CN106686884A - FPC connecting head, touch screen and liquid crystal screen - Google Patents
FPC connecting head, touch screen and liquid crystal screen Download PDFInfo
- Publication number
- CN106686884A CN106686884A CN201710108431.3A CN201710108431A CN106686884A CN 106686884 A CN106686884 A CN 106686884A CN 201710108431 A CN201710108431 A CN 201710108431A CN 106686884 A CN106686884 A CN 106686884A
- Authority
- CN
- China
- Prior art keywords
- circuit layer
- insulating barrier
- fpc
- bus
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052737 gold Inorganic materials 0.000 claims abstract description 9
- 239000010931 gold Substances 0.000 claims abstract description 9
- 238000007731 hot pressing Methods 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 230000004888 barrier function Effects 0.000 claims description 92
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 235000003392 Curcuma domestica Nutrition 0.000 claims description 7
- 244000008991 Curcuma longa Species 0.000 claims description 7
- 235000003373 curcuma longa Nutrition 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 235000013976 turmeric Nutrition 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 abstract 1
- 230000003014 reinforcing effect Effects 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000003467 diminishing effect Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005493 welding type Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
Abstract
The invention relates to an FPC connecting head. The FPC connecting head comprises a first insulating layer, a first circuit layer which consists of a plurality of conductive strips, a second insulating layer, a second circuit layer, a third insulating layer, a third circuit layer until the n<th> insulating layer, an n<th> circuit layer and a (n+1)<th> insulating layer, wherein the front part of the first circuit layer and the front part of the second insulating layer both extend out of the front end of the first insulating layer; the first circuit layer consists of a plurality of conductive strips, and the front parts of the multiple conductive strips are arranged in parallel with equal spacings; the upper surfaces are plated with gold and immersed with gold to form metal layers; the front parts of the conductive strips and the metal layers jointly form metal fingers; the conductive strips in other circuit layers are connected with the conductive layers of the layer on the back end or the middle of the FPC through via holes or ways of gold plating or gold immersing, so that the multiple circuit layers form single circuit layers at the front end of the FPC; and the lowest bottoms, corresponding to the positions of the metal fingers, are coated with a reinforcing plate layer through thermosetting adhesive and hot pressing. By adoption of the FPC connecting head, co-existence of multiple kinds of interfaces can be realized; the connecting head is inserted with a main board, and the interface is not damaged easily; and the connecting head is convenient to use.
Description
Technical field
The present invention relates to electrical connection techniques field, more particularly to a kind of FPC union joints, touch screen and liquid crystal display screen.
Background technology
Current touch screen, liquid crystal display screen is towards slimming, multi-functional, high performance trend development.
Traditional liquid crystal screen, FPC of the touch screen using welding type, due to being limited by technique, the PIN of such FPC is away from more
In more than 0.8mm, unit width cannot accommodate more PINs (common 37PIN), it is impossible to realize multiple interfaces and deposit, and
In mainboard welding process, it is easy to destroy interface, it is impossible to reuse, waste larger, maintenance is also inconvenient.Clearly can not
Meet the demand of liquid crystal display screen or touch screen development.
The content of the invention
It is an object of the invention to provide a kind of FPC union joints, touch screen and liquid crystal display screen, technical problem to be solved is：
Multiple interfaces cannot be realized and deposited, and in mainboard welding process, it is easy to destroy interface, it is impossible to reuse, waste compared with
Greatly, maintenance is also inconvenient.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of FPC union joints, including the first insulating barrier,
One circuit layer and the second insulating barrier, first circuit are placed on the downside of first insulating barrier, second insulating barrier
It is placed in the downside of the first circuit layer, it is exhausted that the front portion of first circuit layer and the front portion of the second insulating barrier stretch out described first
The front end of edge layer；First circuit layer is made up of multiple bus, and the front portion of multiple bus is equidistantly parallel to be arranged, upper
Surface carries out gold-plated or turmeric composition metal layer, and the bus is anterior and metal level composition metal refers to.
