CN106604536A - Polytetrafluoroethylene composite microwave dielectric material and preparation method thereof - Google Patents
Polytetrafluoroethylene composite microwave dielectric material and preparation method thereof Download PDFInfo
- Publication number
- CN106604536A CN106604536A CN201710057438.7A CN201710057438A CN106604536A CN 106604536 A CN106604536 A CN 106604536A CN 201710057438 A CN201710057438 A CN 201710057438A CN 106604536 A CN106604536 A CN 106604536A
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- China
- Prior art keywords
- microwave dielectric
- politef
- microwave
- powder
- circuit board
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- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 33
- 239000003989 dielectric material Substances 0.000 title claims abstract description 25
- 229920001343 polytetrafluoroethylene Polymers 0.000 title abstract description 18
- 239000004810 polytetrafluoroethylene Substances 0.000 title abstract description 17
- 238000002360 preparation method Methods 0.000 title abstract description 6
- -1 Polytetrafluoroethylene Polymers 0.000 title abstract 5
- 239000000463 material Substances 0.000 claims abstract description 72
- 239000000843 powder Substances 0.000 claims abstract description 54
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 239000000945 filler Substances 0.000 claims abstract description 17
- 239000003365 glass fiber Substances 0.000 claims abstract description 17
- 238000000462 isostatic pressing Methods 0.000 claims abstract description 6
- 229950000845 politef Drugs 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 19
- 239000000839 emulsion Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 6
- 238000004062 sedimentation Methods 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 230000015556 catabolic process Effects 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 2
- 239000002585 base Substances 0.000 claims 3
- 239000003513 alkali Substances 0.000 claims 1
- 238000005056 compaction Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000012752 auxiliary agent Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000007873 sieving Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000001291 vacuum drying Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000004567 concrete Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920009441 perflouroethylene propylene Polymers 0.000 description 2
- NIFIFKQPDTWWGU-UHFFFAOYSA-N pyrite Chemical compound [Fe+2].[S-][S-] NIFIFKQPDTWWGU-UHFFFAOYSA-N 0.000 description 2
- 229910052683 pyrite Inorganic materials 0.000 description 2
- 239000011028 pyrite Substances 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- MTZOKGSUOABQEO-UHFFFAOYSA-L barium(2+);phthalate Chemical compound [Ba+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O MTZOKGSUOABQEO-UHFFFAOYSA-L 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002576 ketones Chemical group 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
Abstract
The invention discloses a polytetrafluoroethylene composite microwave dielectric material. calculated based on the total mass of the polytetrafluoroethylene composite microwave dielectric material is composed of the following components in percentage content by mass: 30-60 wt% of polytetrafluoroethylene, 35-60 wt% of microwave dielectric ceramic powder filler, and 5-15 wt% of glass fiber powder. According to the polytetrafluoroethylene composite microwave dielectric material and the preparation method thereof, isostatic pressing compaction is adopted, the isotropy of properties of the material can be ensured, and the composite microwave dielectric material having low thermal expansion coefficients in the X-axis, Y-axis and Z-axis directions is prepared.
Description
Technical field
The present invention relates to printed circuit board field, and in particular to a kind of substrate for printed circuit board and its manufacture method.
Background technology
With the revolution of modern information technologies, gradually stepped into information processes high speed, signal transmission high frequency to digital circuit
In the stage, be to process ever-increasing data, and the frequency of electronic equipment becomes more and more higher.For this purpose, meeting traditional design and system
On the basis of making demand, the requirement of renewal is proposed to the performance of microwave-medium circuit base material.In view of being applied to print electricity
Signal on the plate of road must adopt high frequency, therefore, loss on circuit boards and signal lag how are reduced, become high frequency
Circuit design and the difficult problem for making.
Thermal coefficient of expansion is to weigh the mechanical property that material is varied with temperature.IPC-TM-6502.4.24. sheet material is defined
CTE measuring method.With the change of temperature, in X, Y, size can all small change to dielectric-slab occur in Z-direction, its
In, the change in Z-direction is more crucial, because it directly influences the reliability of plated through-hole, the size in Z-direction becomes
Changing conference makes plated through-hole rupture.
