CN106684058B - Chip heat radiation structure of intelligent toilet lid - Google Patents
Chip heat radiation structure of intelligent toilet lid Download PDFInfo
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- CN106684058B CN106684058B CN201710051895.5A CN201710051895A CN106684058B CN 106684058 B CN106684058 B CN 106684058B CN 201710051895 A CN201710051895 A CN 201710051895A CN 106684058 B CN106684058 B CN 106684058B
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- heat conduction
- heat
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- controlled rectifier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
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- E—FIXED CONSTRUCTIONS
- E03—WATER SUPPLY; SEWERAGE
- E03D—WATER-CLOSETS OR URINALS WITH FLUSHING DEVICES; FLUSHING VALVES THEREFOR
- E03D9/00—Sanitary or other accessories for lavatories ; Devices for cleaning or disinfecting the toilet room or the toilet bowl; Devices for eliminating smells
- E03D9/08—Devices in the bowl producing upwardly-directed sprays; Modifications of the bowl for use with such devices ; Bidets; Combinations of bowls with urinals or bidets; Hot-air or other devices mounted in or on the bowl, urinal or bidet for cleaning or disinfecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Water Supply & Treatment (AREA)
- Molecular Biology (AREA)
- Hydrology & Water Resources (AREA)
- Life Sciences & Earth Sciences (AREA)
- Epidemiology (AREA)
- Toilet Supplies (AREA)
Abstract
The invention provides a chip heat dissipation structure of an intelligent toilet cover, and belongs to the technical field of intelligent toilets. The cooling device solves the problem of how to effectively dredge and cool heat generated by the chip and assist in cold water heating. This intelligence toilet lid is provided with heating system and chip in, and the chip includes the silicon controlled rectifier, and this chip heat radiation structure is including adopting the heat conduction seat that heat conduction material made, and one side surface of silicon controlled rectifier is the heat dissipation face, and the silicon controlled rectifier is fixed on the heat conduction seat and the heat dissipation face is contacted with the heat conduction seat and is leaned on, has tubular heat conduction body on the heat conduction seat, and the both ends of heat conduction body have water inlet and delivery port respectively, and the delivery port links to each other with heating system's water inlet. Through arranging the chip, designing the heat conduction seat with a special structure for the chip, and arranging the heat conduction seat on a water path of a heating system, the problem that the heat dissipation of the silicon controlled rectifier is slow is solved, so that the silicon controlled rectifier can be effectively cooled and the waste heat can be secondarily utilized, and the purpose of energy conservation is achieved.
Description
Technical Field
The invention belongs to the technical field of intelligent toilets, and relates to a chip heat dissipation structure of an intelligent toilet cover.
Background
Along with the continuous improvement of the living standard of people and the progress of science and technology, the importance of people on the living quality is gradually improved, and the intelligent sanitary appliance slowly goes into more and more families. The intelligent closestool is used as a typical representative in places such as families, high-grade hotels and the like with the characteristics of health, comfort, cleanness, sanitation and the like, and has higher popularization rate.
The intelligent closestool is rich in functions: such as cleaning buttocks, cleaning lower body, moving cleaning, heat preservation of seat ring, warm air drying, automatic deodorization, silence sitting and the like. Most conveniently, besides the operation through the button panel, a remote control device is specially arranged to realize the functions, and when a consumer uses the remote control device, all the functions can be easily realized by only holding the remote control device and lightly pressing the remote control device. Such as chinese patent [ application number: 201520869878.9; authorized bulletin number: CN205197894U discloses an intelligent toilet lid; the control panel is arranged at one side of the toilet seat; the control panel internally mounted has the control circuit board, be equipped with the CPU chip on the control circuit board, be equipped with simultaneously with it through printed circuit connected temperature detection circuit, spray lance gondola water faucet step motor control circuit, super warm water level detection circuit, human induction circuit, switching power supply circuit and water pump control circuit.
However, because the function realization of the intelligent closestool is carried out by the control circuit board and the CPU chip in the intelligent closestool cover, the intelligent closestool in the prior art does not have a heat dissipation structure specially aiming at the control circuit board and the CPU chip, so that the CPU chip and the control circuit board are easy to have the problem of overhigh heat in the use process, thereby influencing the service life of the CPU chip and the control circuit board and even causing burning out due to overhigh temperature.
