CN106599791A - Biological recognition module set installation structure and installation method thereof - Google Patents
Biological recognition module set installation structure and installation method thereof Download PDFInfo
- Publication number
- CN106599791A CN106599791A CN201611032774.8A CN201611032774A CN106599791A CN 106599791 A CN106599791 A CN 106599791A CN 201611032774 A CN201611032774 A CN 201611032774A CN 106599791 A CN106599791 A CN 106599791A
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- China
- Prior art keywords
- becket
- chip
- reinforcing chip
- flexible pcb
- metal ring
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
Abstract
The invention discloses a biological recognition module set installation structure and an installation method thereof. The biological recognition module set installation structure comprises a flexible circuit board; a chip is welded onto the flexible circuit board; a cover plate is bonded onto the chip; a reinforcement sheet is bonded at the lower part of the flexible circuit board; the peripheries of the chip and the cover plate are sleeved with a metal ring; and the metal ring is connected with the reinforce sheet through laser welding. The installation method comprises the following steps that: the metal ring is arranged in a bottom plate, the step of the metal ring is reversely buckled on the slot top of an accommodating slot, the cover plate and the chip are arranged in the metal ring, the metal ring is made to closely contact with the reinforcement sheet, a pressing plate is arranged on the reinforcement sheet, and the reinforcement sheet and the metal ring are pressed tightly through the pressing plate; and laser is adopted to weld the metal ring and the reinforcement sheet, and in the welding process, the laser punches through the reinforcement sheet and then forms a groove on the metal ring, the laser melts a material in the reinforcement sheet and a material in the groove of the metal ring, so that the material in the reinforcement sheet and the material in the groove of the metal ring are fused together, after the fused materials are solidified, the connection of the reinforcement sheet and the metal ring can be realized.
Description
Technical field
The present invention relates to electronic device field, more particularly to a kind of bio-identification module mounting structure and its installation method.
Background technology
With the development of technology, bio-identification function is used widely on the electronic products such as mobile phone, especially, will be referred to
Stricture of vagina identification module increasingly increases located at the positive demand of mobile phone.However, in existing band keypress function bio-identification module product
In, connected using binding agent between becket and flexible PCB, there is the risk for coming off, cause structure insecure, when being clicked on
Easily there is becket obscission, while binding agent has certain thickness, increased the thickness of product, in addition, relative to existing skill
In art, turned on by elargol between becket and flexible circuit board, conduction is poor, need to plate becket bottom surface
Nickel etc. is surface-treated, meanwhile, elargol is easily corroded, aoxidizes.
The content of the invention
The invention solves the problems that first technical problem be present situation for prior art, there is provided a kind of bio-identification module
Mounting structure, it can improve the fastness of connection, meanwhile, the thickness of product is reduced, conduction is improved, and be not easy rotten
Erosion, oxidation.
The invention solves the problems that second technical problem be present situation for prior art, there is provided a kind of installation method, its
The fastness of connection can be improved, meanwhile, the thickness of product is reduced, conduction is improved, and be not easy to be corroded, aoxidize.
The present invention solve technical scheme that first technical problem adopted for：A kind of bio-identification module mounting structure,
Including flexible PCB, it is characterised in that：The flexible PCB top is welded with chip, and lid is bonded with above the chip
Plate, the periphery that the flexible PCB lower section is bonded with reinforcing chip, the chip and cover plate is arranged with becket, becket and benefit
Strong piece laser welding connection.
Preferably, the becket and reinforcing chip one-side contact, the becket passes through laser multiple spot welding with reinforcing chip
Connection.
Further, chamfering is formed with hole side relative with the flexible PCB on the becket, by arranging
Chamfering, prevents becket from causing to damage to flexible PCB.
Further, several boss are formed with the bottom surface of the becket, raised head face is contacted with reinforcing chip, described
Flexible PCB is placed in the inner side of boss.By arranging boss, laser welding position is boss and reinforcing chip contact site, just
In realizing carrying out laser welding between becket and reinforcing chip.
Further, the bio-identification module mounting structure also includes a base plate and pressing plate, and on the base plate one is formed with
Holding tank, during installation, the step back-off on the becket is pressed on the bottom surface of reinforcing chip in the groove top of holding tank, the pressing plate
On, by arranging base plate and pressing plate, facilitate implementation and compressed reinforcing chip and becket using pressing plate, realize welding process
In, the positioning between becket and reinforcing chip.
Further, step is formed with the outer wall of the becket, the step is supported or opposed with the flexible PCB, is passed through
Step is set, and in reinforcing chip and welding metal rings, becket can be inverted within base plate, facilitating implementation will mend using pressing plate
Strong piece and becket are compressed, and are easy to the carrying out welded.
Compared with prior art, the advantage of first technical problem that the present invention is solved is：The present invention becket with
Flexible PCB is connected using welding manner, and the fastness of connection is more preferably, difficult for drop-off, and saves becket and flexible circuit
The thickness space of binding agent between plate, makes product thickness thinner；In addition, the present invention by arrange a reinforcing chip, by becket with
Reinforcing chip is integrally welded, and conduction is far above prior art, and is not easy to be corroded, aoxidizes.
