CN106634653A - Photovoltaic module packaging adhesive film with three-dimensional heat-conducting channels, and preparation method and assembly thereof - Google Patents
Photovoltaic module packaging adhesive film with three-dimensional heat-conducting channels, and preparation method and assembly thereof Download PDFInfo
- Publication number
- CN106634653A CN106634653A CN201611152042.2A CN201611152042A CN106634653A CN 106634653 A CN106634653 A CN 106634653A CN 201611152042 A CN201611152042 A CN 201611152042A CN 106634653 A CN106634653 A CN 106634653A
- Authority
- CN
- China
- Prior art keywords
- packaging adhesive
- heat conduction
- adhesive film
- dimensional
- glued membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 99
- 239000002313 adhesive film Substances 0.000 title claims abstract description 98
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 85
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 72
- 239000000945 filler Substances 0.000 claims abstract description 45
- 239000002245 particle Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 4
- 230000004048 modification Effects 0.000 claims description 48
- 238000012986 modification Methods 0.000 claims description 48
- 239000012528 membrane Substances 0.000 claims description 44
- 229920002521 macromolecule Polymers 0.000 claims description 39
- 239000000463 material Substances 0.000 claims description 39
- 229920002943 EPDM rubber Polymers 0.000 claims description 25
- 229920002379 silicone rubber Polymers 0.000 claims description 25
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 17
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 16
- 239000003999 initiator Substances 0.000 claims description 16
- 239000003431 cross linking reagent Substances 0.000 claims description 15
- 239000002048 multi walled nanotube Substances 0.000 claims description 15
- 239000000843 powder Substances 0.000 claims description 15
- 239000003963 antioxidant agent Substances 0.000 claims description 14
- 239000011159 matrix material Substances 0.000 claims description 14
- 239000002356 single layer Substances 0.000 claims description 14
- 230000003078 antioxidant effect Effects 0.000 claims description 12
- 235000006708 antioxidants Nutrition 0.000 claims description 12
- 239000004014 plasticizer Substances 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 239000012752 auxiliary agent Substances 0.000 claims description 10
- 238000002156 mixing Methods 0.000 claims description 10
- 229910052582 BN Inorganic materials 0.000 claims description 9
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 9
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 9
- 238000001125 extrusion Methods 0.000 claims description 9
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000000395 magnesium oxide Substances 0.000 claims description 8
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 7
- 238000007766 curtain coating Methods 0.000 claims description 7
- 238000004049 embossing Methods 0.000 claims description 7
- 229910000077 silane Inorganic materials 0.000 claims description 7
- -1 tackifier Substances 0.000 claims description 7
- 238000004804 winding Methods 0.000 claims description 7
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical group C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000007385 chemical modification Methods 0.000 claims description 6
- 150000003254 radicals Chemical class 0.000 claims description 6
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 5
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 5
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 claims description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 5
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical group C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 4
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 claims description 4
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 4
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 claims description 4
- 239000007822 coupling agent Substances 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 4
- 238000002715 modification method Methods 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 150000003505 terpenes Chemical class 0.000 claims description 4
- 235000007586 terpenes Nutrition 0.000 claims description 4
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 claims description 4
- SIXWIUJQBBANGK-UHFFFAOYSA-N 4-(4-fluorophenyl)-1h-pyrazol-5-amine Chemical compound N1N=CC(C=2C=CC(F)=CC=2)=C1N SIXWIUJQBBANGK-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 239000012964 benzotriazole Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 235000019441 ethanol Nutrition 0.000 claims description 3
- 238000001914 filtration Methods 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 125000005498 phthalate group Chemical group 0.000 claims description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 2
- 125000003354 benzotriazolyl group Chemical group N1N=NC2=C1C=CC=C2* 0.000 claims description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims 2
- 150000002148 esters Chemical class 0.000 claims 1
- 229940074391 gallic acid Drugs 0.000 claims 1
- 235000004515 gallic acid Nutrition 0.000 claims 1
- 239000002071 nanotube Substances 0.000 claims 1
- 239000002041 carbon nanotube Substances 0.000 abstract description 39
- 229920000642 polymer Polymers 0.000 abstract description 13
- 229910021393 carbon nanotube Inorganic materials 0.000 abstract description 6
- 238000010248 power generation Methods 0.000 abstract description 5
- 238000012546 transfer Methods 0.000 abstract description 3
- 239000004020 conductor Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 description 31
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000011256 inorganic filler Substances 0.000 description 5
- 229910003475 inorganic filler Inorganic materials 0.000 description 5
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 230000000875 corresponding effect Effects 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical class C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000006250 one-dimensional material Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 description 1
- AKUNSTOMHUXJOZ-UHFFFAOYSA-N 1-hydroperoxybutane Chemical compound CCCCOO AKUNSTOMHUXJOZ-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 229910004541 SiN Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002079 cooperative effect Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000006384 oligomerization reaction Methods 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C09J123/0853—Vinylacetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/16—Elastomeric ethene-propene or ethene-propene-diene copolymers, e.g. EPR and EPDM rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/204—Applications use in electrical or conductive gadgets use in solar cells
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention relates to a photovoltaic module packaging adhesive film with three-dimensional heat-conducting channels, and a preparation method and assembly thereof. The photovoltaic module packaging adhesive film with three-dimensional heat-conducting channels comprises a high-polymer main body resin, wherein the high-polymer main body resin comprises one-dimensional carbon nanotubes and/or two-dimensional graphene, and a zero-dimensional heat-conducting particle filler; the weight percent of the one-dimensional carbon nanotubes and/or two-dimensional graphene in the packaging adhesive film is 0.001-10%; and the mass percent of the zero-dimensional heat-conducting particle filler in the packaging adhesive film is less than or equal to 10%. The heat-conducting material and content thereof are selected, so that the packaging adhesive film contains the high-efficiency three-dimensional heat-conducting network channels inside; the heat conductivity coefficient is 1.0-2.0 W/m.K; and the packaging adhesive film is hopeful to effectively lower the working temperature of the module by 2-6 DEG C and enhance the output power of the photovoltaic module by 1-2%. The packaging adhesive film can effectively transfer heat generated by the solar module in the power generation process in time, lower the working temperature of the module, enhance the generating capacity of the module and lower the power generation cost of the module.
