CN106711060B - The fluid collection device of spin etch cleaning machine - Google Patents
The fluid collection device of spin etch cleaning machine Download PDFInfo
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- CN106711060B CN106711060B CN201510783139.2A CN201510783139A CN106711060B CN 106711060 B CN106711060 B CN 106711060B CN 201510783139 A CN201510783139 A CN 201510783139A CN 106711060 B CN106711060 B CN 106711060B
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- contact
- ring
- collector unit
- collection device
- fluid collection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
The fluid collection device of spin etch cleaning machine provided by the invention, for collecting the fluid to be splashed by a substrate surface, the fluid collection device includes multiple collector units and multiple driving devices.The multiple collector unit is located on around the substrate.The multiple driving device is connected to the multiple collector unit, lifting for each collector unit of independent control, so that the multiple collector unit can respectively collect different fluids, wherein the quantity of the multiple driving device is equal to the quantity of the multiple collector unit, overcomes the multiple pneumatic cylinders of existing use and has the nonsynchronous problem of lift component.
Description
[technical field]
The present invention relates to a kind of fluid collection device, in particular to a kind of spin etch cleaning machine suitable for substrate
Fluid collection device.
[background technique]
In the technique of semiconductor crystal wafer, display base plate, solar base plate, LED substrate etc., require to carry out substrate
Processing, such as the surface of substrate supply treatment fluid (such as chemicals or deionized water etc.) is etched, clean etc. and handles journey
Sequence, and in the processing substrate, then it must be directed to used treatment fluid by a fluid treating device and be collected, arrange
The subsequent processings such as liquid, recycling.However, the waste liquid that etching process generates is mostly toxic liquid, it is necessary to processing with caution.Therefore, how
Collecting the even different waste liquid of recycling and reusing is an important topic.
Existing spin etch cleaning machine can refer to TaiWan, China new patent M505052U, lose disclosed in rotation
A microscope carrier is equipped in cutting to carry and fix wafer, shaft below microscope carrier can high speed rotation, etching solution is then by top
Fluid supply unit flows down.Fluid collection device its use including it is multiple collect rings collection ring moulds blocks to collect different liquid
Waste liquid can be centrifuged when shaft high speed rotation and throw to collection ring by body.The multiple collection ring must utilize external elevating mechanism
(such as lifting pneumatic cylinder) driving carries out lifting actuation with opposite.When carrying out different liquids collection, specific receipts can be gone up and down in advance
Collect ring, each guidance for collecting ring of liquid runs down is discharged by each drain pipe collected below ring.
However, multiple lifting pneumatic cylinders generally are arranged with steady around collection ring in order to drive a collection ring lifting
Control collect ring lifting, but also because use multiple pneumatic cylinders, it is asynchronous if any moving for a certain pneumatic cylinder, system be possible
It generates alarm and shuts down, and then cause etching solution that may corrode undue substrate and the substrate need to be scrapped, or because shutdown is repaired
Shield reduces equipment capacity, leads to that increased production cost and product yield decline.
[summary of the invention]
In view of this, the purpose of the present invention is to provide a kind of rotation erosions for the reliability of lifting fluid collection device
The fluid collection device of etching cleaning platform overcomes and adopts in the prior art through the corresponding driving device of each collection ring
A collection ring is gone up and down with multiple pneumatic cylinders and be easy to cause the nonsynchronous problem of lift component.
To reach above-mentioned purpose, the fluid collection device of spin etch cleaning machine provided by the invention is for collecting by one
The fluid that substrate surface splashes, the fluid collection device includes multiple collector units and multiple driving devices.The multiple receipts
Collect cell rings to be set to around the substrate.The multiple driving device is connected to the multiple collector unit, for only
The lifting of the vertical each collector unit of control, so that the multiple collector unit can respectively collect different fluids, wherein described more
The quantity of a driving device is equal to the quantity of the multiple collector unit.
