CN106678715A - LED road lamp for municipal engineering - Google Patents
LED road lamp for municipal engineering Download PDFInfo
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- CN106678715A CN106678715A CN201610548116.8A CN201610548116A CN106678715A CN 106678715 A CN106678715 A CN 106678715A CN 201610548116 A CN201610548116 A CN 201610548116A CN 106678715 A CN106678715 A CN 106678715A
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- Prior art keywords
- silicon
- silicon chip
- black
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- led
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- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000011324 bead Substances 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 189
- 229910021418 black silicon Inorganic materials 0.000 abstract description 82
- 238000000034 method Methods 0.000 abstract description 43
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 30
- 229910004205 SiNX Inorganic materials 0.000 abstract description 21
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 21
- 229910052593 corundum Inorganic materials 0.000 abstract description 21
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 21
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 20
- 229910000990 Ni alloy Inorganic materials 0.000 abstract description 20
- 229910052681 coesite Inorganic materials 0.000 abstract description 15
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 15
- 239000000377 silicon dioxide Substances 0.000 abstract description 15
- 229910052682 stishovite Inorganic materials 0.000 abstract description 15
- 229910052905 tridymite Inorganic materials 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000000126 substance Substances 0.000 abstract description 9
- 238000005530 etching Methods 0.000 abstract description 8
- 239000000969 carrier Substances 0.000 abstract description 3
- 238000002310 reflectometry Methods 0.000 abstract 2
- 238000003475 lamination Methods 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 description 155
- 239000010703 silicon Substances 0.000 description 155
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 66
- 239000000243 solution Substances 0.000 description 54
- 239000010408 film Substances 0.000 description 46
- 239000002122 magnetic nanoparticle Substances 0.000 description 38
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 33
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 33
- 238000009792 diffusion process Methods 0.000 description 29
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 24
- 239000011259 mixed solution Substances 0.000 description 24
- 238000007254 oxidation reaction Methods 0.000 description 24
- 238000004544 sputter deposition Methods 0.000 description 24
- 238000006243 chemical reaction Methods 0.000 description 22
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 22
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 18
- 238000004140 cleaning Methods 0.000 description 18
- 239000008367 deionised water Substances 0.000 description 18
- 229910021641 deionized water Inorganic materials 0.000 description 18
- 150000002505 iron Chemical class 0.000 description 18
- 238000001755 magnetron sputter deposition Methods 0.000 description 18
- 230000003647 oxidation Effects 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 18
- 238000002161 passivation Methods 0.000 description 15
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 12
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 12
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 12
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 12
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 12
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 12
- 239000005642 Oleic acid Substances 0.000 description 12
- 235000011114 ammonium hydroxide Nutrition 0.000 description 12
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 12
- 230000007062 hydrolysis Effects 0.000 description 12
- 238000006460 hydrolysis reaction Methods 0.000 description 12
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 12
- 239000007788 liquid Substances 0.000 description 12
- 238000003760 magnetic stirring Methods 0.000 description 12
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 12
- 239000001301 oxygen Substances 0.000 description 12
- 229910052760 oxygen Inorganic materials 0.000 description 12
- 239000002244 precipitate Substances 0.000 description 12
- 239000003643 water by type Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 11
- MCEWYIDBDVPMES-UHFFFAOYSA-N [60]pcbm Chemical compound C123C(C4=C5C6=C7C8=C9C%10=C%11C%12=C%13C%14=C%15C%16=C%17C%18=C(C=%19C=%20C%18=C%18C%16=C%13C%13=C%11C9=C9C7=C(C=%20C9=C%13%18)C(C7=%19)=C96)C6=C%11C%17=C%15C%13=C%15C%14=C%12C%12=C%10C%10=C85)=C9C7=C6C2=C%11C%13=C2C%15=C%12C%10=C4C23C1(CCCC(=O)OC)C1=CC=CC=C1 MCEWYIDBDVPMES-UHFFFAOYSA-N 0.000 description 9
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 9
- 239000010409 thin film Substances 0.000 description 8
- 230000005611 electricity Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000009466 transformation Effects 0.000 description 7
- 239000012901 Milli-Q water Substances 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 238000006701 autoxidation reaction Methods 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 238000000975 co-precipitation Methods 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 230000003628 erosive effect Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 239000008187 granular material Substances 0.000 description 6
- 239000001307 helium Substances 0.000 description 6
- 229910052734 helium Inorganic materials 0.000 description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 239000007791 liquid phase Substances 0.000 description 6
- 239000002086 nanomaterial Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000003921 oil Substances 0.000 description 6
- 230000010355 oscillation Effects 0.000 description 6
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000010926 purge Methods 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 239000001117 sulphuric acid Substances 0.000 description 6
- 235000011149 sulphuric acid Nutrition 0.000 description 6
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 6
- 238000002347 injection Methods 0.000 description 5
- 239000007924 injection Substances 0.000 description 5
- 238000013102 re-test Methods 0.000 description 5
- 238000003912 environmental pollution Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000012827 research and development Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S9/00—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply
- F21S9/02—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator
- F21S9/03—Lighting devices with a built-in power supply; Systems employing lighting devices with a built-in power supply the power supply being a battery or accumulator rechargeable by exposure to light
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
- F21W2131/10—Outdoor lighting
- F21W2131/103—Outdoor lighting of streets or roads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention relates to an LED road lamp for municipal engineering. The LED road lamp comprises a transparent lamp cover, a plurality of detachable LED light sources, a power source, a control switch and a sensor, wherein the power source is connected with the sensor and the control switch, and is connected with the detachable LED light sources; each of the light sources comprises a solar battery assembly, each solar battery assembly comprises a black silicon solar battery module and an accumulator; a black silicon structure is manufactured from Cu/Ni alloy films through etching by an auxiliary chemical method, so that the reflectivity to sunlight can be reduced to 1% or below, the sunlight is absorbed to the greatest extent, and the composition of carriers is effectively reduced; besides, a SiO2/Al2O3/SiNX lamination passive film is adopted, so that the service life of the carriers is effectively prolonged; and the solar converting efficiency of the LED road lamp is 20.78%, and the reflectivity to the sunlight is about 0.84%. The LED road lamp disclosed by the invention is high in converting efficiency and good in repeatability; the purpose of high-efficiency solar utilization is achieved; the energy resource consumption is reduced; the manufacturing cost is low; and the LED road lamp has many great application prospects.
Description
Technical field
The application is related to lighting field, more particularly to a kind of LED street lamp for municipal works.
Background technology
Street lamp, is the light fixture due to providing illumination functions to road.LED street lamp has environment friendly and pollution-free, little power consumption, light efficiency
High the advantages of.
With fossil energy worsening shortages and environmental pollution increase, make full use of including the renewable energy including solar energy
Increasingly paid close attention to by people in source.At present industry solar cell production cost is higher, and the popularization for constraining solar electrical energy generation should
With.Therefore in order that solar cell in the world interior energy is used widely, we must be improved using new technology of preparing
With the new solar cell of research and development, further reduce production cost and improve photoelectric transformation efficiency.
The content of the invention
To overcome problem present in correlation technique, the application to provide a kind of LED street lamp for municipal works.
The invention provides a kind of LED street lamp for municipal works, it is characterised in that:The LED street lamp includes transparent
Lampshade, Dismantlable LED light, power supply and sensor;The light source is provided with multiple;The power supply and sensor and control
Switch connection, the power supply is connected with Dismantlable LED light.
