CN106695162A - Lead-free solder for micro-electronics industry and preparation method thereof - Google Patents
Lead-free solder for micro-electronics industry and preparation method thereof Download PDFInfo
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- CN106695162A CN106695162A CN201611247766.5A CN201611247766A CN106695162A CN 106695162 A CN106695162 A CN 106695162A CN 201611247766 A CN201611247766 A CN 201611247766A CN 106695162 A CN106695162 A CN 106695162A
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- Prior art keywords
- lead
- free solder
- snbicu
- microelectronic industry
- preparation
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a lead-free solder for a micro-electronics industry and a preparation method thereof, and belongs to the technical field of new materials prepared in a lead-free manner. The lead-free solder consists of the following components in percentage by weight: 16-18% of Bi, 0.3-0.8% of Cu, 0.1-0.3% of Fe, 0.1-0.3% of Zn, 0.1-0.3% of Sb, and the balance of Sn. The lead-free solder reaches the melting point of 156-165 DEG C, and satisfies the requirements on the welding temperature by all devices in the micro-electronics industry. The lead-free solder is excellent in wetting spreadability with various semiconductor materials with different performances in the micro-electronics industry, high in binding force and excellent in ductility.
Description
Technical field
The present invention relates to a kind of lead-free solder, and in particular to a kind of lead-free solder and its system for for microelectronic industry
Preparation Method, belongs to unleaded and is made new material technology field.
Background technology
Lead was a kind of harmful metallic element, early in European Union ROHS (Restriction of Hazardous in 2003
Substances, refers to use the instruction of some harmful components on being limited in electronic and electrical equipment) instruction regulation enters Europe
The electronics and IT products in continent can not contain lead, mercury, cadmium, Cr VI, PBBs and PBDEs, before electronic product assembling
Welding and electronic component in making more uses tin-lead solder.Although the lead-free solder field of China is started late, with
Developed country compares still gap, but in order to improve the adaptability of itself product, keeps up with the demand of international market, in analysis
On the basis of the conventional lead-free solder in current domestic and international market, it is proposed by substantial amounts of experimental study a kind of for making pressure-sensitive electricity
Hinder the multi-component leadless solder of device, its electrical property, mechanical property, with the wetting and spreading performance of piezoresistor semiconductor substrate and weldering
Intensity etc. is connect to have reached and used the similar effect of tin-lead solder, it is ensured that export to European Union electronic product integrally realize it is unleaded
The requirement of change.
Tin-lead solder is with a long history, but with the high request to the cognition of Lead Toxicity and electronics industry development butt welding point, nothing
Kupper solder gradually instead of conventional tin-lead solders.Solder has the applicating history of more than 20 years, and it is mainly characterized by can
Welded below 183 DEG C, therefore to the strong adaptability of element, saving energy consumption, reduction disposal of pollutants.Current solder
Mainly there are two kinds of Sn-Bi systems and Sn-In systems, because In is a kind of rare expensive metal so that the application of Sn-In solders is limited, because
This bianry alloy Sn-Bi (especially SnBi58) is often used the occasion in low-temperature welding demand.Sn-Bi systems solder is in temperature wider
There is identical elastic modelling quantity in the range of degree with Sn-Pb, and many physicochemical characteristics of Bi are similar to Pb, the use of Bi can be with
Reduce fusing point, reduce surface tension, the addition of Bi reduces the reaction speed of Sn and Cu, so there is preferable wetability；In addition
Sn-Bi systems solder contains relatively low Sn contents, so as to reduce tin risk high (such as tin palpus).But bismuth also brings other problems,
Influence including its composition to alloy mechanical property is changed greatly, and easily produces low melting point problem (low melting point can be formed after inclined tin
Eutectic), boundary layer is unstable to cause reliability poor, particularly Sn-Bi solders deviate eutectic composition when due to melting range it is larger,
Easily occur dendritic segregation and tissue coarsening in process of setting, unequal power distribution causes easily peelable harm in addition, and natural
Supply is few, reserves are limited etc., and this causes the research of Sn-Bi systems solder and using at a low tide always.
The content of the invention
The present invention provides a kind of lead-free solder for microelectronic industry and preparation method thereof, solves existing Sn-Bi welderings
Material causes poor reliability and easily peelable problem because boundary layer is unstable.
The technical proposal of the invention is realized in this way：
A kind of lead-free solder for microelectronic industry is composed of the following components by weight percentage：Bi16~18%,
Cu0.3~0.8%, Fe0.1~0.3%, Zn0.1~0.3%, Sb0.1~0.3%, balance of Sn.
