CN106712749A - Silicon carbide MOSFET and JEFT based hybrid high-voltage device - Google Patents

Silicon carbide MOSFET and JEFT based hybrid high-voltage device Download PDF

Info

Publication number
CN106712749A
CN106712749A CN201611029350.6A CN201611029350A CN106712749A CN 106712749 A CN106712749 A CN 106712749A CN 201611029350 A CN201611029350 A CN 201611029350A CN 106712749 A CN106712749 A CN 106712749A
Authority
CN
China
Prior art keywords
jfet
voltage
voltage device
mosfet
mixed high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201611029350.6A
Other languages
Chinese (zh)
Other versions
CN106712749B (en
Inventor
倪喜军
李先允
韩焕菊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Institute of Technology
Original Assignee
Nanjing Institute of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Institute of Technology filed Critical Nanjing Institute of Technology
Priority to CN201611029350.6A priority Critical patent/CN106712749B/en
Publication of CN106712749A publication Critical patent/CN106712749A/en
Application granted granted Critical
Publication of CN106712749B publication Critical patent/CN106712749B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/10Modifications for increasing the maximum permissible switched voltage
    • H03K17/107Modifications for increasing the maximum permissible switched voltage in composite switches
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/567Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K2217/00Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/0036Means reducing energy consumption

Landscapes

  • Power Conversion In General (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

The invention discloses a silicon carbide MOSFET and JEFT based hybrid high-voltage device, which comprises an MOSFET, N pieces of JFETs, N pieces of JFET driving circuits, a source electrode of the hybrid high-voltage device, a grid electrode of the hybrid high-voltage device and a drain electrode of the hybrid high-voltage device. Power portions of the circuit are connected in series through silicon carbide devices, and realize driving for the JFETs through components such as voltage stabilizing tubes, diodes, resistors and capacitors. The final hybrid high-voltage device can realize high withstand voltage of at least 6kV. Compared with other high-voltage devices, the high-voltage device disclosed by the invention can realize high frequency, high efficiency and high power intensity, and is applicable to application fields of medium and high voltage power electronic converters.