The invention has the beneficial effects as follows：First insulating barrier and the second insulating barrier the first circuit layer is insulated and protection at
Reason；First insulating barrier, the first circuit layer and the second insulating barrier can realize high-density wiring, light, thin, are easily bent, are applied to
Being increasingly miniaturized of electronic product, lightening, flexible space utilization；Metal level can increase conductive intensities, and increase electricity
Road hardness；Multiple interfaces can also be realized and deposited, and grafting carried out with mainboard, grafting is easier than welding, and interface is not destroyed,
Using more convenient, save time, can reuse.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, N number of 3rd insulating barrier is set, each the 3rd insulation between first insulating barrier and the first circuit layer
The upper side of layer is provided with the second circuit layer being made up of multiple bus；Multiple bus on the second circuit layer to
Under through N number of 3rd insulating barrier it is corresponding with the multiple bus on the first circuit layer connection；Second insulating barrier and first electric
N number of 4th insulating barrier is set between the floor of road, and the downside of each the 4th insulating barrier is provided with what is be made up of multiple bus
Tertiary circuit layer, the multiple bus on the tertiary circuit layer are upward through on N number of 4th insulating barrier and the first circuit layer
Multiple bus connections；Wherein N >=0.
Using the beneficial effect of further scheme：First insulating barrier and the first circuit layer, the 3rd insulating barrier, second circuit
Layer, the 4th insulating barrier, tertiary circuit layer and the second insulating barrier can realize high-density wiring, light, thin, are easily bent, are applied to
Being increasingly miniaturized of electronic product, lightening, flexible space utilization.
Further, by gold, nickel, copper, stannum are silver-colored for the bus on the first circuit layer, second circuit layer and tertiary circuit layer,
Aluminum or Graphene are made.
Using the beneficial effect of further scheme：Gold, nickel, copper, stannum are silver-colored, and aluminum or graphene conductive performance are strong.
Further, first is provided with each bus on each described 3rd insulating barrier correspondence second circuit layer
Via, multiple bus that the multiple bus on second circuit layer are each passed through on the first via of correspondence and the first circuit layer connect
Connect, on each described 4th insulating barrier correspondence tertiary circuit layer, at each bus, be provided with the second via, the 3rd is electric
Multiple bus on the floor of road are each passed through the second via of correspondence and are connected with the multiple bus on the first circuit layer；Described first
Gold-plated or turmeric is carried out in the hole of via and the second via.
Using the beneficial effect of further scheme：First via and the second via are easy to the first circuit layer electric with second respectively
Road floor and the connection of tertiary circuit floor, it is possible to achieve high-density wiring.
Further, the spacing on first circuit layer between two neighboring bus front end be PIN away from for 0.3mm~
1.0mm。
Using the beneficial effect of further scheme：Away from diminishing, unit length can accommodate more PIN numbers to Pin, convenient pre-
Multiple interfaces MCU, RGB, SPI, MIPI, LVDS, IIC, USB are stayed, while touch screen interface can also be integrated, backlight interface.
Further, first insulating barrier and the second insulating barrier are PI materials or PET material.
Using the beneficial effect of further scheme：PI materials or PET material insulating properties are strong.
Further, the downside of second insulating barrier is provided with stiffening plate, and the stiffening plate correspondence is in the metal
The lower section of finger.
Using the beneficial effect of further scheme：Stiffening plate can strengthen the intensity of this device.
Further, the first insulating barrier, second circuit layer, the 3rd insulating barrier, the first circuit layer, the 4th insulating barrier, the 3rd electric
Road floor, the second insulating barrier and stiffening plate pass sequentially through hot-setting adhesive and hot pressing laminating.
Using the beneficial effect of further scheme：Hot-setting adhesive and hot pressing can strengthen the first insulating barrier, second circuit layer, the 3rd
Insulating barrier, the first circuit layer, the 4th insulating barrier, the bonding strength between tertiary circuit layer, the second insulating barrier and stiffening plate.
