CN106653707A - Fingerprint identification module and packaging method - Google Patents
Fingerprint identification module and packaging method Download PDFInfo
- Publication number
- CN106653707A CN106653707A CN201611138905.0A CN201611138905A CN106653707A CN 106653707 A CN106653707 A CN 106653707A CN 201611138905 A CN201611138905 A CN 201611138905A CN 106653707 A CN106653707 A CN 106653707A
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- Prior art keywords
- fingerprint recognition
- ink
- cover plate
- inserts
- recognition chip
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- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000006698 induction Effects 0.000 claims abstract description 23
- 238000012856 packing Methods 0.000 claims description 13
- 238000005516 engineering process Methods 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 230000035945 sensitivity Effects 0.000 abstract description 10
- 238000005520 cutting process Methods 0.000 abstract description 7
- 239000000945 filler Substances 0.000 abstract 4
- 238000012536 packaging technology Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000003313 weakening effect Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000392 somatic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Image Input (AREA)
Abstract
The invention discloses a fingerprint identification module and a packaging method and relates to a field of fingerprint identification module packaging technology. The method includes providing a glass substrate and filling the glass substrate with oil ink so as to form an oil ink cover board; cutting the oil ink cover board and forming a single piece of oil ink cover board; providing a single piece of fingerprint identification chip and bonding the single piece of the fingerprint identification chip on the surface of the single piece of the single oil ink cover board; filling a filler into the surface of the single piece of the oil ink cover board in the surrounding of the single piece of the fingerprint identification chip and controlling the filler to be flush with or lower than the single piece of the fingerprint identification chip, enabling the induction zone of the single piece of the fingerprint identification chip to be exposed and thus obtaining fingerprint identification module. By adopting the technical scheme, the filler is disposed in the surrounding of the fingerprint identification chip; the induction zone of the single piece of the fingerprint identification chip does not have the filler and the induction zone of the single piece of the fingerprint identification chip is exposed, so that fingerprint identification sensitivity is enhanced.
Description
Technical field
The present invention relates to fingerprint recognition module packaging technical field, more particularly to a kind of fingerprint recognition module and its encapsulation side
Method.
Background technology
With the fast development of mobile intelligent terminal technology, user is increasing to the demand of mobile terminal, while to moving
The requirement of dynamic intelligent terminal experience also more and more higher.Biological identification technology is also constantly being applied to mobile intelligent terminal.Its
In, fingerprint identification technology is one of technology that most ripe and consumer most pays close attention to, and with mobile payment security requirement
Improve constantly, fingerprint recognition module will become the indispensable device of the equipment such as mobile intelligent terminal, Mobile payment terminal, and, refer to
The sensitivity of line identification day by day becomes the research emphasis of fingerprint recognition module.
The principle of fingerprint recognition is substantially：Fingerprint recognition module reads finger print data, then transmits finger print data
Module sensor is given, finally by fingerprint reading systems somatic fingerprint image is read.
But, in prior art, fingerprint recognition module is in encapsulation process in the chip induction region of fingerprint recognition module
Plastic packaging defines the plastic packaging glue of thickness about 100um thickness, because the dielectric constant of plastic packaging glue is low, therefore causes the spirit of fingerprint recognition
Sensitivity is limited.
The content of the invention
In view of this, the embodiment of the present invention provides a kind of fingerprint recognition module and its method for packing, to solve existing fingerprint
The relatively low technical problem of fingerprint recognition sensitivity is caused during identification module packaging due to forming thicker packaging plastic.
In a first aspect, a kind of method for packing of fingerprint recognition module is embodiments provided, including：
One glass substrate, and the full-filling ink on the glass substrate are provided, ink cover plate is formed；
The ink cover plate is cut, single ink cover plate is formed；
Single fingerprint recognition chip is provided, the single fingerprint recognition chip is pasted onto into the table of the single ink cover plate
Face；
To the described single ink lid surface injection inserts of the single fingerprint recognition chip circumference, fill out described in control
Charge is flushed or less than the single fingerprint recognition chip, exposes the induction zone of the single fingerprint recognition chip, is obtained
Fingerprint recognition module.
