CN106676490B - A kind of preparation of titanium/nickel composite membrane and the method for connecting titanium or titanium alloy - Google Patents
A kind of preparation of titanium/nickel composite membrane and the method for connecting titanium or titanium alloy Download PDFInfo
- Publication number
- CN106676490B CN106676490B CN201710013832.0A CN201710013832A CN106676490B CN 106676490 B CN106676490 B CN 106676490B CN 201710013832 A CN201710013832 A CN 201710013832A CN 106676490 B CN106676490 B CN 106676490B
- Authority
- CN
- China
- Prior art keywords
- titanium
- temperature
- titanium alloy
- nickel
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010936 titanium Substances 0.000 title claims abstract description 75
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910052719 titanium Inorganic materials 0.000 title claims abstract description 74
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 49
- 229910001069 Ti alloy Inorganic materials 0.000 title claims abstract description 46
- 239000002131 composite material Substances 0.000 title claims abstract description 44
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000012528 membrane Substances 0.000 title claims abstract description 12
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 238000001755 magnetron sputter deposition Methods 0.000 claims abstract description 21
- 239000010410 layer Substances 0.000 claims abstract description 15
- 238000004544 sputter deposition Methods 0.000 claims abstract description 7
- 230000000694 effects Effects 0.000 claims abstract description 6
- 239000002356 single layer Substances 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 3
- 238000003475 lamination Methods 0.000 claims description 35
- 239000002120 nanofilm Substances 0.000 claims description 34
- 238000005219 brazing Methods 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 230000008021 deposition Effects 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 4
- 208000037656 Respiratory Sounds Diseases 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 23
- 238000012360 testing method Methods 0.000 description 9
- 239000010409 thin film Substances 0.000 description 9
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 7
- 238000003032 molecular docking Methods 0.000 description 6
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/14—Titanium or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A kind of preparation of titanium/nickel composite membrane and the method for connecting titanium or titanium alloy belong to welding technology field.It is characterized by: the composite membrane is prepared by magnetron sputtering, titanium and nickel two kinds of elements composition, wherein the thickness in monolayer of titanium and nickel is 20~35nm, and 50~100 layers of alternating sputtering, two sides are respectively the titanium of 1 μ m-thick deposited by magnetron sputtering, and overall thickness is 4~9 μm；500 DEG C are carried out to it under the effect of 5~50MPa pressure and 800 DEG C of two sections of temperature keep the temperature 30min and 60min respectively, and then connects the heating process of titanium or titanium alloy.The problems such as present invention solves titanium alloy connection temperature height, and connection is inaccurate, influences the performance of titanium alloy.The titanium coating of two sides of the present invention ensure that with the wetability of connect base material, pressure application effectively reduce jointing crackle and stomata the defects of, make connector combine it is closer, improve the intensity of jointing, and then improve the application range of connection.
Description
Technical field
The invention belongs to welding technology fields, are related to a kind of using titanium/nickel lamination composite nano film preparation and diffusion
The method for connecting titanium or titanium alloy.
Background technique
Titanium alloy there is outstanding advantages of density is low, corrosion-resistant, specific strength is high, heat-resisting and be referred to as " space metal " or
" marine metal " is widely used in the fields such as Aeronautics and Astronautics, shipbuilding, electric power, petrochemical industry.Its common welding method has tungsten electrode
Argon arc welding, electron-bombardment welding and Laser Welding etc..But Tig Welding speed is relatively slow, weldment deforms larger, seam organization
It is coarseer, the miscellaneous equal welding defects of stomata and tungsten clip easy to produce in weld seam；Easily there is stomata in vacuum electron beam welding line；Laser
It welds penetration power and is not so good as electronics beam intensity, thicker workpiece cannot be welded.Therefore, study a kind of speed of welding is fast, stomata be mingled with it is few, and
The method of strong applicability is extremely urgent.
Diffusion in vacuum Pressure Welding is since it is few to weld contamination, deformation is small, saves material, the essence for being suitble to postwelding not reprocess
Close part and while combining with other heating process can greatly improve its production efficiency and by extensive concern.Nano film material tool
There is the features such as reducing fusing point and crystallization temperature, be improved efficiency when being used as to connect middle layer, reduce cost and other effects.