Preferably, the power supply is made up of solar module;The Dismantlable LED light is connected with each other by multiple
LED composition, multiple lamp beads are provided with the LED.
Preferably, the quantity of the lamp bead is 50~60.
Preferably, the solar module includes black silicon solar cell module and accumulator;The accumulator can be with
The electric energy that storage black silicon solar module is produced;The black silicon solar cell module is that this is black based on the black silicon structure of P-type silicon piece
Silicon structure is prepared by the auxiliary chemical method etching using Cu/Ni alloy films on the basis of silicon chip surface pyramid structure;It is described black
Diffusion layer, photoactive layer, SiO are followed successively by above silicon structure2/Al2O3/SiNXOverlayer passivation film, buffer electrode layer and Top electrode;
The photoactive layer is doped with Fe3O4Magnetic nano-particle;The black silicon structure is in turn below buffer electrode layer, bottom electrode;Institute
State SiO2/Al2O3/SiNXThe thickness of overlayer passivation film about 70nm.
Wherein, the making of the black silicon solar cell module is comprised the following steps:
Step one, cleaning silicon chip:Certain size P-type silicon piece is taken, silicon chip is immersed in into sulphuric acid:Hydrogen peroxide=3:2 (volumes
Than) mixed solution in and carry out supersound process 5min, silicon chip is immersed into 15vol%HF solution, then using deionized water pair
Silicon chip rinses 2min, then silicon chip is placed in the HF solution of 0.5wt.% and rinses 1min, to remove silicon chip surface autoxidation
Layer, last deionized water rinses 2min;
Step 2, prepares pyramid structure:The isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% is prepared, will
Silicon chip is placed in mixed solution the ultrasonic erosion 1h at 80 DEG C, and in silicon chip surface pyramid antireflection structure is obtained;
Step 3, prepares black silicon structure:Silicon chip is positioned in magnetic control sputtering device, 1.2 × 10 are evacuated to-4Below Pa,
Simultaneously magnetron sputtering C u targets, Ni targets, power is respectively 140W, 120W, and magnetron sputtering C u targets, Ni target times are 5min so as to shape
Into Cu/Ni alloy films;The silicon chip that above-mentioned sputtering there are Cu/Ni alloy films is positioned over into the mixed solution of 2.7M H2O2 and 8.3M HF
In, corrode 100min at 92 DEG C, corrode silicon chip surface and go out silicon nanostructure, i.e., black silicon structure is molten with hydrochloric acid after corroding
Liquid is cleaned to it, removes the Ni granules of residual, last deionized water cleaning silicon chip;
Step 4, prepares black silicon solar cell:
1) by the silicon chip for preparing, diffusion layer being diffuseed to form using phosphorus oxychloride liquid source, diffusion temperature is 800 DEG C~
1150℃;Etched using the plasma periphery of carbon tetrafluoride and oxygen, the diffusion layer at the edge of silicon chip is removed, make upper and lower two
Face separates, and then removes phosphorosilicate glass to Wafer Cleaning 30s using low concentration hydrofluoric acid solution (3vol%);
2) by Fe3O4:P3HT:PCBM=0.018:1:Fe3O4 magnetic nano-particles are doped to light and are lived by 0.8 mass ratio
In property layer solution, doping content is 1%, and then silicon chip is placed in above-mentioned photoactive layer solution, sonic oscillation 30min, in silicon
Piece surface covers one layer of photoactive layer;
Wherein, Fe3O4 magnetic nano-particles are prepared as follows using liquid phase coprecipitation method:By 0.85g (3.1mmol)
FeCl36H2O and 0.3g (1.5mmol) FeCl24H2O, is dissolved under nitrogen protection in 200ml ultra-pure waters and makes iron salt
Mixed solution;At 80 DEG C, the Dilute Ammonia Solution that 2ml mass concentrations are 25% is slowly added to iron salt and is mixed by vigorous magnetic stirring
In closing solution, when solution value is increased to 7~8, iron salt hydrolysis produce the Fe3O4 magnetic nano-particles of a large amount of black, continue to drip
Hydro-oxidation helium to pH=9 reacts 3h, makes hydrolysis tend to complete;By black Fe3O4Magnetic nano-particle Magnet is from solution separating
Out, milli-Q water, in being then dispersed in 200ml ultra-pure waters, add 2ml mass concentrations be 25% Dilute Ammonia Solution and
1ml Oleic acid, in 80 DEG C of constant temperature vigorous magnetic stirring 1h.The concentrated hydrochloric acid that mass concentration is 36% is slowly added in most backward solution,
Until produce lumpy precipitate in flask, by lumpy precipitate with, again with ethanol purge 3 times, removing unreacted oil after Magnet collection
Acid, obtains the Fe of oleic acid modified3O4Magnetic nano-particle;
3) using high-temperature thermal oxidation method, the silicon chip of above-mentioned gained is loaded into into high temperature oxidation furnace, into stove oxygen is passed through, make silicon
In oxidation atmosphere, surface is gradually oxidized and generates 5~10nm thick SiO piece2, then the silicon chip is put into into magnetic control sputtering device
In, one layer of Al is deposited with first using reaction magnetocontrol sputtering method2O3Then thin film, thickness about 40nm recycles PECVD deposition
One layer of silicon nitride so as to form SiO2/Al2O3/SiNXOverlayer passivation film;
4) buffer electrode layer is prepared:Using radio frequency magnetron sputtering method, one is deposited in silicon chip upper and lower surface respectively
Layer Cr films, thickness is 100nm, used as the cushion of upper/lower electrode;
5) electrode is prepared:Using the method for silk screen printing, the upper/lower electrode and back of the body electricity of black silicon solar cell are made respectively
, finally black silicon solar cell is sintered, make electrode form good Ohmic contact with silicon, then connect a wire to up and down
Electrode.
The technical scheme that embodiments herein is provided can include following beneficial effect:
1. The embodiment provides a kind of LED street lamp for municipal works, because the street lamp employs the sun
The power supply that energy battery modules operate as it, and the solaode module is made up of black silicon solar cell, is preparing black silicon
During solaode, black silicon structure is prepared using Cu/Ni alloy films auxiliary chemical method etching, using the method in pyramid
The silicon chip surface of structure corrodes the nanostructured for appropriate depth, the reflectance of visible ray is effectively reduced to less than 1%, while energy
Enough recombination rates for effectively reducing carrier, while using SiO2/Al2O3/SiNXThin film is effectively reduced as overlayer passivation film
The reflectance of sunlight, improves the life-span of carrier.And then the extinction using the solaode made by black silicon structure is imitated
Rate is improved, and the light source service life for making the LED street lamp is improved.
2. The embodiment provides a kind of LED street lamp for municipal works, adopts in its power supply for using
Black silicon solar cell, due to adopting SiO2/Al2O3/SiNXUsed as overlayer passivation film, the structural membrane is effectively increased thin film
In the life-span of carrier, in combination with the use of buffer electrode layer, the efficiency of solaode is effectively improved, test obtains highest
Conversion efficiency of solar cell reaches 20.78%.Further, the power supply service life for making LED street lamp extends, and saves replacing battery
Required man power and material's cost;Additionally, during solaode is prepared, due to Fe3O4 magnetic nano-particles being mixed
It is miscellaneous to P3HT:In PCBM photoactive layers, increase free carrier concentration, improve the short circuit current of battery, improve black silicon solar
The energy conversion efficiency of battery;Simple structure, simple production process, low cost, therefore, while battery conversion efficiency is lifted
Manufacturing cost is reduced, with applying to generate potentiality in practice on a large scale.And then make the cost of manufacture of LED street lamp and use
Efficiency is all greatly enhanced.