Description
Technical field
The present invention relates to area of solar cell, more particularly to a kind of photovoltaic component encapsulating glue with three dimentional heat conduction passage
Film and preparation method and component.
Background technology
Solar components are the cores of photovoltaic generating system, and its structure is generally led to by front glass sheet, cell piece string and backboard
Cross the encapsulation such as packaging adhesive film, such as EVA, EPDM, POE or organic silicon rubber to form.Wherein cell piece is mainly silicon-based semiconductor,
Such as monocrystalline silicon battery, polycrystal silicon cell and unformed silion cell etc..Photovoltaic generating system be typically in actual applications compared with
Under high solar radiation, its power generation performance is affected by a natural very big, wherein system critical piece, solar battery group
The operating temperature of part is one of principal element of impact photovoltaic efficiency.Impact of the temperature to solar cell is mainly reflected in
The parameters such as the open-circuit voltage of solar cell, short circuit current and peak power change with the change of battery operating temperature.Research
Show, assembly temperature often raises 1 DEG C, and the power loss of silica-based solar cell is 0.4% or so.
At present the structure of solar components is mostly packaged solar battery sheet using two-layer EVA, and respectively front
Back plate is protected using glass or macromolecule backboard.Head will be derived and distributed to the heat that solar battery sheet is produced at work
First it is accomplished by by EVA packaging adhesive films, therefore, the heat conductivility of encapsulating material EVA has heavy to closing to the generated energy of photovoltaic module
The impact wanted.The EVA adhesive film of high thermal conductivity coefficient can effectively reduce the operating temperature of component, improve the generated energy of component, reduces
The cost of electricity-generating of component.
In view of the thermal conductivity factor of the encapsulating material such as EVA, EPDM, POE or organic silicon rubber is poor, particularly consumption is most
EVA material intrinsic thermal conductivity coefficient is worst, therefore it is modified very necessary.Chinese patent publication No. is
CN103045112A, publication date is that a kind of addition modified inorganic filler is provided in the patent of invention of on 04 17th, 2013
High heat conduction EVA adhesive film.Its mechanism is the modified inorganic filler that high heat conduction is introduced between the organic macromolecule of low heat conduction so that whole
Organic macromolecule in the continuous phase heat conduction to improve EVA adhesive film integral with the blending of the inorganic filler in dispersion phase in individual system
Coefficient.Inorganic filler in glued membrane prepared by the method is in dispersion phase, forms a kind of typical with the macromolecular material of continuous phase
" sea-island " structure (as shown in Figure 7), it is impossible to form overall heat conduction network, although thermal conductivity factor increases, remains at
One relatively low level.In addition, in order to the EVA adhesive film for obtaining high heat conduction generally requires to add substantial amounts of inorganic filler, such one
Melt viscosity to make system is drastically raised, and brings unfavorable to processing and forming.Chinese patent publication No. CN105778792A, it is open
Date is the high heat conduction EVA glue that a kind of addition Graphene is provided in the patent of invention of on 07 20th, 2016 for heat filling
Film, its mechanism is to improve the thermal conductivity factor of EVA adhesive film using the high thermal conductivity of Graphene.Lead in glued membrane prepared by the method
Hot filler Graphene is sheet due to its pattern, and channel density is less in the heat conduction network of formation, therefore although thermal conductivity factor has
Significantly improve, but it is still less to the operating temperature reduction amplitude of photovoltaic module.Therefore, find it is a kind of more effectively and reliably
Solution remains the target that photovoltaic industry is constantly pursued preparing the packaging adhesive film with high-termal conductivity, high-weatherability.
The content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, there is provided a kind of high heat conduction, high insulation, high durable, viscoelastic
The good photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage of property and preparation method and component.The packaging adhesive film of the present invention is based on
One-dimensional Quantum CNT and/or two-dimensional graphene and brium carbonate, barium sulfate, boron nitride, aluminum oxide, magnesia, Si3N4、
High heat conduction with three dimentional heat conduction network channel, the height of one or more combination of the zero dimension conductive particle filler such as AlN, SiN is absolutely
The polymer blended co-extrusion thing of edge, high durable, viscoplasticity.
A kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage that the present invention is provided, including technical scheme below：
A kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage, including macromolecule matrix resin, macromolecule main body
Resin includes one-dimensional CNT and/or two-dimensional graphene, and zero dimension conductive particle filler, one-dimensional CNT and/or
Percentage by weight of the two-dimensional graphene in packaging adhesive film is 0.001-10%；Zero dimension conductive particle filler is in packaging adhesive film
Percentage by weight is less than or equal to 10%.
Wherein, the percentage by weight of one-dimensional CNT and/or two-dimensional graphene in packaging adhesive film is 1-10%；Zero dimension
Percentage by weight of the conductive particle filler in packaging adhesive film is 1-10%.
Wherein, the percentage by weight of one-dimensional CNT and/or two-dimensional graphene in packaging adhesive film is 2-8%；Zero dimension
Percentage by weight of the conductive particle filler in packaging adhesive film is 2-8%.
Wherein, zero dimension conductive particle filler includes brium carbonate, barium sulfate, boron nitride, aluminum oxide, magnesia, Si3N4、AlN
Or in SiN any one or appoint it is several.