The fluoropolymer of low-dielectric loss, such as politef (PTFE), tetrafluoroethylene-perfluoro alkoxy vinyl ethers are total to
Polymers (PFA) and fluorinated ethylene propylene copolymer (FEP), with excellent dielectric properties, resistance to chemical corrosion and hot
Can, water absorption rate is little, and use range is wide, though at high frequencies its dielectric constant and dielectric loss factor change also very little, therefore
The fluoropolymer of low-dielectric loss becomes the first-selection of HF link plate base plate resin.
At present, copper-clad plate preparation method general both at home and abroad is resin concentration dispersion liquid dipping glass-fiber-fabric, one after drying
Press at fixed temperature and be obtained.Polyflon thermal coefficient of expansion is big, the HF link plate baseplate material for so obtaining, by
In having glass-fiber-fabric as backing material, substantially reduce in X and Y direction thermal coefficient of expansion, but in Z-direction thermal coefficient of expansion
It is still very big, the thermal coefficient of expansion of copper is far longer than, bring hidden danger to the reliability of printed circuit board plated through-hole.Foreign countries award
Power patent US4335180 is the PTFE base material process technologies of another height filling content at present, is added in fluoro-resin emulsion
After ceramics and fiber powder mix homogeneously, breakdown of emulsion is settled and obtains dough material, is then rolled into sheet material, is sticked after drying
Copper Foil is sintered.The ceramics and fiber powder of high filler loading capacity play physical crosslinking point effect in fluororesin phase, are effectively improved filling
Dielectric material thermal coefficient of expansion afterwards, but during calendering processing, fluororesin molecule and fiber powder all can be inevitable
Orientations are produced in rolling direction, so as to cause final products in the thermal coefficient of expansion of Z-direction more than X and Y direction.
The content of the invention
The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of politef composite microwave
Dielectric material and preparation method thereof.
The present invention discloses first a kind of composite microwave medium material, adopts politef (PTFE) for carrier material,
It is blended with Microwave dielectric ceramic powder filler and milled glass fiber, by specific processing technique, obtains in X-axis Y-axis and Z axis
All there is the composite microwave medium material of low thermal coefficient of expansion on three directions.
Another object of the present invention is to the high-frequency circuit board made using above-mentioned composite microwave medium material is provided, tool
There is high-frequency dielectric performance, effect is fine in the signal transmission of high-frequency circuit, in addition, the heat on three directions of X-axis Y-axis and Z axis
The coefficient of expansion is low, it is possible to achieve good hole metallization processing.
It is still another object of the present invention to provide preparing above-mentioned composite microwave medium material and making high-frequency circuit with it
The method of middle board substrate.
For achieving the above object and the other purposes present invention is by realizing including following technical scheme.
The present invention provides a kind of politef composite microwave medium material, with the politef composite microwave medium
Count on the basis of the gross mass of material, the politef microwave dielectric material includes following component and weight/mass percentage composition：
30～60wt% of politef
Microwave dielectric ceramic powder 35～60wt% of filler
5～15wt% of glass fiber powder.
Preferably, the number-average molecular weight of the politef is 35～65 × 104.It is by dispersion method polytetrafluoroethyl-ne
Alkene is prepared.
Preferably, angle value is 0.1-20 μm in the particle diameter of the Microwave dielectric ceramic powder filler, and maximum particle diameter is less than 100
μm。
Heretofore described Microwave dielectric ceramic powder filler is selected from alumina base and the dielectric constant microwave of silicate-base
Media ceramic, the microwave dielectric ceramic with medium dielectric constant of barium phthalate base and titania based high-permittivity microwave medium ceramics one
Plant or various.
Preferably, the glass fiber powder be alkali-free glass fibre powder, 5-20 μm of diameter, of length no more than 100 μm.
Present invention also offers a kind of microwave dielectric material sheet material, the sheet material is prepared by the method for comprising the steps and obtained
：
1) politef dispersion emulsion, microwave-medium ceramics are weighed according to the component of politef microwave dielectric material
Powder filler and glass fiber powder；
2) politef dispersion emulsion is added in Microwave dielectric ceramic powder filler and glass fiber powder, stirring mixing,
Prepared glue；
3) add sedimentation agent to be stirred breakdown of emulsion in above-mentioned glue, solidss are leached, then in 80～300 DEG C of bakings
Remove moisture removal and sedimentation agent；
4) solidss after above-mentioned drying are crushed, is obtained powder thing of the mean diameter below 200 μm；
5) above-mentioned powder is loaded into mould, carries out isostatic pressing, obtain hollow cylindrical base material；
6) above-mentioned hollow cylindrical base material is put into into baking oven, less than 400 DEG C of sinter moldings after, be cooled to room temperature；
7) the hollow cylindrical base material rotary-cut after above-mentioned sintering is processed, obtains sheet material.