The present invention is directed to prepare a kind of Ti/Ni lamination composite nano film that wettability is excellent, titanium can be effectively reduced
With the reaction temperature and fusion temperature of nickel, and with rolling state film have more accurate dimensional accuracy and ingredient precision, thus more
The performances such as the good ingredient of control final reacting product.And this film can be used as solder middle layer, be used for titanium and titanium
The connection of alloy forms even tissue, function admirable, without the tight joint of crackle and stomata.
Summary of the invention
The problems such as present invention aim to address titanium alloy connection temperature height, and connection is inaccurate, influence the performance of titanium alloy.
A kind of preparation of titanium/nickel composite membrane and the method for connecting titanium or titanium alloy, it is characterised in that: the composite membrane by
Magnetron sputtering preparation, titanium and nickel two kinds of elements composition, wherein the thickness in monolayer of titanium and nickel is 20~35nm, and alternating sputtering 50~
100 layers, two sides are respectively the titanium of 1 μ m-thick deposited by magnetron sputtering, and overall thickness is 4~9 μm；It is acted in 5~50MPa pressure
Under carry out 500 DEG C to it and 800 DEG C of two sections of temperature keep the temperature 30min and 60min respectively, and then connect the heater of titanium or titanium alloy
Skill.
Further, by this lamination composite nano film under 5MPa pressure, 500 DEG C and 800 DEG C of two sections of temperature are kept the temperature respectively
30min connects pure titanium and pure titanium with 60min.
Further, by this lamination composite nano film under 10MPa pressure, 500 DEG C and 800 DEG C of two sections of temperature are kept the temperature respectively
30min connects pure titanium and TC4 titanium alloy with 60min.
Further, by this lamination composite nano film under 20MPa pressure, 500 DEG C and 800 DEG C of two sections of temperature are kept the temperature respectively
30min connects pure titanium and pure titanium with 60min.
Further, by this lamination composite nano film under 30MPa pressure, 500 DEG C and 800 DEG C of two sections of temperature are kept the temperature respectively
30min connects pure titanium and TC4 titanium alloy with 60min.
Further, by this lamination composite nano film under 40MPa pressure, 500 DEG C and 800 DEG C of two sections of temperature are kept the temperature respectively
30min connects TC4 titanium alloy and TC4 titanium alloy with 60min.
Further, by this lamination composite nano film under 50MPa pressure, 500 DEG C and 800 DEG C of two sections of temperature are kept the temperature respectively
30min connects pure titanium and TC4 titanium alloy with 60min.
More particularly:
Lamination composite nano film is prepared with the method for magnetron sputtering.Monocrystalline silicon piece ultrasonic wave-alcohol washes 3 are divided
Clock, drying, is put into magnetron sputtering chamber, and the thickness of film on silicon wafer is controlled by adjusting the magnetron sputtering time.Thin film sputtering is completed
Film is removed afterwards, is processed into the square of 10mm × 10mm, be layered between 10mm × 10mm × 5mm cuboid titanium alloy into
The connection of row vacuum pressure.400#, 600#, 800#, 1000# and 1500# are passed through in the surface that wherein titanium alloy is contacted with nano thin-film
Waterproof abrasive paper successively polishes any surface finish without obvious scratch, and by ultrasonic wave-alcohol washes and drying and processing.
Its membrane middle layer is made of two kinds of elements of titanium and nickel, and thickness in monolayer is 20~35nm, alternating deposit 50 to 100
Layer, two sides are respectively the titanium of 1 μ m-thick deposited by magnetron sputtering, and film final thickness is 4~9 μm.It is thin by what is be successfully prepared
Film is removed from monocrystalline silicon piece, and carries out DSC test, and testing its reaction temperature is 350~500 DEG C and 600~750 DEG C.By titanium
Alloy-nano thin-film-titanium alloy is successively overlapped and is put into vacuum brazing furnace, carries out 500 to it under the effect of 5~50MPa pressure
DEG C and the heating process that keeps the temperature respectively of 800 DEG C of two sections of temperature, obtain the jointing of function admirable.
