CN106683978B - Cleaning equipment chip idle pulley structure and application method after CMP - Google Patents
Cleaning equipment chip idle pulley structure and application method after CMP Download PDFInfo
- Publication number
- CN106683978B CN106683978B CN201611207241.9A CN201611207241A CN106683978B CN 106683978 B CN106683978 B CN 106683978B CN 201611207241 A CN201611207241 A CN 201611207241A CN 106683978 B CN106683978 B CN 106683978B
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- China
- Prior art keywords
- lazy
- idle pulley
- combination bearing
- axis
- unit
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Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 17
- 210000004907 gland Anatomy 0.000 claims abstract description 16
- 238000007373 indentation Methods 0.000 claims abstract description 3
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 229910010293 ceramic material Inorganic materials 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims 1
- 238000012360 testing method Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 241000478345 Afer Species 0.000 description 1
- 241001400675 Sympodium Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Tyre Moulding (AREA)
Abstract
Cleaning equipment chip idle pulley structure and application method after a kind of CMP, which includes lazy axle unit, with lazy axle unit is locked in the pressing ring on lazy axle unit in the combined idle pulley unit of socket, by idle pulley unit, and is fastened in the sensor on lazy axle unit.Combination bearing is bonded on the inside of cycle surface and left end of the base mouth on the left of combination bearing in hole axle positioning method indentation pedestal.Gland and the clamping of right end of the base mouth are simultaneously compacted cycle surface on the right side of combination bearing in hole axle mode, and axis body runs through combination bearing in hole axle cooperation on the right side of lazy axis, until the step-like bayonet on lazy axis fits in inner ring end face on the left of combination bearing.Lazy axis right end penetrates in counting scale in hole axle mode, and counting scale right side is locked by retainer and lazy axis right end, and counting scale left port is compacted inner ring end face on the right side of combination bearing.The present invention effectively, accurately can carry out tracking of testing the speed online for the chip idle pulley of cleaning equipment after CMP.
Description
Technical field
The present invention relates to the idle pulley structures and the idle pulley of auxiliary carrying and holding chip in cleaning equipment after a kind of CMP
The application method of structure.
Background technique
CMP (chemical mechanical Polishing) cleaning equipment afterwards is carried out in electronic device wafer surface
After high-precision polishing treatment, the equipment of progress surface accurate cleaning.Cleaning equipment prototype after current visible foreign countries CMP, it is brilliant
Piece is relied on after the transmission of line manipulator is detached from place, is slid into the driven rubber tire card slot of idle pulley unit under its self weight.Because lazy
Axle unit is excessively inclined using the support level of monomer bearing and bearing, and concentricity is poor, causes idle pulley unit to swing larger, thus influences
The accuracy to test the speed.Driven rubber tire card slot entrance is in card slot two sides in wedge angle and clamped end simultaneously, card resistance phenomenon easily occurs.
Summary of the invention
The present invention provides cleaning equipment chip idle pulley structure and application method after a kind of CMP, cleans after solving existing CMP
Equipment chip idle pulley is easy to appear card resistance phenomenon, chip idle pulley swing it is larger, influence test the speed accuracy the technical issues of.