Disclosure of Invention
The invention aims at solving the problems in the prior art, and provides a chip heat dissipation structure of an intelligent toilet cover.
The aim of the invention can be achieved by the following technical scheme: the utility model provides a chip heat radiation structure of intelligence toilet lid, be provided with heating system and the chip that is used for heating cold water in the intelligence toilet lid, the chip includes the silicon controlled rectifier, the chip heat radiation structure is including adopting the heat conduction seat that heat conduction material made, a side surface of silicon controlled rectifier is the heat dissipation face, the silicon controlled rectifier is fixed on the heat conduction seat and the heat dissipation face contacts with the heat conduction seat and leans on, its characterized in that, have tubular heat conduction body on the heat conduction seat, the both ends of heat conduction body have water inlet and delivery port respectively, the delivery port links to each other with heating system's inlet end.
The principle of the chip heat radiation structure of the intelligent toilet cover is that a heat conduction seat is designed, a silicon controlled rectifier in the chip is fixed on the heat conduction seat, when the chip works, the silicon controlled rectifier generates heat, and as the heat conduction seat is made of a heat conduction material and the heat radiation surface of the silicon controlled rectifier is contacted and abutted with the heat conduction seat, the heat generated by the silicon controlled rectifier can be quickly and effectively transferred to the heat conduction seat; meanwhile, the heat conducting pipe body is designed on the heat conducting seat, the water outlet of the heat conducting pipe body is communicated with the water inlet end of the heating system, and then cold water is introduced into the water inlet of the heat conducting pipe body, so that cold water flows in the heat conducting pipe body, the heat conducting seat can be cooled by flowing cold water, that is, heat generated by heating of the silicon controlled rectifier is transmitted through the heat conducting seat and finally absorbed and taken away by the cold water, so that heat generated by the silicon controlled rectifier in a chip can be effectively dredged and dissipated, the silicon controlled rectifier can be rapidly cooled, and the service life of the silicon controlled rectifier is prolonged; in the heat dissipation process, the heat emitted by the silicon controlled rectifier is absorbed and taken away by the cold water, which is equivalent to the auxiliary heating of the cold water by the heat emitted by the silicon controlled rectifier, namely, the heat emitted by the silicon controlled rectifier is finally recycled, so that the energy source for heating the cold water by the heating system is saved; therefore, through the special heat conduction seat designed above, and the heat conduction seat is arranged on the water path of the heating system, the problem that the heat dissipation of the silicon controlled rectifier is slow is solved, the silicon controlled rectifier can be effectively cooled, waste heat is secondarily utilized, and the purpose of saving energy is achieved. In addition, the above heating system is disclosed in chinese patent application No. 201210402520.6.
Preferably, in the chip heat dissipation structure of an intelligent toilet lid, the heat conduction seat includes a heat conduction pipe body and a plate-shaped connection heat conduction part located on an outer wall of the heat conduction pipe body, a heat conduction plane with an area larger than that of the heat dissipation surface is arranged on the connection heat conduction part, and the silicon controlled rectifier is fixedly connected to the connection heat conduction part and the heat dissipation surface contacts and leans against the heat conduction plane. Because the controllable silicon is a regular geometric body, the heat conduction plane with larger area than the heat dissipation surface is designed on the connecting heat conduction part by designing the platy connecting heat conduction part, so that the heat dissipation surface on the controllable silicon can be better contacted and matched with the heat conduction seat, the heat generated by the controllable silicon is more effectively transferred, the heat dissipation efficiency of the controllable silicon is further improved, and the heat emitted by the chip during working is effectively conducted and cooled; meanwhile, the higher the heat transfer efficiency of the heat conduction seat is, the more heat is recovered, so that cold water can be heated better, and the aim of saving energy is achieved better.
Preferably, in the chip heat dissipation structure of an intelligent toilet lid, the cross section of the connection heat conduction portion is L-shaped, the heat conduction plane is located on the connection heat conduction portion, the connection heat conduction portion is further provided with a fixing surface, and the shell of the chip is close to the heat conduction tube and is fixed on the fixing surface through screws. Through designing the connection heat conduction part into the shape, be favorable to improving heat transfer efficiency for silicon controlled rectifier and casing all can obtain quick cooling, thereby dredge the cooling to the heat that the chip produced more effectively.