The aspect and advantage that the application is added will be set forth in part in the description, and partly will become from the following description
Obtain substantially, or recognized by the practice of the application.It should be appreciated that the general description of the above and detailed description hereinafter are only
It is exemplary and explanatory, the application can not be limited.
Description of the drawings
Accompanying drawing herein is merged in description and constitutes the part of this specification, shows the enforcement for meeting the present invention
Example, and be used to explain the principle of the present invention together with description.
Fig. 1 is the structural representation of the present invention.
Fig. 2 is the preparation technology of the black silicon solar cell module that the present invention according to an exemplary embodiment is adopted
FB(flow block).
Fig. 3 is the silicon chip surface pyramid structure schematic diagram that the present invention is adopted.
Fig. 4 is the black silicon structure surface film schematic diagram that the present invention is adopted.
Specific embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Explained below is related to
During accompanying drawing, unless otherwise indicated, the same numbers in different accompanying drawings represent same or analogous key element.Following exemplary embodiment
Described in embodiment do not represent and the consistent all embodiments of the present invention.Conversely, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects described in detail in claims, the present invention.
In the description of the present application, it should be noted that unless otherwise prescribed and limit, term " installation ", " connected ",
" connection " should be interpreted broadly, for example, it may be mechanically connected or electrical connection, or the connection of two element internals, can
Being to be joined directly together, it is also possible to be indirectly connected to by intermediary, for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term.
With fossil energy worsening shortages and environmental pollution increase, make full use of including the renewable energy including solar energy
Increasingly paid close attention to by people in source.At present industry solar cell production cost is higher, and the popularization for constraining solar electrical energy generation should
With.Therefore in order that solar cell in the world interior energy is used widely, we must be improved using new technology of preparing
With the new solar cell of research and development, further reduce production cost and improve photoelectric transformation efficiency.
Solar cell is the device for luminous energy being converted into electric energy, in the compounds solar cell of volume production, cadmium telluride
The conversion efficiency highest of solar cell, but the cadmium used in its raw material is harmful substance, and environmental pollution is likely to result in after use, because
This limits widely using for such battery.Crystal silicon cell is a kind of most widely used at present and the most ripe battery, but
Be existing crystal silicon cell due to complex structure, producting process difficulty is larger, high cost, is not applied to large-scale
In commercial production.Therefore, lifted battery conversion efficiency while reduce manufacturing cost be only propulsion photovoltaic application key because
Element.
High-efficiency and low-cost solar cell technology is to popularize the key factor of photovoltaic generation.The discovery of black silicon and black silion cell
The development of technology, the research and development for low-cost high-efficiency battery provide effective resolving ideas.Because special nano surface is tied
Structure makes the Carrier recombination of black silion cell far above common monocrystalline silicon battery, so as to cause current black silion cell efficiency not reach
To the expection of people.
Research discovery, by Fe3O4 magnetic nano-particles P3HT is doped to:In PCBM photoactive layers, because Fe3O4 magnetic is received
Rice corpuscles have superparamagnetism, and the magnetic field produced under electromagnetic interaction improves P3HT:Triplet state in PCBM photoactive layers
Ratio shared by exciton, produces more free carriers, increases free carrier concentration, can improve the short circuit electricity of battery
Stream, and then improve the energy conversion efficiency of polymer solar battery.
Embodiment 1:
Fig. 1 is a kind of structural representation of the LED street lamp for municipal works according to an exemplary embodiment, such as
Shown in Fig. 1, the LED street lamp includes Transparent lamp shade, Dismantlable LED light 4, power supply 1, controlling switch 3 and sensor 2;Institute
State Dismantlable LED light 4 be provided with it is multiple;The power supply 1 is connected with sensor 2 and controlling switch 3, the power supply 1 with can
Dismountable LED light source 4 connects.In the present embodiment, preferably, power supply is made up of solar module described in 1;It is described can
Dismountable LED light source 4 is made up of multiple LEDs being connected with each other, and multiple lamp beads is provided with the LED, in the present embodiment
In, the quantity of lamp bead is 50~60.Further, the quantity of the lamp bead is 55, and is distributed in detachable LED light side by side
On source 4.
Preferably, the solar module includes black silicon solar cell module and accumulator;The black silicon sun
Energy battery module is the black silicon structure based on P-type silicon piece as shown in Figure 3, and the black silicon structure is in silicon chip surface pyramid structure
On the basis of using Cu/Ni alloy films auxiliary chemical method etching prepare, in the present embodiment, the pyramid structure be
Corrode in the isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% and obtain.
Diffusion layer 01 as shown in Figure 4, photoactive layer 02, SiO are followed successively by above the black silicon structure2/Al2O3/SiNXIt is folded
Layer passivating film 03, buffer electrode layer 04 and Top electrode 05;The photoactive layer 02 is doped with Fe3O4Magnetic nano-particle;It is described black
Silicon structure is in turn below buffer electrode layer, bottom electrode;The SiO2/Al2O3/SiNXThe thickness of overlayer passivation film about 70nm.Its
In, the diffusion layer 01 is to spread source for doping P elements using phosphorus oxychloride.