The technical solution adopted by the present invention to solve the technical problems is:
Cleaning equipment chip idle pulley structure after this CMP, including lazy axle unit, with lazy axle unit in the combined idle pulley of socket
Idle pulley unit is locked in the pressing ring on lazy axle unit, and is fastened in the sensor on lazy axle unit by unit；
The lazy axle unit includes pedestal, lazy axis, combination bearing, gland, counting scale, retainer and straight coupling；Described group
Sympodium is held in hole axle positioning method indentation pedestal, is bonded on the inside of cycle surface and left end of the base mouth on the left of combination bearing；It is described
Gland and the clamping of right end of the base mouth are simultaneously compacted cycle surface on the right side of combination bearing in hole axle mode, and straight coupling and gland are in screw thread
Mode screwing hermetic；Axis body runs through combination bearing in hole axle cooperation on the right side of the lazy axis, until the step-like bayonet on lazy axis is bonded
The inner ring end face on the left of the combination bearing, lazy axis right end penetrate in counting scale in hole axle mode, counting scale right side by retainer with it is lazy
The locking of axis right end, counting scale left port are compacted inner ring end face on the right side of combination bearing；
The idle pulley unit includes left chuck, right chuck and the driven glue being held between left chuck and right chuck
Wheel；The left chuck and right chuck are placed on the left of lazy axis on axis body, and are locked by pressing ring；Circumferential direction is provided among the driven rubber tire
Chip card slot, and wafer portal bevelling is had at chip card slot notch, with clamped end face on the inside of driven rubber tire.
The base neck is cased with O-ring.
The right chuck is pressed into left chuck and is fixed by screw and left chuck in hole axle mode.
The sensor is fixed on gland.
The combination bearing is ceramic material.
The application method of cleaning equipment chip idle pulley structure after this CMP, using steps are as follows:
Step 1: connecting gas source, introduces atmosphere through the straight coupling in lazy axle unit；
Step 2: idle pulley unit is in connect chip.
Beneficial effects of the present invention are as follows:
Lazy axle unit of the invention and cabinet to be installed are sealed by O-ring to be fastened, and is done through straight coupling introducing atmosphere airtight
Envelope, lazy axis rotary speed measuring signal are exported through counting scale.Lazy axle unit is cooperated outside support combinations bearing using pedestal and gland or so
End face, step-like bayonet and counting scale left port on lazy axis or so cooperation support combinations bearing inner race end face are enclosed, and passes through meter
Number disk and the centering of lazy axis rotate, and provide stable support for combination bearing, it is ensured that rationally distributed property improves the steady of lazy axis rotation
It is qualitative, it swings idle pulley and reduces, it is more accurate to test the speed.Combination bearing uses ceramic material, its rigidity can be improved.Straight coupling can
Atmosphere is introduced on the inside of gland, so that structure inner chamber be made to form simple and direct reliable hermetic seal.
Idle pulley unit external operating environment of the invention is in spray medium, and idle pulley unit can be used as with afer rotates
Support wheel, the driven rubber tire card slot domatic entrance of chip enter, and can avoid card slot sandwich position, reduce card resistance phenomenon and occur.
The present invention effectively, accurately can carry out tracking of testing the speed online for the chip idle pulley of cleaning equipment after CMP.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is backsight axonometric schematic diagram of the invention.
Fig. 2 is forward sight axonometric schematic diagram of the invention.
Fig. 3 is the schematic cross-sectional view of lazy axle unit.
Fig. 4 is the schematic cross-sectional view of idle pulley unit.
Fig. 5 is the schematic cross-sectional view of driven rubber tire.
Appended drawing reference: the lazy axle unit of 1-, 2- idle pulley unit, 3- sensor, 4- pressing ring, 5- pedestal, 6-O type circle, the lazy axis of 7-,
8- combination bearing, 9- gland, 10- counting scale, 11- retainer, 12- straight coupling, the left chuck of 13-, the right chuck of 14-, the driven glue of 15-
Wheel, 15.1- chip card slot, 15.2- wafer portal bevelling, 15.3- are clamped end face.
Specific embodiment
Embodiment is referring to shown in Fig. 1, Fig. 2, cleaning equipment chip idle pulley structure after this CMP, including lazy axle unit 1, with
Lazy axle unit 1 is in be socketed combined idle pulley unit 2, idle pulley unit 2 is locked in the pressing ring 4 on lazy axle unit 1, and fitting is tight
The sensor 3 being fixed on the gland 9 of lazy axle unit 1.