In a preferred embodiment, the multiple collector unit includes multiple collection rings, the multiple collection ring sequentially diameter
To setting.
In a preferred embodiment, each driving device includes link mechanism, and the bindiny mechanism is for steadily driving
The lifting for collecting ring, avoids lift component asynchronous.Specifically, the link mechanism is coupled to the periphery for collecting ring
The first contact and the second contact on edge.
In this preferred embodiment, first contact and second contact are on the outer peripheral edge for collecting ring
A radian is defined, the radian is between pi/2 to π.
In this preferred embodiment, it is described collect ring include on the outer peripheral edge be connected to first contact and
The reinforcing member of second contact.
In another preferred embodiment, the link mechanism includes being connected to first contact and second contact
Supporting element, the supporting element are set to the bottom of the outer peripheral edge for collecting ring.
In a preferred embodiment, the driving device includes a sliding rail, and the bindiny mechanism includes being connected to the cunning
The arm of encircling of linear movement is done on rail, the arm of encircling is with first end point and the second endpoint.
In this preferred embodiment, the link mechanism further include: the first top pillar is coupled to and described encircles described the of arm
End point；Second top pillar is coupled to second endpoint for encircling arm；First davit is coupled to the institute for collecting ring
State the first contact；Second davit is coupled to second contact for collecting ring；First closure, for sealed described the
One top pillar and first davit；And second closure, it is used for sealed second top pillar and second davit.
In this preferred embodiment, first closure and second closure have an at least horizontal adjustment spiral shell
Silk, for finely tuning the level for collecting ring.
Compared to the prior art, fluid collection device of the invention connects described more one to one through driving device
A collection ring, and overcome the multiple pneumatic cylinders of existing use and have nonsynchronous problem.In addition, collecting ring when in order to strengthen lifting
Horizontal stability, through link mechanism of the invention encircle arm to it is described collection ring outer peripheral edge on the first contact and second
Fulcrum of the contact as lifting, and smoothly can smoothly be gone up and down.
For above-mentioned and other purposes, feature and the advantage of the present invention can be clearer and more comprehensible, cooperates institute's accompanying drawings, make detailed
Carefully it is described as follows:
[Detailed description of the invention]
Fig. 1 is the diagrammatic cross-section of one of the present invention spin etch cleaning machine of preferred embodiment；
The stereoscopic schematic diagram of Fig. 2 fluid collection device of preferred embodiment thus；
Diagrammatic cross-section when Fig. 3 is the fluid collection device collection first fluid of the present embodiment；
Diagrammatic cross-section when Fig. 4 is the fluid collection device collection second fluid of the present embodiment；
Fig. 5 is the three-dimensional view of the fluid collection device of corresponding diagram 3；
Fig. 6 is the schematic top plan view of the fluid collection device of the present embodiment.
[specific embodiment]
Several preferred embodiments of the invention are described in detail by institute's accompanying drawings and following explanation, in different schemas
In, identical component symbol indicates the same or similar element.
Fig. 1 and Fig. 2 is please referred to, Fig. 1 is the section signal of one of the present invention spin etch cleaning machine of preferred embodiment
Figure, the stereoscopic schematic diagram of Fig. 2 fluid collection device of preferred embodiment thus.As shown, the spin etch of the present embodiment is clear
The fluid collection device 120 of washing machine platform 100 is used to collect the fluid to be splashed by 10 surface of a substrate.Specifically, spin etch
Cleaning machine 100 is equipped with a microscope carrier 11, and the lower section of microscope carrier 11 is then connected with a shaft 12, can carry and rotary plate 10, wherein described
Substrate 10 can be semiconductor crystal wafer, display base plate, solar base plate, LED substrate etc..The fluid collection device 120 includes
Multiple collector units 20 and multiple driving devices 30.
