CN106711074A - Substrate processing equipment and alignment control method of to-be-processed substrate - Google Patents
Substrate processing equipment and alignment control method of to-be-processed substrate Download PDFInfo
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- CN106711074A CN106711074A CN201710006065.0A CN201710006065A CN106711074A CN 106711074 A CN106711074 A CN 106711074A CN 201710006065 A CN201710006065 A CN 201710006065A CN 106711074 A CN106711074 A CN 106711074A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- Condensed Matter Physics & Semiconductors (AREA)
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the invention provides substrate processing equipment and an alignment control method of a to-be-processed substrate, and relates to the semiconductor technical field. When the substrate processing equipment positions the to-be-processed substrate in the prior art, the alignment result may be inaccurate because alignment marks are poor in reflective performance; the substrate processing equipment can solve said problems, and comprises the following units: a carrier deck used for bearing the to-be-processed substrate, wherein the to-be-processed substrate has alignment marks made of shading material; a light source arranged on one side of the carrier deck; an image sensor arranged on the other side of the carrier deck, wherein the light source is used for sending lights to the to-be-processed substrate; the light reaches the image sensor through the to-be-processed substrate, the image sensor can collect the image containing the alignment marks; the irradiation zone of the light source at least covers the outer edges of the alignment marks.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of substrate processing equipment and substrate to be processed contraposition control
Method processed.
Background technology
(Thin Film Transistor-Liquid Crystal Display, tft liquid crystal shows TFT-LCD
Show device) generally include mutually to the array base palte and color membrane substrates of box, and be sealingly disposed in array base palte mutually to box and
Liquid crystal layer between color membrane substrates.There is the pixel electrode and public electrode for forming electric field on liquid crystal display panel, lead to
Cross applied voltage and electric field produced between pixel electrode and public electrode, with control liquid crystal layer liquid crystal molecule yawing moment simultaneously
The polarization of incident light is controlled, so as to produce image to show.
, it is necessary to the battle array of composition Thin Film Transistor-LCD during Thin Film Transistor-LCD is made
Row substrate and color membrane substrates such as are deposited with, are exposed, being etched at the processing and fabricating of multiple operations, carry out the processing of above-mentioned operation
When, before process operation, being required for treating substrate processing first carries out the accurate contraposition of placement location, it is determined that substrate to be processed
Corresponding process operation is carried out after correct placement again, can so be reduced due to defect ware caused by Working position skew, carried
The crudy of substrate to be processed is risen, the manufacture yields of substrate to be processed is improved.
When being aligned in existing substrate processing equipment, the ad-hoc location typically on substrate to be processed be machined with by
The alignment mark that light tight and can be reflective material makes, the substrate to be processed to being placed on substrate processing equipment microscope carrier is carried
For front lighting shine, front lighting impinge upon can be produced on alignment mark it is reflective, by CCD Camera (Charge Coupled
Device Camera, charge-coupled device camera) to treat substrate processing and carry out front and take pictures, substrate to be processed is absorbed in front
Data image signal, wherein it is higher due to being capable of reflecting light the light of photograph to be rendered as brightness at corresponding alignment mark position
State, is rendered as the relatively low state of brightness because illumination is directed through, by right at the other positions of correspondence substrate to be processed
The data image signal of charge-coupled device camera intake carries out GTG analysis and believes with the preset standard digital picture of storage
Number compare, you can determine the contraposition accuracy of substrate to be processed.
This alignment mode is higher to the processing request of alignment mark, and in industry, alignment mark is usually using metal material
Matter makes, if the alignment mark surface producing process of metal material is bad its reflective function may be caused poor, and then lead
The reflective part of correspondence alignment mark shows unclear in causing the image gray-scale level of charge-coupled device camera intake to analyze.
The content of the invention
The embodiment of the present invention provides the aligning control method of a kind of substrate processing equipment and substrate to be processed, can solve the problem that
When substrate processing equipment is treated substrate processing and aligned, because alignment mark reflective function is poor, contraposition result is caused to be forbidden
True problem.
