CN106653616A - 指纹传感芯片的封装方法以及封装结构 - Google Patents

指纹传感芯片的封装方法以及封装结构 Download PDF

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Publication number
CN106653616A
CN106653616A CN201611040862.2A CN201611040862A CN106653616A CN 106653616 A CN106653616 A CN 106653616A CN 201611040862 A CN201611040862 A CN 201611040862A CN 106653616 A CN106653616 A CN 106653616A
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CN
China
Prior art keywords
fingerprint sensor
back side
cover plate
fingerprint
weld pad
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Pending
Application number
CN201611040862.2A
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English (en)
Inventor
王之奇
刘渊非
刘宏钧
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China Wafer Level CSP Co Ltd
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China Wafer Level CSP Co Ltd
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Publication date
Application filed by China Wafer Level CSP Co Ltd filed Critical China Wafer Level CSP Co Ltd
Priority to CN201611040862.2A priority Critical patent/CN106653616A/zh
Publication of CN106653616A publication Critical patent/CN106653616A/zh
Priority to US15/815,460 priority patent/US10497728B2/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
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    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
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Abstract

本发明提供一种指纹传感芯片的封装方法以及封装结构，封装方法包含如下步骤：提供盖板；提供指纹传感芯片，其正面设置有指纹传感区以及位于指纹传感区***的焊垫，将焊垫电性引出至所述指纹传感芯片的背面，在所述指纹传感芯片的背面形成与焊垫电连接的第一导电结构；将所述指纹传感芯片的正面与所述盖板的背面贴合；提供柔性线路板，其背面具有第二导电结构，在所述柔性线路板上设置开口；将所述柔性线路板的正面与所述盖板的背面贴合，所述指纹传感芯片位于所述开口中；将所述第一导电结构与所述第二导电结构电连接。从而降低指纹传感芯片的封装尺寸以满足电子产品高集成度、高稳定性的需求，并提高指纹传感芯片封装的稳定性。