The multiple collector unit 20 is located on around the substrate 10, specifically, the multiple collector unit 20
It being connected with including multiple collection rings 22 in the drainage pipe 21 for collecting 22 bottom of ring, the multiple collection ring 22 is sequentially arranged radially,
In this embodiment, the multiple collection ring 22 includes first collecting ring 222 and second collecting ring 224, and first collects ring 222 and the
Two collect ring 224 as concentric annular, are also referred to as knocker wherein being located at the first of outside and collecting ring 222.The fluid of the present embodiment
In the state of Fig. 1, the substrate 10 is exposed to outside entire collector unit 20 collection device 120, at this time can load or unload base
Plate 10.It is noted that collector unit 20 of the invention can be the forms such as cyclic annular or tubulose, and visually collected fluid kind
Class is added outward, such as three collection rings or four collection rings.
Section signal when collecting first fluid to the fluid collection device 120 that Fig. 4, Fig. 3 are the present embodiment referring to figure 3.
Figure, diagrammatic cross-section when Fig. 4 is the collection second fluid of fluid collection device 120 of the present embodiment.As shown in figure 3, first receives
Collect ring 222 to rise, and collects ring 222 by first and collect first fluid.As shown in figure 4, when the second collection ring 224 also rises,
And ring 224 is collected by second and collects second fluid.It will be detailed below the driving device 30 of driving collector unit 20.
As shown in Fig. 2, the multiple driving device 30 is connected to the multiple collector unit 20, (i.e. first collects ring
222 and second collect ring 224), for the lifting of each collector unit 20 of independent control, so that the multiple collector unit 20 can
Different fluids is respectively collected, wherein the quantity of the multiple driving device 30 is equal to the quantity of the multiple collector unit 20.
In this embodiment, the quantity of collector unit 20 is two, and the quantity of driving device 30 is also two.It will be detailed below driving
Dynamic device 30 does principle.
As shown in figure 5, Fig. 5 is the three-dimensional view of the fluid collection device 120 of corresponding diagram 3, and in Fig. 5, driving device 30
Driving first is collected ring 222 and is risen.As shown, each driving device 30 includes a link mechanism 32 and driving source 34, driving
Source 34 with for driving link mechanism 32.For example, driving source 34 includes that pneumatic cylinder, oil hydraulic cylinder, linear motor etc. are linear past
Return driving source, in the present embodiment by taking pneumatic cylinder as an example, only the invention is not limited thereto.The bindiny mechanism 32 is for steadily driving
The lifting for collecting ring 22.
Fig. 6 is please referred to, Fig. 6 is the schematic top plan view of the fluid collection device 120 of the present embodiment.Specifically, the connection
Mechanism 32 be coupled to it is described collect ring 22 outer peripheral edge 23 on one of the first contact 24 and one second contact 25.In schema, respectively
Show the first contact 24 and the second contact 25 of the first collection ring 222 and the second collection ring 224.It is noted that the first touching
Not as being located on bolt in schema, schema only shows the relative position on outer peripheral edge 23 for point 24 and the second contact 25.Specifically
For, first contact 24 and second contact 25 are in defining an arc on the outer peripheral edge 23 for collecting ring 22
Degree, the radian is between pi/2 to π, that is, 90 degree to 180 degree.In this embodiment, as shown, first collects ring 222
First contact 24 and the second contact 25 define radian r1, and second collects the first contact 24 of ring 224 and the definition of the second contact 25
Radian r2 out, the first radian r1 for collecting ring 222 are greater than the second radian r2 for collecting ring 224.
As shown in Figures 2 and 6, in order to strengthen the stability collecting ring 22 and going up and down, the collection ring 22 further includes being located at institute
State the reinforcing member 225 for being connected to first contact 24 and second contact 25 on outer peripheral edge 23.In this embodiment, it mends
Strong part 225 is set on the outer peripheral edge 23 that first collects ring 222.As shown in figures 2 and 5, in addition to this, the link mechanism 32 is gone back
It may include the supporting element 37 for being connected to first contact 24 and second contact 25, the supporting element 37 is set to the receipts
Collect the bottom of the outer peripheral edge 23 of ring 22.In this embodiment, supporting element 37 is used to support the second collection ring 224, with firm
Second collects the lifting of ring 224.