Fig. 2 be a kind of black silicon that adopted of the LED street lamp for municipal works according to an exemplary embodiment too
The preparation method of positive energy battery module, referring to Fig. 2, comprises the following steps:
Step one, cleaning silicon chip:Certain size P-type silicon piece is taken, silicon chip is immersed in into sulphuric acid:Hydrogen peroxide=3:2 (volumes
Than) mixed solution in and carry out supersound process 5min, silicon chip is immersed into 15vol%HF solution, then using deionized water pair
Silicon chip rinses 2min, then silicon chip is placed in the HF solution of 0.5wt.% and rinses 1min, to remove silicon chip surface autoxidation
Layer, last deionized water rinses 2min;
Step 2, prepares pyramid structure:The isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% is prepared, will
Silicon chip is placed in mixed solution the ultrasonic erosion 1h at 80 DEG C, and in silicon chip surface pyramid antireflection structure is obtained;
Step 3, prepares black silicon structure:Silicon chip is positioned in magnetic control sputtering device, 1.2 × 10 are evacuated to-4Below Pa,
Simultaneously magnetron sputtering C u targets, Ni targets, power is respectively 140W, 120W, and magnetron sputtering C u targets, Ni target times are 5min so as to shape
Into Cu/Ni alloy films;The silicon chip that above-mentioned sputtering there are Cu/Ni alloy films is positioned over into the mixed solution of 2.7M H2O2 and 8.3M HF
In, corrode 100min at 92 DEG C, corrode silicon chip surface and go out silicon nanostructure, i.e., black silicon structure is molten with hydrochloric acid after corroding
Liquid is cleaned to it, removes the Ni granules of residual, last deionized water cleaning silicon chip;
Step 4, prepares black silicon solar cell:
1) by the silicon chip for preparing, diffusion layer being diffuseed to form using phosphorus oxychloride liquid source, diffusion temperature is 800 DEG C~
1150℃;Etched using the plasma periphery of carbon tetrafluoride and oxygen, the diffusion layer at the edge of silicon chip is removed, make upper and lower two
Face separates, and then removes phosphorosilicate glass to Wafer Cleaning 30s using low concentration hydrofluoric acid solution (3vol%);
2) by Fe3O4:P3HT:PCBM=0.018:1:Fe3O4 magnetic nano-particles are doped to light and are lived by 0.8 mass ratio
In property layer solution, doping content is 1%, and then silicon chip is placed in above-mentioned photoactive layer solution, sonic oscillation 30min, in silicon
Piece surface covers one layer of photoactive layer;
Wherein, Fe3O4 magnetic nano-particles are prepared as follows using liquid phase coprecipitation method:By 0.85g (3.1mmol)
FeCl36H2O and 0.3g (1.5mmol) FeCl24H2O, is dissolved under nitrogen protection in 200ml ultra-pure waters and makes iron salt
Mixed solution;At 80 DEG C, the Dilute Ammonia Solution that 2ml mass concentrations are 25% is slowly added to iron salt and is mixed by vigorous magnetic stirring
In closing solution, when solution value is increased to 7~8, iron salt hydrolysis produce the Fe3O4 magnetic nano-particles of a large amount of black, continue to drip
Hydro-oxidation helium to pH=9 reacts 3h, makes hydrolysis tend to complete;By black Fe3O4Magnetic nano-particle Magnet is from solution separating
Out, milli-Q water, in being then dispersed in 200ml ultra-pure waters, add 2ml mass concentrations be 25% Dilute Ammonia Solution and
1ml Oleic acid, in 80 DEG C of constant temperature vigorous magnetic stirring 1h.The concentrated hydrochloric acid that mass concentration is 36% is slowly added in most backward solution,
Until produce lumpy precipitate in flask, by lumpy precipitate with, again with ethanol purge 3 times, removing unreacted oil after Magnet collection
Acid, obtains the Fe of oleic acid modified3O4Magnetic nano-particle;
3) using high-temperature thermal oxidation method, the silicon chip of above-mentioned gained is loaded into into high temperature oxidation furnace, into stove oxygen is passed through, make silicon
In oxidation atmosphere, surface is gradually oxidized and generates 5~10nm thick SiO piece2, then the silicon chip is put into into magnetic control sputtering device
In, one layer of Al is deposited with first using reaction magnetocontrol sputtering method2O3Then thin film, thickness about 40nm recycles PECVD deposition
One layer of silicon nitride so as to form SiO2/Al2O3/SiNXOverlayer passivation film;
4) buffer electrode layer is prepared:Using radio frequency magnetron sputtering method, one is deposited in silicon chip upper and lower surface respectively
Layer Cr films, thickness is 100nm, used as the cushion of upper/lower electrode;
5) electrode is prepared:Using the method for silk screen printing, the upper/lower electrode and back of the body electricity of black silicon solar cell are made respectively
, finally black silicon solar cell is sintered, make electrode form good Ohmic contact with silicon, then connect a wire to up and down
Electrode.
Test result:
The black silion cell characteristic of condition is irradiated in AM1.5 standard analogs light source:
Open-circuit voltage is 0.965V, and short circuit current is 58.36mA/cm2, fill factor, curve factor is 80.63%;Black silion cell is to too
The reflectance of sunlight is 0.84%.
The carrier lifetime of battery is measured using QSSPC, as injection carrier concentration △ n=1015cm-3When, effective minority
Carrier lifetime is 10.9 μ s.
It is 20.78% that test obtains the solar energy conversion efficiency of the LED street lamp, the reflectance about 0.84% to sunlight,
Through 3000 retests, transformation efficiency variable quantity is less than 9%, and the high conversion efficiency of the LED street lamp is reproducible.
Embodiment 2
Fig. 1 is a kind of structural representation of the LED street lamp for municipal works according to an exemplary embodiment, such as
Shown in Fig. 1, the LED street lamp includes Transparent lamp shade, Dismantlable LED light 4, power supply 1, controlling switch 3 and sensor 2;Institute
State Dismantlable LED light 4 be provided with it is multiple;The power supply 1 is connected with sensor 2 and controlling switch 3, the power supply 1 with can
Dismountable LED light source 4 connects.In the present embodiment, preferably, power supply is made up of solar module described in 1;It is described can
Dismountable LED light source 4 is made up of multiple LEDs being connected with each other, and multiple lamp beads is provided with the LED, in the present embodiment
In, the quantity of lamp bead is 50~60.Further, the quantity of the lamp bead is 55, and is distributed in detachable LED light side by side
On source 4.
Preferably, the solar module includes black silicon solar cell module and accumulator;The black silicon sun
Energy battery module is the black silicon structure based on P-type silicon piece as shown in Figure 3, and the black silicon structure is in silicon chip surface pyramid structure
On the basis of using Cu/Ni alloy films auxiliary chemical method etching prepare, in the present embodiment, the pyramid structure be
Corrode in the isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% and obtain.
Diffusion layer 01 as shown in Figure 4, photoactive layer 02, SiO are followed successively by above the black silicon structure2/Al2O3/SiNXIt is folded
Layer passivating film 03, buffer electrode layer 04 and Top electrode 05;The photoactive layer 02 is doped with Fe3O4Magnetic nano-particle;It is described black
Silicon structure is in turn below buffer electrode layer, bottom electrode;The SiO2/Al2O3/SiNXThe thickness of overlayer passivation film about 70nm.Its
In, the diffusion layer 01 is to spread source for doping P elements using phosphorus oxychloride.