It can be directly as middle layer brazing of titanium and titanium alloy with titanium/nickel plural layers it is an advantage of the invention that demonstrating.
The advantages of this middle layer for convenience of preparation and use, connect that temperature is low and connector is uniform.1, film can be set by magnetron sputtering
Standby direct setting program sputters completion automatically, and exists with sheet film, it may be convenient to the carrying of multiple films is carried out, and
And what be can be convenient when being attached using film is removed film from silicon wafer.2, due to the nanometer of nano-multilayer film
Effect effectively reduces the temperature of titanium nickel reactant, so that temperature is less than the phase transformation of titanium or titanium alloy when connection titanium alloy
Point, to reduce the influence connected to titanium alloy substrate performance.3, it is prepared due to film with magnetron sputtering method, control can be passed through
Power, granularity, modulation period and the film thickness of time and period control nano thin-film of magnetron sputtering, have been effectively ensured thin
The stable homogeneous of film nano effect, atomic ratio and general thickness effectively increases the essence of jointing compared with common solder
Degree and stability.The advantages of Joining Technology of the present invention, is main are as follows: the titanium coating of two sides ensure that and the wetting of connect base material
Property, pressure application effectively reduce jointing crackle and stomata the defects of, make connector combine it is closer, improve connection
The intensity of connector, and then improve the application range of connection.
Detailed description of the invention
Fig. 1 is the DSC image of nano thin-film of the present invention (number 4).
Fig. 2 is titanium/nickel film connection schematic diagram
Fig. 3 is that nano thin-film (number 1) is applied to the connector SEM figure after connection by the present invention.
Fig. 4 is the heating process curve that nano thin-film is attached by the present invention in vacuum brazing furnace.
Fig. 5 is the test specimen and fracture figure after shearing test.
Specific embodiment
Technical solution of the present invention is further described below with reference to embodiment.The present invention be according to the following steps into
Capable:
Lamination composite nano film is prepared with the method for magnetron sputtering.Monocrystalline silicon piece ultrasonic wave-alcohol washes 3 are divided
Clock, drying, is put into magnetron sputtering chamber, and the thickness of film on silicon wafer is controlled by adjusting the magnetron sputtering time.Thin film sputtering is completed
Film is removed afterwards, is processed into the square of 10mm × 10mm, be layered between 10mm × 10mm × 5mm cuboid titanium alloy into
The connection of row vacuum pressure.400#, 600#, 800#, 1000# and 1500# water are passed through in the face that wherein titanium alloy is contacted with nano thin-film
Sand paper successively polishes any surface finish without obvious scratch, and by ultrasonic wave-alcohol washes and drying and processing.
Its membrane middle layer is made of two kinds of elements of titanium and nickel, and thickness in monolayer is 20~35nm, alternating deposit 50 to 100
Layer, two sides are respectively the titanium of 1 μ m-thick deposited by magnetron sputtering, and film final thickness is 4~9 μm.It is thin by what is be successfully prepared
Film is removed from monocrystalline silicon piece, and carries out DSC test, and testing its reaction temperature is 350~500 DEG C and 600~750 DEG C.By titanium
Alloy-nano thin-film-titanium alloy is successively overlapped and is put into vacuum brazing furnace, carries out 500 to it under the effect of 5~50MPa pressure
DEG C and the heating process that keeps the temperature respectively of 800 DEG C of two sections of temperature, obtain the jointing of function admirable.
