CN106622866A - Automatic glue-pouring machine for electronic component - Google Patents
Automatic glue-pouring machine for electronic component Download PDFInfo
- Publication number
- CN106622866A CN106622866A CN201611150153.XA CN201611150153A CN106622866A CN 106622866 A CN106622866 A CN 106622866A CN 201611150153 A CN201611150153 A CN 201611150153A CN 106622866 A CN106622866 A CN 106622866A
- Authority
- CN
- China
- Prior art keywords
- glue
- flow sensor
- electronic devices
- automatic glue
- pouring device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
- B05C11/1013—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material responsive to flow or pressure of liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/11—Vats or other containers for liquids or other fluent materials
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Coating Apparatus (AREA)
Abstract
The invention relates to the field of glue-pouring devices and discloses an automatic glue-pouring machine for an electronic component. The automatic glue-pouring machine for the electronic component comprises a workbench, a sliding rail, a glue-pouring device fixed on the sliding rail and a control system, wherein the sliding rail comprises a vertical rail and a horizontal rail which are vertical to each other; the horizontal rail slides on the vertical rail up and down; the glue-pouring device is arranged on the horizontal rail; the control system controls motion of the sliding rail; the glue-pouring device comprises a quantifying box, a flow sensor and a control valve; the flow sensor and the control valve are connected with the control system; one end of the flow sensor is connected with the quantifying box and the other end of the flow sensor is connected with a drainage pipe. The moving route of the glue-pouring device is set through the control system, so glue liquid is effectively prevented from entering non-glue-pouring parts; the automatic glue-pouring machine for the electronic component is simple in structure and convenient to operate, and greatly improves the production quality and the production efficiency.
Description
Technical field
The present invention relates to glue-pouring device, more particularly to a kind of automatic glue filling machine for electronic devices and components.
Background technology
In the production process of dual-use electronic devices and components, often due to the use environment of electronic devices and components is required,
There is the requirement of sealing to it, traditional encapsulating operation is completed by manually, man-hour manually hand-held glue-pouring device is product encapsulating,
Not only efficiency is low for the mode of this artificial encapsulating, and the accuracy of more difficult control rubber quality and encapsulating position, often cause compared with
Amount is not enough or excess problem, has a strong impact on the performance of product, it is impossible to ensure the uniformity of product, specifically, electronic devices and components
Being distinctly claimed in manufacture process does not allow for glue to flow into non-encapsulating position, and this requires that operating personnel have higher professional skill
Can, but still cannot completely avoid glue from flowing into the phenomenon at non-encapsulating position, and impact of the human factor to properties of product is excessive, and one
Operational error product occurs in denier will scrap, and bring serious economic loss, therefore, it is necessary to develop a kind of automatic glue filling dress
Put, be accurately controlled volume and the encapsulating position of glue.
The content of the invention
For the deficiencies in the prior art, the present invention provides a kind of automatic glue filling machine for electronic devices and components, by control
System arranges the mobile route of glue-pouring device, is prevented effectively from glue and flows into non-encapsulating position, and simple structure, is easy to operation, pole
Big improves the quality of production and production efficiency.
In order to solve above-mentioned technical problem, the invention provides a kind of automatic glue filling machine for electronic devices and components, including
Workbench, sliding rail, the glue-pouring device being fixed on the sliding rail and control system, the sliding rail includes mutual
Vertical vertical track and horizontal rail, the horizontal rail is slided up and down on vertical track, and the glue-pouring device is arranged on
In the horizontal rail, the control system controls the motion of the sliding rail, and the glue-pouring device includes quantitative case, flow
Sensor and control valve, the flow sensor and control valve are connected with the control system, and the one of the flow sensor
The quantitative case of end connection, the other end of the flow sensor is connected with a drainage tube.
Preferably, the workbench is provided with chute, and the vertical track lower end is arranged in the chute.
Specifically, the glue-pouring device is arranged in the horizontal rail by connector, and the connector is in the water
Slide on plate rail road.
In detail, the vertical track upper end is provided with limited block.
Alternatively, the quantitative case surface is coated with transparent heat-insulation layer.
Further, the quantitative case is provided with volume markings line.
A kind of automatic glue filling machine for electronic devices and components of the present invention, has the advantages that：
1. a kind of automatic glue filling machine for electronic devices and components of the present invention is provided with sliding rail, can drive glue-pouring device
Move with vertical direction in the horizontal direction, and the mobile route of set-up of control system glue-pouring device can be passed through, it is to avoid glue is flowed into
Non- encapsulating position.
2. a kind of automatic glue filling machine for electronic devices and components of the present invention passes through glue during flow sensor element encapsulating
Volume, and by control valve control start and stop, it is ensured that the uniformity of product, while having saved human cost, having improve production
Efficiency.
3. quantitative case is provided with volume markings line in a kind of automatic glue filling machine for electronic devices and components of the present invention, for
The not high product of required precision can with directly range estimation by way of control flow into product glue amount.