Description

指纹传感芯片的封装方法以及封装结构
技术领域
本发明涉及半导体封装技术领域，尤其涉及指纹传感芯片的封装技术。
背景技术
随着现代社会的进步，个人身份识别以及个人信息安全的重要性逐步受到人们的关注。由于人体指纹具有唯一性和不变性，使得指纹识别技术具有安全性好，可靠性高，使用简单方便的特点，使得指纹识别技术被广泛应用于保护个人信息安全的各种领域。而随着科学技术的不断发展，各类电子产品的信息安全问题始终是技术发展的关注要点之一。尤其是对于移动终端，例如手机、笔记本电脑、平板的电脑、数码相机等，对于信息安全性的需求更为突出，相应的，对指纹传感技术的需求日趋增长。
由于电子产品持续朝小型化和多功能化发展，指纹识别装置封装需满足小尺寸和高指纹识别灵敏度的要求。如何降低指纹传感芯片的封装尺寸、优化指纹传感芯片的封装结构成为本领域的研究热点。
发明内容
本发明的目的在于提供一种指纹传感芯片封装方法以及封装结构，优化指纹传感芯片的封装结构，从而降低指纹传感芯片的封装尺寸以满足电子产品高集成度、高稳定性的需求，并提高指纹传感芯片封装的稳定性。
本发明提供一种指纹传感芯片的封装方法，包含如下步骤：提供盖板；提供指纹传感芯片，其正面设置有指纹传感区以及位于指纹传感区***的焊垫，将焊垫电性引出至所述指纹传感芯片的背面，在所述指纹传感芯片的背面形成与焊垫电连接的第一导电结构；将所述指纹传感芯片的正面与所述盖板的背面贴合；提供柔性线路板，其背面具有第二导电结构，在所述柔性线路板上设置开口；将所述柔性线路板的正面与所述盖板的背面贴合，所述指纹传感芯片位于所述开口中；将所述第一导电结构与所述第二导电结构电连接。
优选的，所述盖板为透光基板，在将所述指纹传感芯片与所述盖板贴合之前，在所述盖板的背面上形成遮光油墨。
优选的，在所述盖板的背面黏贴DAF膜用于将所述指纹传感芯片与所述盖板贴合固定。
优选的，在所述盖板的背面涂布黏胶用于将所述指纹传感芯片与所述盖板贴合固定，所述黏胶的介电常数大于或等于4。
优选的，将焊垫电性引出至所述指纹传感芯片的背面并形成第一导电结构包含如下步骤：提供晶圆，晶圆包括多颗网格状排布的指纹传感芯片，所述指纹传感区以及所述焊垫位于所述晶圆的正面；在所述晶圆的背面对应焊垫的位置形成凹槽，所述凹槽的深度小于所述晶圆的厚度；在凹槽中形成通孔，每一通孔对应一个焊垫，所述通孔暴露所述焊垫；形成绝缘层，覆盖所述晶圆的背面、凹槽以及通孔中，所述绝缘层暴露所述焊垫；形成再布线层，所述再布线层延伸至所述晶圆的背面且与所述焊垫电连接；形成保护层，覆盖所述再布线层；在所述保护层上形成开孔，所述开孔位于所述晶圆的背面且暴露所述再布线层。
优选的，提供金属线，采用打线工艺将所述金属线的一端与所述开孔中暴露出的再布线层电连接，将所述金属线的另一端与所述第二导电结构电连接。
优选的，将所述第一导电结构与所述第二导电结构电连接之后，形成塑封层，所述塑封层至少包覆所述金属线。
优选的，将所述第一导电结构与所述第二导电结构电连接之后，在所述盖板的正面设置前框，前框上具有窗口，所述窗口暴露所述指纹传感区对应的盖板区域，在所述柔性线路板的背面设置后盖，所述后盖与所述前框卡合固定。
优选的，采用注塑工艺将塑封材料填充所述前框与所述后盖包围形成的收容腔。
本发明还提供一种指纹传感芯片的封装结构，包含：盖板；指纹传感芯片，其正面设置有指纹传感区以及位于指纹传感区***的焊垫，所述焊垫电性引出至所述指纹传感芯片的背面，所述指纹传感芯片的背面具有与焊垫电连接的第一导电结构；所述指纹传感芯片的正面与所述盖板的背面贴合；柔性线路板，其背面具有第二导电结构，所述柔性线路板上设置开口；所述柔性线路板的正面与所述盖板的背面贴合，所述指纹传感芯片位于所述开口中；所述第一导电结构与所述第二导电结构电连接。
优选的，所述盖板为透光基板，所述盖板的背面上涂布有遮光油墨。
优选的，所述封装结构还包括DAF膜，所述DAF膜的两面分别与所述盖板以及所述指纹传感芯片黏贴。
