In step S22, (coating) layer of conductive film can be first coated with the first wall 116, then first electrode 124 and second electrode 126 are prepared in the conductive film with laser ablation method.The material of conductive film can select graphene or nanometer money.Using laser ablation method patterned conductive thin film, compared with conventional lithography process, processing step drastically reduce the area.
Afterwards, the first lead and the second lead, the first lead connection first electrode 124, the second lead connection second electrode 126 are prepared with typography.The material of lead can select conductive silver paste.
In step S23, packed layer 112 is organic film, and its material can select acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.Packed layer 112 can be by the deposition process such as chemical vapor deposition or printing technology formation in conductive pattern layer 114.It is preferred that forming the gap that packed layer 112 is more conducive to fill conductive pattern layer 114 using deposition process such as chemical vapor depositions.
Due in step S22, producing gap when forming the first patterned layer 120 and the second patterned layer 122, therefore, packed layer 112 also fills the gap of conductive pattern layer 114.Compared to inoranic membrane, the material character of organic film is determined more closely fill the gap of conductive pattern layer 114, and the stress of the whole structure of flexible package cover plate 104 can also be preferably buffered using the packed layer 112 of organic film.Further, when using organic film to fill the gap of conductive pattern layer as packed layer 112, compare the filling of inoranic membrane, can be more preferable as the flatness of packed layer 112 using organic film, in addition, due to organic film filling effect more preferably, so the packaging effect correspondence of flexible package cover plate 100 also can be more preferable.
In step s 24, the second wall 118 can be deposited by chemical vapor deposition (CVD) method and formed on packed layer 112.Second wall 118 can select and the identical inorganic material of the first clearance layer 116, to facilitate the preparation of flexible package cover plate 104 and reduce cost.
In step s3, the mould release membrance (not shown) can be attached in the touch control layer 108 using binder course 110 or vacuum mode.Binder course 110 can use adhesive-layer, and using coating method formation on the second wall 118.
Flexible package cover plate for preparing the second better embodiment, step S2 includes：
S21：The first wall 204 is formed on substrate 218；
S22：The first patterned layer 210 is formed on first wall 204；
S23：The first filling film 214 is formed in first patterned layer 210, first filling film 214 fills the gap of first patterned layer 210；
S24：The second wall 206 is formed on first filling film 214；
S25：The second patterned layer 212 is formed on second wall 206；
S26：The second filling film 216 is formed in second patterned layer 212, second filling film 216 fills the gap of second patterned layer 212；
S27：The 3rd wall 208 is formed on second filling film 216.
First patterned layer 210 and second patterned layer 212 constitute the conductive pattern layer, and first filling film 214 and second filling film 216 constitute the packed layer.
In the step s 21, the first wall 204 can be deposited by chemical vapor deposition (CVD) method and formed on substrate 218, it is preferred that the first wall 204 selects inorganic material.
In step S22, (coating) layer of conductive film can be first coated with the first wall 204, then first electrode is prepared in the conductive film with laser ablation method.The material of conductive film can select graphene or nanometer money.Using laser ablation method patterned conductive thin film, compared with conventional lithography process, processing step drastically reduce the area.
Afterwards, the first lead, the first lead connection first electrode are prepared with typography.The material of first lead can select conductive silver paste.
In step S23, the first filling film 214 is organic film, and the material of organic film can select acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.First filling film 214 can be by the deposition process such as chemical vapor deposition or printing technology formation in the first patterned layer 210.Due in step S22, producing gap when forming the first patterned layer 210, therefore, the first filling film 214 also fills the gap of the first patterned layer 210.Compared to inoranic membrane, the material character of organic film determines more closely fill the gap of the first patterned layer 210, the stress of whole flexible package covering plate structure can also be preferably buffered using the first filling film 214 of organic film, further, when using organic film to fill the gap of conductive pattern layer as the first filling film 214, compare the filling of inoranic membrane, using organic film as
The flatness of first filling film 214 can be more preferable, further, since organic film filling effect is more preferably, so the packaging effect correspondence of flexible package cover plate 200 also can be more preferable.It is preferred that forming the gap that the first filling film 214 is more conducive to fill the first patterned layer 210 using deposition process such as chemical vapor depositions.
In step s 24, the second wall 206 can select and the identical inorganic material of the first clearance layer 204, to facilitate the preparation of flexible package cover plate and reduce cost.Similarly, the second wall 206 can deposit formation using chemical gas deposition method on the first organic film 214.
In step s 25, (coating) layer of conductive film can be first coated with the second wall 206, then second electrode is prepared in the conductive film with laser ablation method.The material of conductive film can select graphene or nanometer money.Using laser ablation method patterned conductive thin film, compared with conventional lithography process, processing step drastically reduce the area.
Afterwards, the second lead, the second lead connection second electrode are prepared with typography.The material of second lead can select conductive silver paste.