In the chip heat dissipation structure of the intelligent toilet cover, the silicon controlled rectifier is tightly fixed on the heat conduction plane through the heat conduction bolt and enables the heat dissipation surface to be tightly attached to the heat conduction plane. The heat conducting bolt can play a role in conducting and transferring heat, so that the heat generated by the silicon controlled rectifier can be transferred to the heat conducting seat more effectively, and the heat generated by the silicon controlled rectifier can be conducted and cooled more effectively; meanwhile, the heat conducting bolt can enable the contact between the silicon controlled rectifier and the heat conducting seat to be more compact, and is beneficial to heat transfer and dredging.
In the above-mentioned intelligent toilet lid's chip heat radiation structure, the silicon controlled rectifier includes the radiating portion of body and protrusion body, heat conduction bolt passes the radiating portion and makes radiating portion and body all closely contact with the heat conduction plane and lean on. Through the design of above radiating portion, can further increase the heat dissipation area of contact of silicon controlled rectifier and heat conduction seat to be favorable to improving the efficiency that the silicon controlled rectifier will heat transfer to the heat conduction seat, make the silicon controlled rectifier can obtain cooling more effectively fast.
In the chip heat dissipation structure of the intelligent toilet cover, the two ends of the heat conduction bolt are respectively provided with the heat conduction gaskets. The design of the heat conduction gasket can improve the contact area of the heat conduction bolt, the heat conduction seat and the silicon controlled rectifier, so that the efficiency of the silicon controlled rectifier for transferring heat to the heat conduction seat is improved, and the silicon controlled rectifier can be cooled more quickly and effectively.
In the chip heat dissipation structure of the intelligent toilet cover, the length of the heat conduction pipe body is larger than the width of the connection heat conduction part. By adopting the design, the heat transferred to the connecting heat conducting part by the silicon controlled rectifier can be absorbed by cold water in the heat conducting pipe body more quickly, so that the silicon controlled rectifier can be cooled more quickly and effectively.
In the chip heat dissipation structure of the intelligent toilet cover, the heat conduction material is copper, aluminum or stainless steel. The heat conductive material may preferably be a copper material having excellent heat conductivity and easy to manufacture and process.
Compared with the prior art, the chip heat radiation structure of the intelligent toilet cover has the following advantages: this intelligence toilet lid is through arranging the chip to for the heat conduction seat of special structure has been designed to the chip, and arranges the heat conduction seat on heating system's water road, has not only solved the slow problem of silicon controlled rectifier heat dissipation, makes the silicon controlled rectifier carry out the reutilization to waste heat when can obtaining effective cooling, reaches the purpose of energy saving.
Drawings
Fig. 1 is a schematic diagram of the arrangement of the heat dissipation structure of the chip in the intelligent toilet cover.
Fig. 2 is a second schematic layout diagram of the heat dissipation structure of the chip in the intelligent toilet lid.
Fig. 3 is an assembly schematic diagram of the heat dissipation structure of the chip.
Fig. 4 is an exploded view of the heat dissipation structure of the present chip.
Fig. 5 is a schematic cross-sectional view of the heat dissipation structure of the chip.
Fig. 6 is a schematic structural diagram of a heat conducting base in the heat dissipation structure of the chip.
Fig. 7 is a schematic diagram of the structure of the thyristor in the chip.
In the figure, 1, a flow control pressure reducing device; 1a, a water outlet end; 2. a heating system; 2a, a water inlet end; 3. a chip; 31. a housing; 32. a silicon controlled rectifier; 321. a body; 322. a heat dissipation part; 32a, a radiating surface; 33. a circuit board; 4. a heat conduction seat; 41. a heat conduction pipe body; 41a, a water inlet; 41b, a water outlet; 42. connecting the heat conduction part; 42a, a heat conduction plane; 42b, a fixed surface; 5. a screw; 6. a heat conducting bolt; 7. a thermally conductive gasket.