优选的，在所述盖板的背面涂布有黏胶用于将所述指纹传感芯片与所述盖板贴合固定，所述黏胶的介电常数大于或等于4。
优选的，所述第一导电结构包含：形成于所述指纹传感芯片背面的凹槽，所述凹槽与所述焊垫的位置对应，所述凹槽的深度小于所述指纹传感芯片的厚度；形成于凹槽中通孔，每一通孔对应一个焊垫，所述通孔暴露所述焊垫；绝缘层，覆盖所述指纹传感芯片的背面、凹槽以及通孔中，所述绝缘层暴露所述焊垫；再布线层，位于所述绝缘层之上，所述再布线层延伸至所述指纹传感芯片的背面且与所述焊垫电连接；保护层，覆盖所述再布线层；形成于所述保护层上开孔，所述开孔位于所述指纹传感芯片的背面且暴露所述再布线层。
优选的，所述封装结构还包括金属线，所述金属线的一端与所述开孔中暴露出的再布线层电连接，所述金属线的另一端与所述第二导电结构电连接。
优选的，所述封装结构还包括塑封层，所述塑封层至少包覆所述金属线。
优选的，在所述盖板的正面设置有前框，前框上具有窗口，所述窗口暴露所述指纹传感区对应的盖板区域，在所述柔性线路板的背面设置有后盖，所述后盖与所述前框卡合固定。
优选的，塑封材料填充所述前框与所述后盖包围形成的收容腔。
本发明的有益效果是通过优化指纹传感芯片的封装方法以及封装结构，从而降低指纹传感芯片的封装尺寸以满足电子产品高集成度、高稳定性的需求，并提高指纹传感芯片封装的稳定性。
附图说明
图1为本发明优选实施例指纹传感芯片的封装结构示意图。
图2为本发明另一实施例指纹传感芯片的封装结构示意图。
图3(a)为本发明优选实施例晶圆的平面示意图。
图3(b)为图3(a)中沿A-A的截面示意图。
图4为本发明优选实施例中保护基板与晶圆对位压合的结构示意图。
图5(a)为本发明优选实施例中形成凹槽与通孔的平面示意图。
图5(b)为本发明优选实施例中形成凹槽与通孔的截面示意图。
图6为本发明优选实施例中形成绝缘层的结构示意图。
图7为本发明优选实施例中形成再布线层的结构示意图。
图8为本发明优选实施例中形成阻焊层以及阻焊层上开口的结构示意图。
图9为本发明优选实施例中移除保护基板的结构示意图。
图10为本发明优选实施例中指纹传感芯片的截面示意图。
图11为本发明优选实施例中盖板的截面示意图。
图12为本发明优选实施例中盖板与指纹传感芯片贴合的截面示意图。
图13为本发明优选实施例中盖板与柔性线路板贴合的截面示意图。
图14为本发明优选实施例形成塑封层的截面示意图。
具体实施方式
以下将结合附图对本发明的具体实施方式进行详细描述。但这些实施方式并不限制本发明，本领域的普通技术人员根据这些实施方式所做出的结构、方法、或功能上的变换均包含在本发明的保护范围内。
需要说明的是，提供这些附图的目的是为了有助于理解本发明的实施例，而不应解释为对本发明的不当限制。为了更清楚起见，图中所示尺寸并未按比例绘制，可能会做放大、缩小或其他改变。此外，在实际制作中应包含长度、宽度及深度的三维空间尺寸。另外，以下描述的第一特征在第二特征之“上”的结构可以包括第一和第二特征形成为直接接触的实施例，也可以包括另外的特征形成在第一和第二特征之间的实施例，这样第一和第二特征可能不是直接接触。
请参考图1，为本发明优选实施例指纹传感芯片的封装结构示意图。指纹传感芯片封装结构包含：指纹传感芯片10、盖板20以及柔性线路板30。
指纹传感芯片10的正面设置有指纹传感区100以及位于指纹传感区100***的焊垫200，焊垫200与指纹传感区100电连接形成电信号传输通路。焊垫100电性引出至指纹传感芯片10的背面，指纹传感芯片10的背面具有与焊垫200电连接的第一导电结构。
于本实施例中，第一导电结构包含：形成于指纹传感芯片10背面的凹槽121，凹槽121与焊垫200的位置对应，凹槽121的深度小于指纹传感芯片10的厚度；形成于凹槽121中通孔122，每一通孔122对应一个焊垫200，通孔122暴露焊垫200；绝缘层123，覆盖指纹传感芯片10的背面、凹槽121的内壁以及通孔122中，绝缘层123暴露焊垫200；再布线层124，位于凹槽121以及通孔122中并延伸至指纹传感芯片10的背面上，再布线层124与焊垫200电连接；保护层125，覆盖再布线层124；形成于保护层125上的开孔，开孔位于指纹传感芯片10的背面且开孔底部暴露再布线层124。