Wherein it is preferred to, a kind of lead-free solder for microelectronic industry, by weight percentage by following components group
Into：Bi17~18%, Cu0.4~0.6%, Fe0.1~0.3%, Zn0.1~0.3%, Sb0.1~0.3%, balance of Sn.
A kind of preparation method of lead-free solder for microelectronic industry, comprises the following steps：
(1) Sn, Bi and Cu are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiCu intermediate alloys；
(2) in the SnBiCu intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiCu
The surface of gold covers anti-oxidation solvent, and alloy is heated into 200~350 DEG C, is incubated 10~20min, removes Surface Oxygen slugging, pours
Note and alloy ingot blank is made in mould, and silk, bar, sheet products are further processed into according to technological requirement.
The present invention adds Cu elements on the basis of Sn-Bi hypoeutectic alloys, makes solder matrix situ react to form tiny
The Cu6Sn5 intermetallic compounds of disperse, so as to improve the binding ability of solder joint and use reliability, and it was found that due to Sn-
Resistivity Bi constituent contents high are reduced in Bi-Cu solders, conduction, the thermal conductivity of solder greatly improved, this can be effective
Alleviate solder joint to generate heat in use Fatigue Failures.
Fe particle dispersion phases are added in Sn-Bi eutectic alloys, microstructure is refined and stabilize, the anti-of alloy is enhanced
Croop property.
It is (tuner, lightning protection component, flexible board, many that lead-free solder prepared by the present invention is mainly used in low-temperature welding technique
The welding such as layer circuit board welding) and the welding of leadless electronic assembling product etc..
Lead-free solder fusing point of the invention is 156~165 DEG C, meets each component of microelectronic industry to welding temperature
It is required that.Also, the semi-conducting material wetting and spreading with the various different performances of microelectronic industry is good, adhesion is strong, and ductility is good,
0.2% bends and stretches intensity reaches more than 70MPa, and tensile strength reaches more than 80MPa, the solder side of elongation percentage more than 20% without pit without
Bubble, smooth, high-temperature soldering nondiscolouring, corrosion stability is excellent.
Specific embodiment
The technical scheme in the embodiment of the present invention is clearly and completely described below, it is clear that described embodiment
Only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, the common skill in this area
All other embodiment that art personnel are obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
Embodiment 1
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder for microelectronic industry：
Bi17%, Cu0.5%, Fe0.2%, Zn0.2%, Sb0.2%, balance of Sn.
The preparation method of the above-mentioned lead-free solder for microelectronic industry, comprises the following steps：
(1) Sn, Bi and Cu are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiCu intermediate alloys；
(2) in the SnBiCu intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiCu
The surface of gold covers anti-oxidation solvent, and alloy is heated into 250 DEG C, is incubated 15min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and silk, bar, sheet products are further processed into according to technological requirement.
Embodiment 2
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder for microelectronic industry：
Bi16%, Cu0.8%, Fe0.1%, Zn0.3%, Sb0.1%, balance of Sn.
The preparation method of the above-mentioned lead-free solder for microelectronic industry, comprises the following steps：
(1) Sn, Bi and Cu are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiCu intermediate alloys；
(2) in the SnBiCu intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiCu
The surface of gold covers anti-oxidation solvent, and alloy is heated into 200 DEG C, is incubated 20min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and silk, bar, sheet products are further processed into according to technological requirement.
Embodiment 3
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder for microelectronic industry：
Bi18%, Cu0.3%, Fe0.3%, Zn0.1%, Sb0.3%, balance of Sn.
The preparation method of the above-mentioned lead-free solder for microelectronic industry, comprises the following steps：
(1) Sn, Bi and Cu are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiCu intermediate alloys；
(2) in the SnBiCu intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiCu
The surface of gold covers anti-oxidation solvent, and alloy is heated into 350 DEG C, is incubated 10min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and silk, bar, sheet products are further processed into according to technological requirement.
Embodiment 4
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder for microelectronic industry：
Bi17%, Cu0.4%, Fe0.1%, Zn0.2%, Sb0.2%, balance of Sn.
The preparation method of the above-mentioned lead-free solder for microelectronic industry, comprises the following steps：
(1) Sn, Bi and Cu are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiCu intermediate alloys；
(2) in the SnBiCu intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiCu
The surface of gold covers anti-oxidation solvent, and alloy is heated into 300 DEG C, is incubated 12min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and silk, bar, sheet products are further processed into according to technological requirement.
Embodiment 5
It is composed of the following components by weight percentage that the present embodiment provides a kind of lead-free solder for microelectronic industry：
Bi17%, Cu0.6%, Fe0.3%, Zn0.2%, Sb0.3%, balance of Sn.