Fig. 2 be a kind of black silicon that adopted of the LED street lamp for municipal works according to an exemplary embodiment too
The preparation method of positive energy battery module, referring to Fig. 2, comprises the following steps:
Step one, cleaning silicon chip:Certain size P-type silicon piece is taken, silicon chip is immersed in into sulphuric acid:Hydrogen peroxide=3:2 (volumes
Than) mixed solution in and carry out supersound process 5min, silicon chip is immersed into 15vol%HF solution, then using deionized water pair
Silicon chip rinses 2min, then silicon chip is placed in the HF solution of 0.5wt.% and rinses 1min, to remove silicon chip surface autoxidation
Layer, last deionized water rinses 2min;
Step 2, prepares pyramid structure:The isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% is prepared, will
Silicon chip is placed in mixed solution the ultrasonic erosion 1h at 80 DEG C, and in silicon chip surface pyramid antireflection structure is obtained;
Step 3, prepares black silicon structure:Silicon chip is positioned in magnetic control sputtering device, 1.2 × 10 are evacuated to-4Below Pa,
Simultaneously magnetron sputtering C u targets, Ni targets, power is respectively 140W, 120W, and magnetron sputtering C u targets, Ni target times are 5min so as to shape
Into Cu/Ni alloy films;The silicon chip that above-mentioned sputtering there are Cu/Ni alloy films is positioned over into the mixed solution of 2.7M H2O2 and 8.3M HF
In, corrode 100min at 92 DEG C, corrode silicon chip surface and go out silicon nanostructure, i.e., black silicon structure is molten with hydrochloric acid after corroding
Liquid is cleaned to it, removes the Ni granules of residual, last deionized water cleaning silicon chip;
Step 4, prepares black silicon solar cell:
1) by the silicon chip for preparing, diffusion layer being diffuseed to form using phosphorus oxychloride liquid source, diffusion temperature is 800 DEG C~
1150℃;Etched using the plasma periphery of carbon tetrafluoride and oxygen, the diffusion layer at the edge of silicon chip is removed, make upper and lower two
Face separates, and then removes phosphorosilicate glass to Wafer Cleaning 30s using low concentration hydrofluoric acid solution (3vol%);
2) by Fe3O4:P3HT:PCBM=0.018:1:Fe3O4 magnetic nano-particles are doped to light and are lived by 0.8 mass ratio
In property layer solution, doping content is 1%, and then silicon chip is placed in above-mentioned photoactive layer solution, sonic oscillation 30min, in silicon
Piece surface covers one layer of photoactive layer;
Wherein, Fe3O4 magnetic nano-particles are prepared as follows using liquid phase coprecipitation method:By 0.85g (3.1mmol)
FeCl36H2O and 0.3g (1.5mmol) FeCl24H2O, is dissolved under nitrogen protection in 200ml ultra-pure waters and makes iron salt
Mixed solution;At 80 DEG C, the Dilute Ammonia Solution that 2ml mass concentrations are 25% is slowly added to iron salt and is mixed by vigorous magnetic stirring
In closing solution, when solution value is increased to 7~8, iron salt hydrolysis produce the Fe3O4 magnetic nano-particles of a large amount of black, continue to drip
Hydro-oxidation helium to pH=9 reacts 3h, makes hydrolysis tend to complete;By black Fe3O4Magnetic nano-particle Magnet is from solution separating
Out, milli-Q water, in being then dispersed in 200ml ultra-pure waters, add 2ml mass concentrations be 25% Dilute Ammonia Solution and
1ml Oleic acid, in 80 DEG C of constant temperature vigorous magnetic stirring 1h.The concentrated hydrochloric acid that mass concentration is 36% is slowly added in most backward solution,
Until produce lumpy precipitate in flask, by lumpy precipitate with, again with ethanol purge 3 times, removing unreacted oil after Magnet collection
Acid, obtains the Fe of oleic acid modified3O4Magnetic nano-particle;
3) using high-temperature thermal oxidation method, the silicon chip of above-mentioned gained is loaded into into high temperature oxidation furnace, into stove oxygen is passed through, make silicon
In oxidation atmosphere, surface is gradually oxidized and generates 5~10nm thick SiO piece2, then the silicon chip is put into into magnetic control sputtering device
In, one layer of Al is deposited with first using reaction magnetocontrol sputtering method2O3Then thin film, thickness about 40nm recycles PECVD deposition
One layer of silicon nitride so as to form SiO2/Al2O3/SiNXOverlayer passivation film;
4) buffer electrode layer is prepared:Using radio frequency magnetron sputtering method, one is deposited in silicon chip upper and lower surface respectively
Layer Cr films, thickness is 100nm, used as the cushion of upper/lower electrode;
5) electrode is prepared:Using the method for silk screen printing, the upper/lower electrode and back of the body electricity of black silicon solar cell are made respectively
, finally black silicon solar cell is sintered, make electrode form good Ohmic contact with silicon, then connect a wire to up and down
Electrode.
Test result:
The black silion cell characteristic of condition is irradiated in AM1.5 standard analogs light source:
Short circuit current is 58.36mA/cm2, fill factor, curve factor is 80.63%;Black silion cell reflectance is 1.5%.Use
QSSPC measures the carrier lifetime of battery, as injection carrier concentration △ n=1015cm-3When, effective minority carrier lifetime is
10.9μs。
It is 21.78% that test obtains the solar energy conversion efficiency of the LED street lamp, reflectance about 1.5%, the Jing to sunlight
3000 retests are crossed, transformation efficiency variable quantity is less than 10%, and the high conversion efficiency of the LED street lamp is reproducible.
Embodiment 3
Fig. 1 is a kind of structural representation of the LED street lamp for municipal works according to an exemplary embodiment, such as
Shown in Fig. 1, the LED street lamp includes Transparent lamp shade, Dismantlable LED light 4, power supply 1, controlling switch 3 and sensor 2;Institute
State Dismantlable LED light 4 be provided with it is multiple;The power supply 1 is connected with sensor 2 and controlling switch 3, the power supply 1 with can
Dismountable LED light source 4 connects.In the present embodiment, preferably, power supply is made up of solar module described in 1;It is described can
Dismountable LED light source 4 is made up of multiple LEDs being connected with each other, and multiple lamp beads is provided with the LED, in the present embodiment
In, the quantity of lamp bead is 50~60.Further, the quantity of the lamp bead is 55, and is distributed in detachable LED light side by side
On source 4.
Preferably, the solar module includes black silicon solar cell module and accumulator;The black silicon sun
Energy battery module is the black silicon structure based on P-type silicon piece as shown in Figure 3, and the black silicon structure is in silicon chip surface pyramid structure
On the basis of using Cu/Ni alloy films auxiliary chemical method etching prepare, in the present embodiment, the pyramid structure be
Corrode in the isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% and obtain.
Diffusion layer 01 as shown in Figure 4, photoactive layer 02, SiO are followed successively by above the black silicon structure2/Al2O3/SiNXIt is folded
Layer passivating film 03, buffer electrode layer 04 and Top electrode 05;The photoactive layer 02 is doped with Fe3O4Magnetic nano-particle;It is described black
Silicon structure is in turn below buffer electrode layer, bottom electrode;The SiO2/Al2O3/SiNXThe thickness of overlayer passivation film about 70nm.Its
In, the diffusion layer 01 is to spread source for doping P elements using phosphorus oxychloride.