To reach above-mentioned purpose, embodiments of the invention are adopted the following technical scheme that：
A kind of one side of the embodiment of the present invention, there is provided substrate processing equipment, including：Microscope carrier, for carrying base to be processed
Plate, substrate to be processed is provided with alignment mark, and alignment mark is shading material.Light source, is arranged at the side of microscope carrier.Image sensing
Device, is arranged at the opposite side of microscope carrier.Wherein, light source is used to be emitted beam towards substrate to be processed, and light is through substrate to be processed
Imageing sensor is reached, so as to imageing sensor image of the collection comprising alignment mark；The irradiation area of light source at least will contraposition
In the outward flange of mark is enclosed in.
Further, substrate processing equipment also includes controller, for by image and standard picture comprising alignment mark
Compare, and export comparison result.
Optionally, the whole substrate to be processed of irradiation area covering of light source, imageing sensor is used to gather whole to be processed
The image of substrate.
Optionally, the irradiation area covering part substrate to be processed of light source, part substrate to be processed by alignment mark and
The peripheral part for surrounding alignment mark is constituted, and imageing sensor is used for the image of collecting part substrate to be processed.
Preferably, the alignment mark on substrate to be processed is provided with least two, and is respectively arranged at substrate to be processed
Corner, light source and imageing sensor are identical with the setting quantity of alignment mark, and the irradiation area of each light source corresponds to one
The corner of the substrate to be processed where individual alignment mark, imageing sensor accordingly gather alignment mark where substrate to be processed
Corner image.
Preferably, light source is infrared light supply.
Further, the size of alignment mark sends optical wavelength and is in same order scope with light source.
The another aspect of the embodiment of the present invention, there is provided a kind of aligning control method of substrate to be processed, on substrate to be processed
Alignment mark is provided with, alignment mark is shading material.The above method includes, from the side of substrate to be processed towards base to be processed
Plate emits beam so that light is by substrate to be processed；In the opposite side of substrate to be processed, gather on substrate to be processed comprising right
The image of position mark.Wherein, at least be enclosed in for the outward flange of alignment mark interior by the overlay area of light.
Further, gather on substrate to be processed after the image comprising alignment mark, the above method also includes, will include
The image of alignment mark is compared with standard picture, and exports comparison result.
Further, when the size of alignment mark is in same order scope with optical wavelength, will be comprising alignment mark
Image compare with standard picture, and export comparison result and include, the image comprising alignment mark is processed, obtain
The center position of alignment mark；In image of the comparison comprising alignment mark in the center position and standard picture of alignment mark
Whether the center position of alignment mark overlaps, and exports comparison result.
The embodiment of the present invention provides a kind of substrate processing equipment, including：Microscope carrier, it is to be processed for carrying substrate to be processed
Substrate is provided with alignment mark, and alignment mark is shading material.Light source, is arranged at the side of microscope carrier.Imageing sensor, is arranged at
The opposite side of microscope carrier.Wherein, light source is used to be emitted beam towards substrate to be processed, and light reaches image and passes through substrate to be processed
Sensor, so as to imageing sensor image of the collection comprising alignment mark；The irradiation area of light source is at least by the outside of alignment mark
In edge is enclosed in.Light source is arranged on the side of microscope carrier, and imageing sensor is arranged on the opposite side of microscope carrier, and light source is towards base to be processed
The light that plate sends by substrate to be processed, wherein, alignment mark is arranged on substrate to be processed for shading material can not be passed through
Light, part beyond alignment mark can transmitted light, in be enclosed in for the outward flange of alignment mark by the irradiation area of light source,
Therefore, the image for being collected on imageing sensor can be by the position where the record alignment mark of the light and shade border of light.This
The requirement that alignment mode reduces the processing technology of the alignment mark treated on substrate processing is planted, substrate processing equipment pair is improve
The stability of position.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of substrate processing equipment provided in an embodiment of the present invention；
Fig. 2 is the structural representation of the substrate processing equipment including controller provided in an embodiment of the present invention；
Fig. 3 is that light source irradiation area includes whole base to be processed in a kind of substrate processing equipment provided in an embodiment of the present invention
The structural representation of plate；
Fig. 4 be a kind of substrate processing equipment provided in an embodiment of the present invention in light source irradiation area include part base to be processed
The structural representation of plate；
Fig. 5 is that the structure that two imageing sensors are included in a kind of substrate processing equipment provided in an embodiment of the present invention is shown
It is intended to；
Fig. 6 is a kind of diffraction pattern schematic diagram of alignment mark provided in an embodiment of the present invention；
Fig. 7 is a kind of flow chart of the aligning control method of substrate to be processed provided in an embodiment of the present invention；
Fig. 8 is the flow chart of the aligning control method of another substrate to be processed provided in an embodiment of the present invention；
Fig. 9 is the flow chart of the aligning control method of another substrate to be processed provided in an embodiment of the present invention.