Optionally, it is described to obtain after fingerprint recognition module, also including：
The fingerprint recognition module is placed and is heated in a mold, until the inserts is fully cured.
Optionally, the inserts is plastic packaging glue.
Optionally, the full-filling ink on the glass substrate, forms ink cover plate, including：
By the way of rotation full-filling, the full-filling ink on the glass substrate forms ink cover plate.
Optionally, the single fingerprint recognition chip is pasted onto after the surface of the single ink cover plate, is also included：
Single ink cover plate for being pasted with the single fingerprint recognition chip is carried out into whole face pressure conjunction, until used when pasting
The glue solidifies.
Optionally, inserts, bag are injected to described single ink lid surface of the single fingerprint recognition chip circumference
Include：
The single ink cover plate is fixed using fixing mould, and using injection machine to single fingerprint recognition chip week
The described single ink lid surface enclosed injects the inserts of set amount.
Optionally, it is described to obtain after fingerprint recognition module, also including：
Surface mount is carried out to the fingerprint recognition module using surface mounting technology.
Second aspect, the embodiment of the present invention additionally provides a kind of fingerprint recognition module, using the fingerprint described in first aspect
The method for packing encapsulation of identification module is obtained, including：
Glass substrate；
Positioned at the ink of the glass baseplate surface；
The single fingerprint recognition chip above the ink；
Positioned at the inserts of the single fingerprint recognition chip circumference, the inserts is flushed or less than described single finger
Line identification chip, the induction zone of the single fingerprint recognition chip exposes outside.
Optionally, the thickness of the ink is 2-15um.
Optionally, the shape of the fingerprint recognition module includes following at least one：
Circular, rectangle or ellipse.
Fingerprint recognition module provided in an embodiment of the present invention and its method for packing, by providing a glass substrate, and in glass
Full-filling ink on glass substrate, forms ink cover plate, and ink cover plate is cut, and forms single ink cover plate, there is provided single finger
Line identification chip, by single fingerprint recognition chip the surface of single ink cover plate is pasted onto, to single fingerprint recognition chip circumference
Single ink lid surface injection inserts, control inserts flush or less than single fingerprint recognition chip, expose list
The induction zone of fingerprint recognition chip, obtains fingerprint recognition module.Using above-mentioned technical proposal, inserts is located at fingerprint recognition core
Around piece, without inserts on the induction zone of fingerprint recognition chip, the induction zone of fingerprint recognition chip is exposed, can be strengthened
The sensitivity of fingerprint recognition, can solve to cause to refer to due to forming thicker packaging plastic during existing fingerprint recognition module packaging
The relatively low technical problem of line identification sensitivity.
Description of the drawings
In order to clearly illustrate the technical scheme of exemplary embodiment of the present, below to describing needed for embodiment
The accompanying drawing to be used does a simple introduction.Obviously, the accompanying drawing introduced is the present invention a part of embodiment to be described
Accompanying drawing, rather than the accompanying drawing of whole, for those of ordinary skill in the art, on the premise of not paying creative work, may be used also
To obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is a kind of schematic flow sheet of the method for packing of fingerprint recognition module provided in an embodiment of the present invention；
Fig. 2 a are a kind of schematic top plan views of glass substrate provided in an embodiment of the present invention；
Fig. 2 b are a kind of schematic cross-sections of glass substrate provided in an embodiment of the present invention；
Fig. 3 a are a kind of schematic top plan views for forming ink on the glass substrate provided in an embodiment of the present invention；
Fig. 3 b are a kind of schematic cross-sections for forming ink on the glass substrate provided in an embodiment of the present invention；
Fig. 4 a are that a kind of cutting that single ink cover plate is formed on full wafer ink cover plate provided in an embodiment of the present invention is shown
It is intended to；
Fig. 4 b are the amplification schematic top plan views of a kind of single ink cover plate in Fig. 4 a shown in part A；
Fig. 4 c are the schematic cross-sections of a kind of single ink cover plate in Fig. 4 a shown in part A；
Fig. 5 a are provided in an embodiment of the present invention a kind of bowing for single fingerprint recognition chip to be pasted on single ink cover plate
Depending on schematic diagram；
Fig. 5 b are provided in an embodiment of the present invention a kind of cutting for single fingerprint recognition chip to be pasted on single ink cover plate
Face schematic diagram；
Fig. 6 is a kind of schematic cross-section that inserts is injected in single ink lid surface provided in an embodiment of the present invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below with reference to the embodiment of the present invention in it is attached
Figure, by specific embodiment, is fully described by technical scheme.Obviously, described embodiment is of the invention
A part of embodiment, rather than the embodiment of whole, based on embodiments of the invention, those of ordinary skill in the art are not doing
The every other embodiment obtained on the premise of going out creative work, each falls within protection scope of the present invention.