Fig. 2 be a kind of black silicon that adopted of the LED street lamp for municipal works according to an exemplary embodiment too
The preparation method of positive energy battery module, referring to Fig. 2, comprises the following steps:
Step one, cleaning silicon chip:Certain size P-type silicon piece is taken, silicon chip is immersed in into sulphuric acid:Hydrogen peroxide=3:2 (volumes
Than) mixed solution in and carry out supersound process 5min, silicon chip is immersed into 15vol%HF solution, then using deionized water pair
Silicon chip rinses 2min, then silicon chip is placed in the HF solution of 0.5wt.% and rinses 1min, to remove silicon chip surface autoxidation
Layer, last deionized water rinses 2min;
Step 2, prepares pyramid structure:The isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% is prepared, will
Silicon chip is placed in mixed solution the ultrasonic erosion 1h at 80 DEG C, and in silicon chip surface pyramid antireflection structure is obtained;
Step 3, prepares black silicon structure:Silicon chip is positioned in magnetic control sputtering device, 1.2 × 10 are evacuated to-4Below Pa,
Simultaneously magnetron sputtering C u targets, Ni targets, power is respectively 140W, 120W, and magnetron sputtering C u targets, Ni target times are 5min so as to shape
Into Cu/Ni alloy films;The silicon chip that above-mentioned sputtering there are Cu/Ni alloy films is positioned over into the mixed solution of 2.7M H2O2 and 8.3M HF
In, corrode 100min at 92 DEG C, corrode silicon chip surface and go out silicon nanostructure, i.e., black silicon structure is molten with hydrochloric acid after corroding
Liquid is cleaned to it, removes the Ni granules of residual, last deionized water cleaning silicon chip;
Step 4, prepares black silicon solar cell:
1) by the silicon chip for preparing, diffusion layer being diffuseed to form using phosphorus oxychloride liquid source, diffusion temperature is 800 DEG C~
1150℃;Etched using the plasma periphery of carbon tetrafluoride and oxygen, the diffusion layer at the edge of silicon chip is removed, make upper and lower two
Face separates, and then removes phosphorosilicate glass to Wafer Cleaning 30s using low concentration hydrofluoric acid solution (3vol%);
2) by Fe3O4:P3HT:PCBM=0.018:1:Fe3O4 magnetic nano-particles are doped to light and are lived by 0.8 mass ratio
In property layer solution, doping content is 1%, and then silicon chip is placed in above-mentioned photoactive layer solution, sonic oscillation 30min, in silicon
Piece surface covers one layer of photoactive layer;
Wherein, Fe3O4 magnetic nano-particles are prepared as follows using liquid phase coprecipitation method:By 0.85g (3.1mmol)
FeCl36H2O and 0.3g (1.5mmol) FeCl24H2O, is dissolved under nitrogen protection in 200ml ultra-pure waters and makes iron salt
Mixed solution;At 80 DEG C, the Dilute Ammonia Solution that 2ml mass concentrations are 25% is slowly added to iron salt and is mixed by vigorous magnetic stirring
In closing solution, when solution value is increased to 7~8, iron salt hydrolysis produce the Fe3O4 magnetic nano-particles of a large amount of black, continue to drip
Hydro-oxidation helium to pH=9 reacts 3h, makes hydrolysis tend to complete;By black Fe3O4Magnetic nano-particle Magnet is from solution separating
Out, milli-Q water, in being then dispersed in 200ml ultra-pure waters, add 2ml mass concentrations be 25% Dilute Ammonia Solution and
1ml Oleic acid, in 80 DEG C of constant temperature vigorous magnetic stirring 1h.The concentrated hydrochloric acid that mass concentration is 36% is slowly added in most backward solution,
Until produce lumpy precipitate in flask, by lumpy precipitate with, again with ethanol purge 3 times, removing unreacted oil after Magnet collection
Acid, obtains the Fe of oleic acid modified3O4Magnetic nano-particle;
3) using high-temperature thermal oxidation method, the silicon chip of above-mentioned gained is loaded into into high temperature oxidation furnace, into stove oxygen is passed through, make silicon
In oxidation atmosphere, surface is gradually oxidized and generates 5~10nm thick SiO piece2, then the silicon chip is put into into magnetic control sputtering device
In, one layer of Al is deposited with first using reaction magnetocontrol sputtering method2O3Then thin film, thickness about 40nm recycles PECVD deposition
One layer of silicon nitride so as to form SiO2/Al2O3/SiNXOverlayer passivation film;
4) buffer electrode layer is prepared:Using radio frequency magnetron sputtering method, one is deposited in silicon chip upper and lower surface respectively
Layer Cr films, thickness is 100nm, used as the cushion of upper/lower electrode;
5) electrode is prepared:Using the method for silk screen printing, the upper/lower electrode and back of the body electricity of black silicon solar cell are made respectively
, finally black silicon solar cell is sintered, make electrode form good Ohmic contact with silicon, then connect a wire to up and down
Electrode.
Test result:
The black silion cell characteristic of condition is irradiated in AM1.5 standard analogs light source:
Open-circuit voltage is 0.965V, and short circuit current is 58.36mA/cm2, fill factor, curve factor is 80.63%;Black silion cell reflection
Rate is 1.32%.The carrier lifetime of battery is measured using QSSPC, as injection carrier concentration △ n=1015cm-3When, effectively
Minority carrier lifetime is 10.9 μ s.
It is 22.78% that test obtains the solar energy conversion efficiency of the LED street lamp, the reflectance about 1.32% to sunlight,
Through 3000 retests, transformation efficiency variable quantity is less than 11%, and the high conversion efficiency of the LED street lamp is reproducible.
Embodiment 4
Fig. 1 is a kind of structural representation of the LED street lamp for municipal works according to an exemplary embodiment, such as
Shown in Fig. 1, the LED street lamp includes Transparent lamp shade, Dismantlable LED light 4, power supply 1, controlling switch 3 and sensor 2;Institute
State Dismantlable LED light 4 be provided with it is multiple;The power supply 1 is connected with sensor 2 and controlling switch 3, the power supply 1 with can
Dismountable LED light source 4 connects.In the present embodiment, preferably, power supply is made up of solar module described in 1;It is described can
Dismountable LED light source 4 is made up of multiple LEDs being connected with each other, and multiple lamp beads is provided with the LED, in the present embodiment
In, the quantity of lamp bead is 50~60.Further, the quantity of the lamp bead is 55, and is distributed in detachable LED light side by side
On source 4.
Preferably, the solar module includes black silicon solar cell module and accumulator;The black silicon sun
Energy battery module is the black silicon structure based on P-type silicon piece as shown in Figure 3, and the black silicon structure is in silicon chip surface pyramid structure
On the basis of using Cu/Ni alloy films auxiliary chemical method etching prepare, in the present embodiment, the pyramid structure be
Corrode in the isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% and obtain.
Diffusion layer 01 as shown in Figure 4, photoactive layer 02, SiO are followed successively by above the black silicon structure2/Al2O3/SiNXIt is folded
Layer passivating film 03, buffer electrode layer 04 and Top electrode 05;The photoactive layer 02 is doped with Fe3O4Magnetic nano-particle;It is described black
Silicon structure is in turn below buffer electrode layer, bottom electrode;The SiO2/Al2O3/SiNXThe thickness of overlayer passivation film about 70nm.Its
In, the diffusion layer 01 is to spread source for doping P elements using phosphorus oxychloride.