Reference：
10- microscope carriers；11- substrates to be processed；20- light sources；30- imageing sensors；40- controllers；X, X ＇, X ＂-light source shine
Penetrate region；A- alignment marks.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
The embodiment of the present invention provides a kind of substrate processing equipment, as shown in figure 1, including：Microscope carrier 10, it is to be processed for carrying
Substrate 11, substrate to be processed 11 is provided with alignment mark a, and alignment mark a is shading material.Light source 20, is arranged at microscope carrier 10
Side.Imageing sensor 30, is arranged at the opposite side of microscope carrier 10.Wherein, light source 20 is used to send light towards substrate to be processed 11
Line, and light reaches imageing sensor 30 through substrate to be processed 11, so as to figure of the collection comprising alignment mark a of imageing sensor 30
Picture；At least be enclosed in for the outward flange of alignment mark a interior by the irradiation area X of light source 20.
It should be noted that first, light source 20 is separately positioned on the both sides of microscope carrier 10, the court of light source 20 with imageing sensor 30
Emitted beam to the substrate to be processed 11 being placed on microscope carrier 10, the correspondence collection image of imageing sensor 30, as shown in figure 1, light
In at least be enclosed in for whole alignment mark a by the irradiation area X in source 20, in the image that imageing sensor 30 is collected, can
Including lighttight alignment mark a and a part around alignment mark a transmission region, i.e., can be by lighttight register guide
Remember that the sharpness of border of a is displayed in the image that imageing sensor 30 is collected.Wherein, what imageing sensor 30 can be collected is saturating
The size in light region is not specifically limited in the present invention, as long as can at least surround the whole outward flange of alignment mark a, it is right to make
Position mark a border can completely show.
Second, because the light that light source 20 sends towards substrate to be processed 11 is needed through substrate to be processed 11 and microscope carrier
Imageing sensor 30 is reached after 10, and is received by imageing sensor 30, wherein, the generally transparent glass base of substrate to be processed 11
Plate, therefore, substrate to be processed 11 can transmitted light, so, microscope carrier 10 is also required to be made using light-permeable material so that light source
The part being only radiated on alignment mark a in 20 light sent towards substrate to be processed 11 is blocked, the equal energy of other parts
It is enough to pass through, in so that receiving the image comprising alignment mark a on imageing sensor 30, only correspond to the position of alignment mark a
The place of putting is shown as shade, other positions can transmitted light show, so as to by being received by imageing sensor 30 comprising right
Position mark a image just can determine alignment mark a where position.Above-mentioned purpose is reached, microscope carrier 10 can also integrally make
Made of light tight material, the form of light-permeable is only set at the position of correspondence alignment mark a, for example, being aligned in correspondence
Made using light-transmitting materials at the position for marking a, or the modes such as area of knockout are set at the position of correspondence alignment mark a
.
The specific setting material of the 3rd, alignment mark a is not specifically limited in the present invention, as long as ensureing to make register guide
Remember the transmission that the material of a can shut out the light.