Table 1 gives the embodiment of lamination composite nano film described in technical solution of the present invention
| Number | Titanium layer thickness (nm) | Nickel layer thickness (nm) | Sputter the period | Overall film thickness (μm) |
| 1 | 20 | 20 | 50 | 4 |
| 2 | 20 | 30 | 50 | 4.5 |
| 3 | 20 | 35 | 50 | 4.75 |
| 4 | 25 | 20 | 70 | 5.15 |
| 5 | 25 | 30 | 70 | 5.85 |
| 6 | 25 | 35 | 70 | 6.2 |
| 7 | 35 | 20 | 100 | 7.5 |
| 8 | 35 | 30 | 100 | 8.5 |
| 9 | 35 | 35 | 100 | 9 |
Lamination composite nano film solder described in above-described embodiment is prepared by following process route:
Titanium/nickel lamination composite nano film is prepared using high vacuum magnetron sputtering apparatus, wherein disc-shaped target
Diameter 80mm, titanium target purity 99.95%, nickel target purity are higher than 99.96%, and substrate is monocrystalline silicon piece.First by monocrystalline silicon piece into
Row ultrasonic wave-alcohol washes 3 minutes, is baked to later, is put into magnetron sputtering chamber.Magnetron sputtering chamber is carried out to be evacuated to 2
×10-4Pa is passed through 99.99% high purity argon in a vacuum chamber, and setting flow is 40L/min, and operating air pressure is arranged
0.5Pa, setting observing and controlling sputtering power are 250w.After setting completed, after stable equipment operation, titanium nickel target is carried out respectively pre-
Sputtering 5 minutes.The modulation period of nano thin-film on monocrystalline silicon piece is controlled by adjusting the magnetron sputtering time of every layer of titanium and nickel
And overall thickness.
It is using the method that lamination composite nano film of the present invention is attached:
The above-mentioned titanium prepared or titanium alloy, lamination composite nano film and titanium or titanium alloy are successively overlapped, wherein with
The contact of lamination composite nano film is the surface that titanium alloy has been subjected to polishing, the size of lamination composite nano film and titanium alloy
It is respectively as follows: 10 × 10mm and 10 × 10 × 5mm.It puts it into vacuum brazing furnace, applies certain pressure, institute in attached drawing 3 is set
The heating process curve shown carries out vacuum brazing.Test specimen furnace cooling after the completion of soldering.
Embodiment one: it is using the pure titanium of lamination composite nano film vacuum brazing of the present invention and pure titanium, the purity of titanium
99.99%, 10 × 10 × 5mm of size apply the pressure of 5MPa using docking mode.9 lamination composite Nano of number after fusing
Film can smoothly fill brazed seam, form good connector.The shear strength of soldered fitting is up to 40-55MPa.
Embodiment two: it is using the pure titanium of lamination composite nano film vacuum brazing of the present invention and TC4 titanium alloy, the purity of titanium
99.99%, 10 × 10 × 5mm of size apply the pressure of 10MPa using docking mode.8 lamination of number after fusing is compound to be received
Rice film can fill brazed seam, form good connector.The shear strength of soldered fitting is up to 40-50MPa.
Embodiment three: the use pure titanium of lamination composite nano film vacuum brazing of the present invention and pure titanium, size 10 × 10 ×
5mm applies the pressure of 20MPa using docking mode.The pure titanium of 6 lamination composite nano film of number and surrounding after fusing occurs
Diffusion forms fine and close connector.The shear strength of soldered fitting is up to 44-60MPa.
Example IV: the pure titanium of lamination composite nano film vacuum brazing of the present invention and TC4 titanium alloy, size 10 × 10 are used
× 5mm applies the pressure of 30MPa using docking mode.5 lamination composite nano film of number after fusing and the pure titanium of surrounding and
Titanium alloy is spread, and forms fine and close connector.The shear strength of soldered fitting is up to 50-60MPa.
Embodiment five: using 3 lamination composite nano film vacuum brazing TC4 titanium alloy of number and TC4 titanium alloy of the invention,
10 × 10 × 5mm of size applies the pressure of 40MPa using docking mode.Due to the presence of pressure, so that soldered fitting is very
Closely, and brazed seam metal and titanium alloy line of demarcation are obvious, do not generate brittle phase with matrix and reduce the performance of test specimen.
The shear strength of soldered fitting is up to 60-80MPa.
Embodiment six: the pure titanium of 1 lamination composite nano film vacuum brazing of number of the invention and TC4 titanium alloy, size are used
10 × 10 × 5mm applies the pressure of 50MPa using docking mode.Due to the presence of pressure, so that soldered fitting is closely,
And brazed seam metal and titanium alloy and pure titanium line of demarcation are obvious, do not generate brittle phase and reduce the performance of test specimen, connector
Function admirable.The shear strength of soldered fitting is up to 80-90MPa.
