CN106597612B - Optical mode plate and communication equipment - Google Patents
Optical mode plate and communication equipment Download PDFInfo
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- CN106597612B CN106597612B CN201610935486.7A CN201610935486A CN106597612B CN 106597612 B CN106597612 B CN 106597612B CN 201610935486 A CN201610935486 A CN 201610935486A CN 106597612 B CN106597612 B CN 106597612B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
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- Optical Integrated Circuits (AREA)
Abstract
The invention discloses a kind of optical mode plate and communication equipments, belong to the communications field.The optical mode plate includes that optical fiber is fanned out to device, optical fiber connector and silicon optical chip, optical fiber is fanned out to device between optical fiber connector and silicon optical chip, it includes matrix and at least one first optical waveguide group that optical fiber, which is fanned out to device, first optical waveguide group runs through matrix, and first optical waveguide group the second end face of matrix is extended to from the first end face of matrix, first end face and second end face are opposite；Optical fiber connector includes at least one optical fiber, each optical fiber includes N root fibre core, and each fibre core is in contact with first optical waveguide, and silicon optical chip includes at least one second optical waveguide group, second optical waveguide group includes the second optical waveguide of N root, and every one first optical waveguide is in contact with second optical waveguide.The present invention solves the problems, such as that the optical signal capacity of optical fiber is unable to get further raising, and the further optical signal capacity for improving optical fiber, the present invention is used for the transmission of optical signal.
Description
Technical field
The present invention relates to the communications field, in particular to a kind of optical mode plate and communication equipment.
Background technique
Optical mode plate generally includes silicon optical chip, optical module and optical fiber, and one end and the silicon optical chip of optical module are of coupled connections,
The other end is connect with fiber coupling, that is, silicon optical chip and optical fiber can be connected in optical module, silicon optical chip is enabled to pass through light
Module is to optical signal transmission fiber.
In the related technology, optical module is array extender lens, and the first end of array extender lens couples company with silicon optical chip
It connects, the second end opposite with first end is connect with multiple fiber couplings, and each optical fiber includes multiple fibre cores.Silicon optical chip to
When optical fiber transmits data, the density for participating in the optical fiber of data transmission is bigger, and the optical signal capacity of optical fiber is bigger, and due to optical fiber
Including multiple fibre cores, in the channel of silicon optical chip and optical signal transmission fiber, the density of optical fiber is larger, so that in silicon optical chip
When transmitting data between optical fiber, the optical signal capacity of optical fiber is larger.
Since in the related technology, array extender lens has certain limitation to the distance of two adjacent optical fiber, to make
The density for obtaining the optical fiber coupled with the second end of array extender lens can not be improved further, and therefore, the optical signal of optical fiber holds
Amount is also unable to get further raising.
Summary of the invention
In order to solve the problems, such as that the optical signal capacity of optical fiber is unable to get further raising, the present invention provides a kind of light
Template and communication equipment.The technical solution is as follows:
In a first aspect, a kind of optical mode plate is provided, including optical fiber is fanned out to device, optical fiber connector and silicon optical chip, it is described
Optical fiber is fanned out to device between the optical fiber connector and the silicon optical chip,
It includes matrix and at least one first optical waveguide group that the optical fiber, which is fanned out to device, and the first optical waveguide group runs through institute
State matrix, and the first optical waveguide group extends to the second end face of described matrix from the first end face of described matrix, described
One end face and the second end face are opposite；
The first optical waveguide group includes the first optical waveguide of N root, and the bending radius of every one first optical waveguide is all larger than or waits
In 5 millimeters, wherein N is the integer more than or equal to 1 and less than or equal to 12；
Signal cross-talk between the first end face, adjacent two first optical waveguides is less than or equal to 40dB；
In the second end face, the spacing of two neighboring first optical waveguide is greater than or equal to 30 microns, and the N root first
The end of optical waveguide is located on the same line；
The optical fiber connector includes at least one optical fiber, and each optical fiber includes N root fibre core, the N in same optical fiber
Root fibre core is in contact one to one with the first optical waveguide of N root being located in same first optical waveguide group, and optical signal is in corresponding fibre
Loss when carrying out coupled transfer between core and the first optical waveguide is less than or equal to 2dB；
The silicon optical chip includes at least one second optical waveguide group, and the second optical waveguide group includes the second light wave of N root
It leads, the first optical waveguide of N root in same first optical waveguide group and the second light wave of N root being located in same second optical waveguide group
It leads and is in contact one to one, optical signal carries out loss when coupled transfer between corresponding first optical waveguide and the second optical waveguide
Less than or equal to 3dB.