The embodiment of the present invention provides a kind of substrate processing equipment, including：Microscope carrier, it is to be processed for carrying substrate to be processed
Substrate is provided with alignment mark, and alignment mark is shading material.Light source, is arranged at the side of microscope carrier.Imageing sensor, is arranged at
The opposite side of microscope carrier.Wherein, light source is used to be emitted beam towards substrate to be processed, and light reaches image and passes through substrate to be processed
Sensor, so as to imageing sensor image of the collection comprising alignment mark；The irradiation area of light source is at least by the outside of alignment mark
In edge is enclosed in.Light source is arranged on the side of microscope carrier, and imageing sensor is arranged on the opposite side of microscope carrier, and light source is towards base to be processed
The light that plate sends by substrate to be processed, wherein, alignment mark is arranged on substrate to be processed for shading material can not be passed through
Light, part beyond alignment mark can transmitted light, in be enclosed in for the outward flange of alignment mark by the irradiation area of light source,
Therefore, the image for being collected on imageing sensor can be by the position where the record alignment mark of the light and shade border of light.This
The requirement that alignment mode reduces the processing technology of the alignment mark treated on substrate processing is planted, substrate processing equipment pair is improve
The stability of position.
Further, in order to be treated before substrate processing 11 is processed in substrate processing equipment, substrate processing 11 is treated
Whether placement location is correctly judged that, as shown in Fig. 2 substrate processing equipment also includes controller 40, controller 40 is used for will
Image comprising alignment mark a is compared with standard picture, and exports comparison result.
It should be noted that the comparison result of the output of controller 40 can direct being superimposed for collection image and standard picture
Image, offset direction and the side-play amount of coincidence and superimposed image are directly judged whether by operator, treat substrate processing 11
Placement location is adjusted correspondingly movement, or respectively by standard picture and the image for collecting in controller 40
Calculated by treatment, directly the position coordinates of the light tight shade at output alignment mark a positions, then calculate two images
Registration and side-play amount between light tight shade, or can also be other alignments, it is not specifically limited herein, as long as
Can calculate and export the positional information of the light tight shade in two images at alignment mark a positions and be compared calculating
.
Wherein, controller 40 can be as shown in Figure 2 computer, or can also can be carried out at data for other
The device of reason, is not specifically limited herein.The image for including alignment mark a that controller 40 collects imageing sensor 30
Receive, and compare with standard picture that is set in advance or storing in advance, substrate to be processed is shown in standard picture
11 are placed on image during correct position, and the position between light source 20, microscope carrier and imageing sensor 30 is changeless
In the case of, the image that imageing sensor 30 will be collected is superimposed with standard picture, impermeable where the alignment mark a in two images
Light shadow region can be completely overlapped, then output compares the result for overlapping, and is illustrating the placement location of substrate to be processed 11 completely just
Really, if the light tight shadow region where alignment mark a in two images only overlaps or completely non-overlapping, export
Incorrect result is compared, illustrates that deviation occurs in the placement location of substrate to be processed 11, and can be according to the comparison knot of output
The superposition side-play amount of the light tight shadow region in fruit, treating the position of substrate processing 11 carries out correspondence adjustment, finally to cause
Light tight shadow region overlaps.
So, by setting controller 40 in substrate processing equipment, you can directly imageing sensor 30 is gathered
To image carry out calculating treatment, and output result, for example, direct outputting standard image and treating for collecting on the display screen
The superimposed image of the image of substrate processing 11, the placement location that operator's control superimposed image treats substrate processing 11 is adjusted in real time
It is whole, improve the operating efficiency aligned before treating substrate processing 11 and being processed operation of substrate processing equipment.
Hereinafter it is described in detail so that substrate processing equipment includes controller 40 as an example.
Further, as shown in figure 3, the whole substrate to be processed 11 of irradiation area X ＇ coverings of light source 20, imageing sensor
30 images for being used to gather whole substrate to be processed 11.
