CN106658948A - Radiating flexible circuit board and surface coating thereof - Google Patents
Radiating flexible circuit board and surface coating thereof Download PDFInfo
- Publication number
- CN106658948A CN106658948A CN201710011422.2A CN201710011422A CN106658948A CN 106658948 A CN106658948 A CN 106658948A CN 201710011422 A CN201710011422 A CN 201710011422A CN 106658948 A CN106658948 A CN 106658948A
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- Prior art keywords
- parts
- radiating
- surface coating
- fpc
- coating
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Paints Or Removers (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
The invention discloses a radiating flexible circuit board. The radiating flexible circuit board comprises a flexible insulating base layer, a conductive circuit layer and a radiating coating; the conductive circuit layer is located between the flexible insulating base layer and the radiating coating, and the flexible insulating base layer and the conductive circuit layer are bonded in a pressing manner after an adhesive is coated; the radiating coating is formed by curing the coated surface coating; and the surface coating is formed by mixing acrylic resin, epoxy resin, glass fibers, a heat-conducting filling, sodium dodecyl benzene sulfonate, a curing agent and a solvent at a high temperature of 88-105 DEG C. The radiating flexible circuit board provided by the invention solves the problem of local overheating caused by small used space of the existing flexible circuit board as the radiating coating is added on the surface of the conductive circuit layer, improves the heat radiation performance of the circuit board while the circuit board is efficiently protected against external impact damage, and is steady in performance, long in service life and wide in application foreground.
Description
Technical field
The present invention relates to printed substrate technical field, more particularly to a kind of FPC and its surface painting of radiating
Material.
Background technology
FPC referred to as " soft board ", is commonly called as FPC in industry, be with printed circuit made by flexible insulated substrate.
Flexible circuit provides excellent electrical property, can meet smaller and more high-density installation design needs, it helps reduction group
Dress operation and enhancing reliability.Flexible PCB is the only solution for meeting miniaturization of electronic products and movement requirement.Can
With free bend, winding, fold, the dynamic bending of millions of times can be born and wire is not damaged, can want according to space layout
Arbitrarily arrangement is asked, and is arbitrarily moved and flexible in three dimensions, so as to reach the integration of components and parts assembling and wire connection；It is soft
Property circuit board can be substantially reduced the volume and weight of electronic product, be suitable for electronic product to high density, miniaturization, highly reliable direction
The needs of development.With miniaturization of electronic products, miniaturization development, many electronic products due to the relation of assembling space, and
The assembling of whole machine is completed using SMD components are mounted on FPC.In real world applications, due to FPC
Using narrow space, cause its heat-conducting effect slow, heat cannot discharge, and easily make wiring board original paper hot-spot, so as to because
Cannot radiate and cause parts damages.The complex electronic equipment of sustainable growth now in printed substrate efficiently and cost performance is high
Evolution of Thermal Control Technique is put forward higher requirement.Based on above statement, the present invention propose a kind of FPC of radiating and its
Surface coating.
The content of the invention
The invention aims to shortcoming present in prior art is solved, and a kind of flexible circuitry of the radiating for proposing
Plate and its surface coating.
A kind of FPC of radiating, the FPC includes flexible insulation basic unit, conductive circuit layer, heat-radiation coating
Layer；The conductive circuit layer is located at the centre position of flexible insulation basic unit and thermal dispersant coatings, the flexible insulation basic unit and conduction
Pressed after coating binder between line layer and formed；The thermal dispersant coatings are coated with solidify afterwards by surface coating and are obtained；It is described
Flexible insulation basic unit is polyimides soft board, polyethylene terephthalate soft board, aramid fiber ester soft board or polychlorostyrene second
One kind in alkene soft board, its thickness is 0.12～0.25mm；The conductive circuit layer is in rolling aluminum foil or rolled copper foil
Kind, its thickness is 0.05～0.1mm；The thickness of the thermal dispersant coatings is 0.1～0.18mm.
A kind of FPC surface coating of radiating, including following raw material：30～50 parts of acrylic resin,
10～20 parts of epoxy resin, 3～6 parts of glass fibre, 1.5～2 parts of heat filling, 2～5 parts of neopelex, solidification
1～3 part of agent, 20～35 parts of solvent.
Preferably, the FPC surface coating of the radiating, including following raw material：Acrylic resin 35
～45 parts, 12～18 parts of epoxy resin, 4～5 parts of glass fibre, 1.6～1.8 parts of heat filling, neopelex 3～
4 parts, 1.5～2.5 parts of curing agent, 25～30 parts of solvent.