Embodiment
Fig. 1 is a kind of schematic flow sheet of the method for packing of fingerprint recognition module provided in an embodiment of the present invention, the present invention
Embodiment provides a kind of method for packing of fingerprint recognition module.Refer to Fig. 1, fingerprint recognition module provided in an embodiment of the present invention
Method for packing may comprise steps of：
S110, one glass substrate of offer, and the full-filling ink on the glass substrate, form ink cover plate.
Exemplary, Fig. 2 a are a kind of schematic top plan views of glass substrate provided in an embodiment of the present invention, as shown in Figure 2 a,
The shape of glass substrate 10 can be circle, optionally, the shape of glass substrate 10 can also for rectangle, triangle or other
Shape, is not defined to the shape of glass substrate 10 in the embodiment of the present invention, is only explained with circular glass substrate.
Fig. 2 b are a kind of schematic cross-section of glass substrate provided in an embodiment of the present invention, as shown in Figure 2 b, the thickness of glass substrate 10
Can be selected according to actual conditions, the embodiment of the present invention is not equally defined to the thickness of glass substrate 10.
Further, full-filling ink 20 on the glass substrate 10, forms ink cover plate, as shown in Figure 3 a and Figure 3 b shows.It is optional
, can be so that by the way of rotation full-filling, on the glass substrate 10 full-filling ink 20, forms ink cover plate, specifically, using rotation
The mode for turning full-filling forms ink cover plate and can use the equipment of rotating serial and mixing apparatus etc. of color ink, by glass base
Plate 10 is positioned on the equipment of rotation at a high speed, is set drive glass substrate 10 by rotation and is rotated at a high speed, and ink 20 is uniform
Full-filling is on the glass substrate 10.Optionally, the thickness range for adopting the ink that the mode of rotary filling inking formed can be 2-
15um, the uniformity of ink 20 can accomplish within ± 2um, if ink thickness fails to reach demand and can also be filled out again
Apply to increase thickness, fully achieve any thickness requirement.
To sum up, on the glass substrate using rotation full-filling by the way of form ink cover plate, ink cover plate not only can be ensured
Being uniformly distributed for curing ink, can also realize any ink thickness requirement, it is ensured that ink cover plate prepares yield, lift ink cover plate
Preparation efficiency.
S120, the ink cover plate is cut, form single ink cover plate.
Exemplary, Fig. 4 a are that one kind provided in an embodiment of the present invention forms single ink cover plate on full wafer ink cover plate
Cutting schematic diagram, as shown in fig. 4 a, on full wafer ink cover plate can include multiple single ink cover plates, the single ink
Cover plate is corresponding with single fingerprint recognition chip in the embodiment of the present invention.The shape of the single ink cover plate can for it is circular,
Matrix, ellipse or other shapes, are not defined to the shape of single ink cover plate here.Optionally, the single oil
Inky cap plate can be cut using cutting tool with arranged in arrays on the full wafer ink cover plate to the full wafer ink cover plate
Cut, form single ink cover plate, as shown in figures 4 b and 4 c, Fig. 4 b are a kind of single ink cover plates in Fig. 4 a shown in part A
Amplification schematic top plan view, Fig. 4 c are the schematic cross-sections of a kind of single ink cover plate in Fig. 4 a shown in part A.Specifically,
Full wafer ink cover plate can be cut using glass cutter, form single ink cover plate, it is also possible to use laser cutting
Method full wafer ink cover plate is cut, formed single ink cover plate, it is preferred that can use laser cutting method shape
Into single ink cover plate, full wafer ink cover plate is cut using laser, it is ensured that cutting precision.