As shown in Figure 3, it is only necessary to a light source 20, and a picture receiver 30 being correspondingly arranged with light source 20
The image of the whole substrate to be processed 11 of collection, and in controller 40, by the substrate whole to be processed 11 that will collect
Image is compared with the standard picture of whole substrate to be processed 11, comparison result is obtained, to determine putting for substrate to be processed 11
Whether seated position is correct.So, setting multiple sets of light sources 20 can be reduced and treats substrate processing respectively with picture receiver 30
11 be acquired image compare when, multiple series of images compare between error, reduce it is multigroup contraposition comparison result it is inconsistent caused by
The probability of error, aligns the stability of judgement in raising substrate processing equipment.
Preferably, as shown in figure 4, the irradiation area X ＂ covering parts substrate 11 to be processed (frame dashed lines of light source 20
It is shown), part substrate 11 to be processed is made up of the peripheral part of alignment mark a and encirclement alignment mark a, imageing sensor 30
For the image of collecting part substrate 11 to be processed.
As shown in figure 4, imageing sensor 30 only gathers by alignment mark a and surrounds the peripheral part structure of alignment mark a
Into part substrate 11 to be processed at image, and the image that will be collected compares with standard picture, exports comparing result,
Whether correctly judged with the placement location for treating substrate processing 11.It is whether correct due to treating the placement location of substrate processing 11
Judgement be the moon at the shadow positions alignment mark a corresponding with standard picture by alignment mark a in the image that collects
Shadow position so, avoids other areas on the whole substrate to be processed 11 of picture receiver 30 pairs come what is compared
The collection of the image in domain, reduces the data processing amount in controller 40, reduces a large amount of invalid datas of imageing sensor 30 pairs
Collection, improve the calculating speed of controller 40.
Wherein, light source 20 can be as shown in Figure 4, and only irradiation includes alignment mark a and surrounds alignment mark a's
Outer peripheral fraction region, the receiving area with imageing sensor 30 is corresponding, or irradiation as shown in Figure 3 is whole
Substrate to be processed 11, and imageing sensor 30 only corresponds to collection alignment mark a and surrounds the peripheral part composition of alignment mark a
Part substrate 11 to be processed at image, the setting herein for light source 20 is not specifically limited, as long as ensureing light source 20
Set location is identical with the set location of light source in standard picture 20.
But, when as shown in figure 4, be provided only with an alignment mark a on substrate to be processed 11, and imageing sensor 30 is only
The image at the part substrate 11 to be processed being made up of the peripheral part of alignment mark a and encirclement alignment mark a is gathered to enter
When the positional information of row substrate 11 to be processed is gathered, if the correct placement position of the placement location of substrate to be processed 11 and standard picture
When only a pair of position has less angular deflection centered on marking at a between putting, whole substrate to be processed 11 is at alignment mark a
The movement that (center position for deflecting) is produced is small-sized, but will form larger at away from deflection center position
Mobile size.At this moment, the image for gathering the alignment mark a of the center position of deflection is entered with standard picture in controller 40
Row is compared, it is possible to can because side-play amount is smaller at correspondence alignment mark a None- identified so that controller 40 will be to be added
The placement location erroneous judgement of work substrate 11 is correct position, and operation is processed in the substrate to be processed 11 to the placement location
When, may result in the Working position mistake on substrate to be processed 11 and produce substandard products to do over again or substrate to be processed 11 is directly reported
It is useless.
Preferably, the alignment mark a on substrate to be processed 11 is provided with least two, as shown in figure 5, substrate to be processed 11
On alignment mark a be provided with two, and be respectively arranged at the corner of substrate to be processed 11, light source 20 and imageing sensor 30
Setting quantity with alignment mark a is identical, and the irradiation area X ＂ of each light source 20 are corresponding to treating where an alignment mark a
The corner of substrate processing 11, imageing sensor 30 accordingly gather alignment mark a where substrate to be processed 11 corner figure
Picture.
