CN106695538B - Grind fixed device and the grinding method using the fixed device of the grinding - Google Patents
Grind fixed device and the grinding method using the fixed device of the grinding Download PDFInfo
- Publication number
- CN106695538B CN106695538B CN201510793282.XA CN201510793282A CN106695538B CN 106695538 B CN106695538 B CN 106695538B CN 201510793282 A CN201510793282 A CN 201510793282A CN 106695538 B CN106695538 B CN 106695538B
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- China
- Prior art keywords
- separator
- stickers
- workpiece
- glue surface
- grinding
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention proposes a kind of fixed devices of grinding, for fixing workpiece comprising fixing seat, the separator being set in fixing seat and the stickers being set on separator.Stickers include ontology, the first glue surface for being set to ontology side and the second glue surface for being set to the ontology other side.First glue surface is equipped with groove.First glue surface is pressed on the separator so that the air discharge in groove is to make stickers paste and be adsorbed on separator.Second glue surface is for pasting workpiece to secure the workpiece against fixing seat.The fixed device of grinding of the invention is convenient for the fixation and removing of workpiece using separator and stickers.The present invention also provides a kind of grinding method using the fixed device of above-mentioned grinding.
Description
Technical field
The present invention relates to a kind of fixed devices, especially a kind of to grind fixed device and grinding using the fixed device of the grinding
Mill method.
Background technique
The fixed product majority of the fixed device of existing grinding is based on glue cementation, waxing and mosaic mode.However, glue
Quick solidifying, flatness is poor after product is bonded;Certain temperature is needed to melt wax body during waxing but product is heated
Deformation, influences product appearance quality and processing quality;The useless pin that mosaic mode generates during the grinding process, which easily produces to be stored in, to be inlayed admittedly
Determine in the gap of mechanism and under the influence of a product fixation to influence the fixation and attrition process quality of product.
Summary of the invention
In view of the above situation, it is necessary to which a kind of be fixed conveniently and the fixed device of stable grinding and solid using the grinding is provided
Determine the grinding method of device.
A kind of fixed device of grinding, for fixing workpiece.The fixed device of the grinding includes fixing seat, is set to the fixing seat
On separator and the stickers that are set on the separator.The stickers include ontology, are set to the first of the ontology side
Glue surface and the second glue surface for being set to the ontology other side.First glue surface is equipped with multiple grooves.The bottom surface of each groove
It is not coated with colloid.First glue surface, which is pressed on the separator, makes the air in multiple grooves be discharged to paste the stickers
And it is adsorbed on the separator.Second glue surface is for pasting the workpiece so that the workpiece is fixed on the fixing seat.
A kind of grinding method using the fixed device of above-mentioned grinding, comprising the following steps:
The separator is fixed in the fixing seat;
First glue surface of the stickers is attached on the separator;
Workpiece is pasted in the second glue surface of the stickers;
The workpiece, the stickers and the separator are pressed to fix workpiece;
The workpiece is subjected to attrition process;
The stickers are removed from the separator with the workpiece;And
The stickers are removed from the workpiece.
The fixed device of above-mentioned grinding and the grinding method that device is fixed using above-mentioned grinding, by fixing seat and stickers
Between separator is set, convenient for the removing of workpiece.Meanwhile by stickers setting there is the first concavo-convex glue surface to make stickers
Stablize to be adhered on separator and easily from separator and remove.
Detailed description of the invention
Fig. 1 is the perspective view of the fixed device of grinding of the invention.
Fig. 2 is the stereogram exploded view that fixed device is ground shown in Fig. 1.
Fig. 3 is the plan view that the stickers of fixed device are ground shown in Fig. 1.
Fig. 4 is the grinding method flow chart using the fixed device of grinding shown in Fig. 1.
Main element symbol description
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
It should be noted that it can be directly to separately when a component is considered as " connection " another component
One component may be simultaneously present the component being centrally located.When a component is considered as " setting exists " another component,
It, which can be, is set up directly on another component or may be simultaneously present the component being centrally located.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Referring to Fig. 1, the fixed device 100 of a kind of grinding provided by the invention, for consolidating to workpiece 200 to be ground
It is fixed.Fixed device 100 is ground to include fixing seat 10, the separator 20 being attached in fixing seat 10 and be attached on separator 20
Multiple stickers 30.Stickers 30 are for pasting workpiece 200 so that workpiece 200 is fixed on the fixed device 100 of grinding.