Another technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of touch screen, including FPC union joints.
The invention has the beneficial effects as follows：FPC union joints can directly be inserted into the connection of wiring board without being welded on mainboard
In device, realize that touch screen mainboard is connected, obtain electric energy and signal.
Another technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of liquid crystal display screen, including FPC union joints.
The invention has the beneficial effects as follows：FPC union joints can directly be inserted into the connection of wiring board without being welded on mainboard
In device, realize that liquid crystal display screen mainboard is connected, obtain electric energy and signal.
Description of the drawings
Fig. 1 is that a kind of structure of FPC union joints of the invention splits schematic diagram；
Fig. 2 is the front view between multiple bus and metal level；
Fig. 3 is a kind of front view of FPC union joints of the invention.
In accompanying drawing, the list of parts representated by each label is as follows：
1st, the first insulating barrier, the 2, first circuit layer, the 3, second insulating barrier, 4, metal level, the 5, the 3rd insulating barrier, the 6, the 4th is exhausted
Edge layer, 7, second circuit layer, 8, tertiary circuit layer, the 9, first via, the 10, second via, 11, stiffening plate.
Specific embodiment
The principle and feature of the present invention are described below in conjunction with accompanying drawing, example is served only for explaining the present invention, and
It is non-for limiting the scope of the present invention.
As shown in Figure 1 to Figure 3, a kind of FPC union joints, including the first insulating barrier 1, the first circuit layer 2 and the second insulating barrier
3, first circuit layer 2 is placed in the downside of first insulating barrier 1, and second insulating barrier 3 is placed in the first circuit layer 2
The front end of first insulating barrier 1 is stretched out in the front portion of downside, the front portion of first circuit layer 2 and the second insulating barrier 3；Institute
State the first circuit layer 2 to be made up of multiple bus, the front portion of multiple bus is equidistantly parallel to be arranged, and carries out in upper surface gold-plated
Or turmeric composition metal layer 4, the bus is anterior and 4 composition metal of metal level refers to；
3 pairs of the first circuit layers 2 of first insulating barrier 1 and the second insulating barrier are insulated and protection is processed；First insulating barrier 1,
First circuit layer 2 and the second insulating barrier 3 can realize high-density wiring, light, thin, are easily bent, are applied to electronic product not
Disconnected miniaturization, lightening, flexible space utilization；Metal level 4 can increase conductive intensities, and increase circuit hardness；May be used also
To realize multiple interfaces and deposit, and grafting is being carried out with mainboard, grafting is easier than welding, and interface is not destroyed, and uses and is more convenient,
Save time, can reuse.
In above-described embodiment, N number of 3rd insulating barrier 5 is set between first insulating barrier 1 and the first circuit layer 2, it is each
The upper side of individual 3rd insulating barrier 5 is provided with the second circuit layer 7 being made up of multiple bus；On the second circuit layer 7
Multiple bus be passed down through N number of 3rd insulating barrier 5 it is corresponding with the multiple bus on the first circuit layer 2 connection；Described
N number of 4th insulating barrier 6 is set between two insulating barriers 3 and the first circuit layer 2, and the downside of each the 4th insulating barrier 6 is respectively provided with
There is the tertiary circuit layer 8 being made up of multiple bus, the multiple bus on the tertiary circuit layer 8 are upward through the N number of 4th
Insulating barrier 6 is connected with the multiple bus on the first circuit layer 2；Wherein N >=0.
First insulating barrier 1 and the first circuit layer 2, the 3rd insulating barrier 5, second circuit layer 7, the 4th insulating barrier 6, tertiary circuit
Layer 8 and the second insulating barrier 3 can realize high-density wiring, light, thin, be easily bent, be applied to being increasingly miniaturized of electronic product,
Lightening, flexible space utilization.