Claims (8)
1. a kind of titanium/nickel composite membrane preparation method, it is characterised in that: the composite membrane is prepared by magnetron sputtering, titanium and nickel
Two kinds of element compositions, wherein the thickness in monolayer of titanium and nickel is 20~35nm, and 50~100 layers of alternating sputtering, two sides are respectively logical
The titanium of 1 μ m-thick of magnetron sputtering deposition is crossed, overall thickness is 4~9 μm and obtains lamination composite nano film.
2. a kind of titanium/method of nickel composite membrane connection titanium or titanium alloy, it is characterised in that: the titanium/nickel composite membrane 5~
500 DEG C are carried out to it under the effect of 50MPa pressure and 800 DEG C of two sections of temperature keep the temperature 30min and 60min respectively, it is compound using titanium/nickel
Film, that is, lamination composite nano film vacuum brazing, and then connect titanium or titanium alloy.
3. according to the method described in claim 2, it is characterized by: by this lamination composite nano film under 5MPa pressure, 500
DEG C keeping the temperature 30min respectively with 800 DEG C of two sections of temperature connects pure titanium and pure titanium with 60min.
4. according to the method described in claim 2, it is characterized by: by this lamination composite nano film under 10MPa pressure,
500 DEG C keep the temperature 30min with 800 DEG C of two sections of temperature respectively and connect pure titanium and TC4 titanium alloy with 60min.
5. according to the method described in claim 2, it is characterized by: by this lamination composite nano film under 20MPa pressure,
500 DEG C keep the temperature 30min with 800 DEG C of two sections of temperature respectively and connect pure titanium and pure titanium with 60min.
6. according to the method described in claim 2, it is characterized by: by this lamination composite nano film under 30MPa pressure,
500 DEG C keep the temperature 30min with 800 DEG C of two sections of temperature respectively and connect pure titanium and TC4 titanium alloy with 60min.
7. according to the method described in claim 2, it is characterized by: by this lamination composite nano film under 40MPa pressure,
500 DEG C keep the temperature 30min with 800 DEG C of two sections of temperature respectively and connect TC4 titanium alloy and TC4 titanium alloy with 60min.
8. according to the method described in claim 2, it is characterized by: by this lamination composite nano film under 50MPa pressure,
500 DEG C keep the temperature 30min with 800 DEG C of two sections of temperature respectively and connect pure titanium and TC4 titanium alloy with 60min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710013832.0A CN106676490B (en) | 2017-01-09 | 2017-01-09 | A kind of preparation of titanium/nickel composite membrane and the method for connecting titanium or titanium alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710013832.0A CN106676490B (en) | 2017-01-09 | 2017-01-09 | A kind of preparation of titanium/nickel composite membrane and the method for connecting titanium or titanium alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106676490A CN106676490A (en) | 2017-05-17 |
| CN106676490B true CN106676490B (en) | 2019-04-12 |
Family
ID=58849301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710013832.0A Active CN106676490B (en) | 2017-01-09 | 2017-01-09 | A kind of preparation of titanium/nickel composite membrane and the method for connecting titanium or titanium alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106676490B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101402268A (en) * | 2008-11-21 | 2009-04-08 | 西安天力金属复合材料有限公司 | Titanium and titanium alloy/steel composite board and method of manufacturing the same |
| CN101768719A (en) * | 2010-01-30 | 2010-07-07 | 深圳市欧帝光学有限公司 | Ti-Ni shape memory alloy glasses manufacturing process |
| CN204387029U (en) * | 2014-12-24 | 2015-06-10 | 湖南湘投金天钛金属有限公司 | A kind of connection set rolled up with titanium or titanium alloy for nickel volume |
| CN105063563A (en) * | 2015-07-31 | 2015-11-18 | 内蒙古科技大学 | Surface modification method for magnesium alloy material |
| CN105925949A (en) * | 2016-05-23 | 2016-09-07 | 东南大学 | Method for preparing micro-nano porous structure on titanium or titanium alloy surface |