4. quantitative case surface is provided with transparent heat-insulation layer in a kind of automatic glue filling machine for electronic devices and components of the present invention,
Glue in quantitative case can be incubated, it is to avoid environmental factor causes glue temperature to reduce rapidly.
5. a kind of automatic glue filling machine simple structure for electronic devices and components of the present invention, it is reasonable in design, workable,
Cost is relatively low, with good marketing use value.
Description of the drawings
In order to be illustrated more clearly that technical scheme, below will be to wanting needed for embodiment or description of the prior art
The accompanying drawing for using is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present invention, right
For those of ordinary skill in the art, on the premise of not paying creative work, can be obtaining it according to these accompanying drawings
Its accompanying drawing.
Fig. 1 is a kind of structural representation of the automatic glue filling machine for electronic devices and components of the present invention.
In figure：1- workbench, 11- chutes, 2- sliding rails, 21- vertical tracks, 22- horizontal rails, 3- glue-pouring devices,
The quantitative casees of 31-, 32- flow sensors, 33- control valves.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than the embodiment of whole.It is based on
Embodiment in the present invention, those of ordinary skill in the art obtained on the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
In one embodiment, as shown in figure 1, the invention provides a kind of automatic glue filling machine for electronic devices and components,
Including workbench 1, sliding rail 2, the glue-pouring device 3 being fixed on the sliding rail and control system, the sliding rail 2
Including orthogonal vertical track 21 and horizontal rail 22, the workbench 1 is provided with chute 11, under the vertical track 21
End is arranged in the chute 11, and the horizontal rail 22 is slided up and down on vertical track 21, and the glue-pouring device 3 is by connecting
Fitting is arranged in the horizontal rail 22, and the connector slides in the horizontal rail 22, the control system control
The motion of the sliding rail 2, wherein, the upper end of the vertical track 21 is provided with limited block, and the glue-pouring device 3 includes quantitative case
31st, flow sensor 32 and control valve 33, the flow sensor 32 and control valve 33 are connected with the control system, described
One end of flow sensor 32 connects quantitative case 31, and the other end of the flow sensor 32 is connected with a drainage tube.
In the present embodiment, the surface of quantitative case 31 is coated with transparent heat-insulation layer, and the glue in quantitative case can be entered
Row insulation, it is to avoid environmental factor causes glue temperature to reduce rapidly, additionally, the quantitative case 31 is provided with volume markings line, it is right
In the not high product of required precision can with directly range estimation by way of control flow into product glue amount.
The operation principle of the present embodiment is：The precise motion track of glue-pouring device 3 is set by control system first, in control
Under the control of system processed, the vertical track 21 and horizontal rail 22 in sliding rail 2 can hang down according to the movement of the movement locus of instruction
Straight rail 21 is moved in the chute 11 on workbench 1, and horizontal rail 22 is slided up and down in the groove of vertical track 21, level
Track 22 drives glue-pouring device 3 mounted thereto to move, the flow sensor 32 and control valve 33 and control in glue-pouring device 3
System connects, and flow sensor 32 transmits a signal to control system, signal is processed through control system, control control
The unlatching size of valve 33 and start and stop, so as to control the flow velocity and flow of glue in quantitative case 31, realize position precisely, and glue amount is uniform
Encapsulating operation, the device ensure that the uniformity of product, cost-effective, and production efficiency is high.
A kind of automatic glue filling machine for electronic devices and components of the present invention, has the advantages that：
1. a kind of automatic glue filling machine for electronic devices and components of the present invention is provided with sliding rail, can drive glue-pouring device
Move with vertical direction in the horizontal direction, and the mobile route of set-up of control system glue-pouring device can be passed through, it is to avoid glue is flowed into
Non- encapsulating position.
2. a kind of automatic glue filling machine for electronic devices and components of the present invention passes through glue during flow sensor element encapsulating
Volume, and by control valve control start and stop, it is ensured that the uniformity of product, while having saved human cost, having improve production
Efficiency.
3. quantitative case is provided with volume markings line in a kind of automatic glue filling machine for electronic devices and components of the present invention, for
The not high product of required precision can with directly range estimation by way of control flow into product glue amount.
4. quantitative case surface is provided with transparent heat-insulation layer in a kind of automatic glue filling machine for electronic devices and components of the present invention,
Glue in quantitative case can be incubated, it is to avoid environmental factor causes glue temperature to reduce rapidly.
5. a kind of automatic glue filling machine simple structure for electronic devices and components of the present invention, it is reasonable in design, workable,
Cost is relatively low, with good marketing use value.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (6)
1. a kind of automatic glue filling machine for electronic devices and components, it is characterised in that including workbench (1), sliding rail (2), solid
Glue-pouring device (3) and the control system being scheduled on the sliding rail,
The sliding rail (2) includes orthogonal vertical track (21) and horizontal rail (22), the horizontal rail (22)
Slide up and down on vertical track (21), the glue-pouring device (3) in the horizontal rail (22), the control system
The motion of the sliding rail (2) is controlled,
The glue-pouring device (3) includes quantitative case (31), flow sensor (32) and control valve (33), the flow sensor
(32) it is connected with the control system with control valve (33), one end of the flow sensor (32) connects quantitative case (31),
The other end of the flow sensor (32) is connected with a drainage tube.