Preferably, step 3) in, the sedimentation agent is volatile organic solvent.The organic solvent is ketone, ether and alcohol.Example
Such as it is ethanol commonly used in the prior art, acetone.
Preferably, step 5) in, the pressure of isostatic pressing is 15～35MPa.It is highly preferred that step 5) in, isostatic pressed
The pressure of molding is 20～25MPa.
The present invention also provides a kind of substrate for printed circuit board, and the substrate for printed circuit board includes：Microwave dielectric material plate
Material and the metal forming of its both sides is covered on respectively.
Preferably, the metal forming is the alloy or composite metallic material of copper, pyrite, aluminum, nickel or these metals.
The present invention provides a kind of preparation method of above-mentioned substrate for printed circuit board, comprises the steps：
Microwave dielectric material sheet material is respectively covered up and down a metal forming, putting press into carries out hot pressing, be obtained and two-sided cover gold
The substrate for printed circuit board of category paper tinsel.
The invention also discloses politef microwave dielectric material as described above and printed circuit board (PCB) as described above
Purposes of the base material on high-frequency circuit board.
Beneficial effects of the present invention：It is blended using ptfe emulsion and Microwave dielectric ceramic powder and glass fiber powder,
Microwave dielectric ceramic powder uniform filling can be made to be dispersed in poly tetrafluoro ethylene matrix, the Microwave dielectric ceramic powder of high filler loading capacity is filled out
Material and glass fiber powder play physical crosslinking point effect in politef phase, are effectively improved dielectric material thermal expansion after filling
Coefficient；Using isostatic pressing pressed compact, it is ensured that the isotropism of material physical property, obtain in three directions of X-axis Y-axis and Z axis
On all with low thermal coefficient of expansion composite microwave medium material.
Description of the drawings
Fig. 1 is shown as the structural representation of the substrate for printed circuit board of embodiment.
Drawing reference numeral explanation
| 100 | Metal foil layer |
| 200 | Composite microwave medium material sheet material |
Specific embodiment
Embodiments of the present invention are illustrated below by way of specific instantiation, those skilled in the art can be by this specification
Disclosed content understands easily other advantages and effect of the present invention.The present invention can also pass through concrete realities different in addition
The mode of applying is carried out or applies, the every details in this specification can also based on different viewpoints with application, without departing from
Various modifications and changes are carried out under the spirit of the present invention.
Before the specific embodiment of the invention is further described, it should be appreciated that protection scope of the present invention is not limited to down
State specific specific embodiment；It is also understood that the term used in the embodiment of the present invention is specific concrete in order to describe
Embodiment, rather than in order to limit the scope of the invention.The test method of unreceipted actual conditions in the following example,
Generally according to normal condition, or according to the condition proposed by each manufacturer.
When embodiment provides numerical range, it should be appreciated that except non-invention is otherwise noted, two ends of each numerical range
Any one numerical value can select between point and two end points.Unless otherwise defined, the present invention used in all technologies and
The same meaning that scientific terminology is generally understood that with those skilled in the art of the present technique.Except the concrete grammar used in embodiment, equipment,
Outside material, according to those skilled in the art to the grasp of prior art and the record of the present invention, can also use and this
Any method of the similar or equivalent prior art of method, equipment described in inventive embodiments, material, equipment and material come real
The existing present invention.
As shown in figure 1, the substrate for printed circuit board of the present embodiment, composite microwave medium material sheet material 200 and cover respectively
In the metal forming 100 of its both sides.
The one kind or many of the metal forming in the alloy or composite metallic material of copper, pyrite, aluminum, nickel or these metals
Kind.It is preferred that low profile copper foil.
Embodiment 1
Table 1
As shown in figure 1, in the present embodiment, substrate for printed circuit board includes composite microwave medium material sheet material 200 and difference
It is overlaid on the metal forming 100 of its both sides.Metal foil layer 100 be low-profile electrolytic copper foil, the thickness 35um of metal foil layer 100.It is multiple
The thickness for closing microwave dielectric material sheet material 200 is 0.25mm.Its unit for electrical property parameters is as shown in table 1.