Wherein, one-dimensional CNT is SWCN or multi-walled carbon nano-tubes, and one-dimensional CNT is through surface
Carbon nano-tube modified, one-dimensional CNT has very big draw ratio, its a diameter of nanoscale, and length is micron or grade；
Two-dimensional graphene is single-layer graphene or multi-layer graphene, and two-dimensional graphene is the Graphene through surface modification,
Its thickness is nanoscale, and apparent size is micron to grade；
Zero dimension conductive particle filler is the zero dimension conductive particle filler through surface modification, and its particle diameter is nanoscale or micron
Level.
Wherein, macromolecule matrix resin be in EVA, POE, EPDM or organic silicon rubber any one or appoint several, envelope
Dress glued membrane also includes crosslinking agent, initiator, tackifier, plasticizer, antioxidant and anti ultraviolet agent.
Wherein, crosslinking agent is the polyfunctional compound containing unsaturated double-bond；Initiator is at relatively high temperatures can be rapid
Decompose and discharge the compound of free radical；Tackifier are relative molecular masses 200～2000, softening point 5～150 DEG C it
Between oligomer；Plasticizer is phthalate.
Wherein, crosslinking agent is divinylbenzene or triallyl isocyanurate；Initiator is dibenzoyl peroxide, uncle
Butylhydroperoxide or peroxidized t-butyl perbenzoate；Tackifier are rosin, terpene or silane coupler；Phthalic acid
Esters are diisononyl phthalate, diisooctyl phthalate or dioctyl phthalate；Antioxidant is anti-
Oxygen agent 168 or antioxidant 1010；Anti ultraviolet agent is benzotriazole ultraviolet absorber.
Wherein, macromolecule matrix resin is processed through chemical modification or physical modification.
Present invention also offers a kind of photovoltaic module, including a kind of above-mentioned envelope of the photovoltaic module with three dimentional heat conduction passage
Dress glued membrane.
The preparation method of a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage that the present invention is provided, to macromolecule
Add one-dimensional CNT and/or two-dimensional graphene, percentage by weight of the percentage by weight for 0.001-10% in matrix resin
For the zero dimension conductive particle filler of 0.001-10%, and other auxiliary agent mixing and stirrings, mixed uniformly raw material is sent into
Screw extruder is extruded under the conditions of 50-100 DEG C, the material of extrusion carry out under the conditions of 30-40 DEG C curtain coating embossing,
Cooled down under the conditions of 10-20 DEG C, under the conditions of 10-20m/min draw winding obtain packaging adhesive film.
Wherein, one-dimensional CNT is the SWCN of surface modification, and its surface modification method is first in strong acid
Middle cleaning, activation, obtain the rich carboxylic CNT in surface, wash afterwards, be dried, and will activate dried CNT point
Dissipate in organic solvent, with corresponding Organic Alcohol or organic amine surface modification is carried out, afterwards filtration drying is standby；
Zero dimension conductive particle filler is the conduction powder of surface modification, and its surface modification method is by corresponding coupling agent
In being scattered in absolute ethyl alcohol, and it is sprayed in a small amount in conduction powder material by several times, mixes at 70 DEG C -90 DEG C and fully ground
Mill obtains the conduction powder material of surface modification.
Wherein, auxiliary agent includes crosslinking agent, the initiator of 1%-10%, the tackifier of 1%-10%, the 1%- of 1%-10%
The anti ultraviolet agent of 10% plasticizer, the antioxidant of 1%-10% and 1%-10%.
The enforcement of the present invention includes following technique effect：
The good packaging adhesive film of the high heat conduction of present invention offer, high insulation, high durable type, viscoplasticity, using One-dimensional Quantum material
Material CNT and/or two-dimensional graphene and one or more combination in zero dimension conductive particle filler are to polymer viscoelastic
Glued membrane is modified.The thermal conductivity factor of glued membrane can pass through CNT and/or Graphene and zero dimension conductive particle filler
Regulating and controlling, the application applicant is selected the content of Heat Conduction Material content through substantial amounts of test so that packaging adhesive film
Inside has efficient three dimentional heat conduction network channel, can timely and effectively transmit the heat that solar components are produced in power generation process
Amount, the operating temperature for reducing component, the cost of electricity-generating for improving component generated energy, reducing component.Such three-dimensional passage of heat is big
The transmission efficiency of heat is improve greatly, the thermal conductivity factor of packaging adhesive film is between 1.0-2.0W/m.K, it is expected to effectively reduce component
Operating temperature 2-6 degree, improve photovoltaic module power output 1-2%；Conduction powder is used merely for filler than traditional
Conductive adhesive film has obvious advantage, therefore can meet component for long periods, efficient power generation requirements.
Additionally, by addition silane coupler glued membrane can be made bonding more firm with glass or macromolecule backboard.It is logical
Crossing the auxiliary agents such as ultraviolet absorber, antioxidant can improve macromolecule glue membrane body weatherability.High heat conduction provided by the present invention, height
Weather-proof, high insulation-encapsulated glued membrane fully incorporates various requirement of the component to packaging adhesive film performance, and various performance indications are controllable, can
Adjust, preparation technology flexibly, makes reliability and improve generated energy, reduce generating electricity into that packaging adhesive film relies on by component Long-Time Service
This provides strong guarantee.
Description of the drawings
(R is any chemical base to the SWCN of surface modifications of the Fig. 1 used by embodiment of the present invention packaging adhesive film
Group).
(R is any chemical base to the multi-walled carbon nano-tubes of surface modifications of the Fig. 2 used by embodiment of the present invention packaging adhesive film
Group).
(R is any chemical base to the single wall layer graphene of surface modifications of the Fig. 3 used by embodiment of the present invention packaging adhesive film
Group).
(R is any chemical base to the multi-layer graphene of surface modifications of the Fig. 4 used by embodiment of the present invention packaging adhesive film
Group).
Fig. 5 is the zero dimension conductive particle filler of the non-surface modification used by embodiment of the present invention packaging adhesive film.