Illustrate the specific structure of the bindiny mechanism 32 of this embodiment below.As shown in figure 5, the driving device 30 includes one
Sliding rail 31, the bindiny mechanism 32 includes being connected on the sliding rail 31 to do one of linear movement and encircle arm 33, described to encircle arm
33 have a first end point 332 and one second endpoint 333.In this embodiment, driving first is collected the sliding rail 31 of ring 222 and is driven
The two sides of a pillar 50 are arranged in both sliding rails 31 of dynamic second collection ring 224, and corresponding driving source 34 is also disposed at pillar
50 two sides, to save the space under collector unit 20.Please with reference to Fig. 2, herein to connect the first company for collecting ring 222
Tie mechanism 32 for, link mechanism 32 further include the first top pillar 334, the second top pillar 335, the first davit 336, the second davit 337,
First closure 338 and the second closure 339.Specifically, the first top pillar 334 is coupled to the first end for encircling arm 33
Point 332；Second top pillar 335 is coupled to second endpoint 333 for encircling arm 33；First davit 336 is coupled to the receipts
Collect first contact 24 of ring 22；Second davit 337 is coupled to second contact 25 for collecting ring 22；First is sealed
Part 338 is used for sealed first top pillar 334 and first davit 336；Second closure 339 is used for sealed described second
Top pillar 335 and second davit 337.It is noted that the link mechanism 32 that ring 224 is collected in connection second is and above-mentioned phase
Together, this is not repeated.
As shown in figures 2 and 5, first closure 338 and second closure 339 have at least one horizontal tune
Whole screw 340, adjusted leveling screws 340 are used to finely tune the level for collecting ring 22.Specifically, the first closure 338 with
And second closure 339 respectively has staggered first locking block 342 and the second locking block 344.First locking block 342 and
Two locking blocks 344 are locked together in first/second top pillar 334,335 and first/second davit 336,337 through bolt respectively, to water
After the whole screw 340 of Heibei provincial opera adjusts level, two staggered first locking blocks 342 and the second locking block 344 are just combined by bolt, in turn
Complete the fixation of link mechanism 32.It is noted that the specific structure of above-mentioned link mechanism 32 is only one embodiment, at other
In embodiment, link mechanism may also be arranged on the top of collector unit 20 and be not take up the space below collector unit 20.
In conclusion fluid collection device 120 of the invention connects the multiple receipts through driving device 30 one to one
Collect ring 22, and overcomes the multiple pneumatic cylinders of existing use and have the nonsynchronous problem of lift component.In addition, in order to strengthen single drive
Horizontality when ring 22 is gone up and down is collected in the dynamic driving of device 30, encircles arm 33 to the collection through link mechanism 32 of the invention
The fulcrum of the first contact 24 and the second contact 25 as lifting on 22 outer peripheral edge 23 of ring, and smoothly can smoothly be gone up and down.
From the foregoing, it will be observed that the reliability for greatly improving fluid collection device running of the invention, and then reduce equipment downtime and generate useless
The probability of material.
Although the present invention has been disclosed above in the preferred embodiment but above preferred embodiment be not intended to limit the invention,
Those skilled in the art, without departing from the spirit and scope of the present invention, can make it is various change and retouch, therefore this
The protection scope of invention subjects to the scope of the claims.