As shown in figure 5, the alignment mark a on substrate to be processed 11 is provided with two, and it is respectively arranged at substrate to be processed
11 corner, a light source 20 is respectively provided with corresponding to each alignment mark a, to being irradiated at alignment mark a, forms light source
Irradiation area X ＂, imageing sensor 30, collection corresponding light source irradiation area X ＂ are set in alignment mark a away from the side of light source 20
Image, light source irradiation area X ＂ and the standard picture of corresponding position that will be collected respectively compare, and obtains two ratios
To result, whether comprehensive two comparison results are correct with the placement location for determining substrate to be processed 11.
So, each light source 20 only corresponds to one alignment mark a of irradiation, and each picture receiver 30 correspondence is adopted
One image of light source irradiation area X ＂ of collection, because two light source irradiation area X ＂ are respectively positioned at the corner of substrate to be processed 11,
Therebetween there is larger distance, therefore, no matter there is the deflection of smaller angle in substrate to be processed 11 centered on optional position,
The position of at least one alignment mark a is necessarily, away from deflection center, to be somebody's turn to do away from the right of deflection center in two alignment mark a
Position mark a place image comparison side-play amount necessarily output can be recognized by controller 40.Two groups of light sources 20 and imageing sensor
30 cooperation, further increases the judgement accuracy that the placement location of substrate processing 11 is treated in substrate processing equipment, carries
Judgement precision high.
Wherein, multiple images sensor 30 can carry out data to be connected to same controller 40 as shown in Figure 5
Calculating treatment, or each imageing sensor 30 connect controller 40 respectively, carry out respectively data calculating process,
This is not especially limited in the present invention, can be configured according to specifically used needs.
Preferably, light source 20 is infrared light supply.
Due in the manufacturing process of liquid crystal display, substrate to be processed 11, such as array base palte or color membrane substrates, it is necessary to
The processing and fabricating of working procedures such as it is deposited with, exposed, being etched, wherein, it is exposed processing for treating substrate processing 11
Equipment, exposure process be through specific pattern mask plate treat substrate processing 11 enter line light source irradiation, with cause base to be processed
The photoresist coated on plate 11 is changed due to there is property by illumination, and (photoresist includes positive glue and anti-glue, and this is sentenced
Illustrated as a example by positive glue, if anti-glue, then the part for being not affected by illumination occurs the change of property), so as to carry out development removal
Etc. subsequent handling.The contraposition for carrying out substrate to be processed 11 is irradiated by visible light source in process equipment is exposed, may be treated
Photoresist on substrate processing 11 produces harmful effect, influences follow-up exposure effect, it is preferred, therefore, that light source 20 is using red
Outer light source, it is to avoid the following process treatment for treating substrate processing 11 is impacted, and infrared light supply low cost, technology maturation, is made
With infrared light supply as the light source 20 in the present invention, its stable working state, and can be cost-effective.
Further, the size of alignment mark a sends optical wavelength and is in same order scope with light source 20.
When alignment mark a size for optical wavelength nano-grade size when, light source 20 towards alignment mark a place irradiation,
When light wave runs into the alignment mark a that can be considered barrier in communication process, it may occur that the diffraction phenomena that offset linear is propagated, such as
Shown in Fig. 6, such as alignment mark a is circle as shown in Figure 6, when the light that light source 20 (not shown in Fig. 6) sends is radiated at
At alignment mark a and it is projected in the diffraction pattern that can receive alignment mark a when on imageing sensor 30 on imageing sensor 30
Sample, diffraction pattern is the donut striped between one group of bright dark phase, and outer ring size of the toroid size more than alignment mark a,
The concentric equal proportion enlarged drawing of as alignment mark a.
So, when need to treat substrate processing 11 carry out high-precision contraposition when, can be on substrate to be processed 11
The alignment mark a of nano-grade size, the enlarged drawing of the alignment mark a received to imageing sensor 30 by controller 40 are set
As carrying out calculating treatment, the center position of the enlarged drawing is obtained, and then will be aligned in the center position and standard picture
Whether the center position of a is marked to compare, so as to the correct judged result of the placement location for drawing substrate to be processed 11.