(R is anyization to the zero dimension conductive particle filler of surface modifications of the Fig. 6 used by embodiment of the present invention packaging adhesive film
Learn group).
Fig. 7 is the packaging adhesive film internal structure schematic diagram (isolated " sea-island " structure) of the Heat Conduction Material for being added with traditional.
Fig. 8 is the packaging adhesive film internal structure schematic diagram (" sea-island " structure of bridging) of the embodiment of the present invention.
In figure,For zero dimension conductive particle filler ,～it is one-dimensional, two-dimentional heat filling.
Specific embodiment
The present invention is described in detail below in conjunction with embodiment and accompanying drawing, it should be pointed out that described reality
Apply example and be intended merely to facilitate the understanding of the present invention, and any restriction effect is not risen to it.
A kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage that the present embodiment is provided, including macromolecule main body tree
Fat, macromolecule matrix resin includes one-dimensional CNT and/or two-dimensional graphene, and zero dimension conductive particle filler, one-dimensional
The percentage by weight of CNT and/or two-dimensional graphene in packaging adhesive film is 0.001-10% (wt%), concrete to may be selected
1-9%, more preferably 2-8%；Percentage by weight of the zero dimension conductive particle filler in packaging adhesive film is less than or equal to
10% (wt%), specifically may be selected 1-9%, more preferably 2-8%.One-dimensional CNT and two-dimensional graphene can be independent
Use, it is also possible to be used in mixed way the carbon-based heat filling of composition.By the restriction to above-mentioned material component and content so that one-dimensional carbon
Nanotube, two-dimensional graphene and zero dimension conductive particle filler can form efficient three dimentional heat conduction net in macromolecule matrix resin
Network passage (as shown in Figure 8), effectively improves the thermal conductivity factor of glued membrane.By to one-dimensional CNT, two-dimensional graphene, Yi Jiling
The addition and physical size of dimension conductive particle filler is adjusted, can be with the passage specific surface area of effective control three-dimensional wire guide network
And channel density, it is expected to the operating temperature 2-6 degree of component is effectively reduced, power output 1-2% of photovoltaic module is improved.This enforcement
The thermal conductivity factor of the packaging adhesive film that example is obtained is between 1.0-2.0W/m.K.Packaging adhesive film can be by blending extrusion, curtain coating press mold
Prepared by the continuous processing such as (embossing), cooling, traction winding, preparation method is simple, it is resulting with high heat conduction, it is high insulation, high
The good performance of weather resistant, viscoplasticity.
In the present embodiment, CNT can be SWCN or multi-walled carbon nano-tubes, or without surface
Carbon nano-tube modified or through surface modification CNT, preferably through surface modification CNT, CNT has very big
Draw ratio, its a diameter of nanoscale, preferably 1 nanometer to 100 nanometers, length is micron or grade, and preferably 1 micron to 10 millis
Rice.Graphene can be the Graphene of single-layer graphene or multi-layer graphene, or non-surface modification or through surface
The Graphene of modification, preferably through the Graphene of surface modification, its thickness be nanoscale, preferably 0.1 nanometer to 100 nanometers, table
See size (i.e. graphene microchip size) be micron to grade, preferably 1 micron to 10 millimeters.Zero dimension conductive particle filler is not
The zero dimension conductive particle filler of surface modification or the zero dimension conductive particle filler through surface modification, its particle diameter be nanoscale or
Micron order, preferably 1 nanometer to 1000 microns.Zero dimension conductive particle filler includes brium carbonate, barium sulfate, boron nitride, aluminum oxide, oxygen
Change magnesium, Si3N4, in AlN or SiN any one or appoint several.Brium carbonate, barium sulfate, boron nitride, aluminum oxide, magnesia, oxygen
Change zinc, Si3N4, the powder such as AlN, SiN, can be that one kind individually mixes with carbon-based Heat Conduction Material, or several leads with carbon-based
Hot material mixes.
Macromolecule matrix resin be EVA (polyethylene-polyvinyl acetate), POE (high polymer of ethene and butylene, or
The high polymer of ethene and octene), in EPDM (ethylene propylene diene rubber) or organic silicon rubber any one or appoint several, packaging plastic
Film also includes crosslinking agent, initiator, tackifier, plasticizer, antioxidant and anti ultraviolet agent.Crosslinking agent used is containing unsaturated
Polyfunctional compound of double bond, such as divinylbenzene or triallyl isocyanurate etc., its distinguishing feature is in free radical
Free radicals copolymerization reaction can be carried out under causing.Initiator used is rapidly to decompose and discharge free radical at relatively high temperatures
Compound, such as azo compound and peroxide etc..Than more typical such as dibenzoyl peroxide (BPO), tert-butyl group mistake
Hydrogen oxide, peroxidized t-butyl perbenzoate etc..Tackifier used can dramatically increase viscous between glued membrane and front glass sheet and backboard
With joint efforts.Including natural and artificial synthesized relative molecular mass 200～2000, the oligomerization between 5～150 DEG C of softening point
Thing.Than it is more typical such as, rosin, terpene and silane coupler etc..Plasticizer used can significantly attenuate the work between macromolecule
Firmly, the mobility of polymer molecular chain is increased, the crystallinity of polymer molecular chain is reduced, be increased the plasticity of polymer.
Relatively it is typically phthalate, such as diisononyl phthalate, diisooctyl phthalate, O-phthalic
Dioctyl phthalate etc..Antioxidant used is the carrying out that can significantly delay or suppress polymer chain oxidizing process, so as to prevent polymerization
Thing aging simultaneously extends its service life, than more typical such as irgasfos 168, antioxidant 1010.Anti ultraviolet agent used can have
Effect absorbs and uv reflectance, significantly improves the compound of polymer ultraviolet aging resistance ability, than more typical such as BTA
Class ultraviolet absorber.