Claims (5)
1. a kind of fluid collection device of spin etch cleaning machine, special for collecting the fluid to be splashed by a substrate surface
Sign is, comprising:
Multiple collector units are located on around the substrate；And
Multiple driving devices are connected to the multiple collector unit, for the lifting of each collector unit of independent control, make
Different fluids can respectively be collected by obtaining the multiple collector unit, wherein the quantity of the multiple driving device is equal to the multiple
The quantity of collector unit；
The multiple collector unit includes multiple collection rings, and the multiple collection ring is sequentially arranged radially；
Each driving device includes link mechanism, and the link mechanism is used to drive the lifting for collecting ring；
The link mechanism is coupled to the first contact and the second contact on the outer peripheral edge for collecting ring；
The driving device includes a sliding rail, and the link mechanism includes being connected on the sliding rail to do encircling for linear movement
Arm, the arm of encircling is with first end point and the second endpoint；And
The link mechanism further include:
First top pillar is coupled to the first end point for encircling arm；
Second top pillar is coupled to second endpoint for encircling arm；
First davit is coupled to first contact for collecting ring；
Second davit is coupled to second contact for collecting ring；
First closure is used for sealed first top pillar and first davit；And
Second closure is used for sealed second top pillar and second davit.
2. fluid collection device according to claim 1, which is characterized in that first contact and second contact in
A radian is defined on the outer peripheral edge for collecting ring, the radian is between pi/2 to π.
3. fluid collection device according to claim 1, which is characterized in that the collection ring includes being located at the outer peripheral edge
On the reinforcing member for being connected to first contact and second contact.
4. fluid collection device according to claim 1, which is characterized in that the link mechanism includes being connected to described the
The supporting element of one contact and second contact, the supporting element are set to the bottom of the outer peripheral edge for collecting ring.
5. fluid collection device according to claim 1, which is characterized in that first closure and second lock
Component has an at least adjusted leveling screws, for finely tuning the level for collecting ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510783139.2A CN106711060B (en) | 2015-11-16 | 2015-11-16 | The fluid collection device of spin etch cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510783139.2A CN106711060B (en) | 2015-11-16 | 2015-11-16 | The fluid collection device of spin etch cleaning machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106711060A CN106711060A (en) | 2017-05-24 |
| CN106711060B true CN106711060B (en) | 2019-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510783139.2A Active CN106711060B (en) | 2015-11-16 | 2015-11-16 | The fluid collection device of spin etch cleaning machine |
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| CN (1) | CN106711060B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111211066B (en) * | 2018-11-22 | 2022-09-02 | 辛耘企业股份有限公司 | Fluid collecting device |
| TWI747580B (en) * | 2020-10-28 | 2021-11-21 | 辛耘企業股份有限公司 | Etching device |
| CN113467199B (en) * | 2021-09-06 | 2021-11-12 | 宁波润华全芯微电子设备有限公司 | Device convenient to dismantle and capable of preventing wafer from being polluted by splashing liquid |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104064500A (en) * | 2014-06-24 | 2014-09-24 | 北京七星华创电子股份有限公司 | Cleaning device and method for slice disc-shaped object |
| TWM505052U (en) * | 2015-01-22 | 2015-07-11 | Scientech Corp | Fluid process processing apparatus |
| CN205081101U (en) * | 2015-11-16 | 2016-03-09 | 弘塑科技股份有限公司 | Fluid collection device of board is rinsed in rotatory etching |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070254098A1 (en) * | 2006-04-28 | 2007-11-01 | Applied Materials, Inc. | Apparatus for single-substrate processing with multiple chemicals and method of use |
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2015
- 2015-11-16 CN CN201510783139.2A patent/CN106711060B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104064500A (en) * | 2014-06-24 | 2014-09-24 | 北京七星华创电子股份有限公司 | Cleaning device and method for slice disc-shaped object |
| TWM505052U (en) * | 2015-01-22 | 2015-07-11 | Scientech Corp | Fluid process processing apparatus |
| CN205081101U (en) * | 2015-11-16 | 2016-03-09 | 弘塑科技股份有限公司 | Fluid collection device of board is rinsed in rotatory etching |
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| CN106711060A (en) | 2017-05-24 |
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