Further, formed after single ink cover plate, can also include that carrying out edge to the single ink cover plate grinds
Mill, obtains entire single ink cover plate.
S130, single fingerprint recognition chip of offer, by the single fingerprint recognition chip the single ink lid is pasted onto
The surface of plate.
Exemplary, Fig. 5 a are that one kind provided in an embodiment of the present invention pastes single fingerprint recognition on single ink cover plate
The schematic top plan view of chip, Fig. 5 b are that one kind provided in an embodiment of the present invention pastes single fingerprint recognition on single ink cover plate
The schematic cross-section of chip, as shown in figure 5 a and 5b, there is provided single fingerprint recognition chip 30, single fingerprint recognition chip 30 can
With the lower surface for including being located at the induction zone of upper surface and being oppositely arranged with the upper surface, the induction zone refers to for sensing
Line signal, the lower surface is used to be pasted with single ink cover plate.Optionally, there is provided after single fingerprint recognition chip 30,
Dispensing and laminating are carried out to single fingerprint recognition chip 30, can use glue or double faced adhesive tape by single fingerprint recognition chip
30 surfaces for being pasted onto single ink cover plate.
It is pointed out that the area of single ink cover plate provided in an embodiment of the present invention is slightly larger than single fingerprint recognition core
The area of piece 30, by single fingerprint recognition chip 30 surface of single ink cover plate is pasted onto, and preferably can be by single fingerprint
The contraposition of identification chip 30 is pasted onto the chip mounting location of single ink cover plate, such as center, it is ensured that single fingerprint recognition
After the completion of chip 30 is pasted, the surface surrounding of single ink cover plate leaves vacant position.
Further, single fingerprint recognition chip 30 is pasted onto after the surface of the single ink cover plate, can be with
Including：
Single ink cover plate for being pasted with single fingerprint recognition chip 30 is carried out into whole face pressure conjunction, until used when pasting
Glue solidifies completely.
Exemplary, it is possible to use press equipment carries out single ink cover plate for being pasted with single fingerprint recognition chip 30
Whole face pressure is closed, it is ensured that single fingerprint recognition chip 30 and single ink cover plate firm pasting.If single fingerprint is known using glue
Other chip 30 is pasted onto on single ink cover plate, during whole face pressure is closed, needs to ensure that glue used when pasting coagulates completely
Gu, it is to avoid because glue causes to be pasted not strongly without solidification completely, the problem that fingerprint recognition chip comes off.
S140, to the single fingerprint recognition chip circumference described single ink lid surface inject inserts, control
The inserts is flushed or less than the single fingerprint recognition chip, exposes the sensing of the single fingerprint recognition chip
Area, obtains fingerprint recognition module.
Exemplary, Fig. 6 is a kind of cutting in single ink lid surface injection inserts provided in an embodiment of the present invention
Face schematic diagram, as shown in fig. 6, to around single fingerprint recognition chip 30 single ink lid surface injection inserts 40 when,
Need to ensure that inserts 40 is flushed or less than single fingerprint recognition chip 30, it is ensured that positioned at the single upper surface of fingerprint recognition chip 30
Induction zone be completely exposed.Specifically, the single ink cover plate can be fixed first by fixing mould, then using injection
Machine injects the inserts 40 of set amount to single ink lid surface around single fingerprint recognition chip 30, controls inserts 40
Flush or less than single fingerprint recognition chip 30, so obtain fingerprint recognition module.Optionally, the inserts 40 of set amount,
The set amount can determine according to the distance between single fingerprint recognition chip 30 and single ink side edge thereof.It is appreciated that
, only single fingerprint recognition chip 30 is flushed with inserts 40 in Fig. 6 and be explained explanation, fill in the embodiment of the present invention
Material 40 can also be less than single fingerprint recognition chip 30, such as under the premise of ensureing that single fingerprint recognition chip 30 is firm, if
The height for putting inserts 40 is the 90%-100% of the single height of fingerprint recognition chip 30.