Preferably, the FPC surface coating of the radiating, including following raw material：Acrylic resin 40
Part, 15 parts of epoxy resin, 4.5 parts of glass fibre, 1.8 parts of heat filling, 3.5 parts of neopelex, 2 parts of curing agent,
28 parts of solvent.
Preferably, the glass fibre and the mass ratio of heat filling are 2～3:1, the heat filling is for mass ratio
7.2～10.2:1 boron nitride and the built agent of aluminium nitride.
Preferably, the curing agent is dicyandiamide, aromatic amine, phenolic aldehyde promise volt clarke type resin, cresols promise volt clarke
One kind or arbitrary composition in type resin, triazine modified phenol promise volt clarke type resin.
Preferably, the solvent is acetone, MEK, cyclohexanone, the molten fine machine of ethyl, methyl cellosolve and dimethyl formyl
One kind or any mixed liquor in amine.
Preferably, the preparation method of the surface coating is：By the acrylic resin of the proportion, epoxy resin, glass
Fiber, heat filling, neopelex, curing agent and solvent, are stirred mixing at a high temperature of 88～105 DEG C,
Mixing speed is 550～750r/min, and incorporation time is 25～40min.
A kind of FPC of radiating proposed by the present invention, increased thermal dispersant coatings, effectively in conducting wire layer surface
While protection circuit plate is not damaged by foreign impacts, wiring board heat dispersion is improve, its stable performance, long service life,
Arbitrary dimension specification can be cut into, applied widely, wiring board heat-transfer rate proposed by the present invention is fast, solves existing flexibility
Wiring board, because of the problem of the caused hot-spot using narrow space, FPC proposed by the present invention can meet big work(
The cooling requirements of rate part wiring board, extend the service life of product.The invention allows for a kind of flexible circuitry of radiating
Plate surface coating, by adding heat filling, controls the proportioning of glass fibre and heat filling, is ensureing coating mechanical property
While, the heat-transfer rate and the capacity of heat transmission of coating are greatly improved, gained surface coating is used for the radiating of FPC,
Effect is significant, is worthy to be popularized.
Specific embodiment
The present invention is made with reference to specific embodiment further explain.
Embodiment one
A kind of FPC of radiating proposed by the present invention, including flexible insulation basic unit, conductive circuit layer, heat-radiation coating
Layer；Conductive circuit layer is located at the centre position of flexible insulation basic unit and thermal dispersant coatings, flexible insulation basic unit and conductive circuit layer it
Between pressed after coating binder and form；Thermal dispersant coatings are coated with solidify afterwards by surface coating and are obtained；Flexible insulation basic unit is poly-
Acid imide soft board, its thickness is 0.22mm；Conductive circuit layer is rolling aluminum foil, and its thickness is 0.08mm；The thickness of thermal dispersant coatings
For 0.15mm.
The FPC surface coating of a kind of radiating, it is characterised in that including following raw material：Acrylic acid tree
40 parts of fat, 15 parts of epoxy resin, 5 parts of glass fibre, 1.8 parts of heat filling, 4 parts of neopelex, 2 parts of curing agent,
28 parts of solvent；Wherein heat filling is that mass ratio is 9.8:1 boron nitride and the built agent of aluminium nitride；Curing agent is phenolic aldehyde promise volt
Clarke type resin；Solvent is acetone；The preparation method of surface coating is：By the acrylic resin of the proportion, epoxy resin, glass
Glass fiber, heat filling, neopelex, curing agent and solvent, are stirred mixing at a high temperature of 100 DEG C, stir
It is 550r/min to mix speed, and incorporation time is 40min.
Embodiment two
A kind of FPC of radiating proposed by the present invention, including flexible insulation basic unit, conductive circuit layer, heat-radiation coating
Layer；Conductive circuit layer is located at the centre position of flexible insulation basic unit and thermal dispersant coatings, flexible insulation basic unit and conductive circuit layer it
Between pressed after coating binder and form；Thermal dispersant coatings are coated with solidify afterwards by surface coating and are obtained；Flexible insulation basic unit is poly-
Ethylene glycol terephthalate soft board, its thickness is 0.12mm；Conductive circuit layer is that in rolled copper foil, its thickness is 0.1mm；Dissipate
The thickness of hot coating is 0.18mm.
