CN106647112A - Double-camera module and camera device having the same - Google Patents
Double-camera module and camera device having the same Download PDFInfo
- Publication number
- CN106647112A CN106647112A CN201510712399.0A CN201510712399A CN106647112A CN 106647112 A CN106647112 A CN 106647112A CN 201510712399 A CN201510712399 A CN 201510712399A CN 106647112 A CN106647112 A CN 106647112A
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- China
- Prior art keywords
- image sensing
- camera module
- sensing area
- light hole
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000003287 optical effect Effects 0.000 claims abstract description 30
- 230000009977 dual effect Effects 0.000 claims description 37
- 238000003384 imaging method Methods 0.000 abstract description 2
- 239000013307 optical fiber Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000005194 fractionation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/02—Bodies
- G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses a double-camera module, and the double-camera module includes a double-lens unit, a lens combination seat, double optical filters, an integrated image sensing chip and a circuit board, wherein the integrated image sensing chip is installed on the circuit board and is electrically connected with the circuit board and includes a first image sensing area and a second image sensing area; the lens combination seat is mounted on the circuit board and surrounds the integrated image sensing chip, has a top surface and a bottom surface, and is provided with a first light through hole and a second light through hole, the double optical fibers include two independent optical filters, and the two optical filters are housed in the lens combination seat and are aligned with the first light through hole and the second light through hole respectively; and the double-lens unit includes two independently installed lenses, and the two lenses are arranged in the first light through hole and the second light through hole respectively and are assembled with the lens combination seat. The double-camera module ensures that center axes of the first image sensing area and the second image sensing area are parallel, and ensures imaging quality. The invention also discloses a camera device.
Description
Technical field
The invention belongs to camera head field, more particularly to a kind of dual camera module and the shooting with the dual camera module
Device.
Background technology
Dual camera module includes two cameras being individually mounted on same circuit board, and two cameras can be simultaneously right
Same object positioned at equidirectional is taken pictures, and the first image and the second image, the first image and the second figure are obtained respectively
Picture can be with compositing 3 d images, it is also possible to mutually compensate for obtaining the two dimensional image of high definition.Fig. 1 is that a pair of in correlation technique is taken the photograph
As the schematic diagram of head mould group, as shown in figure 1, dual camera module include two lens units 1 ', a camera lens assembled base 2 ',
Two cutoff filters 3 ', two image sensing chips 4 '.Wherein, image sensing chip 4 ' and circuit board 5 '
During assembling, first in the precalculated position dispensing of circuit board 5 ', two image sensing chips 4 ' need to be separately assembled to circuit board 5 '
Precalculated position (die bonding), and be adhesively fixed with circuit board 5 ', then by terminal conjunction method (wire bonding),
So that image sensing chip 4 ' is electrically connected with circuit board 5 '.
Two image sensing chips 4 ' are separately assembled on circuit board 5 ', easily produce inclination so that two image sensing cores
The central shaft of piece is not parallel, affects image quality.
The content of the invention
It is contemplated that at least solving one of technical problem in correlation technique to a certain extent.For this purpose, the present invention needs to carry
Go out a kind of dual camera module, image sensing chip run-off the straight when the dual camera module can avoid assembling, it is ensured that imaging
Quality, improves product yield.
The present invention also proposes a kind of camera head with the dual camera module.
In order to solve the above problems, one aspect of the present invention proposes a kind of dual camera module, and the dual camera module includes：Line
Road plate, integral type image sensing chip, camera lens assembled base, double optical filters and bimirror head unit, wherein, integral type image sense
Chip is surveyed, is installed on the wiring board and is electrically connected with the wiring board, the integral type image sensing chip includes the
One image sensing area and the second image sensing area；Camera lens assembled base, is installed on the wiring board and around the integral type shadow
As sensor chip, the camera lens combination seat tool has top surface and the bottom surface relative with the top surface, and the camera lens assembled base is offered
Through first light hole and the second light hole of the top surface and the bottom surface；Double optical filters, including the optical filter of two panels independence,
The optical filter of two panels independence is contained in the camera lens assembled base, and is respectively aligned to first light hole and second thang-kng
Hole；Bimirror head unit, the bimirror head unit includes two independently installed camera lenses, described two independently installed camera lenses point
It is not arranged in first light hole and second loophole and assembles with the camera lens assembled base, Jing two is independently installed
The light of camera lens distinguish Jing after the optical filter of two panels independence and reach the first image sensing area and the second image sensing area.