Description

Mixed high-voltage device based on silicon carbide MOSFET and JFET
Technical field
The present invention relates to a kind of mixed high-voltage device based on silicon carbide MOSFET and JFET, belong to Power Electronic Technique neck Domain.
Background technology
Carborundum (Silicon Carbide, SiC) as third generation semi-conducting material, with high withstand voltage, high-temperature resistant etc. Number of advantages, has obtained the extensive concern in power device field.SiC device after the development of more than 20 years, up to the present, only Having 1200V and 1700V SiC MOSFET and SiC JFET has had some commercially produced products, higher voltage SiC device also in In the laboratory research stage, due to technology and cost reason, large-scale use is not obtained also at present.Wherein SiC MOSFET have open Close that frequency is high, conducting resistance is small, input impedance is high, thermal stability is good, without second breakdown problem the advantages of, but electric current reverse flow When dynamic, the conduction voltage drop of its own parasitic diode is big.SiC JFET pipe have hot properties is good, amplification performance is good, noise is low, Simple structure, mature preparation process, reliability is high, it is cheap the advantages of, but its gate pole threshold values is often negative voltage, not plus is being driven It is normally opened device during dynamic negative pressure, therefore can not be accepted extensively by industrial quarters.
The content of the invention
In order to solve the above-mentioned technical problem, the invention provides a kind of mixed high-voltage based on silicon carbide MOSFET and JFET Device.
In order to achieve the above object, the technical solution adopted in the present invention is:
Mixed high-voltage device based on silicon carbide MOSFET and JFET, including MOSFET, N number of JFET, N number of JFET drive electricity The drain electrode of road, the source electrode of mixed high-voltage device, the grid of mixed high-voltage device and mixed high-voltage device;
The source electrode of MOSFET is connected with the source electrode of mixed high-voltage device, the grid of MOSFET and the grid of mixed high-voltage device Connection, N number of JFET is sequentially connected in series, i-th source electrode connection of the i+1 JFET adjacent thereto that drains of JFET, and i is integer, 0 <i<N, the 1st source electrode of JFET is connected with the drain electrode of MOSFET, and the drain electrode of n-th JFET connects with the drain electrode of mixed high-voltage device Connect;
N number of JFET drive circuits are sequentially connected in series, and the i+1 that the output end of i-th JFET drive circuit is adjacent thereto is individual The input connection of JFET drive circuits, the input of the 1st JFET drive circuit is connected with the grid of mixed high-voltage device, N Grid of the output end of individual JFET drive circuits respectively with N number of JFET is connected.
Also include that MOSFET drives resistance and N number of JFET to drive resistance;MOSFET drives one end of resistance with MOSFET's Grid is connected, and the other end is connected with the grid of mixed high-voltage device, JFET driving resistance two ends respectively with JFET drive circuits The JFET grids connection that output end and the JFET drive circuits drive.
JFET drive circuits include voltage-stabiliser tube string in parallel, diode and resistance capacitance series loop, voltage-stabiliser tube string One end of anode, the anode of diode and resistance capacitance series loop connects into first node, and first node drives for JFET The input of circuit, the other end of the negative electrode of voltage-stabiliser tube string, the negative electrode of diode and resistance capacitance series loop connects into Two nodes, Section Point is the output end of JFET drive circuits.
Voltage-stabiliser tube string include several series connection voltage-stabiliser tube, first anode of voltage-stabiliser tube as voltage-stabiliser tube string anode, The negative electrode of last voltage-stabiliser tube as voltage-stabiliser tube string negative electrode, the anode of two adjacent voltage-stabiliser tubes is connected with negative electrode.
N=5.
The beneficial effect that the present invention is reached:1st, circuit power part of the present invention is connected by silicon carbide device, and is passed through The elements such as voltage-stabiliser tube, diode, resistance, electric capacity realize that JFET drives, and final mixed type high tension apparatus can realize at least 6kV's High withstand voltage, with respect to other high tension apparatus, this high tension apparatus low cost is capable of achieving high-frequency, high efficiency and high power density, is applicable Mesohigh converters application field;2nd, switching frequency of the present invention is much higher compared with other high tension apparatus, therefore it is constituted Converter power density it is high;3rd, only one driving input port of the present invention, drives fairly simple;4th, voltage-stabiliser tube string clamper electricity Only in static state effectively, during dynamic operation, power device partial pressure is determined by resistance capacitance, and voltage-stabiliser tube need not puncture operation on road, because This, the switching loss of actual motion is smaller;5th, conduction loss of the present invention is relatively small, and the positive gate threshold values of SiC MOSFET has Very strong antijamming capability;6th, in circuit during reverse direction current flow, by the way that to electric capacity automatic discharging, electric current flows only through SiC JFET Passage, both reduces conduction loss, and anti-paralleled diode is saved again;7th, driven using the positive voltage of SiC MOSFET, and matched somebody with somebody Suitable positive voltage SiC JFET drive circuits are put, accelerates the opening process of mixed type high tension apparatus.
Brief description of the drawings
Fig. 1 is circuit diagram of the invention.
Fig. 2 is each device voltage figure when mixed type high tension apparatus are turned off.
Fig. 3 is each device voltage measured drawing of mixed type high tension apparatus.
Fig. 4 is each device voltage figure when mixed type high tension apparatus are opened.
Specific embodiment
The invention will be further described below in conjunction with the accompanying drawings.Following examples are only used for clearly illustrating the present invention Technical scheme, and can not be limited the scope of the invention with this.
As shown in figure 1, the mixed high-voltage device based on silicon carbide MOSFET and JFET, including MOSFET, MOSFET drive Resistance, 5 JFET, 5 JFET drive circuits, 5 JFET drive resistance, the source electrode of mixed high-voltage device, mixed high-voltage device Grid and mixed high-voltage device drain electrode.