| CN106271214A (en) * | 2016-09-26 | 2017-01-04 | 北京工业大学 | A kind of preparation method of soldering rustless steel Ag Cu/W nano-multilayer film solder |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020043456A1 (en) * | 2000-02-29 | 2002-04-18 | Ho Ken K. | Bimorphic, compositionally-graded, sputter-deposited, thin film shape memory device |
-
2017
- 2017-01-09 CN CN201710013832.0A patent/CN106676490B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101402268A (en) * | 2008-11-21 | 2009-04-08 | 西安天力金属复合材料有限公司 | Titanium and titanium alloy/steel composite board and method of manufacturing the same |
| CN101768719A (en) * | 2010-01-30 | 2010-07-07 | 深圳市欧帝光学有限公司 | Ti-Ni shape memory alloy glasses manufacturing process |
| CN204387029U (en) * | 2014-12-24 | 2015-06-10 | 湖南湘投金天钛金属有限公司 | A kind of connection set rolled up with titanium or titanium alloy for nickel volume |
| CN105063563A (en) * | 2015-07-31 | 2015-11-18 | 内蒙古科技大学 | Surface modification method for magnesium alloy material |
| CN105925949A (en) * | 2016-05-23 | 2016-09-07 | 东南大学 | Method for preparing micro-nano porous structure on titanium or titanium alloy surface |
| CN106271214A (en) * | 2016-09-26 | 2017-01-04 | 北京工业大学 | A kind of preparation method of soldering rustless steel Ag Cu/W nano-multilayer film solder |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106676490A (en) | 2017-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102554455B (en) | Diffusion welding method for tungsten-titanium alloy target and copper alloy back plate | |
| Koleňák et al. | Shear strength and wettability of active Sn3. 5Ag4Ti (Ce, Ga) solder on Al2O3 ceramics | |
| CN106271214B (en) | A kind of preparation method being brazed stainless steel Ag-Cu/W nano-multilayer film solder | |
| US5988488A (en) | Process of bonding copper and tungsten | |
| CN110303236A (en) | It is a kind of for tungsten or the hot isostatic pressing diffusion connection method of tungsten alloy and high strength steel | |
| CN113001024B (en) | Laser welding method for dissimilar materials | |
| CN101494322A (en) | Tungsten copper connection method | |
| JP5552543B2 (en) | Zygote | |
| CN110734296B (en) | Connecting joint based on nickel-based superalloy and ceramic and preparation method thereof | |
| CN100532330C (en) | Method of connecting ceramic by low temperature active vacuum diffusion | |
| CN102489813A (en) | Vacuum active brazing process of molybdenum-copper alloys and stainless steel | |
| CN105220121B (en) | A kind of target material assembly and preparation method thereof | |
| CN106181000A (en) | A kind of tungsten alloy and the method for attachment of molybdenum alloy | |
| CN109604802A (en) | The connection method of tungsten or tungsten alloy and steel, the connection method of profile and sectional material joint | |
| CN111347147A (en) | Hot isostatic pressing connection method of tungsten and heat sink material | |
| CN110732768A (en) | same/different metal connection forming method based on amorphous alloy | |
| CN112620850A (en) | High-temperature brazing connection method for graphite and stainless steel | |
| CN106676490B (en) | A kind of preparation of titanium/nickel composite membrane and the method for connecting titanium or titanium alloy | |
| CN105925948B (en) | A kind of aluminum alloy surface activation connection method | |
| CN113909801A (en) | Preparation method of low-activation steel and tungsten all-solid-solution joint | |
| CN108856941A (en) | A kind of composite soldering and its method for being brazed TC4 titanium alloy | |
| CN105328291A (en) | Method for improving brazing performance of hard alloys through surface treatment | |
| CN108907512A (en) | Enhancing aluminum-base composite material by silicon carbide particles gallium base solder preparation and application | |
| CN107447194A (en) | Tantalum target component and its manufacture method | |
| JP6561481B2 (en) | Method of joining steel materials |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240613 Address after: Floor 1, No. 58, Lane 1, Zhensheng Road, Zhongdai Street, Pinghu City, Jiaxing City, Zhejiang Province, 314299 Patentee after: Temiko (Jiaxing) New Materials Co.,Ltd. Country or region after: China Address before: 100124 No. 100 Chaoyang District Ping Tian Park, Beijing Patentee before: Beijing University of Technology Country or region before: China |