The dual camera module of the present invention, by using integral type image sensing chip, and on integral type image sensing chip
First image sensing area and the second image sensing area are set, compared with correlation technique using two independent image sensing chips,
The problem of run-off the straight when can avoid assembling respectively, it is ensured that the central shaft in Liang Ge image sensings area is parallel, it is ensured that image quality,
Improve product yield.
Wherein, each camera lens of the bimirror head unit includes：Lens barrel and lens set, the lens set is arranged at the mirror
In cylinder, the outer surface of the lens barrel is provided with the first screw thread.
Specifically, the lens barrel is the lens barrel of hollow cylindrical.
Wherein, the inner surface of first light hole and second light hole is respectively arranged with and is engaged with first screw thread
The second screw thread, the bimirror head unit threadedly assembles with the camera lens assembled base.
The central shaft of first light hole and second light hole is parallel with optical axis direction.
Specifically, the camera lens assembled base is rectangular-shape.
Wherein, the circuit in the first image sensing area and the second image sensing area is independently encapsulated, and described
The central axial alignment of the center in one image sensing area and first light hole, the center in the second image sensing area with it is described
The central axial alignment of the second light hole.
Specifically, described pair of optical filter is cutoff filter.The wiring board be PCB (Printed Circuit Board,
Printed substrate).
In order to solve the above problems, another aspect of the present invention proposes a kind of camera head, and the camera head includes above-mentioned double take the photograph
As head mould group.
The camera head of the present invention, by using above-mentioned dual camera module, avoiding assembling Shi Liangge image sensings area
Run-off the straight, it is ensured that image quality.
Description of the drawings
Fig. 1 is the fractionation schematic diagram of dual camera module of the prior art；
Fig. 2 is the fractionation schematic diagram of dual camera module according to an embodiment of the invention；
Fig. 3 is the schematic diagram of the integral type image sensing chip of a specific embodiment of the invention；
Fig. 4 is the block diagram of camera head according to an embodiment of the invention.
Reference：
Camera head 1000, dual camera module 100,
Bimirror head unit 10, camera lens assembled base 20, double optical filters 30, integral type image sensing chip 40 and wiring board
50,
The top surface 1 of camera lens assembled base 20 and bottom surface 2, the first light hole 21 and the second light hole 22, the first image sensing area
3 and the second image sensing area 4.
Specific embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein identical from start to finish
Or similar label represents same or similar element or the element with same or like function.Retouch below with reference to accompanying drawing
The embodiment stated is exemplary, it is intended to for explaining the present invention, and be not considered as limiting the invention.
For the technical problem in correlation technique, the embodiment of the present invention proposes a kind of dual camera module and takes the photograph with this pair
As the camera head of head mould group.
The dual camera module for proposing according to embodiments of the present invention is described with reference to the accompanying drawings.
Fig. 2 is the fractionation schematic diagram of dual camera module according to an embodiment of the invention, as shown in Fig. 2 should
Dual camera module 100 includes bimirror head unit 10, camera lens assembled base 20, double optical filters 30, integral type image sensing
Chip 40 and wiring board 50.
Wherein, bimirror head unit 10 includes two independently installed camera lenses, and each camera lens includes lens barrel and lens set, and (figure is not
Sign), specifically, lens barrel can be the lens barrel of hollow cylindrical.Lens set is arranged in lens barrel.
Camera lens assembled base 20 has top surface 1 and the bottom surface 2 relative with top surface 1, and camera lens assembled base 20 is offered through top surface 1
With first light hole 21 and the second light hole 22 of bottom surface 2, two independently installed camera lenses of bimirror head unit 10 set respectively
It is placed in the first light hole 21 and the second loophole 22, and assembles with camera lens assembled base 20.