In above-described embodiment, the bus on the first circuit layer 2, second circuit layer 7 and tertiary circuit layer 8 by gold, nickel,
Copper, stannum, silver, aluminum or Graphene are made；Gold, nickel, copper, stannum are silver-colored, and aluminum or graphene conductive performance are strong.
In above-described embodiment, it is all provided with each bus on each 5 corresponding second circuit layer 7 of the 3rd insulating barrier
The first via 9 is equipped with, the multiple bus on second circuit layer 7 are each passed through on the first via 9 of correspondence and the first circuit layer 2
The connection of multiple bus, is provided with the at each bus on each 6 corresponding tertiary circuit layer 8 of the 4th insulating barrier
Two vias 10, the multiple bus on tertiary circuit layer 8 are each passed through multiple on correspondence the second via 10 and the first circuit layer 2
Bus connects；Gold-plated or turmeric is carried out in the hole of first via 9 and the second via 10；
First via 9 and the second via 10 are easy to the first circuit layer 2 to connect with second circuit layer 7 and tertiary circuit layer 8 respectively
Connect, it is possible to achieve high-density wiring；Gold-plated or turmeric connective stability is carried out in hole.
In above-described embodiment, the spacing on first circuit layer 2 between two neighboring bus is 0.3mm~1.0mm；
Away from diminishing, unit length can accommodate more PIN numbers to Pin, conveniently reserved multiple interfaces MCU, RGB, SPI, MIPI, LVDS,
IIC, USB, while touch screen interface can also be integrated, backlight interface.
In above-described embodiment, first insulating barrier 1 and the second insulating barrier 3 are PI materials or PET material, PI or
PET insulating properties are strong.
In above-described embodiment, the downside of second insulating barrier 3 is provided with stiffening plate 11,11 corresponding position of the stiffening plate
In the lower section of the metal finger.
In above-described embodiment, the first insulating barrier 1, second circuit layer 7, the 3rd insulating barrier 5, the first circuit layer the 2, the 4th insulate
Layer 6, tertiary circuit layer 8, the second insulating barrier 3 and stiffening plate 11 pass sequentially through hot pressing laminating；It is exhausted that hot-setting adhesive hot pressing can strengthen first
Edge layer 1, second circuit layer 7, the 3rd insulating barrier 5, the first circuit layer 2, the 4th insulating barrier 6, tertiary circuit layer 8, the second insulating barrier 3
And the bonding strength between stiffening plate 11.
Embodiment 2：
A kind of touch screen, including FPC union joints；FPC union joints can directly be inserted into wiring board without being welded on mainboard
Adapter in, realize that touch screen mainboard is connected, obtain electric energy and signal.
Embodiment 3：
A kind of liquid crystal display screen, including FPC union joints；FPC union joints can directly be inserted into wiring board without being welded on mainboard
Adapter in, realize that liquid crystal display screen mainboard is connected, obtain electric energy and signal.
The foregoing is only presently preferred embodiments of the present invention, not to limit the present invention, all spirit in the present invention and
Within principle, any modification, equivalent substitution and improvements made etc. should be included within the scope of the present invention.
Claims (10)
1. a kind of FPC union joints, it is characterised in that：Including the first insulating barrier (1), the first circuit layer (2) and the second insulating barrier
(3), first circuit layer (2) is placed in the downside of first insulating barrier (1), and second insulating barrier (3) is placed in first
The downside of circuit layer (2), the front portion of first circuit layer (2) and the front portion of the second insulating barrier (3) stretch out described first
The front end of insulating barrier (1)；First circuit layer (2) is made up of multiple bus, and the front portion of multiple bus is equidistantly parallel
Arrangement, carries out gold-plated or turmeric composition metal layer (4), the bus front portion and metal level (4) composition metal in upper surface
Refer to.