The thickness of packaging adhesive film is micron order or grade, and preferably 100 microns to 2 millimeters, fabric width is 1 to 4 meters.EVA、
The high molecular bulk resin such as POE, EPDM or organic silicon rubber, CNT and/or Graphene, zero dimension conductive particle filler and friendship
Extrudate is passed through after the mixture Jing twin-screw extrusions such as connection agent, initiator, tackifier, plasticizer, antioxidant, anti ultraviolet agent
The continuous processings such as curtain coating, press mold (embossing), cooling, traction and winding obtain high heat conduction, high insulation, the packaging adhesive film of high durable.
Preferably, macromolecule matrix resin can be processed through chemical modification or physical modification.Macromolecule matrix resin
Modifier can be chemical modification (such as copolymerization), physical modification (being for example blended) or the combination of the two.
CNT (CNTs) (shown in Fig. 1 and Fig. 2) is a kind of typical One-dimensional Quantum material, is known in the world at present
One of best Heat Conduction Material.Nanotube-shaped material is compared with graininess with other shapes of radiating filler, it is easier to shape
Into heat conduction network, therefore heat transfer efficiency is higher.Graphene is also a kind of special material, is a kind of hexangle type being made up of carbon atom
Flat thin (flakey) in honeycomb lattice, the two-dimensional material (shown in Fig. 3 and Fig. 4) of only one of which carbon atom thickness, with property
Can anisotropy be that the performance in parallel scale direction and vertical scale direction has very big otherness.Graphene is the current world
On most thin, most hard nano material, thermal conductivity factor is up to 5300W/mK (parallel scale direction), or even is higher than carbon nanometer
Pipe.Brium carbonate, barium sulfate, boron nitride, aluminum oxide, magnesia, zinc oxide, Si3N4, AlN, SiN etc. be used as traditional powder heat conduction
Material, is commonly used for the filler (shown in Fig. 5 and Fig. 6) of insulating heat-conduction material, and the thermal conductivity of packaging adhesive film is strongly depend on powder and leads
The shape of hot material, size, surface modification situation and addition.In the present invention, powder Heat Conduction Material is used as carbon nanometer
The auxiliary heat conduction filler of pipe and/or Graphene, three dimentional heat conduction network is internally formed by the cooperative effect between them in glued membrane,
The area and channel density of packaging adhesive film inside heat transfer can be greatly increased, the thermal conductivity factor of packaging adhesive film is effectively improved.With
Prior art is compared, and the one-dimensional material and two-dimensional material that the present invention is adopted can form preferably solid thermal conductive network with zero dimension material
Network, the heat conduction particle for making powdery is no longer scattered, isolated in Polymer Blending System " island ", but by one-dimensional material
Get up with two-dimensional material bridging " island " (shown in Fig. 8), such special construction makes the transmission of heat quick and effective, it is ensured that group
Part works all the time at a suitable temperature, and generating efficiency and service life are greatly enhanced.In addition, the present embodiment institute
Zero dimension material, one-dimensional material and two-dimensional material are through surface chemical modification.Material after modification not only with packaging adhesive film
There is good compatibility, and compared with the material of non-surface modification, system melt viscosity is significantly under similar addition
Reduce, make processing and forming more simple；The organic group of what is more important surface chemical modification can be shielded further
The conductiving point of heat filling, increases the insulating properties of material, and the glued membrane for making gained has high-termal conductivity, high durable and high insulation simultaneously
Property.
The present embodimentization provides a kind of photovoltaic module, including a kind of above-mentioned photovoltaic module with three dimentional heat conduction passage
Packaging adhesive film.
Following preparation methods with multiple embodiments to the above-mentioned photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage
It is described.
Embodiment 1
The preparation method of the photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage of the present embodiment is to add in EVA pellets
Plus 3% (wt%) surface modification SWCN, the zero dimension conductive particle of the surface modification of 0.5% (wt%) fills out
Feed powder body, i.e. brium carbonate, barium sulfate, boron nitride, aluminum oxide, magnesia, Si3N4, one or more in AlN, SiN etc. mixed
Close, and other auxiliary agent mixing and stirrings, mixed uniformly raw material feeding double screw extruder is extruded into (50-100
DEG C), the material of extrusion carries out curtain coating embossing (30-40 DEG C), cooling (10-20 DEG C), traction winding (10-20m/min) and obtains this
The high heat conduction of embodiment, high insulation, as high durable EVA packaging adhesive films, the EVA packaging adhesive films based on SWCN.This
The auxiliary agent of embodiment is crosslinking agent：Triallyl isocyanurate, the initiator of 1% (wt%)：The oxidation hexichol of 1% (wt%)
Formyl, tackifier：Modified rosin, the plasticizer of 2% (wt%)：It is the diisononyl phthalate of 2% (wt%), anti-oxidant
Agent：Irgasfos 168, the anti ultraviolet agent of 1% (wt%)：The BTA of 1% (wt%).
In the present embodiment, the SWCN of surface modification is carried out as follows：CNT is first in strong acid
(H2SO4/HNO3) in cleaning, activation, obtain CNT of the surface rich in carboxyl (- COOH), washing afterwards, be dried, activation is dry
CNT after dry is scattered in organic solvent, with corresponding Organic Alcohol (R-OH) or organic amine (R-NH2) carry out surface and repair
Decorations, afterwards filtration drying is standby.
The conduction powder of surface modification is carried out as follows：By corresponding coupling agent, (silane coupler, phthalate ester are coupled
Agent or aluminate coupling agent) absolute ethyl alcohol is scattered in, and be sprayed in a small amount in conduction powder material by several times, in 80 DEG C of mixing
And carry out being fully ground the conduction powder material for obtaining surface modification.
Embodiment 2
Prepared by the way of similar to Example 1, difference is to replace EVA with POE macromolecules, obtains height and leads
Heat, high insulation, as the POE packaging adhesive films of high durable, the POE packaging adhesive films based on SWCN.