Detailed Description
The following are specific embodiments of the present invention and the technical solutions of the present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
Specifically, as shown in fig. 1 and 2, a flow control pressure reducing device 1, a heating system 2 for heating cold water and a chip 3 are arranged in the intelligent toilet cover. The above-mentioned flow control pressure reducing device is disclosed in chinese patent application No. 201610571439.9; as shown in fig. 3, the heat dissipation structure of the chip includes a heat conduction seat 4 made of a heat conduction material, wherein the heat conduction material is copper, aluminum or stainless steel, and the heat conduction seat 4 is preferably made of copper. As shown in fig. 6, the heat conduction seat 4 includes a heat conduction pipe 41 and a plate-shaped connection heat conduction portion 42 having an L-shaped cross section and located on an outer wall of the heat conduction pipe 41. The length of the heat conductive pipe 41 is greater than the width of the connection heat conductive part 42. The two ends of the heat-conducting pipe body 41 are respectively provided with a water inlet 41a and a water outlet 41b, the water inlet 41a is connected with the water outlet end 1a of the flow control pressure reducing device 1, and the water outlet 41b is connected with the water inlet end 2a of the heating system 2.
As shown in fig. 3, 4 and 5, the chip 3 includes a housing 31 and a thyristor 32 located within the housing 31. A circuit board 33 is mounted in the housing 31, and pins of the silicon controlled rectifier 32 are soldered to the circuit board 33. One side surface of the silicon controlled rectifier 32 is a heat radiating surface 32a, the connecting heat conducting part 42 is provided with a heat conducting plane 42a with an area larger than that of the heat radiating surface 32a, the silicon controlled rectifier 32 is fixedly connected to the connecting heat conducting part 42, and the heat radiating surface 32a contacts and abuts against the heat conducting plane 42 a. The connecting heat conducting part 42 is also provided with a fixing surface 42b, and the shell 31 of the chip 3 is close to the heat conducting pipe 41 and is fixed on the fixing surface 42b through the screw 5. The silicon controlled rectifier 32 is pressed and fixed on the heat conduction plane 42a through the heat conduction bolt 6, and the heat dissipation surface 32a is tightly attached to the heat conduction plane 42 a. Preferably, the heat conducting gaskets 7 are respectively arranged at two ends of the heat conducting bolt 6.
More specifically, as shown in fig. 7, the silicon controlled rectifier 32 includes a body 321 and a heat dissipation portion 322 protruding from the body 321, and the heat conduction bolt 6 passes through the heat dissipation portion 322 and brings both the heat dissipation portion 322 and the body 321 into close contact with the heat conduction plane 42 a.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Although terms of the flow control pressure reducing device 1, the water outlet end 1a, the heating system 2, the water inlet end 2a, the chip 3, the housing 31, the silicon controlled rectifier 32, the body 321, the heat radiating portion 322, the heat radiating surface 32a, the circuit board 33, the heat conducting base 4, the heat conducting pipe body 41, the water inlet 41a, the water outlet 41b, the connection heat conducting portion 42, the heat conducting plane 42a, the fixing surface 42b, the screw 5, the heat conducting bolt 6, the heat conducting spacer 7, etc. are used herein more, the possibility of using other terms is not excluded. These terms are used merely for convenience in describing and explaining the nature of the invention; they are to be interpreted as any additional limitation that is not inconsistent with the spirit of the present invention.
Claims (8)
1. The utility model provides a chip heat radiation structure of intelligence toilet lid, be provided with heating system (2) and chip (3) that are used for heating cold water in the intelligence toilet lid, chip (3) are including silicon controlled rectifier (32), chip heat radiation structure is including adopting heat conduction seat (4) that heat conduction material made, one side surface of silicon controlled rectifier (32) is heat dissipation face (32 a), silicon controlled rectifier (32) are fixed on heat conduction seat (4) and heat dissipation face (32 a) are contacted with heat conduction seat (4) and are leaned on, a serial communication port, have tubular heat conduction body (41) on heat conduction seat (4), the both ends of heat conduction body (41) have water inlet (41 a) and delivery port (41 b) respectively, delivery port (41 b) link to each other with inlet end (2 a) of heating system (2).