Fig. 2 be a kind of black silicon that adopted of the LED street lamp for municipal works according to an exemplary embodiment too
The preparation method of positive energy battery module, referring to Fig. 2, comprises the following steps:
Step one, cleaning silicon chip:Certain size P-type silicon piece is taken, silicon chip is immersed in into sulphuric acid:Hydrogen peroxide=3:2 (volumes
Than) mixed solution in and carry out supersound process 5min, silicon chip is immersed into 15vol%HF solution, then using deionized water pair
Silicon chip rinses 2min, then silicon chip is placed in the HF solution of 0.5wt.% and rinses 1min, to remove silicon chip surface autoxidation
Layer, last deionized water rinses 2min;
Step 2, prepares pyramid structure:The isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% is prepared, will
Silicon chip is placed in mixed solution the ultrasonic erosion 1h at 80 DEG C, and in silicon chip surface pyramid antireflection structure is obtained;
Step 3, prepares black silicon structure:Silicon chip is positioned in magnetic control sputtering device, 1.2 × 10 are evacuated to-4Below Pa,
Simultaneously magnetron sputtering C u targets, Ni targets, power is respectively 140W, 120W, and magnetron sputtering C u targets, Ni target times are 5min so as to shape
Into Cu/Ni alloy films;The silicon chip that above-mentioned sputtering there are Cu/Ni alloy films is positioned over into the mixed solution of 2.7M H2O2 and 8.3M HF
In, corrode 100min at 92 DEG C, corrode silicon chip surface and go out silicon nanostructure, i.e., black silicon structure is molten with hydrochloric acid after corroding
Liquid is cleaned to it, removes the Ni granules of residual, last deionized water cleaning silicon chip;
Step 4, prepares black silicon solar cell:
1) by the silicon chip for preparing, diffusion layer being diffuseed to form using phosphorus oxychloride liquid source, diffusion temperature is 800 DEG C~
1150℃;Etched using the plasma periphery of carbon tetrafluoride and oxygen, the diffusion layer at the edge of silicon chip is removed, make upper and lower two
Face separates, and then removes phosphorosilicate glass to Wafer Cleaning 30s using low concentration hydrofluoric acid solution (3vol%);
2) by Fe3O4:P3HT:PCBM=0.018:1:Fe3O4 magnetic nano-particles are doped to light and are lived by 0.8 mass ratio
In property layer solution, doping content is 1%, and then silicon chip is placed in above-mentioned photoactive layer solution, sonic oscillation 30min, in silicon
Piece surface covers one layer of photoactive layer;
Wherein, Fe3O4 magnetic nano-particles are prepared as follows using liquid phase coprecipitation method:By 0.85g (3.1mmol)
FeCl36H2O and 0.3g (1.5mmol) FeCl24H2O, is dissolved under nitrogen protection in 200ml ultra-pure waters and makes iron salt
Mixed solution;At 80 DEG C, the Dilute Ammonia Solution that 2ml mass concentrations are 25% is slowly added to iron salt and is mixed by vigorous magnetic stirring
In closing solution, when solution value is increased to 7~8, iron salt hydrolysis produce the Fe3O4 magnetic nano-particles of a large amount of black, continue to drip
Hydro-oxidation helium to pH=9 reacts 3h, makes hydrolysis tend to complete;By black Fe3O4Magnetic nano-particle Magnet is from solution separating
Out, milli-Q water, in being then dispersed in 200ml ultra-pure waters, add 2ml mass concentrations be 25% Dilute Ammonia Solution and
1ml Oleic acid, in 80 DEG C of constant temperature vigorous magnetic stirring 1h.The concentrated hydrochloric acid that mass concentration is 36% is slowly added in most backward solution,
Until produce lumpy precipitate in flask, by lumpy precipitate with, again with ethanol purge 3 times, removing unreacted oil after Magnet collection
Acid, obtains the Fe of oleic acid modified3O4Magnetic nano-particle;
3) using high-temperature thermal oxidation method, the silicon chip of above-mentioned gained is loaded into into high temperature oxidation furnace, into stove oxygen is passed through, make silicon
In oxidation atmosphere, surface is gradually oxidized and generates 5~10nm thick SiO piece2, then the silicon chip is put into into magnetic control sputtering device
In, one layer of Al is deposited with first using reaction magnetocontrol sputtering method2O3Then thin film, thickness about 40nm recycles PECVD deposition
One layer of silicon nitride so as to form SiO2/Al2O3/SiNXOverlayer passivation film;
4) buffer electrode layer is prepared:Using radio frequency magnetron sputtering method, one is deposited in silicon chip upper and lower surface respectively
Layer Cr films, thickness is 100nm, used as the cushion of upper/lower electrode;
5) electrode is prepared:Using the method for silk screen printing, the upper/lower electrode and back of the body electricity of black silicon solar cell are made respectively
, finally black silicon solar cell is sintered, make electrode form good Ohmic contact with silicon, then connect a wire to up and down
Electrode.
Test result:
The black silion cell characteristic of condition is irradiated in AM1.5 standard analogs light source:
Open-circuit voltage is 0.965V, and short circuit current is 58.36mA/cm2, fill factor, curve factor is 80.63%;Black silion cell reflection
Rate is 1.26%.The carrier lifetime of battery is measured using QSSPC, as injection carrier concentration △ n=1015cm-3When, effectively
Minority carrier lifetime is 10.9 μ s.
It is 20.69% that test obtains the solar energy conversion efficiency of the LED street lamp, the reflectance about 1.26% to sunlight,
Through 3000 retests, transformation efficiency variable quantity is less than 12%, and the high conversion efficiency of the LED street lamp is reproducible.
Embodiment 5
Fig. 1 is a kind of structural representation of the LED street lamp for municipal works according to an exemplary embodiment, such as
Shown in Fig. 1, the LED street lamp includes Transparent lamp shade, Dismantlable LED light 4, power supply 1, controlling switch 3 and sensor 2;Institute
State Dismantlable LED light 4 be provided with it is multiple;The power supply 1 is connected with sensor 2 and controlling switch 3, the power supply 1 with can
Dismountable LED light source 4 connects.In the present embodiment, preferably, power supply is made up of solar module described in 1;It is described can
Dismountable LED light source 4 is made up of multiple LEDs being connected with each other, and multiple lamp beads is provided with the LED, in the present embodiment
In, the quantity of lamp bead is 50~60.Further, the quantity of the lamp bead is 55, and is distributed in detachable LED light side by side
On source 4.
Preferably, the solar module includes black silicon solar cell module and accumulator;The black silicon sun
Energy battery module is the black silicon structure based on P-type silicon piece as shown in Figure 3, and the black silicon structure is in silicon chip surface pyramid structure
On the basis of using Cu/Ni alloy films auxiliary chemical method etching prepare, in the present embodiment, the pyramid structure be
Corrode in the isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% and obtain.
Diffusion layer 01 as shown in Figure 4, photoactive layer 02, SiO are followed successively by above the black silicon structure2/Al2O3/SiNXIt is folded
Layer passivating film 03, buffer electrode layer 04 and Top electrode 05;The photoactive layer 02 is doped with Fe3O4Magnetic nano-particle;It is described black
Silicon structure is in turn below buffer electrode layer, bottom electrode;The SiO2/Al2O3/SiNXThe thickness of overlayer passivation film about 70nm.Its
In, the diffusion layer 01 is to spread source for doping P elements using phosphorus oxychloride.