2. a kind of FPC union joints according to claim 1, it is characterised in that：First insulating barrier (1) and the first circuit layer
(2) N number of 3rd insulating barrier (5) is set between, and the upper side of each the 3rd insulating barrier (5) is provided with by multiple bus structures
Into second circuit layer (7)；Multiple bus on the second circuit layer (7) are passed down through N number of 3rd insulating barrier (5) and the
Multiple bus correspondences on one circuit layer (2) connect；Arrange N number of between second insulating barrier (3) and the first circuit layer (2)
4th insulating barrier (6), the downside of each the 4th insulating barrier (6) are provided with the tertiary circuit layer being made up of multiple bus
(8), the multiple bus on the tertiary circuit layer (8) are upward through on N number of 4th insulating barrier (6) and the first circuit layer (2)
The connection of multiple bus；Wherein N >=0.
3. a kind of FPC union joints according to claim 2, it is characterised in that：First circuit layer (2), second circuit layer (7) and
Bus on tertiary circuit layer (8) is made by gold, nickel, copper, stannum, silver, aluminum or Graphene.
4. a kind of FPC union joints according to claim 2, it is characterised in that：Each described 3rd insulating barrier (5) correspondence the
The first via (9), the multiple bus on second circuit layer (7) point are provided with two circuit layers (7) at each bus
The first via (9) Chuan Guo not be corresponded to be connected with the multiple bus on the first circuit layer (2), each described 4th insulating barrier
(6) the second via (10) is provided with each bus in correspondence tertiary circuit layer (8), it is many on tertiary circuit layer (8)
Individual bus is each passed through the second via of correspondence (10) and is connected with the multiple bus on the first circuit layer (2)；First mistake
Gold-plated or turmeric is carried out in the hole of hole (9) and the second via (10).
5. a kind of FPC union joints according to claim 1, it is characterised in that：It is two neighboring on first circuit layer (2) to lead
PIN between electric bar is away from for 0.3mm~1.0mm.
6. a kind of FPC union joints according to claim 1, it is characterised in that：First insulating barrier (1) and the second insulating barrier
(3) PI or PET material are.
7. a kind of FPC union joints according to any one of claim 1 to 6, it is characterised in that：Second insulating barrier (3)
Downside is provided with stiffening plate (11), lower section of stiffening plate (11) correspondence in the metal finger.
8. a kind of FPC union joints according to claim 7, it is characterised in that：First insulating barrier (1), second circuit layer (7),
3rd insulating barrier (5), the first circuit layer (2), the 4th insulating barrier (6), tertiary circuit layer (8), the second insulating barrier (3) and stiffening plate
(11) pass sequentially through hot-setting adhesive to fit with hot pressing.
9. a kind of touch screen, it is characterised in that：Including the FPC union joints described in any one of claim 1 to 8.
10. a kind of liquid crystal display screen, it is characterised in that：Including the FPC union joints described in any one of claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710108431.3A CN106686884A (en) | 2017-02-27 | 2017-02-27 | FPC connecting head, touch screen and liquid crystal screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710108431.3A CN106686884A (en) | 2017-02-27 | 2017-02-27 | FPC connecting head, touch screen and liquid crystal screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106686884A true CN106686884A (en) | 2017-05-17 |
Family
ID=58862429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710108431.3A Pending CN106686884A (en) | 2017-02-27 | 2017-02-27 | FPC connecting head, touch screen and liquid crystal screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106686884A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107881546A (en) * | 2017-10-20 | 2018-04-06 | 江西鑫力华数码科技有限公司 | A kind of electro-plating method of FPC |