2. The chip heat dissipation structure of an intelligent toilet lid according to claim 1, wherein the heat conduction seat (4) comprises a heat conduction pipe body (41) and a plate-shaped connection heat conduction part (42) located on the outer wall of the heat conduction pipe body (41), the connection heat conduction part (42) is provided with a heat conduction plane (42 a) with an area larger than that of the heat dissipation surface (32 a), and the silicon controlled rectifier (32) is fixedly connected to the connection heat conduction part (42) and the heat dissipation surface (32 a) contacts and leans against the heat conduction plane (42 a).
3. The chip heat dissipation structure of an intelligent toilet lid according to claim 2, wherein the cross section of the connection heat conduction portion (42) is L-shaped, the heat conduction plane (42 a) is located on the connection heat conduction portion (42), the connection heat conduction portion (42) is further provided with a fixing surface (42 b), and the shell (31) of the chip (3) is close to the heat conduction body (41) and is fixed on the fixing surface (42 b) through a screw (5).
4. A chip heat dissipation structure of an intelligent toilet lid according to claim 2 or 3, wherein the silicon controlled rectifier (32) is fixed on the heat conduction plane (42 a) by pressing through the heat conduction bolt (6) and the heat dissipation plane (32 a) is tightly attached to the heat conduction plane (42 a).
5. The chip heat dissipation structure of an intelligent toilet lid according to claim 4, wherein the silicon controlled rectifier (32) comprises a body (321) and a heat dissipation part (322) protruding out of the body (321), and the heat conduction bolt (6) penetrates through the heat dissipation part (322) and enables the heat dissipation part (322) and the body (321) to be in close contact with the heat conduction plane (42 a).
6. The chip heat dissipation structure of an intelligent toilet lid according to claim 4, wherein the two ends of the heat conduction bolt (6) are respectively provided with a heat conduction pad (7).
7. A chip heat dissipation structure of a smart toilet lid according to claim 2 or 3, characterized in that the length of the heat conductive pipe body (41) is greater than the width of the connection heat conductive part (42).
8. A chip heat dissipation structure for a smart toilet lid as claimed in claim 1, 2 or 3, wherein the heat conductive material is copper, aluminum or stainless steel.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710051895.5A CN106684058B (en) | 2017-01-21 | 2017-01-21 | Chip heat radiation structure of intelligent toilet lid |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710051895.5A CN106684058B (en) | 2017-01-21 | 2017-01-21 | Chip heat radiation structure of intelligent toilet lid |
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| CN106684058A CN106684058A (en) | 2017-05-17 |
| CN106684058B true CN106684058B (en) | 2023-06-13 |
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| CN201710051895.5A Active CN106684058B (en) | 2017-01-21 | 2017-01-21 | Chip heat radiation structure of intelligent toilet lid |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107574895A (en) * | 2017-09-08 | 2018-01-12 | 宁波米迪电器有限公司 | Intelligent closestool current temperature regulating device, current temperature-controlling system and current temperature control method |
| CN116417319A (en) * | 2021-12-30 | 2023-07-11 | 中微半导体设备(上海)股份有限公司 | Temperature control device and corresponding plasma processor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6226994B1 (en) * | 1997-07-02 | 2001-05-08 | Sel Application Co., Ltd. | Thermoelectric element and thermoelectric cooling or heating device provided with the same |
| JP2001297622A (en) * | 2000-04-14 | 2001-10-26 | Rabo Sufia Kk | Lighting device |
| CN201755723U (en) * | 2009-09-10 | 2011-03-09 | 杭州升程高科技有限公司 | Semiconductor cooling welding machine |
| CN206480613U (en) * | 2017-01-21 | 2017-09-08 | 浙江怡和卫浴有限公司 | A kind of chip cooling structure of Intelligent toilet cover |
-
2017
- 2017-01-21 CN CN201710051895.5A patent/CN106684058B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6226994B1 (en) * | 1997-07-02 | 2001-05-08 | Sel Application Co., Ltd. | Thermoelectric element and thermoelectric cooling or heating device provided with the same |
| JP2001297622A (en) * | 2000-04-14 | 2001-10-26 | Rabo Sufia Kk | Lighting device |
| CN201755723U (en) * | 2009-09-10 | 2011-03-09 | 杭州升程高科技有限公司 | Semiconductor cooling welding machine |
| CN206480613U (en) * | 2017-01-21 | 2017-09-08 | 浙江怡和卫浴有限公司 | A kind of chip cooling structure of Intelligent toilet cover |
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