Embodiment 3
Prepared by the way of similar to Example 1, difference is to replace EVA with EPDM macromolecules, obtains height and leads
Heat, high insulation, as the EPDM packaging adhesive films of high durable, the EPDM packaging adhesive films based on SWCN.
Embodiment 4
Prepared by the way of similar to Example 1, difference is to replace EVA with organic silicon rubber macromolecule, is obtained
To high heat conduction, high insulation, high durable organic silicon rubber packaging adhesive film, the as organic silicon rubber based on SWCN seals
Dress glued membrane.
Embodiment 5
By the way of similar to Example 1, difference is to replace single with the multi-walled carbon nano-tubes of surface modification
Wall carbon nano tube.High heat conduction, high insulation, the EVA packaging adhesive films of high durable for obtaining, the as EVA based on multi-walled carbon nano-tubes is sealed
Dress glued membrane.The surface modification of multi-walled carbon nano-tubes is similar to SWCN.
Embodiment 6
By the way of similar to Example 5, difference is to replace EVA with POE macromolecules.Obtain high heat conduction, height
Insulation, as the POE packaging adhesive films of high durable, the POE packaging adhesive films based on multi-walled carbon nano-tubes.
Embodiment 7
By the way of similar to Example 5, difference is to replace EVA with EPDM macromolecules.Obtain high heat conduction, height
Insulation, as the EPDM packaging adhesive films of high durable, the EPDM packaging adhesive films based on multi-walled carbon nano-tubes.
Embodiment 8
By the way of similar to Example 5, difference is to replace EVA with organic silicon rubber macromolecule.Obtain height
Heat conduction, high insulation, as the organic silicon rubber packaging adhesive film of high durable, the organic silicon rubber packaging plastic based on multi-walled carbon nano-tubes
Film.
Embodiment 9
By the way of similar to Example 1, difference is to replace single wall with the single-layer graphene of surface modification
CNT.Obtain high heat conduction, high insulation, as the EVA packaging adhesive films of high durable, the EVA packaging plastics based on single-layer graphene
Film.The surface modification of single-layer graphene is similar to SWCN.
Embodiment 10
By the way of similar to Example 9, difference is to replace EVA with POE macromolecules.Obtain high heat conduction, height
Insulation, as the POE packaging adhesive films of high durable, the POE packaging adhesive films based on single-layer graphene.
Embodiment 11
By the way of similar to Example 9, difference is to replace EVA with EPDM macromolecules.Obtain high heat conduction, height
Insulation, as the EPDM packaging adhesive films of high durable, the EPDM packaging adhesive films based on single-layer graphene.
Embodiment 12
By the way of similar to Example 9, difference is to replace EVA with organic silicon rubber macromolecule.Obtain height
Heat conduction, high insulation, as the organic silicon rubber packaging adhesive film of high durable, the organic silicon rubber packaging plastic based on single-layer graphene
Film.
Embodiment 13
By the way of similar to Example 1, difference is to replace single wall with the multi-layer graphene of surface modification
CNT.Obtain high heat conduction, high insulation, as the EVA packaging adhesive films of high durable, the EVA packaging plastics based on multi-layer graphene
Film.The surface modification of multi-layer graphene is similar to SWCN.
Embodiment 14
By the way of similar to embodiment 13, difference is to replace EVA with POE macromolecules.Obtain high heat conduction, height
Insulation, as the POE packaging adhesive films of high durable, the POE packaging adhesive films based on multi-layer graphene.
Embodiment 15
By the way of similar to embodiment 13, difference is to replace EVA with EPDM macromolecules.Obtain high heat conduction,
Height insulation, as the EPDM packaging adhesive films of high durable, the EPDM packaging adhesive films based on multi-layer graphene.
Embodiment 16
By the way of similar to embodiment 13, difference is to replace EVA with organic silicon rubber macromolecule.Obtain height
Heat conduction, high insulation, as the organic silicon rubber packaging adhesive film of high durable, the organic silicon rubber packaging plastic based on multi-layer graphene
Film.
Embodiment 17
By the way of similar to Example 1, difference is the SWCN with surface modification and surface
The mixture of modification multi-layer graphene replaces SWCN.High heat conduction, high insulation, the EVA packaging adhesive films of high durable are obtained,
As based on SWCN and the EVA packaging adhesive films of multi-layer graphene.
Embodiment 18
By the way of similar to embodiment 17, difference is to replace EVA with POE macromolecules.Obtain high heat conduction, height
Insulation, the POE packaging adhesive films of high durable, as based on SWCN and the POE packaging adhesive films of multi-layer graphene.
Embodiment 19
By the way of similar to embodiment 17, difference is to replace EVA with EPDM macromolecules.Obtain high heat conduction,
Height insulation, the POE packaging adhesive films of high durable, as based on SWCN and the EPDM packaging adhesive films of multi-layer graphene.
Embodiment 20
By the way of similar to embodiment 17, difference is to replace EVA with organic silicon rubber macromolecule.Obtain height
Heat conduction, high insulation, the organic silicon rubber packaging adhesive film of high durable, as based on the organic of SWCN and multi-layer graphene
Silicon rubber packaging adhesive film.
Embodiment 21
By the way of similar to Example 1, difference is the multi-walled carbon nano-tubes with surface modification and surface
The mixture of the single-layer graphene of modification replaces SWCN.Obtain high heat conduction, high insulation, the EVA packaging plastics of high durable
Film, as based on multi-walled carbon nano-tubes and the EVA packaging adhesive films of single-layer graphene.
Embodiment 22
By the way of similar to embodiment 21, difference is to replace EVA with POE macromolecules.Obtain high heat conduction, height
Insulation, the POE packaging adhesive films of high durable, as based on multi-walled carbon nano-tubes and the POE packaging adhesive films of single-layer graphene.