指纹传感芯片10的正面与盖板20的背面贴合。盖板20为具有较高介电常数的材质，可以是玻璃或者陶瓷。于本实施例中，盖板20为透光基板，盖板20的背面上涂布有遮光油墨23。
指纹传感芯片10与盖板20通过DAF膜或者黏胶贴合固定，于本实施例中，在盖板20的背面设置有DAF膜24，指纹传感芯片10的正面贴合于DAF膜24上，保证了指纹传感芯片10贴合固定的平整度。如果采用黏胶，为了避免降低指纹传感的灵敏度，黏胶采用具有较高介电常数的材质，黏胶的介电常数大于或者4。
柔性线路板30上设置开口，柔性线路板30的正面与盖板20的背面贴合，指纹传感芯片10位于开口中，降低了指纹传感芯片的封装结构厚度。柔性线路板30的背面具有第二导电结构，于本实施例中，第二导电结构为柔性线路板30暴露出的金属垫34，通过金属线40将金属垫34与指纹传感芯片10的第一导电结构电连接。金属线40的一端与开孔126底部暴露的再布线层124电连接，金属线40的另一端与柔性线路板30上的金属垫34电连接。塑封层50至少完全包覆金属线40，实现对金属线40的固定、绝缘、保护。
请参考图2，更进一步的，指纹传感芯片封装结构还包括前框60以及与前框60卡合固定的后盖70。前框60设置于盖板20的正面21，前框60上具有窗口61，窗口61暴露指纹盖板20的部分区域，该部分区域与指纹传感区100相对应，方便指纹传感芯片10获取指纹信息。后盖70设置于柔性线路板30的背面，前框60与后盖70包围形成收容腔，为了进一步提高指纹传感芯片封装结构的稳固性，塑封材料填充于收容腔内所有空隙。柔性线路板30部分暴露于收容腔之外，方便柔性线路板30与外部电路电连接。
相应的，本发明提供一种指纹传感芯片的封装方法。
请参考图3(a)以及图3(b)，提供晶圆1，图3(a)为晶圆1的平面示意图，图3(b)为晶圆1的截面示意图。晶圆1包括多颗网格状排布的指纹传感芯片10，每一指纹传感芯片10具有指纹识别区100以及位于指纹识别区***的焊垫200，于本实施例中，在单个指纹传感芯片10中，多个焊垫200排成两列位于指纹识别区100相对的两个侧边。晶圆1具有彼此相对的正面11以及背面12，指纹识别区100以及焊垫200设置于晶圆1的正面11。
请参考图4，提供保护基板2并将保护基板2与晶圆1对位压合。具体的，保护基板2与晶圆1的形状以及尺寸一致，两者厚度可以不同。在保护基板2的一个表面或者晶圆1的正面上形成临时键合胶层21，然后，将晶圆1与保护基板2对位压合。
于本实施例中，保护基板2为透光基板，临时键合胶层21的材质为具有UV光敏感特性的UV胶，当UV光透过保护基板2照射到临时键合胶层21时，临时键合胶层21将失去粘性。
为了避免在封装过程中磨损保护基板2，在保护基板2的另一个表面上设置有保护胶带22。
请参考图5(a)以及图5(b)，分别为平面示意图以及截面示意图，在晶圆1的第二表面12上形成多个独立的凹槽121，凹槽121的位置与焊垫200的位置对应，凹槽121的深度小于晶圆1的厚度。在凹槽121中形成通孔122，每一通孔122对应一个焊垫200，通孔122暴露焊垫200。
为了避免晶圆1在封装过程由于凹槽121的设置造成晶圆1强度过低而降低了封装良率，本发明尽量控制凹槽121的尺寸，本发明设置凹槽121的长度小于凹槽121所在的指纹传感芯片10的侧边的边长。因此，在晶圆1中相邻的指纹传感芯片10之间形成足够多的留白用于保证相邻指纹传感芯片10之间的连接强度，避免晶圆1在封装过程中产生裂片的风险，提高了封装良率。
于本实施例中，采用蚀刻工艺形成凹槽121。一个凹槽121横跨两个指纹传感芯片10，即一个凹槽121中具有两列焊垫200，且两列焊垫200分别属于相邻的两个指纹传感芯片10。后续在完成封装之后，沿凹槽121的中心线切割晶圆1。
