CN106670516A - 刀具及其镀膜工艺 - Google Patents
刀具及其镀膜工艺 Download PDFInfo
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Abstract
本发明涉及一种刀具及其镀膜工艺,该刀具包括刀刃、以及附在刀刃上的镀膜层,所述镀膜层从内到外依次包括:嫁接膜层,所述嫁接膜层是铌或不锈钢膜层;铟锡合金膜层;硬度加强层,所述硬度加强层是氮化钛或氮化硅膜层;以及离型力强化层,所述离型力强化层是单晶硅或者氟化钙或者氟化镁膜层。该刀具可防止溢胶且耐磨性能良好。
Description
技术领域
本发明涉及刀具领域,更具体地说,涉及一种刀具及其镀膜工艺。
背景技术
在特种印刷行业,为了方便附帶有双面胶的制品(例如,模切件、装饰及功能性LOGO、电池标签、保洁品及化妆品标签、电子产品外观特征卷标等等)与精密机构件或产品更好更快地贴合,多采用刀模对双面胶材料进行模切,来制成最终的双面胶制品。
鉴于双面胶材料的特性,市面上的模切刀模存在如下缺点:采用这些普通刀模来模切双面胶材料时,双面胶材料边缘的胶会被刀模的刀刃带出一部分,造成溢胶现象。有部分刀模经AF镀膜处理,但在斩型过程中这些刀模的镀层不耐磨,刀模寿命短,且起不到防溢胶的作用。也有部分刀模的刀刃涂覆铁氟龙材质以减轻溢胶现象,但是这种刀模在斩切较厚(例如胶厚度大于0.10mm)的双面胶材料时,会有斩不动的情况,此外,刀模的刀刃涂覆铁氟龙仍然会不耐磨。
发明内容
本发明要解决的技术问题在于,针对现有技术中刀模的上述缺陷,提供一种刀具及其镀膜工艺,该刀具可防止溢胶且耐磨性能良好。
本发明解决其技术问题所采用的技术方案是:构造一种刀具,包括刀刃、以及附在刀刃上的镀膜层,所述镀膜层从内到外依次包括:
嫁接膜层,所述嫁接膜层是铌或不锈钢膜层;
铟锡合金膜层;
硬度加强层,所述硬度加强层是氮化钛或氮化硅膜层;以及
离型力强化层,所述离型力强化层是单晶硅或者氟化钙或者氟化镁膜层。
根据本发明所述的刀具,所述嫁接膜层的膜厚为
根据本发明所述的刀具,所述铟锡合金膜层的膜厚为
根据本发明所述的刀具,所述硬度加强层的厚度为
根据本发明所述的刀具,所述离型力强化层的膜厚为
本发明还提供了一种刀具的镀膜工艺,包括以下步骤:
S1、在真空室内采用离子源对刀具进行轰击清洁;
S2、用电子束蒸发镀膜方式在所述刀具的表面进行镀膜;该步骤S2包括:
S21、在刀具表面沉积嫁接膜层,所述嫁接膜层是铌或不锈钢膜层;
S22、在所述嫁接膜层上沉积铟锡合金膜层;
S23、在所述铟锡合金膜层上沉积硬度加强层,所述硬度加强层是氮化钛或氮化硅膜层;以及
S24、在硬度加强层上沉积离型力强化层,所述离型力强化层是单晶硅或者氟化钙或者氟化镁膜层。
根据本发明所述的刀具的镀膜工艺,在所述步骤S2中,所述真空室内加热至255~265℃,所述真空室内的真空度为3.5*E-3Pa~1.5*E-3Pa。
根据本发明所述的刀具的镀膜工艺,所述刀具固定在夹具上,而所述夹具固定在所述真空室内的转架上,所述转架在步骤S1及S2的过程中匀速旋转。
根据本发明所述的刀具的镀膜工艺,在所述步骤S22沉积铟锡合金膜层的过程中,以4.5~5.5SCCM的气体流量向真空室内供给氧气。
根据本发明所述的刀具的镀膜工艺,在所述步骤S23中,在真空室内放置钛或硅材料,并以34~36SCCM的气体流量向真空室内供给氮气。
实施本发明的刀具及其镀膜工艺,具有以下有益效果:对刀具进行镀膜后,溢胶问题得到较大程度的改善。此外由于硬度加强层是氮化钛或氮化硅膜层,其硬度较高,具有良好的耐磨性,也改善了刀具的耐磨性能。
附图说明
下面将结合附图及实施例对本发明作进一步说明,附图中:
图1是本发明中刀模的示意图;
图2是本发明中刀具的截面图。
图3是本发明中镀膜工艺的流程图。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。