Embodiment 23
By the way of similar to embodiment 21, difference is to replace EVA with EPDM macromolecules.Obtain high heat conduction,
Height insulation, the EPDM packaging adhesive films of high durable, as based on multi-walled carbon nano-tubes and the EPDM packaging adhesive films of single-layer graphene.
Embodiment 24
By the way of similar to embodiment 21, difference is to replace EVA with organic silicon rubber macromolecule.Obtain height
Heat conduction, high insulation, the organic silicon rubber packaging adhesive film of high durable, as based on the organic of multi-walled carbon nano-tubes and single-layer graphene
Silicon rubber packaging adhesive film.
Embodiment 25
The preparation method of a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage of the present embodiment, to polymeric main
In body resin add percentage by weight for 0.001-10% (preferred 1-10%) one-dimensional CNT and/or two-dimensional graphene,
Percentage by weight is the zero dimension conductive particle filler of 0.001-10% (preferred 1-10%), and zero dimension conductive particle filler can be selected
Brium carbonate, barium sulfate, boron nitride, aluminum oxide, magnesia, Si3N4, in AlN or SiN any one or appoint it is several, and other
Auxiliary agent mixing and stirring, mixing time is -300 minutes 30 minutes, the crosslinking agent of auxiliary agent including 1%-10%, 1%-10%
The uvioresistant of initiator, the tackifier of 1%-10%, the plasticizer of 1%-10%, the antioxidant of 1%-10% and 1%-10%
Agent.Mixed uniformly raw material feeding screw extruder is extruded under the conditions of 50-100 DEG C, the material of extrusion is at 30-40 DEG C
Under the conditions of carry out curtain coating embossing, cooled down under the conditions of 10-20 DEG C, winding is drawn under the conditions of 10-20m/min encapsulated
Glued membrane.
In above-described embodiment, crosslinking agent is the polyfunctional compound containing unsaturated double-bond, and crosslinking agent may be selected divinyl
Base benzene or triallyl isocyanurate；Initiator is the chemical combination that can rapidly decompose and discharge free radical at relatively high temperatures
Thing, initiator is dibenzoyl peroxide, TBHP or peroxidized t-butyl perbenzoate；Tackifier are average moleculars
200～2000, the oligomer between 5～150 DEG C of softening point, tackifier may be selected rosin, terpene or silane idol to quality
Connection agent；Plasticizer is phthalate, and phthalate may be selected diisononyl phthalate, phthalic acid
Two isodecyl esters or dioctyl phthalate；Antioxidant may be selected irgasfos 168 or antioxidant 1010；Anti ultraviolet agent can
Select benzotriazole ultraviolet absorber.
Packaging adhesive film obtained by the method for above-described embodiment has advantages below：
1st), from the suitable one-dimensional CNT of physical size and chemical property and/or two-dimensional graphene, with EVA,
POE, EPDM, organic silicon rubber Polymer material are matrix resin, are equipped with crosslinking agent, initiator, silane coupler, plasticising
Agent, tackifier, other auxiliary agents, auxiliary give zero dimension conductive particle filler brium carbonate, barium sulfate, boron nitride, aluminum oxide, magnesia,
Zinc oxide, Si3N4, after one or more uniform mixing in AlN, SiN etc. by twin-screw extrusion, obtain with three dimentional heat conduction
The high heat conduction of network channel, high insulation, the polymer blended co-extrusion thing of viscoplasticity, afterwards extrudate through curtain coating, press mold (embossing),
The contact techniques such as cooling, traction and winding obtain high heat conduction, high insulation, the photovoltaic component encapsulating glued membrane of high durable.Wherein, it is one-dimensional
CNT and/or two-dimensional graphene can simultaneously as the main channel framework of heat conduction network, it is also possible to carbon nanometer is used alone
Pipe or Graphene as heat conduction network main channel framework, zero dimension conductive particle filler can be used alone one kind or while
Using multiple combination as heat conduction network accessory channel framework, above-mentioned Heat Conduction Material glued membrane be internally formed high-specific surface area,
The three dimentional heat conduction network of high pass track density, effectively improves the thermal conductivity factor (as shown in Figure 8) of glued membrane.
2), it is adjusted by the addition and physical size to zero dimension conductive particle filler, can be three-dimensional with effective control
The passage specific surface area of heat conduction network and channel density.
3), the addition of a large amount of polarity inorganic matters and organic matter along with embossed technology be that film surface is roughening, make this
The glued membrane of bright gained has good bonding force to cell piece and backboard, substantially reduces or has evaded the layering in practical application and ask
Topic.
4), the addition of antioxidant and anti ultraviolet agent causes invented glued membrane to have good weatherability, service life
It is improved.
5), high heat conduction packaging adhesive film is expected 2 to 6 DEG C of operating temperature for reducing component, greatly improves the power output of component,
Effectively reduce cost of electricity-generating.
Finally it should be noted that above example is only illustrating technical scheme, rather than to present invention guarantor
The restriction of shield scope, although having made to explain to the present invention with reference to preferred embodiment, one of ordinary skill in the art should
Work as understanding, technical scheme can be modified or equivalent, without deviating from the reality of technical solution of the present invention
Matter and scope.
Claims (13)
1. a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage, including macromolecule matrix resin, it is characterised in that：Institute
Stating macromolecule matrix resin includes one-dimensional CNT and/or two-dimensional graphene, and zero dimension conductive particle filler, one-dimensional carbon
The percentage by weight of nanotube and/or two-dimensional graphene in packaging adhesive film is 0.001-10%；Zero dimension conductive particle filler exists
Percentage by weight in packaging adhesive film is less than or equal to 10%.
2. a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 1, it is characterised in that：One
The percentage by weight of dimension CNT and/or two-dimensional graphene in packaging adhesive film is 1-10%；Zero dimension conductive particle filler exists
Percentage by weight in packaging adhesive film is 1-10%.