Specifically, the outer surface of the lens barrel of bimirror head unit 10 is provided with the first screw thread such as external screw thread, the first light hole 21
The the second screw thread such as internal thread being engaged with the first screw thread, twin-lens list are respectively arranged with the inner surface of the second light hole 22
Unit 10 threadedly assembles with camera lens assembled base 20, i.e., two camera lenses respectively with the first light hole 21 and the second light hole
22 is engaged through the thread.Wherein, the central shaft of the first light hole 21 and the second light hole 22 is parallel with optical axis direction, i.e.,
After bimirror head unit 10 is assembled with camera lens assembled base 20, the central shaft of two camera lenses is parallel with optical axis.Specifically, camera lens
Assembled base 20 can be rectangular-shape.
Double optical filters 30 include the optical filter of two panels independence, and the optical filter of two panels independence is contained in camera lens assembled base 20, and
It is respectively aligned to the first light hole 21 and the second light hole 22.In one embodiment of the invention, double optical filters 30 are infrared
Edge filter, for filtering the available light by the first light hole 21 and the second light hole 22 in infrared light.
As shown in figure 3, the schematic diagram of the integral type image sensing chip 40 for a specific embodiment of the present invention.Integral type
Image sensing chip 40 is installed on wiring board 50, and camera lens assembled base 20 is also installed on wiring board 50, for example lens group
The bottom surface 2 for closing seat 20 is connected with wiring board 50, and around integral type image sensing chip 40.Integral type image sensing chip
40 include the first image sensing area 3 and the second image sensing area 4, the of the first image sensing area 3 alignment camera lens assembled base 20
One light hole 21, for the optical signal that sensing passes through the first light hole 21, the alignment camera lens assembled base of the second image sensing area 4
20 the second light hole 22, for the optical signal that sensing passes through the second light hole 22.Specifically, integral type image sensing core
Piece 40 is electrically connected with wiring board 50, for by by the optical signal of the first light hole 21 and by the second light hole 22
Optical signal is converted to electric signal.Wherein, the circuit individual packages in the first image sensing area 3 and the second image sensing area 4,
And first image sensing area 3 center and the first light hole 21 central axial alignment, the center in the second image sensing area 4 and the
The central axial alignment of two light holes 22, through the light difference Jing two panels of two independently installed camera lenses of bimirror head unit 10
The first image sensing area 3 and the second image sensing area 4 are reached after independent optical filter, Liang Ge image sensings area is sensed
Light is independent of each other, and conversion of the optical signal to electric signal is realized respectively.
Integral type image sensing chip 40 is installed on the precalculated position of wiring board 50, the bottom surface 2 of camera lens assembled base 20 and circuit
Plate 50 is connected, and the precalculated position as causes the first image sensing area 3 and second shadow of integral type image sensing chip 40
As the position that first light hole 21 and the second light hole 22 of sensing area 4 and camera lens assembled base 20 are aligned.Specifically, line
Road plate 50 is PCB, for realizing signal conduction with external circuit.
It is understood that the dual camera module 100 of the embodiment of the present invention uses an integral type image sensing chip
40, and two independent image sensing areas are set on integral type image sensing chip 40, Ji Liangge image sensings area is located at same
On one carrier, formula image sensing chip 40 is integrally formed, directly the integral type image sensing chip 40 can be assembled in into line
On road plate 50, compared with correlation technique using the image sensing chip of two panels independence, without the need for two panels image sensing chip is divided
Do not assemble, it is to avoid the problem of the two panels image sensing chip run-off the straight occurred when assembling respectively, it is ensured that dual camera module
Two image sensing district center axles of 100 integral type chip 40 are parallel, improve image quality.
In sum, dual camera module 100 according to embodiments of the present invention, by using integral type image sensing chip 40,
And the first image sensing area 3 and the second image sensing area 4 are set on integral type image sensing chip 40, in correlation technique
Compared using two independent image sensing chips, the problem of run-off the straight when can avoid assembling respectively, it is ensured that double shootings
Two image sensing district center axles of the integral type image sensing chip 40 of head mould group 100 are parallel, it is ensured that image quality, improve
Product yield.
Based on the dual camera module of above-mentioned aspect, describe what embodiment according to a further aspect of the invention was proposed with reference to the accompanying drawings
Camera head.
Fig. 4 is the block diagram of camera head according to an embodiment of the invention, as shown in figure 4, the camera head 1000 is wrapped
Include the dual camera module 100 of above-mentioned aspect embodiment.