当晶圆1执行切割工艺之后，彼此相邻的指纹传感芯片10分离开来，对于单个指纹传感芯片10来说，重点是保证指纹传感芯片拐角处的强度，于本实施例中，指纹传感芯片10具有彼此相对的第一侧边以及第二侧边，所述凹槽所在的侧边的两端分别与所述第一侧边以及第二侧边相接，所述凹槽的两端不接触所述第一侧边和所述第二侧边。
请参考图6，在晶圆1的第二表面12上形成绝缘层123，绝缘层123覆盖晶圆1的第二表面12、凹槽121中以及通孔122中，绝缘层123暴露焊垫。
绝缘层123的材质为氧化硅、氮化硅、氮氧化硅或树脂类介电材质。
请参考图7，形成再布线层124，再布线层124与焊垫200电连接，位于凹槽121与通孔122中并延伸至晶圆1的第二表面12。
再布线层124采用成熟的RDL工艺选择性地分布于绝缘层123的表面并与对应的焊垫200电连接，再布线层124不连续，其分别对应不同的焊垫200，并彼此绝缘。
请参考图8，形成保护层125，保护层125至少覆盖再布线层124，于本实施例中，保护层125覆盖于晶圆1的第二表面12且覆盖于凹槽121以及通孔122中。
在保护层125设置开孔126，开孔126暴露再布线层124，且开孔126位于晶圆1的第二表面12上。
保护层125的材质可以为具有感光特性的防焊油墨，开孔126通过曝光显影工艺在保护层125上形成。
请参考图9，移除保护基板2。本实施例中临时键合胶层21的材质为UV胶，通过移除保护基板2上的保护胶带22，并将UV光透过保护基板2照射临时键合胶层21使其失去粘性，然后移除保护基板2。
若临时键合胶层21的材质为热敏感胶，则通过热解键合工艺使临时键合胶层21失去粘性，而为了避免焊接凸起127受到热解键合工艺的影响，在去除保护基板2之后再形成焊接凸起127。
在移除保护基板2之后通过清洗工艺清除晶圆1的正面上残留的临时键合胶。
请参考图10，采用切割工艺切割晶圆1将相邻的指纹传感芯片10彼此分离。
请参考图11，提供盖板20，具有彼此相对的正面21以及背面，在盖板20的背面上依次形成遮光油墨23以及DAF膜24。
请参考图12，将指纹传感芯片10的正面与盖板20的背面贴合。
请参考图13，将柔性线路板30的正面与盖板20的背面贴合。柔性线路板30具有彼此相对的正面以及背面，柔性线路板30的背面具有第二导电结构，于本实施例中，第二导电结构34为柔性线路板30暴露出的金属垫34，柔性线路板30上设置开口33，开口33避开柔性线路板30内的导电线路，开口33的形状不作特殊限定，只要其能够使指纹感应芯片穿透开口33即可。柔性线路板上还设置有与外部电连接的导电端子，本发明对此不再赘述。
指纹传感芯片10位于开口33中，采用打线工艺将指纹传感芯片10上开孔126底部暴露的再布线层124与柔性线路板30的背面上的金属垫34通过金属线40电连接。
相比于现有技术中，将指纹传感芯片10作为压力承载板，本发明通过利用盖板20作为打线工艺的压力载板，增大了压力承载面积，避免现有技术损坏指纹传感芯片的风险且提升了工艺操作的稳定性以及良率。
请参考图14，形成塑封层50，,塑封层50至少包覆金属线40。于本实施例中，塑封层包覆整个开口33，指纹传感芯片10、金属线40、金属垫34均包覆其中，提升了指纹传感芯片的封装结构的稳定性。
于本发明的另一实施例中，在完成图14的步骤之后，前框60以及与前框60卡合固定的后盖70，请参考图2。于盖板20的正面21设置前框60，前框60上具有窗口61，窗口61暴露指纹盖板20的部分区域，该部分区域与指纹传感区100相对应，方便指纹传感芯片10获取指纹信息。于柔性线路板30的背面设置后盖70，前框60与后盖70包围形成收容腔。
为了进一步提高指纹传感芯片封装结构的稳固性，在收容腔内其余空隙处填充塑封材料。柔性线路板30部分暴露于收容腔之外，方便柔性线路板30与外部电路电连接。
本发明的有益效果是通过优化指纹传感芯片的封装方法以及封装结构，从而降低指纹传感芯片的封装尺寸以满足电子产品高集成度、高稳定性的需求，并提高指纹传感芯片封装的稳定性。