The preparation method of the above-mentioned lead-free solder for microelectronic industry, comprises the following steps：
(1) Sn, Bi and Cu are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiCu intermediate alloys；
(2) in the SnBiCu intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, closed in the middle of SnBiCu
The surface of gold covers anti-oxidation solvent, and alloy is heated into 220 DEG C, is incubated 18min, removes Surface Oxygen slugging, is cast in mould
In be made alloy ingot blank, and silk, bar, sheet products are further processed into according to technological requirement.
The physicochemical property of lead-free solder obtained in above-described embodiment is as follows：
As seen from the above table, lead-free solder fusing point of the invention is 156~165 DEG C, meets each component of microelectronic industry
Requirement to welding temperature.Also, the semi-conducting material wetting and spreading with the various different performances of microelectronic industry is good, adhesion
By force, ductility is good.
Presently preferred embodiments of the present invention is the foregoing is only, is not intended to limit the invention, it is all in essence of the invention
Within god and principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (3)
1. a kind of lead-free solder for microelectronic industry, it is characterised in that composed of the following components by weight percentage：
Bi16~18%, Cu0.3~0.8%, Fe0.1~0.3%, Zn0.1~0.3%, Sb0.1~0.3%, balance of Sn.
2. a kind of lead-free solder for microelectronic industry according to claim 1, it is characterised in that by weight percentage
Meter is composed of the following components：Bi17~18%, Cu0.4~0.6%, Fe0.1~0.3%, Zn0.1~0.3%, Sb0.1~
0.3%th, balance of Sn.
3. a kind of preparation method of the lead-free solder for microelectronic industry described in claim 1 or 2, it is characterised in that bag
Include following steps：
(1) Sn, Bi and Cu are weighed by proportioning, is placed in vacuum melting furnace, prepare SnBiCu intermediate alloys；
(2) in the SnBiCu intermediate alloys, Fe, Zn and Sb the addition vacuum melting furnace that will prepare, in SnBiCu intermediate alloys
Surface covers anti-oxidation solvent, and alloy is heated into 200~350 DEG C, is incubated 10~20min, removes Surface Oxygen slugging, is cast in
Alloy ingot blank is made in mould, and silk, bar, sheet products are further processed into according to technological requirement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611247766.5A CN106695162A (en) | 2016-12-29 | 2016-12-29 | Lead-free solder for micro-electronics industry and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611247766.5A CN106695162A (en) | 2016-12-29 | 2016-12-29 | Lead-free solder for micro-electronics industry and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106695162A true CN106695162A (en) | 2017-05-24 |
Family
ID=58906116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611247766.5A Pending CN106695162A (en) | 2016-12-29 | 2016-12-29 | Lead-free solder for micro-electronics industry and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106695162A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1252842A (en) * | 1997-04-22 | 2000-05-10 | 伊科索尔德国际股份有限公司 | Lead-free solder |
| CN1927525A (en) * | 2006-08-11 | 2007-03-14 | 北京有色金属研究总院 | Silver-free tin-bismuth-copper leadless solder and preparation method |
| CN101700605A (en) * | 2009-11-13 | 2010-05-05 | 苏州优诺电子材料科技有限公司 | Low melting point lead-free welding material alloy |
| JP2015062933A (en) * | 2013-09-25 | 2015-04-09 | 日立金属株式会社 | Lead-free solder alloy, bonding material, and bonded element |
| WO2016178000A1 (en) * | 2015-05-02 | 2016-11-10 | Alpha Metals, Inc. | Lead-free solder alloy with low melting point |
-
2016
- 2016-12-29 CN CN201611247766.5A patent/CN106695162A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1252842A (en) * | 1997-04-22 | 2000-05-10 | 伊科索尔德国际股份有限公司 | Lead-free solder |
| CN1927525A (en) * | 2006-08-11 | 2007-03-14 | 北京有色金属研究总院 | Silver-free tin-bismuth-copper leadless solder and preparation method |
| CN101700605A (en) * | 2009-11-13 | 2010-05-05 | 苏州优诺电子材料科技有限公司 | Low melting point lead-free welding material alloy |
| JP2015062933A (en) * | 2013-09-25 | 2015-04-09 | 日立金属株式会社 | Lead-free solder alloy, bonding material, and bonded element |
| WO2016178000A1 (en) * | 2015-05-02 | 2016-11-10 | Alpha Metals, Inc. | Lead-free solder alloy with low melting point |
Non-Patent Citations (1)
| Title |
|---|
| 徐骏等: "Sn-Bi系列低温无铅焊料及其发展趋势", 《电子工艺技术》 * |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |
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| RJ01 | Rejection of invention patent application after publication |