Since in the optical mode plate in the present invention, optical fiber is fanned out to the first optical waveguide in device respectively and in optical fiber connector
The second optical waveguide in fibre core and silicon optical chip is in contact, and optical signal is enabled to be fanned out to device in optical fiber connector, optical fiber
Your and transmitted between silicon optical chip.And optical fiber connector includes at least one optical fiber, each optical fiber includes N root fibre core again,
When needing to improve the density of optical fiber, it can be realized by increasing the quantity of fibre core in optical fiber, and the fibre core in increasing optical fiber
When quantity, optical fiber be fanned out to device can permit it is smaller at a distance from the first optical waveguide being in contact with adjacent fibre core, therefore, can
The further density for improving optical fiber, and then further improve the optical signal capacity of optical fiber.
In addition, laser writing can be carried out in matrix when manufacture optical fiber is fanned out to device, so that the intracorporal part position of base
The refractive index set changes, to obtain the first optical waveguide.Since optical fiber provided by the invention is fanned out to device in the mistake of manufacture
Drawing cone is not carried out in journey, and during using optical mode plate, drawing cone is carried out without to optical fiber, so that the optical mode plate makes
Reliability during is stronger.Exemplary, silicon optical chip can go out light with edge, and the optical fiber is fanned out to device and is arranged in silicon light
The other end that optical fiber is fanned out to device is arranged in one end of chip, optical fiber connector, so that the height of entire optical mode plate is lower, occupies
The small volume in space.
It with reference to first aspect, is more than or equal to 3 and to be less than or wait in N under the first embodiment of first aspect
It is identical in the spacing of the second end face, the first optical waveguide of each adjacent two in the case where 12 integer.
With reference to first aspect or the first embodiment of first aspect, under second of embodiment of first aspect,
The optical mode plate further includes substrate, and the optical fiber is fanned out to device and the silicon optical chip is arranged at the same surface of the substrate
On, and the optical fiber is fanned out to the edge that device is located at the substrate.
With reference to first aspect, second of embodiment of the first embodiment of first aspect or first aspect,
Under the third embodiment of one side, the material of described matrix is fluoropolymer resin, quartz glass or borosilicate glass.
With reference to first aspect or the first embodiment of first aspect is into the third embodiment of first aspect
Any one, under the 4th kind of embodiment of first aspect, it includes at least two first optical waveguides that the optical fiber, which is fanned out to device,
Group, the minimum range between the edge of two neighboring first optical waveguide group are greater than or equal to 250 microns.
With reference to first aspect or the first embodiment of first aspect is into the 4th kind of embodiment of first aspect
Any one, under the 5th kind of embodiment of first aspect, it includes at least three first optical waveguides that the optical fiber, which is fanned out to device,
Group, at least three first optical waveguide group are located on the same line in the end of the first end face.
With reference to first aspect or the first embodiment of first aspect is into the 5th kind of embodiment of first aspect
Any one, under the 6th kind of embodiment of first aspect, it is micro- that the mode field diameter of first optical waveguide is greater than or equal to 3
Rice, and it is less than or equal to 15 microns.