It should be noted that the shape of first, alignment mark a is not limited in circle as shown in Figure 6, by spreading out for light
Penetrate theory to understand, when the size of barrier is in same order with optical wavelength size, light irradiation will be sent out on barrier
The above-mentioned diffraction phenomena of life, the image for receiving is identical with the central projection of barrier, along barrier edge generation it is concentric and
The light and shade striped that equal proportion is amplified.If for example, alignment mark be rectangle, the diffraction pattern for receiving be it is concentric with rectangle and
Along four sides of rectangle respectively to the increased a plurality of light and dark vertical bar line in deep direction.
Second, when alignment mark a is irregular figure, the size of described alignment mark a can be respectively along to be added
The maximum length of the orthogonal two offsides edge direction of work substrate 11.
3rd, identical order of magnitude scope refers to optical wavelength and is usually hundreds of nanometers, when the size of alignment mark a is
Size in units of nanometer, is as in identical order of magnitude scope with optical wavelength.For example, tens nanometers, hundreds of nanometers etc.,
Belong to be in identical order of magnitude scope with optical wavelength
The another aspect of the embodiment of the present invention, there is provided a kind of aligning control method of substrate to be processed, in substrate to be processed
Alignment mark a is provided with 11, alignment mark a is shading material.As shown in fig. 7, the above method includes,
S101, emitted beam towards substrate to be processed 11 from the side of substrate to be processed 11 so that light is by be processed
Substrate 11.
S102, the opposite side in substrate to be processed 11, gather the image comprising alignment mark a on substrate 11 to be processed.Its
In, at least be enclosed in for the outward flange of alignment mark a by the overlay area X of light.
Towards the light that substrate to be processed 11 sends, due to alignment mark a for shading material makes, alignment mark is radiated at
Light on a is stopped and cannot be passed through that by alignment mark a being radiated at the light at the position beyond alignment mark a can pass through
The outgoing of substrate to be processed 11, image is gathered in the opposite side of substrate to be processed 11, i.e., can be adopted at the position of correspondence alignment mark a
Collect one with the light tight shadow region of alignment mark a shape identicals.Wherein, as long as the overlay area X of light is comprising whole
The outward flange of alignment mark a and alignment mark a, you can record the shadow region and shadow region of whole alignment mark a
Border, so that it is determined that the location of alignment mark a, and then determine the placement location of substrate 11 to be processed.
Further, gather on substrate 11 to be processed after the image comprising alignment mark a, as shown in figure 8, the above method
Also include,
S103, image and standard picture comprising alignment mark a are compared, and export comparison result.
Standard picture is referred to when the placement location of substrate to be processed 11 is correct, and contraposition is included on substrate to be processed 11
Mark the image of a.In the case where each device position of collection image is fixed, entered by the image and standard picture that will collect
Row is compared, you can by the superposition situation of the shade of the alignment mark a in two images, obtain the placement location of substrate to be processed 11
Information.
Because standard picture is the reference picture picture compared, therefore, standard picture is needed in substrate processing equipment work
It is preceding storage or be arranged in substrate processing equipment, for for when compare with the collection result of same position.
Further, when the size of alignment mark a is in same order scope with optical wavelength, as shown in figure 9, will bag
Image containing alignment mark a is compared with standard picture, and is exported comparison result and included,
S1031, the image comprising alignment mark a is processed, obtained the center position of alignment mark a.
S1032, comparison include right in the center position and standard picture of alignment mark a in the image of alignment mark a
Position marks whether the center position of a overlaps, and exports comparison result.
So, when the size of alignment mark a is in same order scope with optical wavelength, collected by treatment
Alignment mark a diffraction pattern, obtain the center position of alignment mark a, the central point with alignment mark a in standard picture
Compare position, you can obtain placement position information of the substrate to be processed 11 in substrate processing equipment.