图1是本发明中刀模100的示意图。如图1所示,本发明的刀模100包括刀托200、连接在刀托200上的刀具300。其中刀托200为金属或塑料制成,在刀托200上开有安装槽,刀具300镶嵌在安装槽内,从而固定在刀托200上。刀具300包括刀刃301、以及附在刀刃301上的镀膜层302。其中刀刃301为不锈钢等金属制成。
图2是本发明中刀具300的截面图。如图2所示,镀膜层302从内到外依次包括:嫁接膜层303、铟锡合金膜层304、硬度加强层305、以及离型力强化层306。其中嫁接膜层303是铌或不锈钢膜层,其作用是在随后的膜层与刀刃301之间起到嫁接作用,使得随后的膜层能够牢固地附着在刀具300上。硬度加强层305是氮化钛或氮化硅膜层,其硬度较高,具有良好的耐磨性。离型力强化层306是单晶硅或者氟化钙或者氟化镁膜层,使得镀膜后的刀具300具有良好的离型力,在斩切双面胶材料时不会出现溢胶现象。嫁接膜层303的膜厚为铟锡合金膜层304的膜厚为硬度加强层305的厚度为离型力强化层306的膜厚为
图3是本发明中镀膜工艺的流程图。以下将结合图3描述如何在刀具300上形成镀膜层302。在本发明中,采用电子束真空蒸发的真空镀膜方式,在真空条件下,利用电子束激发镀膜材料,使镀膜材料气化或升华并沉积在刀具300上,从而形成镀膜层302。
首先,在步骤S1中,在真空室内采用离子源对刀具300进行轰击清洁。将刀具300固定在夹具上,而夹具固定在镀膜设备的真空室内的转架上。转架在清洁及镀膜的过程中匀速旋转,以便能够同时对刀具的两个表面进行清洁和镀膜。对真空室进行预抽真空,使真空室内的真空度达到5.5*E-3Pa~4.5*E-3Pa。之后开启离子源对刀具300进行轰击清洁。在轰击的过程中,保持离子源的阳极电压为95~105V,离子源的阴极电流为4~4.2A,离子源的阳极电流为3.9~4.1A,以便保持合适的轰击能量。轰击的过程中,向真空室内供给惰性气体,同时抽真空以便将真空室内的真空度保持在不低于4.9*E-3Pa~5.1*E-3Pa。惰性气体的供给方式为自动供给,且惰性气体可以是例如氩气。轰击时间为5分钟。
在轰击过程中,离子轰击刀具300的表面,使得刀具300表面的灰尘、杂质等脱落,这些灰尘、杂质随着抽真空的过程而从真空室内抽出。
在步骤S2中,采用电子束蒸发镀膜方式在刀具300的表面进行镀膜。在镀膜前,将真空室内加热至255~265℃。真空室的初始真空度为3.5*E-3Pa~2.5*E-3Pa。在镀膜的过程中,保持真空室内的真空度为3.5*E-3Pa~1.5*E-3Pa。
步骤S2包括:S21、在刀具300表面沉积嫁接膜层303。该嫁接膜层303源自铌或不锈钢材料,该材料为柱状,直径为1~2mm、长度为2~3cm,纯度为79.9%~89.99%。在沉积嫁接膜层303时,阻蒸电流为280~300A,膜层沉积速率为在沉积嫁接膜层303的过程中,不向真空室内供给气体。
S22、在嫁接膜层303上沉积铟锡合金膜层304。该铟锡合金膜层304的材料来自铟锡合金,该材料为条状,直径为1~2mm、长度为3~4cm,纯度为68%~72%。在沉积铟锡合金膜层304时,阻蒸电流为220~260A,膜层沉积速率为在沉积铟锡合金膜层304的过程中,以4.5~5.5SCCM的气体流量向真空室内供给氧气。这是因为铟锡合金容易氧化,供给适量的氧气,可以使铟锡合金适当氧化,这样在刀具300制成以后,就不会再因与氧气接触而氧化。
S23、在铟锡合金膜层304上沉积硬度加强层305。该硬化加强层305来自置于真空室内的钛或硅材料。该材料为颗粒状,直径为1~2mm、长度为1~2mm,纯度为99.9%~99.99%。在沉积硬化加强层305时,电子束流为350~390mA,膜层沉积速率为以34~36SCCM的气体流量向真空室内供给氮气。这使得材料与氮气发生反应,从而生成对应的氮化钛或氮化硅并沉积在铟锡合金膜层304上。