The FPC surface coating of a kind of radiating, it is characterised in that including following raw material：Acrylic acid tree
35 parts of fat, 20 parts of epoxy resin, 3 parts of glass fibre, 1.5 parts of heat filling, 3 parts of neopelex, 3 parts of curing agent,
25 parts of solvent；Wherein heat filling is that mass ratio is 7.8:1 boron nitride and the built agent of aluminium nitride；Curing agent be dicyandiamide and
The promise of triazine modified phenol lies prostrate the composition of clarke type resin；Solvent is the mixing of acetone and methyl cellosolve and dimethylformamide
Liquid；The preparation method of surface coating is：By the acrylic resin of the proportion, epoxy resin, glass fibre, heat filling, ten
Dialkyl benzene sulfonic acids sodium, curing agent and solvent, are stirred mixing at a high temperature of 95 DEG C, and mixing speed is 650r/min, mix
The conjunction time is 32min.
Embodiment three
A kind of FPC of radiating proposed by the present invention, including flexible insulation basic unit, conductive circuit layer, heat-radiation coating
Layer；Conductive circuit layer is located at the centre position of flexible insulation basic unit and thermal dispersant coatings, flexible insulation basic unit and conductive circuit layer it
Between pressed after coating binder and form；Thermal dispersant coatings are coated with solidify afterwards by surface coating and are obtained；Flexible insulation basic unit is poly-
Vinyl chloride soft board, its thickness is 0.15mm；Conductive circuit layer is rolled copper foil, and its thickness is 0.1mm；The thickness of thermal dispersant coatings is
0.12mm。
The FPC surface coating of a kind of radiating, it is characterised in that including following raw material：Acrylic acid tree
It is 45 parts of fat, 10 parts of epoxy resin, 6 parts of glass fibre, 2 parts of heat filling, 5 parts of neopelex, 1 part of curing agent, molten
32 parts of agent；Wherein heat filling is that mass ratio is 8:1 boron nitride and the built agent of aluminium nitride；Curing agent is aromatic amine；
Solvent is cyclohexanone；The preparation method of surface coating is：By the acrylic resin of the proportion, epoxy resin, glass fibre, lead
Hot filler, neopelex, curing agent and solvent, are stirred mixing at a high temperature of 88 DEG C, and mixing speed is
750r/min, incorporation time is 25min.
The performance of the FPC of the radiating proposed in the test embodiment of the present invention one～tri-, draws following result：
| Embodiment | One | Two | Three |
| Thickness of slab (mm) | 0.45 | 0.4 | 0.37 |
| Dielectric strength (Kv/mm) | 1.9 | 2.5 | 2.3 |
Existing FPC is compared, the FPC radiating speed of the radiating proposed in the embodiment of the present invention one～tri-
Rate is greatly improved, and concrete increase rate is as follows：
| Embodiment | One | Two | Three |
| Radiating increase rate (%) | 53% | 47% | 51.5% |
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto,
Any those familiar with the art the invention discloses technical scope in, technology according to the present invention scheme and its
Inventive concept equivalent or change in addition, all should be included within the scope of the present invention.
Claims (8)
1. a kind of FPC of radiating, it is characterised in that the FPC includes flexible insulation basic unit, conducting wire
Layer, thermal dispersant coatings；The conductive circuit layer is located at the centre position of flexible insulation basic unit and thermal dispersant coatings, the flexible insulation base
Pressed after coating binder between layer and conductive circuit layer and formed；The thermal dispersant coatings are by surface coating coating solidify afterwards
；The flexible insulation basic unit be polyimides soft board, polyethylene terephthalate soft board, aramid fiber ester soft board or
One kind in polyvinyl chloride soft board, its thickness is 0.12～0.25mm；The conductive circuit layer is rolling aluminum foil or rolled copper foil
In one kind, its thickness be 0.05～0.1mm；The thickness of the thermal dispersant coatings is 0.1～0.18mm.
2. a kind of FPC surface coating of radiating according to claim 1, it is characterised in that including following heavy
Amount part raw material：30～50 parts of acrylic resin, 10～20 parts of epoxy resin, 3～6 parts of glass fibre, 1.5～2 parts of heat filling,
2～5 parts of neopelex, 1～3 part of curing agent, 20～35 parts of solvent.
3. the FPC and its surface coating of a kind of radiating according to claim 2, it is characterised in that including following
Raw material：35～45 parts of acrylic resin, 12～18 parts of epoxy resin, 4～5 parts of glass fibre, heat filling 1.6～
1.8 parts, 3～4 parts of neopelex, 1.5～2.5 parts of curing agent, 25～30 parts of solvent.
4. the FPC surface coating of a kind of radiating according to claim 2, it is characterised in that including following heavy
Amount part raw material：40 parts of acrylic resin, 15 parts of epoxy resin, 4.5 parts of glass fibre, 1.8 parts of heat filling, detergent alkylate sulphur
3.5 parts of sour sodium, 2 parts of curing agent, 28 parts of solvent.