The source electrode of MOSFET is connected with the source electrode of mixed high-voltage device, the grid of MOSFET by MOSFET drive resistance with The grid connection of mixed high-voltage device, 5 JFET are sequentially connected in series, and the drain electrode of two adjacent JFET is connected with source electrode, the 1st JFET Source electrode be connected with the drain electrode of MOSFET, the drain electrode of the 5th JFET is connected with the drain electrode of mixed high-voltage device.
5 JFET drive circuits are sequentially connected in series, and the output end of two adjacent JFET drive circuits is connected with input, and the 1st The input of individual JFET drive circuits is connected with the grid of mixed high-voltage device, and the output end of 5 JFET drive circuits is led to respectively Crossing 5 JFET drives resistance to be connected with the grid of 5 JFET.
JFET drive circuits include voltage-stabiliser tube string in parallel, diode and resistance capacitance series loop, voltage-stabiliser tube string One end of anode, the anode of diode and resistance capacitance series loop connects into first node, and first node drives for JFET The input of circuit, the other end of the negative electrode of voltage-stabiliser tube string, the negative electrode of diode and resistance capacitance series loop connects into Two nodes, Section Point is the output end of JFET drive circuits.
Voltage-stabiliser tube string include several series connection voltage-stabiliser tube, first anode of voltage-stabiliser tube as voltage-stabiliser tube string anode, The negative electrode of last voltage-stabiliser tube as voltage-stabiliser tube string negative electrode, the anode of two neighboring voltage-stabiliser tube is connected with negative electrode.Resistance electricity Hold resistance and electric capacity that series loop includes series connection.
The operation principle of above-mentioned mixed high-voltage device is specifically divided into quiescent operation, normal turn-off process, normal hard switching and opens By journey and normal Sofe Switch opening process.
In order to better illustrate above-mentioned operation principle, to Fig. 1 in each symbol illustrate:J1~J55 are represented respectively JFET, M1Represent MOSFET, R1~R5The resistance in 5 resistance capacitance series loops, C are represented respectively1~C55 electricity are represented respectively Electric capacity in resistance capacitances in series loop, DZ1~DZ5The voltage-stabiliser tube string in 5 JFET drive circuits, D are represented respectivelyF1~DF5Respectively The diode in 5 JFET drive circuits is represented, MGD1 represents MOSFET and drives resistance, JGD1~JGD5 to represent 5 JFET and drive Dynamic resistance, CJSRepresent mixed high-voltage device source electrode, CJDRepresent mixed high-voltage device drain, CJGRepresent mixed high-voltage device gate Pole, CJS1~CJS5J is represented respectively1~J5Source electrode, CJG1~CJG5J is represented respectively1~J5Driving node, i.e., 5 JFET drive The output end of dynamic circuit, PGS represents drive pulse signal.
A, quiescent operation (i.e. no switch motion):Now it is added in CJGDrive circuit output signal be -5V or 0V (0V I.e. drive circuit does not work), this value is less than M1Gate pole threshold value, therefore M1It is off state.When high-voltage dc voltage accesses mixed type The CJ of high tension apparatusDAnd CJSBetween when, M1Drain electrode and source electrode both end voltage can gradually rise;Now R1C1Series loop two ends electricity Pressure also rises therewith, and DZ1And DF1Inevitable reversely cut-off;Although M1Drain electrode and source electrode both end voltage and R1C1Series loop two The climbing of terminal voltage is different, but in this mode, final running status is to work as CJG1And CJGBoth end voltage is equal to DZ1Number During value, DZ1It is breakdown, hereafter M1Drain electrode and source electrode and R1C1Series loop both end voltage is by DZ1Clamper is to fixed numbers, i.e. M1 It is pressure-resistant by DZ1Breakdown voltage is determined.If high-voltage dc voltage is very high, DZ2~DZ5Can breakdown successively, i.e. CJG2~CJG5 Continue to be clamped, the process can ensure SiC MOSFET and each SiC JFET bear resistance to be pressed in device nominal value range It is interior, power device will not be damaged.Certainly, side circuit use can consider voltage margin, general CJG5Will not be clamped, i.e. J5One It is directly conducting state, high-voltage dc voltage is by SiC MOSFET and 4 SiC JFET (J1~J4) share and bearing.
B, normal turn-off process:Now it is added in CJGDrive circuit output signal -5V is switched to by positive voltage, this value be less than M1 Gate pole threshold value, therefore M1Into turn off process.After side circuit turn off process starts, the CJ of mixed high-voltage deviceDAnd CJSIt Between necessarily bear certain high-voltage dc voltage, therefore M1Drain electrode and source electrode both end voltage will rise first;Now M1Channel part Electric current is transferred to J1Drive circuit circulation, R1C1Series loop both end voltage necessarily also rises therewith, and DZ1With diode DF1 Inevitable reversely cut-off;Because the climbing of M1 drain electrodes and source electrode both end voltage is less than R1C1The climbing of series loop both end voltage (M1The output capacitance value of drain electrode and source electrode compares C1Value is big), therefore, hereafter M1Drain electrode and source electrode both end voltage rise to certain numerical value When, R1C1Series loop both end voltage is raised to M1Drain electrode and source electrode both end voltage and JFET threshold voltage sums, i.e. J1Grid The gate pole threshold voltage for becoming smaller than JFET poor with source electrode both end voltage, J1Begin to turn off process, subsequent J1Drain electrode and source electrode two ends Voltage begins to ramp up, R2C2Series loop both end voltage also synchronously rises;Same principle, due to J1Drain electrode and source electrode both end voltage Climbing be less than R2C2Climbing (the J of series loop both end voltage1The output capacitance value of drain electrode and source electrode compares C2Value is big), work as J1 When drain electrode and source electrode both end voltage rise to certain numerical value, J2Also begin to turn off process;J3~J5Turn off process be similar to, such as Fig. 2 Shown, each silicon carbide device shut-off is a progressive process.Additionally, as shown in figure 3, the voltage shared of each power device is all in DZ1 ~DZ5Under breakdown voltage, whole turn off process is without DZ1~DZ5Puncture.Because switching frequency under normal circumstances is higher, Within each switch periods very short time, CJG1~CJG5The potential of each node is not greatly changed, i.e., normal turn-off process is not Need by DZ1~DZ5To maintain CJG1~CJG5The potential of each node, now its potential is by rationally setting C1~C5Numerical value is controlled The voltage build-up rate of system is maintained.