电子束轰击时会产生光斑,在步骤S23中,将光斑调到最小。在刀具300与材料之间设置有挡板,该挡板将刀具300与材料隔绝。采用电子束对材料进行真空蒸发,并延迟10秒打开挡板。之后继续在刀具300上进行沉积。这是由于在蒸发前材料表面可能有杂质,真空蒸发时,这些杂质也被蒸发,由于挡板将刀具隔绝,蒸发的材料及杂质会沉积在挡板上,而不会沉积在刀具上。
S24、在硬度加强层305上沉积离型力强化层306。该离型力强化层306来自单晶硅或者氟化钙或者氟化镁材料。该材料为颗粒状,直径为1~2mm、长度为1~2mm,纯度为99.9%~99.99%。在沉积硬化加强层305时,电子束流为50~150mA,膜层沉积速率为在沉积离型力强化层306的过程中,不向真空室内供给气体。
电子束轰击时会产生光斑,在步骤S23中,将光斑调到最大。在刀具300与材料之间设置有挡板,该挡板将刀具300与材料隔绝。采用电子束对材料进行真空蒸发,并延迟10秒打开挡板。之后继续在刀具300上进行沉积。这是由于在蒸发前材料表面可能有杂质,真空蒸发时,这些杂质也被蒸发,由于挡板将刀具隔绝,蒸发的材料及杂质会沉积在挡板上,而不会沉积在刀具上。
在整个镀膜过程中,刀具300的转架的转动速度为20-24RPM,以保证刀具的各表面被均匀镀膜。整个镀膜过程持续68-72分钟。
采用镀膜后的刀具300对某一品牌的双面胶材料进行模切,经实验数据统计,在镀膜前,模切得到的产品良率为75.3%;在镀膜后,溢胶问题得到较大程度的改善,模切得到的产品的良率为90.5%,可见产品的良率得到了大幅改善。此外由于硬度加强层305是氮化钛或氮化硅膜层,其硬度较高,具有良好的耐磨性,也改善了刀具300的耐磨性能。
以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。
Claims (10)
1.一种刀具,包括刀刃、以及附在刀刃上的镀膜层,其特征在于,
所述镀膜层从内到外依次包括:
嫁接膜层,所述嫁接膜层是铌或不锈钢膜层;
铟锡合金膜层;
硬度加强层,所述硬度加强层是氮化钛或氮化硅膜层;以及
离型力强化层,所述离型力强化层是单晶硅或者氟化钙或者氟化镁膜层。
2.根据权利要求1所述的刀具,其特征在于,所述嫁接膜层的膜厚为
3.根据权利要求1所述的刀具,其特征在于,所述铟锡合金膜层的膜厚为
4.根据权利要求1所述的刀具,其特征在于,所述硬度加强层的厚度为
5.根据权利要求1所述的刀具,其特征在于,所述离型力强化层的膜厚为
6.一种刀具的镀膜工艺,其特征在于,包括以下步骤:
S1、在真空室内采用离子源对刀具进行轰击清洁;
S2、用电子束蒸发镀膜方式在所述刀具的表面进行镀膜;该步骤S2包括:
S21、在刀具表面沉积嫁接膜层,所述嫁接膜层是铌或不锈钢膜层;
S22、在所述嫁接膜层上沉积铟锡合金膜层;
S23、在所述铟锡合金膜层上沉积硬度加强层,所述硬度加强层是氮化钛或氮化硅膜层;以及
S24、在硬度加强层上沉积离型力强化层,所述离型力强化层是单晶硅或者氟化钙或者氟化镁膜层。
7.根据权利要求6所述的刀具的镀膜工艺,其特征在于,在所述步骤S2中,所述真空室内加热至255~265℃,所述真空室内的真空度为3.5*E-3Pa~1.5*E-3Pa。
8.根据权利要求6所述的刀具的镀膜工艺,其特征在于,所述刀具固定在夹具上,而所述夹具固定在所述真空室内的转架上,所述转架在步骤S1及S2的过程中匀速旋转。
9.根据权利要求7所述的刀具的镀膜工艺,其特征在于,在所述步骤S22沉积铟锡合金膜层的过程中,以4.5~5.5SCCM的气体流量向真空室内供给氧气。
10.根据权利要求7所述的刀具的镀膜工艺,其特征在于,在所述步骤S23中,在真空室内放置钛或硅材料,并以34~36SCCM的气体流量向真空室内供给氮气。
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