The manufacture method of the substrate for printed circuit board of the present embodiment, comprises the following steps：
Weigh 5 kilograms of PTFE emulsion (great Jin D210, PTFE solid content 60%), 6 kilograms of Microwave dielectric ceramic powder filler
(BaO-Sm2O3-TiO2System, D50 particle diameter 2um, dielectric constant 90), glass fiber powder 1 kilogram of (megalith EMG13-250, diameter
13um, long 50um) carry out mixing 1 hour, 1500 turns of rotating speed, the glue being uniformly mixed using blender.
2000ml acetone is added to be slowly stirred in above-mentioned glue, it can be seen that there are pureed solidss to settle.
Solidss are leached, vacuum drying oven is put into, in 110 DEG C of bakings moisture removal and auxiliary agent are removed, obtain light yellow powder solidss.
Solidss after above-mentioned drying are gently beaten into broken, powder of the particle diameter in below 200um is obtained after sieving.
Above-mentioned powder is fitted in the tubbiness rubber mold that section is annular, being placed in isostatic pressed press carries out isostatic pressed
Molding, pressure is 20MPa, obtains internal diameter 60mm, the hollow cylindrical blank of external diameter 150mm.
Above-mentioned hollow cylindrical blank is placed in high temperature oven, 400 DEG C is warmed up to 10 DEG C/min heating rates, insulation
30 minutes, then it is cooled to less than 60 DEG C with 10 DEG C/min speed and takes out.
Hollow cylindrical blank after above-mentioned sintering is placed on peeler carries out rotary-cut processing, obtains thickness 0.25mm's
Sheet material.
Above-mentioned sheet material is respectively covered up and down a 35um low-profile electrolytic copper foil, putting vacuum press into carries out hot pressing,
Under 2.5MPa pressure conditions, 380 DEG C are warmed up to 10 DEG C/min heating rates, 60 minutes are incubated, then with 10 DEG C/min speed
It is cooled to less than 60 DEG C to take out, that is, the composite board of two-sided copper foil covered is obtained.
Embodiment 2
As shown in figure 1, in the present embodiment, substrate for printed circuit board includes composite microwave medium material sheet material 200 and difference
It is overlaid on the metal forming 100 of its both sides.Metal foil layer 100 be low-profile electrolytic copper foil, the thickness 18um of metal foil layer 100.It is multiple
The thickness for closing microwave dielectric material sheet material 200 is 0.25mm.Its unit for electrical property parameters is as shown in table 1.
The manufacture method of the substrate for printed circuit board of the present embodiment, comprises the following steps：
Weigh 10 kilograms of PTFE emulsion (great Jin D210, PTFE solid content 60%) 3.5 kilograms of Microwave dielectric ceramic powder filler
(BaO-ZnO-TiO2System, D50 particle diameter 5um, dielectric constant 36), glass fiber powder 1.5 kilograms of (megalith EMG13-250, diameters
13um, long 50um) carry out mixing 1 hour, 1500 turns of rotating speed, the glue being uniformly mixed using blender.
2000ml acetone is added to be slowly stirred in above-mentioned glue, it can be seen that there are pureed solidss to settle.
Solidss are leached, vacuum drying oven is put into, in 110 DEG C of bakings moisture removal and auxiliary agent are removed, obtain light yellow powder solidss.
Solidss after above-mentioned drying are gently beaten into broken, powder of the particle diameter in below 200um is obtained after sieving.
Above-mentioned powder is fitted in the tubbiness rubber mold that section is annular, being placed in isostatic pressed press carries out isostatic pressed
Molding, pressure is 20MPa, obtains internal diameter 60mm, the hollow cylindrical blank of external diameter 150mm.
Above-mentioned hollow cylindrical blank is placed in high temperature oven, 400 DEG C is warmed up to 10 DEG C/min heating rates, insulation
30 minutes, then it is cooled to less than 60 DEG C with 10 DEG C/min speed and takes out.
Hollow cylindrical blank after above-mentioned sintering is placed on peeler carries out rotary-cut processing, obtains thickness 0.25mm's
Sheet material.
Above-mentioned sheet material is respectively covered up and down a 35um low-profile electrolytic copper foil, putting vacuum press into carries out hot pressing,
Under 2.5MPa pressure conditions, 380 DEG C are warmed up to 10 DEG C/min heating rates, 60 minutes are incubated, then with 10 DEG C/min speed
It is cooled to less than 60 DEG C to take out, that is, the composite board of two-sided copper foil covered is obtained.