Shown in Figure 3, the lazy axle unit 1 includes pedestal 5, lazy axis 7, combination bearing 8, gland 9, counting scale 10, lock
Circle 11 and straight coupling 12.5 neck of pedestal is cased with O-ring 6.The combination bearing 8 is ceramic material, and combination bearing 8 is in
Hole axle positioning method is pressed into pedestal 5, is bonded on the inside of 8 left side cycle surface of combination bearing and 5 left port of pedestal.The gland 9
It is compacted 8 right side cycle surface of combination bearing with 5 right output port clamping of pedestal and in hole axle mode, straight coupling 12 and gland 9 are in spiral shell
Line mode screwing hermetic.The 7 right side axis body of lazy axis runs through combination bearing 8 in hole axle cooperation, until the step-like bayonet on lazy axis 7
Fit in 8 left side inner ring end face of combination bearing, lazy 7 right end of axis penetrates in counting scale 10 in hole axle mode, counting scale right side by
Retainer 11 and lazy 7 right end of axis lock, and counting scale left port is compacted 8 right side inner ring end face of combination bearing.
Referring to fig. 2, shown in Fig. 4, the idle pulley unit 2 includes left chuck 13, right chuck 14 and is held in left chuck
Driven rubber tire 15 between 13 and right chuck 14；The left chuck 13 and right chuck 14 are placed on lazy 7 left side axis body of axis, and by pressing
4 locking of circle.
Shown in Figure 4, left 13 center of chuck is provided with axis hole, and right chuck 14 is pressed into left chuck 13 simultaneously in hole axle mode
It is fixed by screw and left chuck 13.
Shown in Figure 5, the driven 15 centre circumferential direction of rubber tire is provided with chip card slot 15.1, and at chip card slot notch
With wafer portal bevelling 15.2, with clamped end face 15.3 on the inside of driven rubber tire 15.
The application method of cleaning equipment chip idle pulley structure after this CMP, using steps are as follows:
Step 1: connecting gas source, introduces atmosphere through the straight coupling 12 in lazy axle unit 1；
Step 2: idle pulley unit 2 is in connect chip.
Claims (5)
1. cleaning equipment chip idle pulley structure after a kind of CMP, it is characterised in that: including lazy axle unit (1) and lazy axle unit (1)
In the combined idle pulley unit (2) of socket, idle pulley unit (2) is locked in the pressing ring (4) on lazy axle unit (1), and fitting is tightly
The sensor (3) being fixed on lazy axle unit (1)；
The lazy axle unit (1) includes pedestal (5), lazy axis (7), combination bearing (8), gland (9), counting scale (10), retainer
(11) and straight coupling (12)；The combination bearing (8) is interior in hole axle positioning method indentation pedestal (5), on the left of combination bearing (8)
It is bonded on the inside of cycle surface and pedestal (5) left port；The gland (9) is with pedestal (5) right output port clamping and in hole axle mode pressure
Cycle surface on the right side of real combination bearing (8), straight coupling (12) and gland (9) are in engagement thread screwing hermetic；The lazy axis (7)
Right side axis body runs through combination bearing (8) in hole axle cooperation, until the step-like bayonet on lazy axis (7) fits in combination bearing (8) left side
Side inner ring end face, lazy axis (7) right end penetrate in counting scale (10) in hole axle mode, and counting scale right side is by retainer (11) and lazy axis
(7) right end locks, and counting scale left port is compacted inner ring end face on the right side of combination bearing (8)；
The idle pulley unit (2) includes left chuck (13), right chuck (14) and is held in left chuck (13) and right chuck
(14) the driven rubber tire (15) between；The left chuck (13) and right chuck (14) are placed on the left of lazy axis (7) on axis body, and by pressing
Enclose (4) locking；The intermediate circumferential direction of the driven rubber tire (15) is provided with chip card slot (15 .1), and has at chip card slot notch
Wafer portal bevelling (15 .2), driven rubber tire (15) inside is with clamped end face (15 .3).
2. cleaning equipment chip idle pulley structure after CMP according to claim 1, it is characterised in that: pedestal (5) neck
It is cased with O-ring (6).