Fig. 2 be a kind of black silicon that adopted of the LED street lamp for municipal works according to an exemplary embodiment too
The preparation method of positive energy battery module, referring to Fig. 2, comprises the following steps:
Step one, cleaning silicon chip:Certain size P-type silicon piece is taken, silicon chip is immersed in into sulphuric acid:Hydrogen peroxide=3:2 (volumes
Than) mixed solution in and carry out supersound process 5min, silicon chip is immersed into 15vol%HF solution, then using deionized water pair
Silicon chip rinses 2min, then silicon chip is placed in the HF solution of 0.5wt.% and rinses 1min, to remove silicon chip surface autoxidation
Layer, last deionized water rinses 2min;
Step 2, prepares pyramid structure:The isopropyl alcohol mixture of the NaOH and 7vol.% of 2.8wt.% is prepared, will
Silicon chip is placed in mixed solution the ultrasonic erosion 1h at 80 DEG C, and in silicon chip surface pyramid antireflection structure is obtained;
Step 3, prepares black silicon structure:Silicon chip is positioned in magnetic control sputtering device, 1.2 × 10 are evacuated to-4Below Pa,
Simultaneously magnetron sputtering C u targets, Ni targets, power is respectively 140W, 120W, and magnetron sputtering C u targets, Ni target times are 5min so as to shape
Into Cu/Ni alloy films;The silicon chip that above-mentioned sputtering there are Cu/Ni alloy films is positioned over into the mixed solution of 2.7M H2O2 and 8.3M HF
In, corrode 100min at 92 DEG C, corrode silicon chip surface and go out silicon nanostructure, i.e., black silicon structure is molten with hydrochloric acid after corroding
Liquid is cleaned to it, removes the Ni granules of residual, last deionized water cleaning silicon chip;
Step 4, prepares black silicon solar cell:
1) by the silicon chip for preparing, diffusion layer being diffuseed to form using phosphorus oxychloride liquid source, diffusion temperature is 800 DEG C~
1150℃;Etched using the plasma periphery of carbon tetrafluoride and oxygen, the diffusion layer at the edge of silicon chip is removed, make upper and lower two
Face separates, and then removes phosphorosilicate glass to Wafer Cleaning 30s using low concentration hydrofluoric acid solution (3vol%);
2) by Fe3O4:P3HT:PCBM=0.018:1:Fe3O4 magnetic nano-particles are doped to light and are lived by 0.8 mass ratio
In property layer solution, doping content is 1%, and then silicon chip is placed in above-mentioned photoactive layer solution, sonic oscillation 30min, in silicon
Piece surface covers one layer of photoactive layer;
Wherein, Fe3O4 magnetic nano-particles are prepared as follows using liquid phase coprecipitation method:By 0.85g (3.1mmol)
FeCl36H2O and 0.3g (1.5mmol) FeCl24H2O, is dissolved under nitrogen protection in 200ml ultra-pure waters and makes iron salt
Mixed solution;At 80 DEG C, the Dilute Ammonia Solution that 2ml mass concentrations are 25% is slowly added to iron salt and is mixed by vigorous magnetic stirring
In closing solution, when solution value is increased to 7~8, iron salt hydrolysis produce the Fe3O4 magnetic nano-particles of a large amount of black, continue to drip
Hydro-oxidation helium to pH=9 reacts 3h, makes hydrolysis tend to complete;By black Fe3O4Magnetic nano-particle Magnet is from solution separating
Out, milli-Q water, in being then dispersed in 200ml ultra-pure waters, add 2ml mass concentrations be 25% Dilute Ammonia Solution and
1ml Oleic acid, in 80 DEG C of constant temperature vigorous magnetic stirring 1h.The concentrated hydrochloric acid that mass concentration is 36% is slowly added in most backward solution,
Until produce lumpy precipitate in flask, by lumpy precipitate with, again with ethanol purge 3 times, removing unreacted oil after Magnet collection
Acid, obtains the Fe of oleic acid modified3O4Magnetic nano-particle;
3) using high-temperature thermal oxidation method, the silicon chip of above-mentioned gained is loaded into into high temperature oxidation furnace, into stove oxygen is passed through, make silicon
In oxidation atmosphere, surface is gradually oxidized and generates 5~10nm thick SiO piece2, then the silicon chip is put into into magnetic control sputtering device
In, one layer of Al is deposited with first using reaction magnetocontrol sputtering method2O3Then thin film, thickness about 40nm recycles PECVD deposition
One layer of silicon nitride so as to form SiO2/Al2O3/SiNXOverlayer passivation film;
4) buffer electrode layer is prepared:Using radio frequency magnetron sputtering method, one is deposited in silicon chip upper and lower surface respectively
Layer Cr films, thickness is 100nm, used as the cushion of upper/lower electrode;
5) electrode is prepared:Using the method for silk screen printing, the upper/lower electrode and back of the body electricity of black silicon solar cell are made respectively
, finally black silicon solar cell is sintered, make electrode form good Ohmic contact with silicon, then connect a wire to up and down
Electrode.
Test result:
The black silion cell characteristic of condition is irradiated in AM1.5 standard analogs light source:
Open-circuit voltage is 0.965V, and short circuit current is 58.36mA/cm2, fill factor, curve factor is 80.63%;Black silion cell reflection
Rate is 2.1%.The carrier lifetime of battery is measured using QSSPC, as injection carrier concentration △ n=1015cm-3When, it is effectively few
Number carrier lifetime is 10.9 μ s.
It is 26.58% that test obtains the solar energy conversion efficiency of the LED street lamp, reflectance about 2.1%, the Jing to sunlight
3000 retests are crossed, transformation efficiency variable quantity is less than 14%, and the high conversion efficiency of the LED street lamp is reproducible.
With regard to the device in above-described embodiment, wherein modules perform the concrete mode of operation in relevant the method
Embodiment in be described in detail, explanation will be not set forth in detail herein.
Those skilled in the art will readily occur to its of the present invention after considering description and putting into practice invention disclosed herein
Its embodiment.The application is intended to any modification of the present invention, purposes or adaptations, these modifications, purposes or
Person's adaptations follow the general principle of the present invention and including the undocumented common knowledge in the art of the application
Or conventional techniques.Description and embodiments are considered only as exemplary, and true scope and spirit of the invention are by following
Claim is pointed out.
It should be appreciated that the precision architecture for being described above and being shown in the drawings is the invention is not limited in, and
And can without departing from the scope carry out various modifications and changes.The scope of the present invention is only limited by appended claim.
Claims (3)
1. a kind of LED street lamp for municipal works, it is characterised in that:The LED street lamp includes Transparent lamp shade, detachable
LED light source, power supply, controlling switch and sensor;The Dismantlable LED light is provided with multiple;The power supply and sensing
Device and controlling switch connect, and the power supply is connected with Dismantlable LED light.
2. a kind of LED street lamp for municipal works according to claim 1, it is characterised in that:The power supply is by the sun
Can battery component composition;The Dismantlable LED light is made up of multiple LEDs being connected with each other, and is provided with the LED
Multiple lamp beads.
3. a kind of LED street lamp for municipal works according to claim 2, it is characterised in that:The quantity of the lamp bead
For 50~60.
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CN102353010A (en) * | 2011-09-02 | 2012-02-15 | 房雪锋 | Acousto-optic emergency control solar thermoelectric complementary light emitting diode (LED) lamp |
CN104393114A (en) * | 2014-11-17 | 2015-03-04 | 中国电子科技集团公司第四十八研究所 | Preparation method of polycrystalline black silicon of micro-nano composite suede structure |
CN204534397U (en) * | 2015-01-26 | 2015-08-05 | 李英 | Intelligent solar LED street lamp |
CN204859641U (en) * | 2015-07-16 | 2015-12-09 | 昆明恩辉电子电气有限公司 | Automatic LED street lamp of luminance is adjusted to sensitization |
CN204879912U (en) * | 2015-08-11 | 2015-12-16 | 云南睿利科技有限公司 | Lightning protection LED solar street lamp |
CN105276514A (en) * | 2015-11-27 | 2016-01-27 | 宁波皓升半导体照明有限公司 | Solar LED streetlamp |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN102353010A (en) * | 2011-09-02 | 2012-02-15 | 房雪锋 | Acousto-optic emergency control solar thermoelectric complementary light emitting diode (LED) lamp |
CN104393114A (en) * | 2014-11-17 | 2015-03-04 | 中国电子科技集团公司第四十八研究所 | Preparation method of polycrystalline black silicon of micro-nano composite suede structure |
CN204534397U (en) * | 2015-01-26 | 2015-08-05 | 李英 | Intelligent solar LED street lamp |
CN204859641U (en) * | 2015-07-16 | 2015-12-09 | 昆明恩辉电子电气有限公司 | Automatic LED street lamp of luminance is adjusted to sensitization |
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