CN106625201A - 化学机械抛光装置 - Google Patents
化学机械抛光装置 Download PDFInfo
- Publication number
- CN106625201A CN106625201A CN201511021045.8A CN201511021045A CN106625201A CN 106625201 A CN106625201 A CN 106625201A CN 201511021045 A CN201511021045 A CN 201511021045A CN 106625201 A CN106625201 A CN 106625201A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- thickness
- component
- output signal
- mechanical polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150149350A KR101684842B1 (ko) | 2015-10-27 | 2015-10-27 | 화학 기계적 연마 장치 |
KR10-2015-0149350 | 2015-10-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106625201A true CN106625201A (zh) | 2017-05-10 |
CN106625201B CN106625201B (zh) | 2019-08-30 |
Family
ID=57734065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201511021045.8A Active CN106625201B (zh) | 2015-10-27 | 2015-12-30 | 化学机械抛光装置 |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101684842B1 (zh) |
CN (1) | CN106625201B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110193775A (zh) * | 2019-03-12 | 2019-09-03 | 上海新昇半导体科技有限公司 | 化学机械抛光方法以及化学抛光*** |
CN111230729A (zh) * | 2018-11-28 | 2020-06-05 | 凯斯科技股份有限公司 | 基板处理装置 |
CN113231955A (zh) * | 2021-06-04 | 2021-08-10 | 上海芯物科技有限公司 | 一种涡电流传感器的测厚校准方法、装置及研磨*** |
CN114888715A (zh) * | 2018-04-03 | 2022-08-12 | 应用材料公司 | 针对垫厚度使用机器学习和补偿的抛光装置 |
WO2023035247A1 (zh) * | 2021-09-10 | 2023-03-16 | 华为技术有限公司 | 化学机械抛光设备及其控制方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1505554A (zh) * | 2001-05-02 | 2004-06-16 | Ӧ�ò��Ϲ�˾ | 具有光学和涡流监视的集成结束点检测*** |
US20070239309A1 (en) * | 2006-04-05 | 2007-10-11 | Mitsuo Tada | Polishing apparatus and polishing method |
CN101978486A (zh) * | 2008-04-17 | 2011-02-16 | 诺发***股份有限公司 | 用于确定导电层厚度的方法和装置 |
CN102049732A (zh) * | 2010-08-30 | 2011-05-11 | 清华大学 | 一种硅片边缘膜厚测量方法 |
US20120276662A1 (en) * | 2011-04-27 | 2012-11-01 | Iravani Hassan G | Eddy current monitoring of metal features |
CN104471685A (zh) * | 2012-07-25 | 2015-03-25 | 应用材料公司 | 监控扣环厚度及压力控制 |
KR20150066685A (ko) * | 2013-12-09 | 2015-06-17 | 주식회사 케이씨텍 | 화학 기계적 연마 방법 및 장치 |
CN104907920A (zh) * | 2014-03-12 | 2015-09-16 | 株式会社荏原制作所 | 膜厚测定值的补正方法、膜厚补正器、及涡流传感器 |
KR101561815B1 (ko) * | 2014-06-23 | 2015-10-20 | 주식회사 케이씨텍 | 화학 기계적 연마 공정에서의 웨이퍼 막두께 측정 방법 및 이에 사용되는 캐리어 헤드의 리테이너 링 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3303963B2 (ja) * | 1997-01-20 | 2002-07-22 | 株式会社東京精密 | ウェーハの厚み加工量測定装置 |
KR101482064B1 (ko) * | 2008-10-16 | 2015-01-13 | 어플라이드 머티어리얼스, 인코포레이티드 | 와전류 이득 보상 |
-
2015
- 2015-10-27 KR KR1020150149350A patent/KR101684842B1/ko active IP Right Grant
- 2015-12-30 CN CN201511021045.8A patent/CN106625201B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1505554A (zh) * | 2001-05-02 | 2004-06-16 | Ӧ�ò��Ϲ�˾ | 具有光学和涡流监视的集成结束点检测*** |
US20070239309A1 (en) * | 2006-04-05 | 2007-10-11 | Mitsuo Tada | Polishing apparatus and polishing method |
CN101978486A (zh) * | 2008-04-17 | 2011-02-16 | 诺发***股份有限公司 | 用于确定导电层厚度的方法和装置 |
CN102049732A (zh) * | 2010-08-30 | 2011-05-11 | 清华大学 | 一种硅片边缘膜厚测量方法 |
US20120276662A1 (en) * | 2011-04-27 | 2012-11-01 | Iravani Hassan G | Eddy current monitoring of metal features |
CN104471685A (zh) * | 2012-07-25 | 2015-03-25 | 应用材料公司 | 监控扣环厚度及压力控制 |
KR20150066685A (ko) * | 2013-12-09 | 2015-06-17 | 주식회사 케이씨텍 | 화학 기계적 연마 방법 및 장치 |
CN104907920A (zh) * | 2014-03-12 | 2015-09-16 | 株式会社荏原制作所 | 膜厚测定值的补正方法、膜厚补正器、及涡流传感器 |
KR101561815B1 (ko) * | 2014-06-23 | 2015-10-20 | 주식회사 케이씨텍 | 화학 기계적 연마 공정에서의 웨이퍼 막두께 측정 방법 및 이에 사용되는 캐리어 헤드의 리테이너 링 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114888715A (zh) * | 2018-04-03 | 2022-08-12 | 应用材料公司 | 针对垫厚度使用机器学习和补偿的抛光装置 |
CN111230729A (zh) * | 2018-11-28 | 2020-06-05 | 凯斯科技股份有限公司 | 基板处理装置 |
CN110193775A (zh) * | 2019-03-12 | 2019-09-03 | 上海新昇半导体科技有限公司 | 化学机械抛光方法以及化学抛光*** |
CN110193775B (zh) * | 2019-03-12 | 2021-09-17 | 上海新昇半导体科技有限公司 | 化学机械抛光方法以及化学抛光*** |
CN113231955A (zh) * | 2021-06-04 | 2021-08-10 | 上海芯物科技有限公司 | 一种涡电流传感器的测厚校准方法、装置及研磨*** |
CN113231955B (zh) * | 2021-06-04 | 2022-08-23 | 上海芯物科技有限公司 | 一种涡电流传感器的测厚校准方法、装置及研磨*** |
WO2023035247A1 (zh) * | 2021-09-10 | 2023-03-16 | 华为技术有限公司 | 化学机械抛光设备及其控制方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101684842B1 (ko) | 2016-12-20 |
CN106625201B (zh) | 2019-08-30 |
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Effective date of registration: 20180207 Address after: Gyeonggi Do, South Korea Applicant after: K.C.TECH Co.,Ltd. Address before: Gyeonggi Do, South Korea Applicant before: K.C.TECH Co.,Ltd. Applicant before: KC Limited by Share Ltd. Effective date of registration: 20180207 Address after: Gyeonggi Do, South Korea Applicant after: K.C.TECH Co.,Ltd. Applicant after: KC Limited by Share Ltd. Address before: Jing Jidao Applicant before: K.C. Tech Co.,Ltd. |
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