Please refer to Fig. 2 and Fig. 3, fixing seat 10 is in substantially circular ring shape, is used for the work that will be fixed in fixing seat 10
Part 200 is fixed in other processing unit (plant) (not shown).Separator 20 is similar to the shape of fixing seat 10 comprising first surface
21 and the second surface 22 opposite with first surface 21.First surface 21 be smooth plane in order to stickers 30 attaching with
Removing.Second surface 22 is attached in fixing seat 10 so that separator 20 to be fixed in fixing seat 10.In this implementation, separator 20
For release film.
Stickers 30 are generally rectangular shaped.Multiple stickers 30 are distributed uniformly and circumferentially in fixing seat 10 and close to solid
The periphery (not indicating) of reservation 10.Stickers 30 include ontology 31, are set to first glue of the ontology 31 towards 20 side of separator
Face 32 and the second glue surface 33 for being set to another opposite side of ontology 31.First glue surface 32 coating colloid (not indicating) is simultaneously formed with more
A groove 321.Groove 321 does not apply colloid for the bottom (not indicating) of irregular slot and groove 321.Groove 321 is distributed in
In first glue surface 32 and entire first glue surface 32 has been covered with it.First glue surface 32 and 21 phase of first surface of separator 20 are pasted.By
In the first glue surface 32 have groove 321, when the first glue surface 32 is bonded with the first surface 21 of separator 20 and pressed so that
Air in groove 321 in first glue surface 32 is discharged so that the first glue surface 32 is pasted and is adsorbed on first surface 21 improves
Stickers 30 are attached at the fastness of separator 20.Simultaneously as the first glue surface 32 is adsorbed on first surface 21 and the first table
Face 21 is smooth surface so that stickers 30 remain convenient for removing and without colloid.Second glue surface, 33 even spread has colloid (not
Mark) so that the second glue surface 33 is pasted with 200 phase of workpiece.In addition, the viscosity of the second glue surface 33 be greater than the first glue surface 32 viscosity from
And remove the first glue surface 32 in stripping process easily with separator 20.
Please refer to Fig. 2 to Fig. 4, using the grinding method of the fixed device 100 of above-mentioned grinding, steps are as follows:
S101: separator 20 is fixed in fixing seat 10;
S102: the first glue surface 32 of stickers 30 is attached on separator 20;
S103: workpiece 200 is pasted in the second glue surface 33 of stickers 30;
S104: workpiece 200, stickers 30 and separator 20 are pressed to fix workpiece 200;
S105: workpiece 200 is subjected to attrition process;
S106: after attrition process, stickers 30 and workpiece 200 are removed from separator 20;
S107: stickers 30 are removed from workpiece 200.
In the present embodiment, the groove 321 in the first glue surface 32 of stickers 30 is in disorderly arranged, but not limited to this, it should
First glue surface 32 has the attaching that stickers 30 Yu separator 20 are had no effect in the groove of array-like arrangement.
The fixed device 100 of above-mentioned grinding and the grinding method that device 100 is fixed using above-mentioned grinding, by fixing seat 10
Separator 20 is set between stickers 30, convenient for the fixation and removing of workpiece 200.Meanwhile groove is set by stickers 30
321 make stickers 30 stablize to paste and remove with being adsorbed on separator 20 and easily from separator 20.
In addition, those skilled in the art can also do other variations in spirit of that invention, certainly, these are smart according to the present invention
The variation that mind is done should be all included in scope of the present invention.
Claims (6)
1. a kind of fixed device of grinding, for fixing workpiece to be ground, the fixed device of the grinding includes fixing seat, and feature exists
In: the stickers that device further includes the separator being set in the fixing seat and is set on the separator are fixed in the grinding, should
Stickers include ontology, the first glue surface for being set to the ontology side and the second glue surface for being set to the ontology other side, this
One glue surface is equipped with multiple grooves, and the bottom surface of each groove is not coated with colloid, the first glue surface be pressed on the separator make it is multiple
Air discharge in the groove is to make the stickers paste and be adsorbed on the separator, and second glue surface is for pasting the work
Part is the workpiece to be fixed in the fixing seat.