The 6th kind of embodiment with reference to first aspect, under the 7th kind of embodiment of first aspect, the fibre core
Mode field diameter is greater than or equal to 3 microns, and is less than or equal to 15 microns.
7th kind of embodiment of the 6th kind of embodiment or first aspect with reference to first aspect, the of first aspect
Under eight kinds of embodiments, the mode field diameter of second optical waveguide is greater than or equal to 3 microns, and is less than or equal to 15 microns.
With reference to first aspect or the first embodiment of first aspect is into the 5th kind of embodiment of first aspect
Any one, under the 9th kind of embodiment of first aspect, the mode field diameter of each fibre core is equal to the first light wave being in contact
The mode field diameter led.
With reference to first aspect or the first embodiment of first aspect is into the 5th kind of embodiment of first aspect
Any one, under the tenth kind of embodiment of first aspect, the mode field diameter of every one first optical waveguide is equal to the to be in contact
The mode field diameter of two optical waveguides.
With reference to first aspect or the first embodiment of first aspect is into the tenth kind of embodiment of first aspect
Any one, under a kind of the tenth embodiment of first aspect, the optical mode plate further include: protective cover, the protective cover are solid
It is scheduled on the surface of the substrate, and the surface of the protective cover and substrate forms a receiving portion, the optical fiber is fanned out to device and is located at
In described accommodation section.
The tenth a kind of embodiment with reference to first aspect, under the 12nd kind of embodiment of first aspect, matrix
First end face and second end face are not blocked by the protective cover.
The 12nd kind of embodiment with reference to first aspect is located at institute under the 13rd kind of embodiment of first aspect
State the end of at least one the first optical waveguide group of first end face and at least one first optical waveguide positioned at the second end face
It is not blocked by the protective cover the end of group.
The tenth a kind of embodiment with reference to first aspect, under the 14th kind of embodiment of first aspect, the guarantor
The first surface of shield is provided with baffle, and the baffle of the first surface is located at the optical fiber and is fanned out to above device；The protection
The second surface of cover is oppositely arranged with the first surface, and second surface setting is there are two baffle, and described two baffles
It is fanned out to optical fiber on the same surface of device fixed setting on the substrate；The third surface of the protective cover, the 4th table
Face and the 5th surface are respectively positioned between the first surface and second surface, and the third surface, the 4th surface and institute
It states the 5th surface and is provided with baffle, the baffle on the third surface and the baffle on the 4th surface are oppositely arranged, and described
The baffle of the baffle on three surfaces, the baffle on the 4th surface and the 5th surface is used to connect the gear of the first surface
The baffle of plate and the second surface, the baffle on the 5th surface are also used to connect the baffle and described on the third surface
The baffle on four surfaces, the baffle on the 5th surface is located at the optical fiber and is fanned out between device and the silicon optical chip, and is located at
The top of second optical waveguide.
The 14th kind of embodiment with reference to first aspect, under the 15th kind of embodiment of first aspect, the light
Template further include: adapter, the adapter are socketed on the optical fiber connector, and there are two the two sides settings of the adapter
Buckle structure, the baffle on the third surface is fanned out on the surface of device close to the optical fiber is provided with bayonet, the 4th table
The baffle in face is fanned out on the surface of device close to the optical fiber and is provided with bayonet, described two buckle structures can respectively with it is described
The bayonet on third surface and the clamping of the bayonet on the 4th surface.That is, the clamping by adapter and protector can be real
The optical fiber in optical fiber connector and protective cover in existing adapter is fanned out to the connection of device.
In addition, the baffle on the 5th surface can play guarantor to silicon optical chip when adapter and protector to be clamped
Shield effect prevents from damaging silicon optical chip during clamping.