The present invention solve technical scheme that second technical problem adopted for：It is a kind of using described bio-identification module
The installation method of mounting structure, it is characterised in that include：
Step S1：Reinforcing chip is connected by binding agent with flexible PCB；
Step S2：Chip is welded in into flexible PCB by tin cream；
Step S3：By cover plate by binding agent and chip adhesive；
Step S4：Becket is positioned in base plate, the step back-off on becket in the groove top of holding tank, then by cover plate
It is positioned in becket with chip, becket is in close contact with reinforcing chip, then, pressing plate is placed on reinforcing chip, pressing plate will
Reinforcing chip is compressed with becket；
Step S5：Becket is welded with reinforcing chip using laser, in welding process, laser punch after reinforcing chip
Form groove on becket, laser by reinforcing chip bore a hole in material and material melts in metal ring groove and mutually melt
Close, connection is realized after solidification.
Preferably, the reinforcing chip and becket are stainless steel, and stainless steel is more suitable for laser welding.
Further, the cover plate material is sapphire, ceramics or glass；Or, the cover plate adopts coating structure,
Coating material is resin or ink.
Compared with prior art, the advantage of second technical problem that the present invention is solved is：The present invention becket with
Flexible PCB is connected using welding manner, and the fastness of connection is more preferably, difficult for drop-off, and saves becket and flexible circuit
The thickness space of binding agent between plate, makes product thickness thinner；In addition, the present invention by arrange a reinforcing chip, by becket with
Reinforcing chip is integrally welded, and conduction is far above prior art, and is not easy to be corroded, aoxidizes.
Description of the drawings
Fig. 1 is the structural representation of bio-identification module mounting structure in the embodiment of the present invention；
Fig. 2 is the specific implementation step schematic diagram () of bio-identification module mounting structure in the embodiment of the present invention；
Fig. 3 is the specific implementation step schematic diagram (two) of bio-identification module mounting structure in the embodiment of the present invention.
Specific embodiment
The present invention is described in further detail below in conjunction with accompanying drawing embodiment.
As shown in Figures 1 to 3, the bio-identification module mounting structure in this enforcement, including flexible PCB 4, chip 2, lid
Plate 1, becket 3, reinforcing chip 11, base plate 22 and pressing plate 21.
Wherein, the top of flexible PCB 4 is bonded with chip 2, and the top of the chip 2 is bonded with cover plate 1, flexible PCB 4
Lower section is bonded with the periphery of reinforcing chip 11, the chip 2 and cover plate 1 and is arranged with becket 3, becket 3 and the laser of reinforcing chip 11
It is welded to connect, it is preferable that becket 3 and the one-side contact of reinforcing chip 11, becket 3 is connected with reinforcing chip 11 by laser multiple spot welding
Connect.
In order to prevent becket 3 from causing to damage to flexible PCB 4, hole side relative with flexible PCB 4 on becket 3
On be formed with chamfering 31.
In addition, being formed with step 33 on the outer wall of becket 3, the step 33 is supported or opposed with the flexible PCB 4, by setting
Step 33 is put, when reinforcing chip 11 and becket 3 are welded, becket 3 can be inverted within base plate 22, facilitated implementation using pressure
Plate 21 is compressed reinforcing chip 11 and becket 3, is easy to the carrying out welded.Additionally, being formed with the bottom surface of the becket 3
Several boss 32, the end face of boss 32 is contacted with reinforcing chip 11, and the flexible PCB 4 is placed in the inner side of boss 32.By setting
Put boss 32, laser welding position is boss 32 and the contact site of reinforcing chip 11, facilitate implementation becket 3 and reinforcing chip 11 it
Between carry out laser welding.Meanwhile, a holding tank 221 is formed with base plate 22, during installation, the step 33 on the becket 3 falls
The groove top of holding tank 221 is buckled in, the pressing plate 21 is pressed on the bottom surface of reinforcing chip 11, by arranging base plate 22 and pressing plate 21,
Facilitate implementation and compressed reinforcing chip 11 and becket 3 using pressing plate 21, in realizing welding process, becket 3 and reinforcing chip
Positioning between 11.
Finally, present invention also offers a kind of installation method using described bio-identification module mounting structure, including：
Step S1：Reinforcing chip 11 is connected by binding agent with flexible PCB 4；
Step S2：Chip 2 is welded in into flexible PCB 4 by tin cream；
Step S3：Cover plate 1 is bonded by binding agent with chip 2；
Step S4：Becket 3 is positioned in base plate 22, the back-off of step 33 on becket 3 is in the groove of holding tank 221
Top, then cover plate 1 and chip 2 are positioned in becket 3, becket 3 is in close contact with reinforcing chip 11, then, in reinforcing chip
Pressing plate 21 is placed on 11, pressing plate 21 compresses reinforcing chip 11 with becket 3；
Step S5：Becket 3 is welded with reinforcing chip 11 using laser, in welding process, laser punches reinforcing chip
Groove 34 is formed on becket 3 after 11, in the material and the groove 34 of becket 3 that laser is bored a hole reinforcing chip 11 in 111
Material melts simultaneously mutually merge, and connection is realized after solidification.