In step S26, the material of the second filling film 216 can select acrylic resin, methacrylic resin, polyester, polyethylene terephthalate, polyethylene or polypropylene.Second filling film 216 can be by the deposition process such as chemical vapor deposition or printing technology formation in the second patterned layer 212.Due in step s 25, producing gap when forming the second patterned layer 212, therefore, the second filling film 216 also fills the gap of the second patterned layer 212.Compared to inoranic membrane, the material character of organic film determines more closely fill the gap of the second patterned layer 212, the stress of whole flexible package covering plate structure can also be preferably buffered using the second filling film 216 of organic film, further, when using organic film to fill the gap of conductive pattern layer as the second filling film 216, compare the filling of inoranic membrane, can be more preferable as the flatness of the second filling film 216 using organic film, in addition, due to organic film filling effect more preferably, so the packaging effect correspondence of flexible package cover plate 200 also can be more preferable.It is preferred that forming the gap that the second filling film 216 is more conducive to fill the second patterned layer 212 using deposition process such as chemical vapor depositions.
In step s 27, the 3rd wall 208 can select and the identical inorganic material of the first clearance layer 204, to facilitate the preparation of flexible package cover plate and reduce cost.Similarly, the 3rd wall 208 can deposit formation using chemical gas deposition method on the second filling film 216.
In step s3, the mould release membrance (not shown) can be attached in the touch control layer 202 using binder course 220 or vacuum mode.Binder course 220 can use adhesive-layer, and using coating method formation on the 3rd wall 208.
In summary, in the preparation method of above-mentioned flexible package cover plate, for realizing that the conductive pattern layer of touch function can be formed in flexible package cover plate, therefore, the associated process steps such as touch panel laminating can be reduced, meanwhile, filling film covering conductive pattern layer and the gap for filling conductive pattern layer, the light extraction aberration that conductive pattern layer is formed is reduced, is conducive to the homogeneity of light extraction.
It please join Fig. 6, the preparation method of the touch display unit of the 4th better embodiment of the invention comprises the following steps：
S1：Substrate is provided；
S2：Touch control layer is formed on the substrate, the touch control layer includes filling film layer and conductive pattern layer, the filling film layer covers the conductive pattern layer and fills the gap of the conductive pattern layer；
S3：Mould release membrance is formed in the touch control layer, the touch control layer is located between the substrate and the mould release membrance；
S4：The mould release membrance is removed, and display panel is fitted in the touch control layer by binder course；
S5：Solidify the binder course.
Wherein, illustrating for step S1~S3 can join flexible package cover plate of embodiment of above and preparation method thereof.
In step s3, if mould release membrance is to be attached to by binder course in touch control layer, then in step s 4, directly display panel can be fitted in the touch control layer by binder course after removing mould release membrance.
In step s3, if mould release membrance is to be attached to by vacuum mode in touch control layer, then in step s 4, remove after mould release membrance, display panel can be fitted in the touch control layer after wall outer surface coating binder course.
In step s 5, binder course is solidified using curing modes such as pressurization or ultraviolet curings.
In summary, the preparation method of above-mentioned touch display unit can reduce the associated process steps such as touch panel laminating and be conducive to the homogeneity of touch display unit light extraction.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " exemplary embodiment ", " example ", " specific example " or " some examples " etc. means to be contained at least one embodiment of the present invention or example with reference to specific features, structure, material or the feature of the embodiment or example description.In this manual, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, specific features, structure, material or the feature of description can in an appropriate manner be combined in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：A variety of change, modification, replacement and modification can be carried out to these embodiments, the scope of the present invention is limited by claim and its equivalent in the case where not departing from the principle and objective of the present invention.
Claims (17)
- A kind of flexible package cover plate for possessing touch function, it is characterised in that the touch control layer including substrate and on the substrate, the touch control layer includes packed layer and conductive pattern layer, and the packed layer covers the conductive pattern layer and fills the gap of the conductive pattern layer.
- The flexible package cover plate as claimed in claim 1 for possessing touch function, it is characterised in that the packed layer is organic film.
- The flexible package cover plate as claimed in claim 1 for possessing touch function, it is characterized in that, the touch control layer includes the first wall and the second wall, first wall connects the substrate and the conductive pattern layer, the conductive pattern layer includes the first patterned layer and the second patterned layer, first patterned layer and second patterned layer are in same layer, and the packed layer is filled between first patterned layer and second patterned layer, and second wall connects the packed layer.
- The flexible package cover plate as claimed in claim 3 for possessing touch function, it is characterised in that the material of first wall is inorganic material, and the material of second wall is inorganic material.
- The flexible package cover plate as claimed in claim 1 for possessing touch function, it is characterized in that, the touch control layer includes the first wall, the second clearance layer and the 3rd wall, and the conductive pattern layer includes the first patterned layer and the second patterned layer, and the packed layer includes the first filling film and the second filling film；First wall connects the substrate and first patterned layer；First filling film covers first patterned layer and fills the gap of first patterned layer；Second wall connects first filling film and second patterned layer；Second filling film covers second patterned layer and fills the gap of second patterned layer；3rd wall connects second filling film.