The 14th kind of embodiment with reference to first aspect, under the 16th kind of embodiment of first aspect, the light
The two sides of fiber connector are additionally provided with two groups of pilot pins, and the baffle on the third surface is provided with close to the surface of the adapter
The baffle of one group of location hole, the 4th surface is provided with one group of location hole close to the surface of the adapter, and described two groups fixed
Position needle and two groups of location holes correspond, and each pilot pin is inserted into corresponding location hole.Specifically, designing each positioning
Needle on optical fiber connector position and each location hole at the position on protective cover, need to guarantee in each pilot pin
After being inserted into corresponding location hole, the optical fiber in optical fiber connector can be fanned out to the first light in device with the optical fiber inside protective cover
Waveguide is effectively of coupled connections.
Optionally, the material of the substrate is ceramics.
Second aspect, provides a kind of communication equipment, and the communication equipment includes: optical fiber and optical mode plate, the optical fiber and
Optical signal can be transmitted between the optical mode plate, the optical mode plate is described in first aspect or any embodiment of first aspect
Optical mode plate.
In conclusion the present invention provides a kind of optical mode plate, light signal transmission system and its installation method, in the optical mode plate
In, optical fiber be fanned out to the first optical waveguide in device respectively with the second light wave in the fibre core and silicon optical chip in optical fiber connector
It leads and is in contact, optical signal is fanned out between device and your silicon optical chip in optical fiber connector, optical fiber and is transmitted.And optical fiber
Connector includes at least one optical fiber, and each optical fiber includes N root fibre core again, in the density for needing to improve optical fiber, can be passed through
The quantity for increasing fibre core in optical fiber realizes, and in increasing optical fiber when the quantity of fibre core, optical fiber be fanned out to device can permit with
The distance for the first optical waveguide that adjacent fibre core is in contact is smaller, therefore, can further improve the density of optical fiber, Jin Erjin
The optical signal capacity of the raising optical fiber of one step.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1-1 is a kind of structural schematic diagram for optical mode plate that the relevant technologies provide；
Fig. 1-2 is a kind of structural schematic diagram for optical fiber that the relevant technologies provide；
Fig. 2-1 is the structural schematic diagram for another optical mode plate that the relevant technologies provide；
Fig. 2-2 is the sectional view of optical mode plate shown in Fig. 2-1；
Fig. 3 is the structural schematic diagram for another optical mode plate that the relevant technologies provide；
Fig. 4 is a kind of structural schematic diagram of optical mode plate provided in an embodiment of the present invention；
Fig. 5 is the structural schematic diagram that a kind of optical fiber provided in an embodiment of the present invention is fanned out to device；
Fig. 6 is a kind of first end face schematic diagram provided in an embodiment of the present invention；
Fig. 7 is a kind of second end face schematic diagram provided in an embodiment of the present invention；
Fig. 8 is the structural schematic diagram of another optical mode plate provided in an embodiment of the present invention；
Fig. 9 is the structural schematic diagram of another optical mode plate provided in an embodiment of the present invention；
Figure 10 is a kind of partial structural diagram of optical mode plate shown in Fig. 9 provided in an embodiment of the present invention；
Figure 11 is the partial structural diagram of another kind optical mode plate shown in Fig. 9 provided in an embodiment of the present invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
With the increase of volume of transmitted data, future communications data throughout reach terabyte (English:
Trillionbyte；Referred to as: TB)~thousand terabyte (English: Petabyte；Referred to as: PB) magnitude, therefore, in silicon optical chip
When with optical signal transmission fiber, it is badly in need of improving the optical signal capacity (namely data capacity of optical fiber) of optical fiber.