C, normal hard switching opening process:
(1) CJ is just added to when opening signalGWhen, R1C1The C of series loop1Electric discharge, D are not had startedF1、DZ1All it is reverse cutting Only, now all SiC JFET cut-off states are unaffected;Due to M1Grid receive drive positive pulse, therefore, M1Output electricity Appearance begins through M1Channel discharge, M1Drain electrode and source electrode both end voltage begin to decline.Due to R1C1The C of series loop1Electric capacity is not yet Electric discharge, i.e. node CJG1Relative potentials keep it is constant, with M1 drain electrode and source electrode both end voltage decline, i.e. node CJS1Electricity Gesture declines, J1Grid and source electrode both end voltage difference become greater than the gate pole threshold voltage of SiC JFET, J1Start slow conducting, i.e., J1Drain electrode and source electrode both end voltage begin to decline, now R1C1The C of series loop1Electric capacity passes through J1Gate discharge, i.e., equivalent to Output J1Drive pulse signal.
(2) with J1It is open-minded, J1Output capacitance begin through J1Channel discharge, J1Drain electrode and source electrode both end voltage start Decline.Due to R2C2The C of series loop2Electric capacity does not discharge yet, i.e. node CJG2Relative potentials keep it is constant, with J1Drain electrode and Source electrode both end voltage declines, i.e. node CJS2Potential decline, J2Grid and source electrode both end voltage difference become greater than SiC JFET's Gate pole threshold voltage, J2Start slow conducting, now R2C2The C of series loop2Electric capacity passes through J2Gate discharge, i.e., equivalent to defeated Go out J2Drive pulse signal.
(3) J3, J4, J5 using all fours opening process, the overall process of all devices is associated cross, be only according to One small time delay (about 20~50ns) of secondary difference, as shown in figure 4, its priority time delay opened successively is connected by resistance capacitance The Capacity control in loop.
Etc. (4) after all devices are all opened, it is added to CJGDrive signal pass through DF1~DF5The grid of each SiC JFET of clamper Voltage, it is ensured that the grid of SiC MOSFET and all SiC JFET all in gate pole threshold voltage more than, can be fully on, and Conducting resistance is reduced with this.
D, normal ZVS Sofe Switch opening process:The difference of ZVS Sofe Switch opening process and hard switching opening process is, Now CJGThere is no drive signal, and now sense of current is opposite.Specific principle is as follows:
(1) now CJGWithout drive signal, R1C1The C of series loop1Electric capacity does not have started electric discharge, DF1、DZ1All it is reverse cutting Only, now SiC MOSFET and all SiC JFET cut-off states are unaffected;Due to sense of current conversely, therefore, this is anti- To electric current to M1Output capacitance electric discharge, M1Drain electrode and source electrode both end voltage begin to decline.Due to R1C1The C of series loop1Electric capacity Do not discharge yet, i.e. node CJG1Relative potentials keep it is constant, with M1Drain electrode and source electrode both end voltage decline, i.e. node CJS1's Potential declines, J1Grid and source electrode both end voltage difference become greater than the gate pole threshold voltage of SiC JFET, J1Start slow conducting, J1Drain electrode and source electrode both end voltage begin to decline, now R1C1The C of series loop1Electric capacity passes through J1Gate discharge, i.e., equivalent to Output J1Drive pulse signal.
(2) with J1It is open-minded, J1Output capacitance begin through J1Channel discharge, while reverse current is also to J1Output Electric capacity discharges, J1Drain electrode and source electrode both end voltage begin to decline.Due to R2C2The C of series loop2Electric capacity does not discharge yet, i.e. node CJG2Relative potentials keep it is constant, with J1Drain electrode and source electrode both end voltage decline, i.e. node CJS2Potential decline, J2Grid The gate pole threshold voltage for becoming greater than SiC JFET poor with source electrode both end voltage, J2Start slow conducting, now R2C2Series loop C2Electric capacity passes through J2Gate discharge, i.e., equivalent to output J2Drive pulse signal.
(3)J3, J4, J5Using the opening process of all fours, the overall process of all devices is associated cross, be only according to It is secondary difference one small time delay, the priority time delay that it is opened successively by resistance capacitance series loop electric capacity and reverse current size Control.
Etc. (4) after all devices are all opened, although M1Grid there is no drive signal, but reverse current can walk MOSFET Corresponding parasitic diode, and the grid of all JFET is all in " 0 " current potential, thus all JFET grid voltage all in gate pole It is more than threshold voltage, can be fully on, all JFET participate in conducting without corresponding parallel diode during being somebody's turn to do.If this After process, M1Grid adds drive signal, i.e. SiC MOSFET to realize synchronous rectification pattern, and reverse current can be by SiC MOSFET parasitic diodes are transferred to the passage of SiC MOSFET, and conduction voltage drop is reduced with this.
Above-described embodiment is situation when taking N=5, and certain N is alternatively other positive integers, and specific numeral is according to actual feelings Depending on condition.
The circuit power part of above-mentioned mixed high-voltage device by silicon carbide device connect, and by voltage-stabiliser tube, diode, The elements such as resistance, electric capacity realize that JFET drives, and final mixed type high tension apparatus can realize at least high withstand voltage of 6kV, with respect to it His high tension apparatus, this high tension apparatus drives fairly simple, and switching loss is smaller, and conduction loss is relatively small, strong antijamming capability, Low cost, the converter power density of its composition is high, is capable of achieving high-frequency, high efficiency and high power density, is applicable mesohigh electricity Power electronic converter application field.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art For member, on the premise of the technology of the present invention principle is not departed from, some improvement and deformation can also be made, these improve and deform Also should be regarded as protection scope of the present invention.