Optionally, inserts 40 can be plastic packaging glue or other capsulation materials, and the embodiment of the present invention is not equally to filling
The type of material 40 is defined.
In sum, control inserts to flush or less than fingerprint recognition chip, it is ensured that the sense of fingerprint recognition chip surface
Area is answered to be completely exposed, it is ensured that induction zone with fingerprint signal directly contact, can lift the identification sensitivity of fingerprint signal, can keep away
Exempt from weakening of the inserts for fingerprint signal.
Further, it is described to obtain after fingerprint recognition module, to include：
The fingerprint recognition module is placed and is heated in a mold, until inserts 40 is fully cured.
Exemplary, fingerprint recognition module can be placed in heating mould and be heated, it is ensured that inserts 40 is complete
Solidification, it is ensured that fingerprint recognition module is consolidated.
Further, it is described to obtain after fingerprint recognition module, to include：
Surface mount is carried out to the fingerprint recognition module using surface mounting technology.
Exemplary, surface mounting technology (Surface Mounting Technology, SMT) is a kind of Electronic Assemblies
Technology, after fingerprint recognition module is obtained, surface mount is carried out using SMT flow processs to fingerprint recognition module.
The method for packing of fingerprint recognition module provided in an embodiment of the present invention, by providing a glass substrate, and in glass
Full-filling ink on substrate, forms ink cover plate, and ink cover plate is cut, and forms single ink cover plate, there is provided single fingerprint
Identification chip, by single fingerprint recognition chip the surface of single ink cover plate is pasted onto, to single fingerprint recognition chip circumference
Single ink lid surface injects inserts, and control inserts is flushed or less than single fingerprint recognition chip, exposes single
The induction zone of fingerprint recognition chip, obtains fingerprint recognition module.Using above-mentioned technical proposal, on the induction zone of fingerprint recognition chip
Without inserts, inserts is only positioned at around fingerprint recognition chip, it is ensured that expose the induction zone of fingerprint recognition chip, fingerprint
The induction zone of identification chip with directly contact, can strengthen the sensitivity of fingerprint recognition with fingerprint signal, it is to avoid inserts is for finger
The weakening of line signal, can solve to cause fingerprint to know due to forming thicker packaging plastic during existing fingerprint recognition module packaging
The relatively low technical problem of other sensitivity.Also, the fingerprint recognition module obtained using above-mentioned technical proposal encapsulation, module thickness can
It is many to reduce, meet the frivolous development trend of fingerprint class product.
The embodiment of the present invention also provides a kind of fingerprint recognition module, equally may be referred to Fig. 6, provided in an embodiment of the present invention
Fingerprint recognition module can include：
Glass substrate 10；
Positioned at the ink 20 on the surface of glass substrate 10；
Positioned at single fingerprint recognition chip 30 of the top of ink 20；
Inserts 40 around single fingerprint recognition chip 30, inserts 40 is flushed or less than single fingerprint recognition
Chip 30, the induction zone of single fingerprint recognition chip 30 exposes outside.
Optionally, the thickness of the ink is 2-15um.
Optionally, the shape of the fingerprint recognition module includes following at least one：
Circular, rectangle or ellipse.