Embodiment 3
As shown in figure 1, in the present embodiment, substrate for printed circuit board includes composite microwave medium material sheet material 200 and difference
It is overlaid on the metal forming 100 of its both sides.Metal foil layer 100 be low-profile electrolytic copper foil, the thickness 18um of metal foil layer 100.It is multiple
The thickness for closing microwave dielectric material sheet material 200 is 0.25mm.Its unit for electrical property parameters is as shown in table 1.
The manufacture method of the substrate for printed circuit board of the present embodiment, comprises the following steps：
Weigh 10 kilograms of PTFE emulsion (great Jin D210, PTFE solid content 50%) 4 kilograms of Microwave dielectric ceramic powder filler
(BaO-ZnO-TiO2System, D50 particle diameter 5um, dielectric constant 36), microwave fiber powder 1 kilogram of (megalith EMG13-250, diameter
13um, long 50um) carry out mixing 1 hour, 1500 turns of rotating speed, the glue being uniformly mixed using blender.
2000ml acetone is added to be slowly stirred in above-mentioned glue, it can be seen that there are pureed solidss to settle.
Solidss are leached, vacuum drying oven is put into, in 110 DEG C of bakings moisture removal and auxiliary agent are removed, obtain light yellow powder solidss.
Solidss after above-mentioned drying are gently beaten into broken, powder of the particle diameter in below 200um is obtained after sieving.
Above-mentioned powder is fitted in the tubbiness rubber mold that section is annular, being placed in isostatic pressed press carries out isostatic pressed
Molding, pressure is 20MPa, obtains internal diameter 60mm, the hollow cylindrical blank of external diameter 150mm.
Above-mentioned hollow cylindrical blank is placed in high temperature oven, 400 DEG C is warmed up to 10 DEG C/min heating rates, insulation
30 minutes, then it is cooled to less than 60 DEG C with 10 DEG C/min speed and takes out.
Hollow cylindrical blank after above-mentioned sintering is placed on peeler carries out rotary-cut processing, obtains thickness 0.25mm's
Sheet material.
Above-mentioned sheet material is respectively covered up and down a 35um low-profile electrolytic copper foil, putting vacuum press into carries out hot pressing,
Under 2.5MPa pressure conditions, 380 DEG C are warmed up to 10 DEG C/min heating rates, 60 minutes are incubated, then with 10 DEG C/min speed
It is cooled to less than 60 DEG C to take out, that is, the composite board of two-sided copper foil covered is obtained.
Embodiment 4
As shown in figure 1, in the present embodiment, substrate for printed circuit board includes composite microwave medium material sheet material 200 and difference
It is overlaid on the metal forming 100 of its both sides.Metal foil layer 100 be low-profile electrolytic copper foil, the thickness 18um of metal foil layer 100.It is multiple
The thickness for closing microwave dielectric material sheet material 200 is 0.25mm.Its unit for electrical property parameters is as shown in table 1.
The manufacture method of the substrate for printed circuit board of the present embodiment, comprises the following steps：
Weigh 10 kilograms of PTFE emulsion (great Jin D210, PTFE solid content 50%) 4.5 kilograms of Microwave dielectric ceramic powder filler
(BaO-ZnO-TiO2System, D50 particle diameter 5um, dielectric constant 36), glass fiber powder 0.5 kilogram of (megalith EMG13-250, diameter
13um, long 50um) carry out mixing 1 hour, 1500 turns of rotating speed, the glue being uniformly mixed using blender.
2000ml acetone is added to be slowly stirred in above-mentioned glue, it can be seen that there are pureed solidss to settle.
Solidss are leached, vacuum drying oven is put into, in 110 DEG C of bakings moisture removal and auxiliary agent are removed, obtain light yellow powder solidss.
Solidss after above-mentioned drying are gently beaten into broken, powder of the particle diameter in below 200um is obtained after sieving.
Above-mentioned powder is fitted in the tubbiness rubber mold that section is annular, being placed in isostatic pressed press carries out isostatic pressed
Molding, pressure is 25MPa, obtains internal diameter 60mm, the hollow cylindrical blank of external diameter 150mm.