应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施方式中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。
上文所列出的一系列的详细说明仅仅是针对本发明的可行性实施方式的具体说明，它们并非用以限制本发明的保护范围，凡未脱离本发明技艺精神所作的等效实施方式或变更均应包含在本发明的保护范围之内。

Claims (18)

1.一种指纹传感芯片的封装方法，其特征在于，包含如下步骤：
提供盖板；
提供指纹传感芯片，其正面设置有指纹传感区以及位于指纹传感区***的焊垫，将焊垫电性引出至所述指纹传感芯片的背面，在所述指纹传感芯片的背面形成与焊垫电连接的第一导电结构；
将所述指纹传感芯片的正面与所述盖板的背面贴合；
提供柔性线路板，其背面具有第二导电结构，在所述柔性线路板上设置开口；
将所述柔性线路板的正面与所述盖板的背面贴合，所述指纹传感芯片位于所述开口中；
将所述第一导电结构与所述第二导电结构电连接。
2.根据权利要求1所述的指纹传感芯片的封装方法，其特征在于，所述盖板为透光基板，在将所述指纹传感芯片与所述盖板贴合之前，在所述盖板的背面上形成遮光油墨。
3.根据权利要求1所述的指纹传感芯片的封装方法，其特征在于，在所述盖板的背面黏贴DAF膜用于将所述指纹传感芯片与所述盖板贴合固定。
4.根据权利要求1所述的指纹传感芯片的封装方法，其特征在于，在所述盖板的背面涂布黏胶用于将所述指纹传感芯片与所述盖板贴合固定，所述黏胶的介电常数大于或等于4。
5.根据权利要求1所述的指纹传感芯片的封装方法，其特征在于，将焊垫电性引出至所述指纹传感芯片的背面并形成第一导电结构包含如下步骤：
提供晶圆，晶圆包括多颗网格状排布的指纹传感芯片，所述指纹传感区以及所述焊垫位于所述晶圆的正面；
在所述晶圆的背面对应焊垫的位置形成凹槽，所述凹槽的深度小于所述晶圆的厚度；
在凹槽中形成通孔，每一通孔对应一个焊垫，所述通孔暴露所述焊垫；
形成绝缘层，覆盖所述晶圆的背面、凹槽以及通孔中，所述绝缘层暴露所述焊垫；
形成再布线层，所述再布线层延伸至所述晶圆的背面且与所述焊垫电连接；
形成保护层，覆盖所述再布线层；
在所述保护层上形成开孔，所述开孔位于所述晶圆的背面且暴露所述再布线层。
6.根据权利要求5所述的指纹传感芯片的封装方法，其特征在于，提供金属线，采用打线工艺将所述金属线的一端与所述开孔中暴露出的再布线层电连接，将所述金属线的另一端与所述第二导电结构电连接。
7.根据权利要求4所述的指纹传感芯片的封装方法，其特征在于，将所述第一导电结构与所述第二导电结构电连接之后，形成塑封层，所述塑封层至少包覆所述金属线。
8.根据权利要求1所述的指纹传感芯片的封装方法，其特征在于，将所述第一导电结构与所述第二导电结构电连接之后，在所述盖板的正面设置前框，前框上具有窗口，所述窗口暴露所述指纹传感区对应的盖板区域，在所述柔性线路板的背面设置后盖，所述后盖与所述前框卡合固定。
9.根据权利要求8所述的指纹传感芯片的封装方法，其特征在于，采用注塑工艺将塑封材料填充所述前框与所述后盖包围形成的收容腔。
10.一种指纹传感芯片的封装结构，其特征在于，包含：
盖板；
指纹传感芯片，其正面设置有指纹传感区以及位于指纹传感区***的焊垫，所述焊垫电性引出至所述指纹传感芯片的背面，所述指纹传感芯片的背面具有与焊垫电连接的第一导电结构；
所述指纹传感芯片的正面与所述盖板的背面贴合；
柔性线路板，其背面具有第二导电结构，所述柔性线路板上设置开口；
所述柔性线路板的正面与所述盖板的背面贴合，所述指纹传感芯片位于所述开口中；
所述第一导电结构与所述第二导电结构电连接。
11.根据权利要求10所述的指纹传感芯片的封装结构，其特征在于，所述盖板为透光基板，所述盖板的背面上涂布有遮光油墨。
12.根据权利要求10所述的指纹传感芯片的封装结构，其特征在于，所述封装结构还包括DAF膜，所述DAF膜的两面分别与所述盖板以及所述指纹传感芯片黏贴。