Fingerprint recognition module provided in an embodiment of the present invention can adopt fingerprint recognition module provided in an embodiment of the present invention
Method for packing encapsulation obtain, fingerprint recognition module provided in an embodiment of the present invention does not have on the induction zone of fingerprint recognition chip
Inserts, inserts is only positioned at around fingerprint recognition chip, it is ensured that expose the induction zone of fingerprint recognition chip, fingerprint recognition
The induction zone of chip with directly contact, can strengthen the sensitivity of fingerprint recognition with fingerprint signal, it is to avoid inserts is believed for fingerprint
Number weakening.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious changes,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although the present invention is carried out by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
More other Equivalent embodiments can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (10)
1. a kind of method for packing of fingerprint recognition module, it is characterised in that include：
One glass substrate, and the full-filling ink on the glass substrate are provided, ink cover plate is formed；
The ink cover plate is cut, single ink cover plate is formed；
Single fingerprint recognition chip is provided, the single fingerprint recognition chip is pasted onto into the surface of the single ink cover plate；
Inserts is injected to described single ink lid surface of the single fingerprint recognition chip circumference, the inserts is controlled
Flush or less than the single fingerprint recognition chip, expose the induction zone of the single fingerprint recognition chip, obtain fingerprint
Identification module.
2. method according to claim 1, it is characterised in that described to obtain after fingerprint recognition module, also including：
The fingerprint recognition module is placed and is heated in a mold, until the inserts is fully cured.
3. method according to claim 2, it is characterised in that the inserts is plastic packaging glue.
4. method according to claim 1, it is characterised in that the full-filling ink on the glass substrate, forms ink lid
Plate, including：
By the way of rotation full-filling, the full-filling ink on the glass substrate forms ink cover plate.
5. method according to claim 1, it is characterised in that the single fingerprint recognition chip is pasted onto into described single
After the surface of ink cover plate, also include：
Single ink cover plate for being pasted with the single fingerprint recognition chip is carried out into whole face pressure conjunction, until glue used when pasting
Water-setting is consolidated.
6. method according to claim 1, it is characterised in that to described single of the single fingerprint recognition chip circumference
Ink lid surface injects inserts, including：
The single ink cover plate is fixed using fixing mould, and using injection machine to the single fingerprint recognition chip circumference
The single ink lid surface injects the inserts of set amount.
7. the method according to any one of claim 1-6, described to obtain after fingerprint recognition module, also including：
Surface mount is carried out to the fingerprint recognition module using surface mounting technology.
8. a kind of fingerprint recognition module, is encapsulated using the method for packing of the fingerprint recognition module described in any one of claim 1-7
Obtain, it is characterised in that include：
Glass substrate；
Positioned at the ink of the glass baseplate surface；
The single fingerprint recognition chip above the ink；
Positioned at the inserts of the single fingerprint recognition chip circumference, the inserts is flushed or known less than the single fingerprint
Other chip, the induction zone of the single fingerprint recognition chip exposes outside.
9. fingerprint recognition module according to claim 8, it is characterised in that the thickness of the ink is 2-15um.
10. fingerprint identification module according to claim 8, it is characterised in that the shape of the fingerprint recognition module includes
Following at least one：
Circular, rectangle or ellipse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611138905.0A CN106653707A (en) | 2016-12-12 | 2016-12-12 | Fingerprint identification module and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611138905.0A CN106653707A (en) | 2016-12-12 | 2016-12-12 | Fingerprint identification module and packaging method |
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| Publication Number | Publication Date |
|---|---|
| CN106653707A true CN106653707A (en) | 2017-05-10 |
Family
ID=58824226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611138905.0A Pending CN106653707A (en) | 2016-12-12 | 2016-12-12 | Fingerprint identification module and packaging method |
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| CN (1) | CN106653707A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107273854A (en) * | 2017-06-16 | 2017-10-20 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| CN107341450A (en) * | 2017-06-16 | 2017-11-10 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| CN117975516A (en) * | 2024-04-02 | 2024-05-03 | 深圳贝特莱电子科技股份有限公司 | Packaging structure and method of fingerprint sensor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107273854A (en) * | 2017-06-16 | 2017-10-20 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| CN107341450A (en) * | 2017-06-16 | 2017-11-10 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| CN117975516A (en) * | 2024-04-02 | 2024-05-03 | 深圳贝特莱电子科技股份有限公司 | Packaging structure and method of fingerprint sensor |
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