Above-mentioned hollow cylindrical blank is placed in high temperature oven, 400 DEG C is warmed up to 10 DEG C/min heating rates, insulation
30 minutes, then it is cooled to less than 60 DEG C with 10 DEG C/min speed and takes out.
Hollow cylindrical blank after above-mentioned sintering is placed on peeler carries out rotary-cut processing, obtains thickness 0.25mm's
Sheet material.
Above-mentioned sheet material is respectively covered up and down a 35um low-profile electrolytic copper foil, putting vacuum press into carries out hot pressing,
Under 2.5MPa pressure conditions, 380 DEG C are warmed up to 10 DEG C/min heating rates, 60 minutes are incubated, then with 10 DEG C/min speed
It is cooled to less than 60 DEG C to take out, that is, the composite board of two-sided copper foil covered is obtained.
The above, only presently preferred embodiments of the present invention, it is not any to the present invention in form and substantial restriction,
It should be pointed out that for those skilled in the art, on the premise of without departing from the inventive method, can also make
Some improvement and supplement, these are improved and supplement also should be regarded as protection scope of the present invention.All those skilled in the art,
Without departing from the spirit and scope of the present invention, when make using disclosed above technology contents it is a little more
Dynamic, modification and the equivalent variations for developing, are the Equivalent embodiments of the present invention；Meanwhile, all substantial technologicals pair according to the present invention
Change, modification and the differentiation of any equivalent variations that above-described embodiment is made, still falls within the scope of technical scheme
It is interior.
Claims (10)
1. a kind of politef composite microwave medium material, it is characterised in that with the politef composite microwave medium
Count on the basis of the gross mass of material, the politef composite microwave medium material includes that following component and quality percentage contain
Amount：
30～60wt% of politef
Microwave dielectric ceramic powder 35～60wt% of filler
5～15wt% of glass fiber powder.
2. politef composite microwave medium material as claimed in claim 1, it is characterised in that the Microwave dielectric ceramic powder
Angle value is 0.1-20 μm in the particle diameter of filler, and maximum particle diameter is less than 100 μm.
3. politef composite microwave medium material as claimed in claim 1, it is characterised in that the glass fiber powder is nothing
Alkali containing glass fibre powder, 5-20 μm of diameter, of length no more than 100 μm.
4. politef composite microwave medium material as claimed in claim 1, it is characterised in that the number of the politef
Average molecular weight is (35～65) × 104。
5. a kind of microwave dielectric material sheet material, it is characterised in that the method that the microwave dielectric material sheet material comprises the steps
Prepare：
1) politef dispersion emulsion, microwave-medium ceramics are weighed according to the component of politef composite microwave medium material
Powder filler and glass fiber powder；
2) politef dispersion emulsion is added in Microwave dielectric ceramic powder filler and glass fiber powder, stirring mixing is obtained
Glue；
3) add sedimentation agent to be stirred breakdown of emulsion in above-mentioned glue, solidss are leached, then remove in 80～300 DEG C of bakings
Moisture and sedimentation agent；
4) solidss after above-mentioned drying are crushed, is obtained powder thing of the mean diameter below 200 μm；
5) above-mentioned powder is loaded into mould, carries out isostatic pressing, obtain hollow cylindrical base material；
6) above-mentioned hollow cylindrical base material is put into into baking oven, less than 400 DEG C of sinter moldings after, be cooled to room temperature；
7) the hollow cylindrical base material rotary-cut after above-mentioned sintering is processed, obtains sheet material.
6. microwave dielectric material sheet material as claimed in claim 5, it is characterised in that step 3) in, the sedimentation agent is volatile
Organic solvent.
7. microwave dielectric material sheet material as claimed in claim 5, it is characterised in that step 5) in, the pressure of isostatic pressing is
15～35MPa.
8. a kind of substrate for printed circuit board, it is characterised in that the substrate for printed circuit board includes：Microwave dielectric material sheet material and
The metal forming of its both sides is covered on respectively.
9. a kind of method for preparing substrate for printed circuit board as claimed in claim 8, comprises the steps：By microwave dielectric material
Sheet material respectively covers up and down a metal forming, and putting press into carries out hot pressing, and the substrate for printed circuit board of two-sided clad with metal foil is obtained.
10. the politef microwave dielectric material and such as any one of claim 5～7 institute as described in any one of Claims 1 to 4
State purposes of the substrate for printed circuit board on high-frequency circuit board.
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