2. the automatic glue filling machine for electronic devices and components according to claim 1, it is characterised in that the workbench (1)
Chute (11) is provided with, vertical track (21) lower end is arranged in the chute (11).
3. the automatic glue filling machine for electronic devices and components according to claim 2, it is characterised in that the glue-pouring device
(3) it is arranged in the horizontal rail (22) by connector, the connector slides in the horizontal rail (22).
4. the automatic glue filling machine for electronic devices and components according to claim 3, it is characterised in that the vertical track
(21) upper end is provided with limited block.
5. the automatic glue filling machine for electronic devices and components according to any one in claim 1-4, it is characterised in that institute
State quantitative case (31) surface and be coated with transparent heat-insulation layer.
6. the automatic glue filling machine for electronic devices and components according to claim 5, it is characterised in that the quantitative case (31)
It is provided with volume markings line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611150153.XA CN106622866A (en) | 2016-12-14 | 2016-12-14 | Automatic glue-pouring machine for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611150153.XA CN106622866A (en) | 2016-12-14 | 2016-12-14 | Automatic glue-pouring machine for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106622866A true CN106622866A (en) | 2017-05-10 |
Family
ID=58824560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611150153.XA Pending CN106622866A (en) | 2016-12-14 | 2016-12-14 | Automatic glue-pouring machine for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106622866A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107597499A (en) * | 2017-09-14 | 2018-01-19 | 安徽明洋电子有限公司 | A kind of vacuum injection mechanism of charactron biliquid automatic glue filling machine |
| CN110152942A (en) * | 2019-06-06 | 2019-08-23 | 惠州市德赛西威汽车电子股份有限公司 | A kind of automatic double surface gluer and its glue spreading method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6010740A (en) * | 1997-09-30 | 2000-01-04 | Preferred Machining Corporation | Fluid dispensing system |
| EP1384503A2 (en) * | 2002-07-10 | 2004-01-28 | Bähr GmbH Bremen - Industrie Technik | Process and apparatus for dosing and mixing pumpable components and lance for extracting the components from a container |
| US20130220481A1 (en) * | 2010-10-11 | 2013-08-29 | Khs Gmbh | Method and filling system for filling containers in a volume and/or quantity controlled manner |
| CN104174554A (en) * | 2014-08-29 | 2014-12-03 | 长城汽车股份有限公司 | Gluing device of automobile windshield glass |
| CN105344554A (en) * | 2015-11-27 | 2016-02-24 | 苏州兴亚净化工程有限公司 | Automatic glue-pouring machine |
| CN105597981A (en) * | 2016-03-08 | 2016-05-25 | 佳马机械涂覆科技（苏州）有限公司 | Movable spray coating device with five degrees of freedom |
| CN206652671U (en) * | 2016-12-14 | 2017-11-21 | 杨烨 | A kind of automatic glue filling machine for electronic component |
-
2016
- 2016-12-14 CN CN201611150153.XA patent/CN106622866A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6010740A (en) * | 1997-09-30 | 2000-01-04 | Preferred Machining Corporation | Fluid dispensing system |
| EP1384503A2 (en) * | 2002-07-10 | 2004-01-28 | Bähr GmbH Bremen - Industrie Technik | Process and apparatus for dosing and mixing pumpable components and lance for extracting the components from a container |
| US20130220481A1 (en) * | 2010-10-11 | 2013-08-29 | Khs Gmbh | Method and filling system for filling containers in a volume and/or quantity controlled manner |
| CN104174554A (en) * | 2014-08-29 | 2014-12-03 | 长城汽车股份有限公司 | Gluing device of automobile windshield glass |
| CN105344554A (en) * | 2015-11-27 | 2016-02-24 | 苏州兴亚净化工程有限公司 | Automatic glue-pouring machine |
| CN105597981A (en) * | 2016-03-08 | 2016-05-25 | 佳马机械涂覆科技（苏州）有限公司 | Movable spray coating device with five degrees of freedom |
| CN206652671U (en) * | 2016-12-14 | 2017-11-21 | 杨烨 | A kind of automatic glue filling machine for electronic component |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107597499A (en) * | 2017-09-14 | 2018-01-19 | 安徽明洋电子有限公司 | A kind of vacuum injection mechanism of charactron biliquid automatic glue filling machine |
| CN107597499B (en) * | 2017-09-14 | 2019-03-22 | 安徽明洋电子有限公司 | A kind of vacuum injection mechanism of charactron biliquid automatic glue filling machine |
| CN110152942A (en) * | 2019-06-06 | 2019-08-23 | 惠州市德赛西威汽车电子股份有限公司 | A kind of automatic double surface gluer and its glue spreading method |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170510 |