3. cleaning equipment chip idle pulley structure after CMP according to claim 1, it is characterised in that: the right chuck (14)
Left chuck (13) is pressed into hole axle mode and is fixed by screw and left chuck (13).
4. cleaning equipment chip idle pulley structure after CMP according to claim 1, it is characterised in that: the sensor (3) is solid
It is scheduled on gland (9).
5. cleaning equipment chip idle pulley structure after CMP according to claim 1, it is characterised in that: the combination bearing (8)
For ceramic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611207241.9A CN106683978B (en) | 2016-12-23 | 2016-12-23 | Cleaning equipment chip idle pulley structure and application method after CMP |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611207241.9A CN106683978B (en) | 2016-12-23 | 2016-12-23 | Cleaning equipment chip idle pulley structure and application method after CMP |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106683978A CN106683978A (en) | 2017-05-17 |
| CN106683978B true CN106683978B (en) | 2019-02-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611207241.9A Active CN106683978B (en) | 2016-12-23 | 2016-12-23 | Cleaning equipment chip idle pulley structure and application method after CMP |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106683978B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020077649A1 (en) * | 2018-10-15 | 2020-04-23 | 杭州众硅电子科技有限公司 | Cmp wafer cleaning apparatus |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090068640A (en) * | 2007-12-24 | 2009-06-29 | 주식회사 동부하이텍 | Chemical-mechanical polishing apparatus for manufacturing semiconductor devices and method thereof |
| CN101712130A (en) * | 2009-12-22 | 2010-05-26 | 中国电子科技集团公司第四十五研究所 | Positioning conversion device applied to chemical mechanical polishing equipment of silicon wafer |
| CN102371535A (en) * | 2010-08-11 | 2012-03-14 | 中国电子科技集团公司第四十五研究所 | Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment |
| CN105051882A (en) * | 2013-03-15 | 2015-11-11 | 应用材料公司 | Substrate position aligner |
| CN105164793A (en) * | 2013-03-15 | 2015-12-16 | 应用材料公司 | Design of disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing |
| WO2016057234A1 (en) * | 2014-10-10 | 2016-04-14 | Entegris, Inc. | Point of use or point of dispense filter with multiple pleat packs |
-
2016
- 2016-12-23 CN CN201611207241.9A patent/CN106683978B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090068640A (en) * | 2007-12-24 | 2009-06-29 | 주식회사 동부하이텍 | Chemical-mechanical polishing apparatus for manufacturing semiconductor devices and method thereof |
| CN101712130A (en) * | 2009-12-22 | 2010-05-26 | 中国电子科技集团公司第四十五研究所 | Positioning conversion device applied to chemical mechanical polishing equipment of silicon wafer |
| CN102371535A (en) * | 2010-08-11 | 2012-03-14 | 中国电子科技集团公司第四十五研究所 | Silicon wafer positioning and loading device applied to chemical mechanical polishing equipment |
| CN105051882A (en) * | 2013-03-15 | 2015-11-11 | 应用材料公司 | Substrate position aligner |
| CN105164793A (en) * | 2013-03-15 | 2015-12-16 | 应用材料公司 | Design of disk/pad clean with wafer and wafer edge/bevel clean module for chemical mechanical polishing |
| WO2016057234A1 (en) * | 2014-10-10 | 2016-04-14 | Entegris, Inc. | Point of use or point of dispense filter with multiple pleat packs |
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| Publication number | Publication date |
|---|---|
| CN106683978A (en) | 2017-05-17 |
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Effective date of registration: 20230306 Address after: 100176 101, floor 2, building 2, No. 1, Taihe Third Street, economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Jingyi Precision Technology Co.,Ltd. Address before: 100176 No. 1, Taihe 3rd Street, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee before: BEIJING SEMICONDUCTOR EQUIPMENT INSTITUTE (THE 45TH Research Institute OF CETC) |