Preferably, reinforcing chip 11 and becket 3 are stainless steel, and stainless steel is more suitable for laser welding.
Further, the material of the cover plate 1 is sapphire, ceramics or glass；Or, the cover plate 1 is tied using coating
Structure, coating material is resin or ink.
To sum up, becket 3 of the invention is connected with flexible PCB 4 using welding manner, and the fastness of connection is more preferable, no
It is easy to fall off, and the thickness space of binding agent between becket 3 and flexible PCB 4 is saved, make product thickness thinner；In addition,
Becket 3 and reinforcing chip 11, by arranging a reinforcing chip 11, are integrally welded by the present invention, and conduction is far above prior art
Scheme, and be not easy to be corroded, aoxidize.
Claims (10)
1. a kind of bio-identification module mounting structure, including flexible PCB (4), it is characterised in that：The flexible PCB (4)
Top is welded with chip (2), and cover plate (1) is bonded with above the chip (2), and flexible PCB (4) lower section is bonded with benefit
The periphery of strong piece (11), the chip (2) and cover plate (1) is arranged with becket (3), becket (3) and reinforcing chip (11) laser
It is welded to connect.
2. bio-identification module mounting structure according to claim 1, it is characterised in that：The becket (3) and reinforcement
Piece (11) one-side contact, the becket (3) is connected with reinforcing chip (11) by laser multiple spot welding.
3. bio-identification module mounting structure according to claim 2, it is characterised in that：On the becket (3) and institute
State and be formed with chamfering (31) on the relative hole side of flexible PCB (11).
4. bio-identification module mounting structure according to claim 2, it is characterised in that：The bottom surface of the becket (3)
On be formed with several boss (32), boss (32) end face is contacted with reinforcing chip (11), and the flexible PCB (4) is placed in boss
(32) inner side.
5. bio-identification module mounting structure according to claim 2, it is characterised in that：The outer wall of the becket (3)
On be formed with step (33), the step (33) is supported or opposed with the flexible PCB (11).
6. bio-identification module mounting structure according to claim 5, it is characterised in that：The bio-identification module is installed
Structure also includes a base plate (22) and pressing plate (21), and on the base plate (22) holding tank (221), during installation, the gold are formed with
In the groove top of holding tank (221), the pressing plate (21) is pressed on the bottom surface of reinforcing chip (11) to step (33) back-off on category ring (3)
On.
7. the installation method of the bio-identification module mounting structure described in a kind of utilization claim 6, it is characterised in that include：
Step S1：Reinforcing chip (11) is connected by binding agent with flexible PCB (4)；
Step S2：Chip (2) is welded in into flexible PCB (4) by tin cream；
Step S3：Cover plate (1) is bonded by binding agent and chip (2)；
Step S4：Becket (3) is positioned in base plate (22), step (33) back-off on becket (3) is in holding tank (221)
Groove top, then cover plate (1) and chip (2) are positioned in becket (3), becket (3) is in close contact with reinforcing chip (11),
Then, pressing plate (21) is placed on reinforcing chip (11), pressing plate (21) compresses reinforcing chip (11) and becket (3)；
Step S5：Becket (3) is welded with reinforcing chip (11) using laser, in welding process, laser punches reinforcing chip
(11) groove (34) is formed on becket (3) after, laser is bored a hole reinforcing chip (11) material and becket in (111)
(3) material melts in groove (34) simultaneously mutually merge, and connection is realized after solidification.
8. installation method according to claim 7, it is characterised in that：The reinforcing chip (11) and becket (3) are stainless
Steel matter.
9. installation method according to claim 7, it is characterised in that：Cover plate (1) material be sapphire, ceramics or
Glass.
10. installation method according to claim 7, it is characterised in that：The cover plate (1) adopts coating structure, coating material
Matter is resin or ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611032774.8A CN106599791B (en) | 2016-11-16 | 2016-11-16 | Biological identification module mounting structure and mounting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611032774.8A CN106599791B (en) | 2016-11-16 | 2016-11-16 | Biological identification module mounting structure and mounting method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106599791A true CN106599791A (en) | 2017-04-26 |
| CN106599791B CN106599791B (en) | 2023-06-23 |
Family
ID=58592497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611032774.8A Active CN106599791B (en) | 2016-11-16 | 2016-11-16 | Biological identification module mounting structure and mounting method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106599791B (en) |
Cited By (3)
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| CN109670370A (en) * | 2017-10-13 | 2019-04-23 | 南昌欧菲生物识别技术有限公司 | Becket and preparation method thereof, fingerprint recognition mould group and terminal |
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| CN109670370A (en) * | 2017-10-13 | 2019-04-23 | 南昌欧菲生物识别技术有限公司 | Becket and preparation method thereof, fingerprint recognition mould group and terminal |
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| Publication number | Publication date |
|---|---|
| CN106599791B (en) | 2023-06-23 |
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