The camera head 1000 of the embodiment of the present invention, by the dual camera module 100 using above-described embodiment, can avoid
The problem of two panels image sensing chip run-off the straight when assembling respectively, it is ensured that the integral type image sense of dual camera module 100
Two image sensing district center axles for surveying chip 40 are parallel, it is ensured that image quality.
For example, the dual camera module 100 can serve as the camera of mobile phone camera, panel computer, it is also possible to be applied to
In electronic watch with camera function.
In the description of this specification, it is to be understood that term " " center ", " longitudinal direction ", " horizontal ", " length ", " width
Degree ", " thickness ", " on ", D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom "
The orientation or position relationship of the instruction such as " interior ", " outward ", " clockwise ", " counterclockwise ", " axial direction ", " radial direction ", " circumference "
Be based on orientation shown in the drawings or position relationship, be for only for ease of description the present invention and simplify description, rather than indicate or
Hint indication device or element must have specific orientation, with specific azimuth configuration and operation, therefore it is not intended that
Limitation of the present invention.
Additionally, in describing the invention, " multiple " are meant that at least two, such as two, three etc., unless otherwise
It is clearly specific to limit.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. mean to combine the specific features of the embodiment or example description, structure, material or
Feature is contained at least one embodiment of the present invention or example.In this manual, to the schematic representation of above-mentioned term
Necessarily it is directed to identical embodiment or example.And, the specific features of description, structure, material or feature can be with
Combine in an appropriate manner in any one or more embodiments or example.Additionally, in the case of not conflicting, ability
The technical staff in domain can enter the feature of the different embodiments or example described in this specification and different embodiments or example
Row is combined and combined.
Although embodiments of the invention have been shown and described above, it is to be understood that above-described embodiment be it is exemplary,
It is not considered as limiting the invention, one of ordinary skill in the art within the scope of the invention can be to above-described embodiment
It is changed, changes, replacing and modification.
Claims (10)
1. a kind of dual camera module, it is characterised in that include：
Wiring board；
Integral type image sensing chip, is installed on the wiring board and is electrically connected with the wiring board, the integral type shadow
As sensor chip includes the first image sensing area and the second image sensing area；
Camera lens assembled base, is installed on the wiring board and around the integral type image sensing chip, the camera lens assembled base
With top surface and the bottom surface relative with the top surface, the camera lens assembled base offers through the top surface and the bottom surface
One light hole and the second light hole；
Double optical filters, including the optical filter of two panels independence, the optical filter of two panels independence is contained in the camera lens assembled base, and
It is respectively aligned to first light hole and second light hole；
Bimirror head unit, the bimirror head unit includes two independently installed camera lenses, described two independently installed camera lenses point
It is not arranged in first light hole and second loophole and assembles with the camera lens assembled base, Jing two is independently installed
The light of camera lens distinguish Jing after the optical filter of two panels independence and reach the first image sensing area and the second image sensing area.
2. dual camera module as claimed in claim 1, it is characterised in that each camera lens of the bimirror head unit is wrapped
Include：Lens barrel and lens set, the lens set is arranged in the lens barrel, and the outer surface of the lens barrel is provided with the first screw thread.
3. dual camera module as claimed in claim 2, it is characterised in that the lens barrel for hollow cylindrical lens barrel.
4. dual camera module as claimed in claim 3, it is characterised in that first light hole and second thang-kng
The inner surface in hole is respectively arranged with the second screw thread being engaged with first screw thread, the bimirror head unit and the lens group
Close seat threadedly to assemble.
5. dual camera module as claimed in claim 4, it is characterised in that first light hole and second thang-kng
The central shaft in hole is parallel with optical axis direction.
6. dual camera module as claimed in claim 5, it is characterised in that the camera lens assembled base is rectangular-shape.
7. dual camera module as claimed in claim 6, it is characterised in that the first image sensing area and described second
Circuit individual packages in image sensing area, and the central shaft of the center in the first image sensing area and first light hole
Alignment, the central axial alignment of the center in the second image sensing area and second light hole.
8. dual camera module as claimed in claim 1, it is characterised in that described pair of optical filter is cutoff filter.
9. dual camera module as claimed in claim 1, it is characterised in that the wiring board is PCB.