Wherein, standard picture can be substrate to be processed 11 be in correct placement position when image information, with collection
To image compare before, treatment obtain substrate to be processed 11 be in correct placement position when alignment mark a central point
The center position of the alignment mark a in position, and the image that is collected for the treatment of, the two is compared, output ratio
To result.Standard picture can also be directly the central point of the alignment mark a when substrate to be processed 11 is in correct placement position
Positional information, when collection image is obtained, only to the alignment mark a treatment in the image that collects, is collected
The center position of the alignment mark a in image, directly compares, and export comparison result.
In the contraposition principle of aforesaid substrate process equipment and the illustrating of the course of work, to aligning control method
It has been be described in detail that, here is omitted.
The above, specific embodiment only of the invention, but protection scope of the present invention is not limited thereto, and it is any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all contain
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. a kind of substrate processing equipment, it is characterised in that including：
Microscope carrier, for carrying substrate to be processed, the substrate to be processed is provided with alignment mark, and the alignment mark is lightproof material
Matter；
Light source, is arranged at the side of the microscope carrier；
Imageing sensor, is arranged at the opposite side of the microscope carrier；
Wherein, the light source is used to be emitted beam towards the substrate to be processed, and the light is arrived through the substrate to be processed
Up to described image sensor, so as to described image sensor image of the collection comprising the alignment mark；The irradiation of the light source
At least be enclosed in for the outward flange of the alignment mark interior by region.
2. substrate processing equipment according to claim 1, it is characterised in that also including controller, for will be comprising described
The image of alignment mark is compared with standard picture, and exports comparison result.
3. substrate processing equipment according to claim 1, it is characterised in that the irradiation area of the light source covers whole institute
Substrate to be processed is stated, described image sensor is used to gather the image of the whole substrate to be processed.
4. substrate processing equipment according to claim 1, it is characterised in that the irradiation area covering part institute of the light source
Substrate to be processed is stated, the part substrate to be processed is by the alignment mark and the peripheral part structure of the encirclement alignment mark
Into described image sensor is used for the image of substrate to be processed described in collecting part.
5. substrate processing equipment according to claim 4, it is characterised in that the alignment mark on the substrate to be processed sets
It is equipped with least two, and is respectively arranged at the corner of the substrate to be processed, the light source and described image sensor and institute
The setting quantity for stating alignment mark is identical, and the irradiation area of each light source is corresponding to where an alignment mark
The corner of substrate to be processed, described image sensor accordingly gather the alignment mark where substrate to be processed corner
Image.
6. the substrate processing equipment according to claim any one of 1-5, it is characterised in that the light source is infrared light supply.
7. substrate processing equipment according to claim 6, it is characterised in that the size of the alignment mark and the light source
Send optical wavelength and be in same order scope.
8. a kind of aligning control method of substrate to be processed, it is characterised in that be provided with alignment mark on the substrate to be processed,
The alignment mark is shading material, and methods described includes,
Emitted beam towards the substrate to be processed from the side of the substrate to be processed so that the light is by described to be added
Work substrate；
In the opposite side of the substrate to be processed, the image comprising the alignment mark on the substrate to be processed is gathered；
Wherein, at least be enclosed in for the outward flange of the alignment mark interior by the overlay area of the light.
9. aligning control method according to claim 8, it is characterised in that included on the collection substrate to be processed
After the image of the alignment mark, methods described also includes,
Image comprising the alignment mark and standard picture are compared, and exports comparison result.
10. aligning control method according to claim 9, it is characterised in that when the alignment mark size with it is described
It is described that the image comprising the alignment mark and standard picture are compared when optical wavelength is in same order scope, and
Exporting comparison result includes,
The image comprising alignment mark is processed, the center position of the alignment mark is obtained；
Compare the center position and alignment mark in the standard picture of alignment mark in the image comprising alignment mark
Center position whether overlap, and export comparison result.
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| CN201710006065.0A CN106711074A (en) | 2017-01-04 | 2017-01-04 | Substrate processing equipment and alignment control method of to-be-processed substrate |
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| CN201710006065.0A CN106711074A (en) | 2017-01-04 | 2017-01-04 | Substrate processing equipment and alignment control method of to-be-processed substrate |
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Application publication date: 20170524 |