Claims (5)

1. the mixed high-voltage device of silicon carbide MOSFET and JFET is based on, it is characterised in that:Including MOSFET, N number of JFET, N number of The drain electrode of JFET drive circuits, the source electrode of mixed high-voltage device, the grid of mixed high-voltage device and mixed high-voltage device;
The source electrode of MOSFET is connected with the source electrode of mixed high-voltage device, and the grid of MOSFET connects with the grid of mixed high-voltage device Connect, N number of JFET is sequentially connected in series, i-th source electrode connection of the i+1 JFET adjacent thereto that drains of JFET, i is integer, 0<i <N, the 1st source electrode of JFET is connected with the drain electrode of MOSFET, and the drain electrode of n-th JFET is connected with the drain electrode of mixed high-voltage device;
N number of JFET drive circuits are sequentially connected in series, and the i+1 JFET that the output end of i-th JFET drive circuit is adjacent thereto drives The input connection of dynamic circuit, the input of the 1st JFET drive circuit is connected with the grid of mixed high-voltage device, N number of JFET Grid of the output end of drive circuit respectively with N number of JFET is connected.
2. the mixed high-voltage device based on silicon carbide MOSFET and JFET according to claim 1, it is characterised in that:Also wrap Including MOSFET drives resistance and N number of JFET to drive resistance;MOSFET drives one end of resistance to be connected with the grid of MOSFET, another End be connected with the grid of mixed high-voltage device, JFET drivings resistance two ends respectively with the output end of JFET drive circuits and this The JFET grids connection that JFET drive circuits drive.
3. the mixed high-voltage device based on silicon carbide MOSFET and JFET according to claim 1 and 2, it is characterised in that: JFET drive circuits include voltage-stabiliser tube string in parallel, diode and resistance capacitance series loop, the anode of voltage-stabiliser tube string, two poles The anode of pipe and one end of resistance capacitance series loop connect into first node, and first node is the input of JFET drive circuits End, the other end of the negative electrode of voltage-stabiliser tube string, the negative electrode of diode and resistance capacitance series loop connects into Section Point, second Node is the output end of JFET drive circuits.
4. the mixed high-voltage device based on silicon carbide MOSFET and JFET according to claim 3, it is characterised in that:Voltage stabilizing Pipe string include several series connection voltage-stabiliser tube, first anode of voltage-stabiliser tube as voltage-stabiliser tube string anode, last voltage stabilizing The negative electrode of pipe as voltage-stabiliser tube string negative electrode, the anode of two adjacent voltage-stabiliser tubes is connected with negative electrode.
5. the mixed high-voltage device based on silicon carbide MOSFET and JFET according to claim 1, it is characterised in that:N= 5。
CN201611029350.6A 2016-11-14 2016-11-14 Hybrid high-voltage device based on silicon carbide MOSFET and JFET Active CN106712749B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611029350.6A CN106712749B (en) 2016-11-14 2016-11-14 Hybrid high-voltage device based on silicon carbide MOSFET and JFET