2. as described in claim 1 grind fixed device, it is characterised in that: the separator include first surface and with this first
The opposite second surface in surface, first glue surface are attached on the first surface, which is attached in the fixing seat.
3. as described in claim 1 grind fixed device, it is characterised in that: the viscosity of second glue surface is greater than first glue surface
Viscosity to make in stripping process second glue surface easily remove with the separator.
4. as described in claim 1 grind fixed device, it is characterised in that: the separator is release film.
5. as described in claim 1 grind fixed device, it is characterised in that: the stickers include multiple, multiple stickers
It is distributed uniformly and circumferentially in the fixing seat and close to the fixing seat periphery.
6. a kind of use the grinding method as described in any one in claim 1-5 for grinding fixed device, it is characterised in that: the party
Method the following steps are included:
The separator is fixed in the fixing seat;
First glue surface of the stickers is attached on the separator;
Workpiece is pasted in the second glue surface of the stickers;
The workpiece, the stickers and the separator are pressed to fix workpiece;
The workpiece is subjected to attrition process;
The stickers are removed from the separator with the workpiece;And
The stickers are removed from the workpiece.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510793282.XA CN106695538B (en) | 2015-11-18 | 2015-11-18 | Grind fixed device and the grinding method using the fixed device of the grinding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510793282.XA CN106695538B (en) | 2015-11-18 | 2015-11-18 | Grind fixed device and the grinding method using the fixed device of the grinding |
Publications (2)
Publication Number | Publication Date |
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CN106695538A CN106695538A (en) | 2017-05-24 |
CN106695538B true CN106695538B (en) | 2019-07-05 |
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CN101547986A (en) * | 2006-10-05 | 2009-09-30 | 武藏化成工业股份有限公司 | Superstrong adhesive tape |
CN202572118U (en) * | 2012-04-24 | 2012-12-05 | 正恩科技有限公司 | Thinning structure for light emitting diode wafer |
CN104231964A (en) * | 2014-09-17 | 2014-12-24 | 常州昊天塑胶科技有限公司 | Grinding pad fixing adhesive tape and grinding pad attaching structure |
CN104485294A (en) * | 2014-12-12 | 2015-04-01 | 浙江中纳晶微电子科技有限公司 | Temporary bonding and separation method for wafers |
CN104559822A (en) * | 2014-12-29 | 2015-04-29 | 宁波大榭开发区综研化学有限公司 | Strippable double-sided sticky tape for large-size sapphire glass grinding and preparation method of strippable double-sided sticky tape |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4381860B2 (en) * | 2004-03-24 | 2009-12-09 | 日東電工株式会社 | Method and apparatus for separating reinforcing plate fixed to reinforced semiconductor wafer |
CN201517084U (en) * | 2009-03-27 | 2010-06-30 | 上海稳健医疗器械有限公司 | Ventilating adhesive tape and production device thereof |
-
2015
- 2015-11-18 CN CN201510793282.XA patent/CN106695538B/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101547986A (en) * | 2006-10-05 | 2009-09-30 | 武藏化成工业股份有限公司 | Superstrong adhesive tape |
CN202572118U (en) * | 2012-04-24 | 2012-12-05 | 正恩科技有限公司 | Thinning structure for light emitting diode wafer |
CN104231964A (en) * | 2014-09-17 | 2014-12-24 | 常州昊天塑胶科技有限公司 | Grinding pad fixing adhesive tape and grinding pad attaching structure |
CN104485294A (en) * | 2014-12-12 | 2015-04-01 | 浙江中纳晶微电子科技有限公司 | Temporary bonding and separation method for wafers |
CN104559822A (en) * | 2014-12-29 | 2015-04-29 | 宁波大榭开发区综研化学有限公司 | Strippable double-sided sticky tape for large-size sapphire glass grinding and preparation method of strippable double-sided sticky tape |
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Publication number | Publication date |
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CN106695538A (en) | 2017-05-24 |
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