13.根据权利要求10所述的指纹传感芯片的封装结构，其特征在于，在所述盖板的背面涂布有黏胶用于将所述指纹传感芯片与所述盖板贴合固定，所述黏胶的介电常数大于或等于4。
14.根据权利要求10所述的指纹传感芯片的封装结构，其特征在于，所述第一导电结构包含：
形成于所述指纹传感芯片背面的凹槽，所述凹槽与所述焊垫的位置对应，所述凹槽的深度小于所述指纹传感芯片的厚度；
形成于凹槽中通孔，每一通孔对应一个焊垫，所述通孔暴露所述焊垫；
绝缘层，覆盖所述指纹传感芯片的背面、凹槽以及通孔中，所述绝缘层暴露所述焊垫；
再布线层，位于所述绝缘层之上，所述再布线层延伸至所述指纹传感芯片的背面且与所述焊垫电连接；
保护层，覆盖所述再布线层；
形成于所述保护层上开孔，所述开孔位于所述指纹传感芯片的背面且暴露所述再布线层。
15.根据权利要求14所述的指纹传感芯片的封装结构，其特征在于，所述封装结构还包括金属线，所述金属线的一端与所述开孔中暴露出的再布线层电连接，所述金属线的另一端与所述第二导电结构电连接。
16.根据权利要求15所述的指纹传感芯片的封装结构，其特征在于，所述封装结构还包括塑封层，所述塑封层至少包覆所述金属线。
17.根据权利要求10所述的指纹传感芯片的封装结构，其特征在于，在所述盖板的正面设置有前框，前框上具有窗口，所述窗口暴露所述指纹传感区对应的盖板区域，在所述柔性线路板的背面设置有后盖，所述后盖与所述前框卡合固定。
18.根据权利要求17所述的指纹传感芯片的封装结构，其特征在于，塑封材料填充所述前框与所述后盖包围形成的收容腔。
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CN112259518A (zh) * 2020-01-08 2021-01-22 王之奇 芯片的扇出封装结构及其扇出封装方法
CN112687650A (zh) * 2019-10-17 2021-04-20 浙江荷清柔性电子技术有限公司 超薄芯片的封装结构、柔性集成封装方法
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CN107170769A (zh) * 2017-07-06 2017-09-15 苏州晶方半导体科技股份有限公司 一种影像传感芯片的封装结构及其封装方法
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CN109460694A (zh) * 2017-09-06 2019-03-12 蓝思科技（长沙）有限公司 指纹传感器、智能终端及指纹传感器封装方法
CN107481980A (zh) * 2017-09-22 2017-12-15 浙江卓晶科技有限公司 一种薄型指纹芯片封装方法及封装结构
CN108447842A (zh) * 2018-04-28 2018-08-24 苏州晶方半导体科技股份有限公司 一种指纹芯片的封装结构以及封装方法
CN109284716A (zh) * 2018-09-21 2019-01-29 京东方科技集团股份有限公司 一种基板、显示面板及显示装置
CN109592634A (zh) * 2018-12-07 2019-04-09 中国科学院上海微***与信息技术研究所 有源基板及其制备方法
CN109592634B (zh) * 2018-12-07 2020-10-09 中国科学院上海微***与信息技术研究所 有源基板及其制备方法
CN112687650A (zh) * 2019-10-17 2021-04-20 浙江荷清柔性电子技术有限公司 超薄芯片的封装结构、柔性集成封装方法
CN112259518A (zh) * 2020-01-08 2021-01-22 王之奇 芯片的扇出封装结构及其扇出封装方法
CN117975516A (zh) * 2024-04-02 2024-05-03 深圳贝特莱电子科技股份有限公司 一种指纹传感器的封装结构及方法

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