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611029350.6A CN106712749B (en) 2016-11-14 2016-11-14 Hybrid high-voltage device based on silicon carbide MOSFET and JFET

Publications (2)

Publication Number Publication Date
CN106712749A true CN106712749A (en) 2017-05-24
CN106712749B CN106712749B (en) 2021-09-21

Family

ID=58940138

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611029350.6A Active CN106712749B (en) 2016-11-14 2016-11-14 Hybrid high-voltage device based on silicon carbide MOSFET and JFET

Country Status (1)

Country Link
CN (1) CN106712749B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107037852A (en) * 2017-06-06 2017-08-11 哈尔滨工业大学深圳研究生院 Linear voltage-controlled current source topological structure and the sun battle array simulator
CN108092493A (en) * 2017-12-26 2018-05-29 南京工程学院 A kind of SiC MOSFET series circuits
CN108696268A (en) * 2018-05-24 2018-10-23 南京工程学院 A kind of direct driving circuit of open type GaN FET
CN110429562A (en) * 2019-08-22 2019-11-08 西南交通大学 Hybrid high voltage DC breaker and its control method based on normal open type SIC device

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1320277A (en) * 1998-09-25 2001-10-31 西门子公司 Electronic switching device with at least two semiconductor components
WO2006037942A1 (en) * 2004-10-06 2006-04-13 Vetco Gray Controls Limited Power switches
EP1410505B1 (en) * 2001-07-23 2009-03-25 SiCED Electronics Development GmbH & Co KG Switching device for a switching operation at a high working voltage
CN102948076A (en) * 2010-04-07 2013-02-27 Eth苏黎世公司 Switching device having jfet series circuit
CN103516338A (en) * 2012-06-18 2014-01-15 瑞萨电子株式会社 Semiconductor device and system using same
CN103681666A (en) * 2012-08-30 2014-03-26 英飞凌科技德累斯顿有限责任公司 Circuit arrangement with first semiconductor device and with plurality of second semiconductor devices
CN103716026A (en) * 2012-09-28 2014-04-09 英飞凌科技奥地利有限公司 Switch circuit
US20150014698A1 (en) * 2013-07-12 2015-01-15 International Rectifier Corporation Integrated III-Nitride D-Mode HFET with Cascoded Pair Half Bridge
CN106067794A (en) * 2015-04-22 2016-11-02 瑞萨电子株式会社 Semiconductor device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1320277A (en) * 1998-09-25 2001-10-31 西门子公司 Electronic switching device with at least two semiconductor components
EP1410505B1 (en) * 2001-07-23 2009-03-25 SiCED Electronics Development GmbH & Co KG Switching device for a switching operation at a high working voltage
WO2006037942A1 (en) * 2004-10-06 2006-04-13 Vetco Gray Controls Limited Power switches
CN102948076A (en) * 2010-04-07 2013-02-27 Eth苏黎世公司 Switching device having jfet series circuit
CN103516338A (en) * 2012-06-18 2014-01-15 瑞萨电子株式会社 Semiconductor device and system using same
CN103681666A (en) * 2012-08-30 2014-03-26 英飞凌科技德累斯顿有限责任公司 Circuit arrangement with first semiconductor device and with plurality of second semiconductor devices
CN103716026A (en) * 2012-09-28 2014-04-09 英飞凌科技奥地利有限公司 Switch circuit
US20150014698A1 (en) * 2013-07-12 2015-01-15 International Rectifier Corporation Integrated III-Nitride D-Mode HFET with Cascoded Pair Half Bridge
CN106067794A (en) * 2015-04-22 2016-11-02 瑞萨电子株式会社 Semiconductor device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
J. BIELA 等: "Balancing Circuit for a 5kV/50ns Pulsed Power Switch Based on SiC-JFET Super Cascode", 《2009 IEEE PULSED POWER CONFERENCE》 *
XIJUN NI 等: "Development of 6kV SiC hybrid power switch based on 1200V SiC JFET and MOSFET", 《2015 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE)》 *
倪喜军: "高压SiC器件在FREEDM***中的应用", 《电源学报》 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107037852A (en) * 2017-06-06 2017-08-11 哈尔滨工业大学深圳研究生院 Linear voltage-controlled current source topological structure and the sun battle array simulator
CN108092493A (en) * 2017-12-26 2018-05-29 南京工程学院 A kind of SiC MOSFET series circuits
CN108092493B (en) * 2017-12-26 2020-12-25 南京工程学院 SiC MOSFET series circuit
CN108696268A (en) * 2018-05-24 2018-10-23 南京工程学院 A kind of direct driving circuit of open type GaN FET
CN108696268B (en) * 2018-05-24 2021-09-24 南京工程学院 Direct drive circuit of normally-open GaN FET
CN110429562A (en) * 2019-08-22 2019-11-08 西南交通大学 Hybrid high voltage DC breaker and its control method based on normal open type SIC device