5. a kind of FPC surface coating of radiating according to claim 2, it is characterised in that the glass fibers
Dimension is 2～3 with the mass ratio of heat filling:1, it is 7.2～10.2 that the heat filling is mass ratio:1 boron nitride and nitridation
The built agent of aluminium.
6. a kind of FPC surface coating of radiating according to claim 2, it is characterised in that the curing agent
For dicyandiamide, aromatic amine, phenolic aldehyde promise volt clarke type resin, cresols promise volt clarke type resin, triazine modified phenol Nuo Fula
One kind or arbitrary composition in gram type resin.
7. the FPC surface coating of a kind of radiating according to claim 2, it is characterised in that the solvent is
One kind or any mixed liquor in the molten fine machine of acetone, MEK, cyclohexanone, ethyl, methyl cellosolve and dimethylformamide.
8. the FPC surface coating of a kind of radiating according to any one of claim 2-7, it is characterised in that
The preparation method of the surface coating is：By the acrylic resin of the proportion, epoxy resin, glass fibre, heat filling, ten
Dialkyl benzene sulfonic acids sodium, curing agent and solvent, are stirred mixing at a high temperature of 88～105 DEG C, and mixing speed is 550～
750r/min, incorporation time is 25～40min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710011422.2A CN106658948A (en) | 2017-01-06 | 2017-01-06 | Radiating flexible circuit board and surface coating thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710011422.2A CN106658948A (en) | 2017-01-06 | 2017-01-06 | Radiating flexible circuit board and surface coating thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106658948A true CN106658948A (en) | 2017-05-10 |
Family
ID=58842689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710011422.2A Pending CN106658948A (en) | 2017-01-06 | 2017-01-06 | Radiating flexible circuit board and surface coating thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106658948A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107446443A (en) * | 2017-09-06 | 2017-12-08 | 王维维 | A kind of switch status display device three-proofing coating |
| CN108395748A (en) * | 2018-03-29 | 2018-08-14 | 朱大胜 | Soft board cover board for flexible circuit board processing and the soft board cover board technological process |
| CN112105241A (en) * | 2020-09-30 | 2020-12-18 | 追信数字科技有限公司 | Exoskeleton plug-in mobile phone heat dissipation device and manufacturing method thereof |
| US11998172B2 (en) * | 2019-11-07 | 2024-06-04 | Meditrina, Inc. | Endoscope and method of use |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104350814A (en) * | 2012-06-15 | 2015-02-11 | 株式会社钟化 | Heat dissipation structure |
| CN104769057A (en) * | 2012-09-28 | 2015-07-08 | 韩化石油化学株式会社 | Radiation paint composition and radiation structure |
| CN105006439A (en) * | 2014-04-24 | 2015-10-28 | 东部Hitek株式会社 | Method of packaging semiconductor devices and apparatus for performing the same |
| CN105023886A (en) * | 2014-04-16 | 2015-11-04 | 东部Hitek株式会社 | Semiconductor package and method for manufacturing same |
-
2017
- 2017-01-06 CN CN201710011422.2A patent/CN106658948A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104350814A (en) * | 2012-06-15 | 2015-02-11 | 株式会社钟化 | Heat dissipation structure |
| CN104769057A (en) * | 2012-09-28 | 2015-07-08 | 韩化石油化学株式会社 | Radiation paint composition and radiation structure |
| CN105023886A (en) * | 2014-04-16 | 2015-11-04 | 东部Hitek株式会社 | Semiconductor package and method for manufacturing same |
| CN105006439A (en) * | 2014-04-24 | 2015-10-28 | 东部Hitek株式会社 | Method of packaging semiconductor devices and apparatus for performing the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107446443A (en) * | 2017-09-06 | 2017-12-08 | 王维维 | A kind of switch status display device three-proofing coating |
| CN108395748A (en) * | 2018-03-29 | 2018-08-14 | 朱大胜 | Soft board cover board for flexible circuit board processing and the soft board cover board technological process |
| US11998172B2 (en) * | 2019-11-07 | 2024-06-04 | Meditrina, Inc. | Endoscope and method of use |
| CN112105241A (en) * | 2020-09-30 | 2020-12-18 | 追信数字科技有限公司 | Exoskeleton plug-in mobile phone heat dissipation device and manufacturing method thereof |
| CN112105241B (en) * | 2020-09-30 | 2022-08-12 | 宜宾市天珑通讯有限公司 | Exoskeleton plug-in mobile phone heat dissipation device and manufacturing method thereof |
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