| WO2018153383A1 (en) * | 2017-02-27 | 2018-08-30 | 深圳市柯达科电子科技有限公司 | Fpc connector, touch screen and liquid crystal screen |
| EP3993569A1 (en) * | 2020-10-28 | 2022-05-04 | Shenzhen Startek Electronic | Flexible printed circuit, fpc, connecting head |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480837A (en) * | 2010-11-30 | 2012-05-30 | 山一电机股份有限公司 | Flexible circuit board |
| CN103577017A (en) * | 2012-08-07 | 2014-02-12 | 株式会社日本显示器 | Display device with touch sensor, and electronic apparatus |
| WO2016047492A1 (en) * | 2014-09-22 | 2016-03-31 | 株式会社フジクラ | Printed wiring board |
| CN206442588U (en) * | 2017-02-27 | 2017-08-25 | 深圳市柯达科电子科技有限公司 | A kind of FPC connectors, touch-screen and liquid crystal display |
-
2017
- 2017-02-27 CN CN201710108431.3A patent/CN106686884A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480837A (en) * | 2010-11-30 | 2012-05-30 | 山一电机股份有限公司 | Flexible circuit board |
| CN103577017A (en) * | 2012-08-07 | 2014-02-12 | 株式会社日本显示器 | Display device with touch sensor, and electronic apparatus |
| WO2016047492A1 (en) * | 2014-09-22 | 2016-03-31 | 株式会社フジクラ | Printed wiring board |
| CN206442588U (en) * | 2017-02-27 | 2017-08-25 | 深圳市柯达科电子科技有限公司 | A kind of FPC connectors, touch-screen and liquid crystal display |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018153383A1 (en) * | 2017-02-27 | 2018-08-30 | 深圳市柯达科电子科技有限公司 | Fpc connector, touch screen and liquid crystal screen |
| US10886652B2 (en) | 2017-02-27 | 2021-01-05 | Shenzhen Startek Electronic Technology Co., Ltd. | FPC connector, touch-sensitive screen and LCD screen |
| CN107881546A (en) * | 2017-10-20 | 2018-04-06 | 江西鑫力华数码科技有限公司 | A kind of electro-plating method of FPC |
| CN107881546B (en) * | 2017-10-20 | 2019-06-14 | 江西鑫力华数码科技有限公司 | A kind of electro-plating method of flexible circuit board |
| EP3993569A1 (en) * | 2020-10-28 | 2022-05-04 | Shenzhen Startek Electronic | Flexible printed circuit, fpc, connecting head |
| JP2023503773A (en) * | 2020-10-28 | 2023-02-01 | 深▲せん▼市柯達科電子科技有限公司 | FPC connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206442588U (en) | A kind of FPC connectors, touch-screen and liquid crystal display | |
| CN106686884A (en) | FPC connecting head, touch screen and liquid crystal screen | |
| CN106293210A (en) | A kind of touch base plate and preparation method thereof, contact panel, touch control display apparatus | |
| CN108304086A (en) | Touch control display apparatus | |
| CN103279240A (en) | Touch panel | |
| CN106096596B (en) | Fingerprint module, fingerprint module preparation method and mobile terminal | |
| CN103713794A (en) | Narrow frame one-chip type capacitor inducting touch screen and manufacturing method thereof | |
| CN103295670A (en) | Transparent conducting film | |
| CN110825268A (en) | Touch module, touch display device and electronic equipment | |
| CN102543894A (en) | Electrical connection pad structure and integrated circuit comprising a plurality of electrical connection pad structures | |
| CN201234406Y (en) | Flexible printed circuit board | |
| CN106775120A (en) | A kind of contact panel and touch control display apparatus | |
| CN204721708U (en) | A kind of two-layer printed circuit board of resistance to bending | |
| CN1573802A (en) | Transparent touch panel | |
| CN202009534U (en) | Reinforced structure for preventing break of flexible circuit board | |
| US11307706B2 (en) | FPC connector, touch-sensitive screen and display device | |
| CN106484165A (en) | Contact panel and its manufacture method | |
| CN105578723B (en) | A kind of flexible PCB and mobile terminal | |
| TWI331696B (en) | ||
| CN202679795U (en) | Flexible printed circuit board and electronic component adopting same | |
| CN103677367B (en) | Contact panel | |
| CN204990237U (en) | Touch panel | |
| CN102170753A (en) | Circuit board pin structure | |
| WO2020232690A1 (en) | Pin structure and flexible panel | |
| CN104676377B (en) | Liquid crystal display device and its backlight module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170517 |
|
| RJ01 | Rejection of invention patent application after publication |