3. a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 2, it is characterised in that：One
The percentage by weight of dimension CNT and/or two-dimensional graphene in packaging adhesive film is 2-8%；Zero dimension conductive particle filler is in envelope
Percentage by weight in dress glued membrane is 2-8%.
4. a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 3, it is characterised in that：Institute
Zero dimension conductive particle filler is stated including brium carbonate, barium sulfate, boron nitride, aluminum oxide, magnesia, Si3N4, in AlN or SiN
Any one is appointed several.
5. a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 1, it is characterised in that：One
Dimension CNT is SWCN or multi-walled carbon nano-tubes, and one-dimensional CNT is through surface modification CNT one
Dimension CNT has very big draw ratio, its a diameter of nanoscale, and length is micron order or grade；
Two-dimensional graphene is single-layer graphene or multi-layer graphene, and two-dimensional graphene is the Graphene through surface modification, and it is thick
Spend for nanoscale, apparent size is micron order to grade；
Zero dimension conductive particle filler is the zero dimension conductive particle filler through surface modification, and its particle diameter is nanoscale or micron order.
6. a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 1, it is characterised in that：Institute
State macromolecule matrix resin be in EVA, POE, EPDM or organic silicon rubber any one or appoint several, the packaging adhesive film is also
Including crosslinking agent, initiator, tackifier, plasticizer, antioxidant and anti ultraviolet agent.
7. a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 6, it is characterised in that：Institute
It is the polyfunctional compound containing unsaturated double-bond to state crosslinking agent；The initiator is rapidly to decompose and release at relatively high temperatures
Release the compound of free radical；The tackifier be relative molecular mass 200～2000, softening point is between 5～150 DEG C
Oligomer；The plasticizer is phthalate.
8. a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 7, it is characterised in that：Institute
It is divinylbenzene or triallyl isocyanurate to state crosslinking agent；The initiator is dibenzoyl peroxide, tert-butyl group mistake
Hydrogen oxide or peroxidized t-butyl perbenzoate；The tackifier are rosin, terpene or silane coupler；The O-phthalic
Esters of gallic acid is diisononyl phthalate, diisooctyl phthalate or dioctyl phthalate；It is described anti-oxidant
Agent is irgasfos 168 or antioxidant 1010；The anti ultraviolet agent is benzotriazole ultraviolet absorber.
9. a kind of photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 1, it is characterised in that：Institute
State macromolecule matrix resin to process through chemical modification or physical modification.
10. a kind of photovoltaic module, it is characterised in that：There is three dimentional heat conduction passage including the arbitrary described one kind of claim 1-9
Photovoltaic component encapsulating glued membrane.
A kind of 11. preparation methods of the photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage, it is characterised in that：To polymeric main
Adding one-dimensional CNT and/or two-dimensional graphene, percentage by weight that percentage by weight is 0.001-10% in body resin is
The zero dimension conductive particle filler of 0.001-10%, and other auxiliary agent mixing and stirrings, send mixed uniformly raw material into spiral shell
Bar extruder is extruded under the conditions of 50-100 DEG C, and the material of extrusion carries out curtain coating embossing under the conditions of 30-40 DEG C, in 10-
Cooled down under the conditions of 20 DEG C, under the conditions of 10-20m/min draw winding obtain packaging adhesive film.
A kind of 12. preparation methods of the photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 11,
It is characterized in that：One-dimensional CNT is the SWCN of surface modification, and its surface modification method is first in strong acid
Cleaning, activation, obtain the rich carboxylic CNT in surface, wash afterwards, be dried, and will activate dried CNT dispersion
In organic solvent, surface modification is carried out with corresponding Organic Alcohol or organic amine, afterwards filtration drying is standby；
Zero dimension conductive particle filler is the conduction powder of surface modification, and its surface modification method is by the dispersion of corresponding coupling agent
In absolute ethyl alcohol, and it is sprayed in a small amount in conduction powder material by several times, mixes and carry out at 70 DEG C -90 DEG C and be fully ground
To the conduction powder material of surface modification.
A kind of 13. preparation methods of the photovoltaic component encapsulating glued membrane with three dimentional heat conduction passage according to claim 11,
It is characterized in that：The crosslinking agent of the auxiliary agent including 1%-10%, the initiator of 1%-10%, the tackifier of 1%-10%,
The anti ultraviolet agent of the plasticizer of 1%-10%, the antioxidant of 1%-10% and 1%-10%.
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| CN107805472A (en) * | 2017-09-30 | 2018-03-16 | 珠海聚碳复合材料有限公司 | A kind of graphene heat conduction film of the high insulation of high heat conduction applied to electronic component and preparation method thereof |
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| CN110734644A (en) * | 2019-06-24 | 2020-01-31 | 上海大学 | heat-conducting insulating boron nitride polymer composite material and preparation method thereof |
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| CN112321933A (en) * | 2020-11-05 | 2021-02-05 | 苏州赛伍应用技术股份有限公司 | Heat-conducting packaging adhesive film and preparation method and application thereof |
| CN113278370A (en) * | 2021-05-19 | 2021-08-20 | 常州安迪新材料有限公司 | HBN-containing heat-conducting POE packaging adhesive film |
| CN113372848A (en) * | 2021-05-19 | 2021-09-10 | 常州安迪新材料有限公司 | Heat conduction type POE packaging adhesive film containing graphene |
| CN113897060A (en) * | 2021-10-21 | 2022-01-07 | 北京旭碳新材料科技有限公司 | Grafted graphene heat dissipation silica gel composition, grafted graphene heat dissipation silica gel, and preparation method and application thereof |
| CN114214023A (en) * | 2021-12-01 | 2022-03-22 | 北京旭碳新材料科技有限公司 | Modified graphene heat dissipation silica gel and preparation method thereof |
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Application publication date: 20170510 |