10. a kind of camera head, it is characterised in that include the dual camera module as described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510712399.0A CN106647112A (en) | 2015-10-28 | 2015-10-28 | Double-camera module and camera device having the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510712399.0A CN106647112A (en) | 2015-10-28 | 2015-10-28 | Double-camera module and camera device having the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106647112A true CN106647112A (en) | 2017-05-10 |
Family
ID=58816122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510712399.0A Pending CN106647112A (en) | 2015-10-28 | 2015-10-28 | Double-camera module and camera device having the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106647112A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509011A (en) * | 2017-08-28 | 2017-12-22 | 华勤通讯技术有限公司 | Dual camera module and electronic equipment |
| CN108322632A (en) * | 2018-02-28 | 2018-07-24 | 广东欧珀移动通信有限公司 | Camera module, electronic device and camera module production method |
| CN108495021A (en) * | 2018-06-26 | 2018-09-04 | 宁波金晟芯影像技术有限公司 | A kind of dual camera |
| CN108581869A (en) * | 2018-03-16 | 2018-09-28 | 深圳市策维科技有限公司 | A kind of camera module alignment methods |
| CN108712600A (en) * | 2018-08-23 | 2018-10-26 | Oppo广东移动通信有限公司 | A kind of camera module and electronic equipment |
| CN111038388A (en) * | 2019-11-28 | 2020-04-21 | 天津津航技术物理研究所 | Dual-mode vehicle-mounted auxiliary driving system |
| WO2022099505A1 (en) * | 2020-11-11 | 2022-05-19 | 深圳市大疆创新科技有限公司 | Vehicle-mounted multi-view assembly, assembling method, and vehicle |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH03138634A (en) * | 1989-10-25 | 1991-06-13 | Hitachi Ltd | Stereo camera |
| CN103841404A (en) * | 2014-03-18 | 2014-06-04 | 江西省一元数码科技有限公司 | Novel three-dimensional image shooting module |
| CN104834158A (en) * | 2015-05-22 | 2015-08-12 | 南昌欧菲光电技术有限公司 | Double-camera module group |
| CN205176454U (en) * | 2015-10-28 | 2016-04-20 | 南昌欧菲光电技术有限公司 | Two camera modules and have its camera device |
-
2015
- 2015-10-28 CN CN201510712399.0A patent/CN106647112A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03138634A (en) * | 1989-10-25 | 1991-06-13 | Hitachi Ltd | Stereo camera |
| CN103841404A (en) * | 2014-03-18 | 2014-06-04 | 江西省一元数码科技有限公司 | Novel three-dimensional image shooting module |
| CN104834158A (en) * | 2015-05-22 | 2015-08-12 | 南昌欧菲光电技术有限公司 | Double-camera module group |
| CN205176454U (en) * | 2015-10-28 | 2016-04-20 | 南昌欧菲光电技术有限公司 | Two camera modules and have its camera device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107509011A (en) * | 2017-08-28 | 2017-12-22 | 华勤通讯技术有限公司 | Dual camera module and electronic equipment |
| CN108322632A (en) * | 2018-02-28 | 2018-07-24 | 广东欧珀移动通信有限公司 | Camera module, electronic device and camera module production method |
| CN108322632B (en) * | 2018-02-28 | 2020-09-08 | Oppo广东移动通信有限公司 | Camera module, electronic device and camera module manufacturing method |
| CN108581869A (en) * | 2018-03-16 | 2018-09-28 | 深圳市策维科技有限公司 | A kind of camera module alignment methods |
| CN108495021A (en) * | 2018-06-26 | 2018-09-04 | 宁波金晟芯影像技术有限公司 | A kind of dual camera |
| CN108712600A (en) * | 2018-08-23 | 2018-10-26 | Oppo广东移动通信有限公司 | A kind of camera module and electronic equipment |
| CN111038388A (en) * | 2019-11-28 | 2020-04-21 | 天津津航技术物理研究所 | Dual-mode vehicle-mounted auxiliary driving system |
| WO2022099505A1 (en) * | 2020-11-11 | 2022-05-19 | 深圳市大疆创新科技有限公司 | Vehicle-mounted multi-view assembly, assembling method, and vehicle |
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