Also Published As

Publication number Publication date
CN106712749B (en) 2021-09-21

Similar Documents

Publication Publication Date Title
CN108988617B (en) A kind of driving circuit and circuits improvement method of active suppression SiC MOSFET crosstalk phenomenon
CN108092493B (en) SiC MOSFET series circuit
CN106655853B (en) A kind of three-level inverter
CN205725436U (en) Gate driver circuit and include the bridge circuit of gate driver circuit
CN106712749A (en) Silicon carbide MOSFET and JEFT based hybrid high-voltage device
CN110311572A (en) A kind of transformer isolation drive control method and its isolated drive circuit
CN109980905A (en) Clutter reduction circuit, driving circuit and the bridge converter of sic filed effect pipe
CN108306534B (en) A kind of Modular multilevel converter and its submodule topological structure
WO2017107931A1 (en) Equivalent transistor and three-level inverter
CN106921307A (en) A kind of flexible direct current transverter submodule topological structure
CN101976940A (en) Drive bootstrap circuit for switching tube of switching power supply converter
CN104638959A (en) Neutral point clamped (NPC) converter for use in power module, and power module incorporating same
CN105337504B (en) One kind mixing bridge arm type isolation type bidirectional DC converter and its control method
CN103281002B (en) Based on the solid switch formula high-voltage pulse power source of IGBT series connection
CN107317508B (en) A kind of electrical energy transformer
Moballegh et al. Evaluation of high voltage 15 kV SiC IGBT and 10 kV SiC MOSFET for ZVS and ZCS high power DC-DC converters
CN103595226A (en) Isolation symmetrical complementation drive circuit of transformer
CN106787632B (en) Multi-stage driving circuit of SiC JFET string
CN112910240B (en) Variable grid voltage switching-on control circuit, power module and power converter
CN208094427U (en) Negative pressure driving circuit
CN109586601A (en) A kind of mixed bridge circuit and its control method
CN203590008U (en) Transformer isolation symmetry complementation drive circuit
CN110429562B (en) Hybrid high-voltage direct-current circuit breaker based on normally-on SIC device and control method thereof
CN108306535B (en) Single-phase eleven-level inverter
CN101697452B (en) Resonance circuit with controllable voltage-limiting circuit and dynamic control method thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
CB03 Change of inventor or designer information

Inventor after: Han Huanju

Inventor after: Li Xianyun

Inventor after: Ni Xijun

Inventor before: Ni Xijun

Inventor before: Li Xianyun

Inventor before: Han Huanju

CB03 Change of inventor or designer information
GR01 Patent grant
GR01 Patent grant