- The flexible package cover plate as claimed in claim 5 for possessing touch function, it is characterised in that the material of first wall is inorganic material, and the material of second wall is inorganic material, and the material of the 3rd wall is inorganic material.
- The flexible package cover plate as claimed in claim 1 for possessing touch function, it is characterised in that the flexible package cover plate also includes binder course, the binder course is located in the touch control layer, and the touch control layer is located between the substrate and the binder course.
- A kind of preparation method for the flexible package cover plate for possessing touch function, it is characterised in that comprise the following steps：S1：Substrate is provided；S2：Touch control layer is formed on the substrate, the touch control layer includes packed layer and conductive pattern layer, the packed layer covers the conductive pattern layer and fills the gap of the conductive pattern layer；S3：Mould release membrance is formed in the touch control layer, the touch control layer is located between the substrate and the mould release membrance.
- The preparation method of the flexible package cover plate as claimed in claim 8 for possessing touch function, it is characterised in that step S2 comprises the following steps：S21：The first wall is formed on the substrate；S22：The first patterned layer and the second patterned layer are formed on first wall, first patterned layer and second patterned layer are in same layer, and first patterned layer and second patterned layer constitute the conductive pattern layer；S23：The packed layer is formed in the conductive pattern layer, the packed layer fills the gap between first patterned layer and the second patterned layer；S24：The second wall is formed on the packed layer.
- The preparation method of the flexible package cover plate as claimed in claim 9 for possessing touch function, it is characterised in that the material of first wall is inorganic material, and the material of second wall is inorganic material.
- The preparation method of the flexible package cover plate as claimed in claim 8 for possessing touch function, it is characterised in that step S2 comprises the following steps：S21：The first wall is formed on the substrate；S22：The first patterned layer is formed on first wall；S23：The first filling film is formed in first patterned layer, first filling film fills the gap of first patterned layer；S24：The second wall is formed on first filling film；S25：The second patterned layer is formed on second wall；S26：The second filling film is formed in second patterned layer, second filling film fills the gap of second patterned layer；S27：The 3rd wall is formed on second filling film；First patterned layer and second patterned layer constitute the conductive pattern layer, and first filling film and second filling film constitute the packed layer.
- The preparation method of the flexible package cover plate as claimed in claim 11 for possessing touch function, it is characterised in that should The material of first wall is inorganic material, and the material of second wall is inorganic material, and the material of the 3rd wall is inorganic material.
- The preparation method of the flexible package cover plate as claimed in claim 8 for possessing touch function, it is characterised in that step S3 includes：The mould release membrance is attached in the touch control layer using binder course or vacuum mode.
- A kind of touch display unit, it is characterized in that, including display panel and possesses the flexible package cover plate of touch function, the flexible package cover plate includes substrate and the touch control layer on the substrate, the touch control layer includes packed layer and conductive pattern layer, the packed layer covers the conductive pattern layer and fills the gap of the conductive pattern layer, and the touch control layer is fitted with the display panel.
- Touch display unit as claimed in claim 14, it is characterized in that, the touch control layer includes the first wall and the second wall, first wall connects the substrate and the conductive pattern layer, the conductive pattern layer includes the first patterned layer and the second patterned layer, first patterned layer and second patterned layer are in same layer, and the packed layer is filled between first patterned layer and second patterned layer, and second wall connects the packed layer.
- Touch display unit as claimed in claim 13, it is characterized in that, the touch control layer includes the first wall, the second clearance layer and the 3rd wall, and the conductive pattern layer includes the first patterned layer and the second patterned layer, and the packed layer includes the first filling film and the second filling film；First wall connects the substrate and first patterned layer；First filling film covers first patterned layer and fills the gap of first patterned layer；Second wall connects first filling film and second patterned layer；Second filling film covers second patterned layer and fills the gap of second patterned layer；3rd wall connects second filling film.
- A kind of preparation method of touch display unit, it is characterised in that comprise the following steps：S1：Substrate is provided；S2：Touch control layer is formed on the substrate, the touch control layer includes packed layer and conductive pattern layer, the packed layer covers the conductive pattern layer and fills the gap of the conductive pattern layer；S3：Mould release membrance is formed in the touch control layer, the touch control layer is located between the substrate and the mould release membrance；S4：The mould release membrance is removed, and display panel is fitted in the touch control layer by binder course；S5：Solidify the binder course.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/082241 WO2016206023A1 (en) | 2015-06-24 | 2015-06-24 | Flexible packaging cover plate, preparation method therefor, touch display device, and preparation method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106716315A true CN106716315A (en) | 2017-05-24 |
Family
ID=57584464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580002181.4A Withdrawn CN106716315A (en) | 2015-06-24 | 2015-06-24 | Flexible packaging cover plate, preparation method therefor, touch display device, and preparation method therefor |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106716315A (en) |
| WO (1) | WO2016206023A1 (en) |
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- 2015-06-24 CN CN201580002181.4A patent/CN106716315A/en not_active Withdrawn
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2016206023A1 (en) | 2016-12-29 |
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