Fig. 1-1 is a kind of structural schematic diagram for optical mode plate that the relevant technologies provide, and Fig. 1-2 is one kind that the relevant technologies provide
The structural schematic diagram of optical fiber 1, incorporated by reference to Fig. 1-1 and Fig. 1-2, optical mode plate includes array extender lens 0, optical fiber 1 and silicon optical chip
(not marking in Fig. 1-1), one end and the silicon optical chip of array extender lens 0 are of coupled connections, the other end and multiple 1 companies of coupling of optical fiber
It connects, and each optical fiber 1 includes multiple fibre cores 10.When silicon optical chip transmits data to fibre core 10, the fibre core of data transmission is participated in
10 density is bigger, and the optical signal capacity of fibre core 10 is bigger, and since optical fiber 1 is made of more parallel fibre cores 10, in silicon
Optical chip and fibre core 10 transmit in the channel of optical signal, and the density of fibre core 10 is larger, so that between silicon optical chip and fibre core 10
When transmitting data, the optical signal capacity of fibre core 10 is larger.But since array extender lens is to the distance of two adjacent fibre cores
There is certain limitation, so that the density of the optical fiber coupled with the other end of array extender lens can not be improved further,
Therefore, the optical signal capacity of optical fiber is also unable to get further raising.In addition, each fibre core 10 in Fig. 1-2 be required to it is curved
Song, and the port of each fibre core 10 can go out light, since optical fiber is more fragile, fibre core 10 is subject to certain restrictions in bending, because
This makes optical mode plate higher, and volume is larger, occupied space layout.
Fig. 2-1 is the structural schematic diagram for another optical mode plate 2 that the relevant technologies provide, and Fig. 2-2 is optical mode shown in Fig. 2-1
The sectional view of plate 2.Incorporated by reference to Fig. 2-1 and Fig. 2-2, which includes optical fiber group 21 and silicon optical chip 22, and optical fiber group 21 includes
Multifiber 211, and bored by the optical fiber group 21 that multifiber 211 forms by drawing, so that the diameter of every optical fiber 211 becomes smaller,
To effectively raise the density of optical fiber 211 in optical fiber group 21, the optical signal capacity of optical fiber is improved.But due to drawing
The diameter of optical fiber is smaller after cone, and optical fiber is more fragile, and during use, optical fiber is easier to be broken, therefore, the optical mode plate
2 reliability is poor.In addition, the center-spaced precision of optical fiber group can reduce with the increase of number of fibers in optical fiber group, because
The coupling efficiency of this optical fiber can reduce.
Fig. 3 is the structural schematic diagram for another optical mode plate 3 that the relevant technologies provide, as shown in figure 3, the optical mode plate 3 includes
Optical fiber 31, optical module (not marked in Fig. 3) and silicon optical chip (being not shown in Fig. 3), wherein optical module include optical mode block main body with
And two layer planer optical wave-guides 32 in optical mode block main body are set.Optical fiber 31 includes four fibre cores 311, and four fibre cores 311
It is divided into two layers of optical fiber.Every layer planer optical wave-guides 32 are of coupled connections with every layer of fibre core, and are of coupled connections with silicon optical chip, due to optical fiber
The quantity of fibre core in 31 is larger, and therefore, the optical signal capacity of optical fiber is larger.But the planar optical waveguide due to being located at lower layer
There is interval between silicon optical chip, so, the planar optical waveguide positioned at lower layer can not effectively be of coupled connections with silicon optical chip.
The loss in addition, precision for the position being overlapped due to planar optical waveguide is more difficult to control, when planar optical waveguide and fiber coupling
It is larger, and the manufacture difficulty of optical mode plate is increased planar optical waveguide to be overlapped.
As shown in figure 4, the optical mode plate 7 may include that optical fiber is fanned out to device the embodiment of the invention provides a kind of optical mode plate 7
4, optical fiber connector 5 and silicon optical chip 6, optical fiber are fanned out to device 4 between optical fiber connector 5 and silicon optical chip 6.
Fig. 5 is the structural schematic diagram that a kind of optical fiber provided in an embodiment of the present invention is fanned out to device 4, as shown in figure 5, Optical fibre fan
Device 4 may include matrix 41 and at least one first optical waveguide group for being accommodated in matrix 41 out, each first optical waveguide group
It may include the first optical waveguide of N root 42, N is integer, and 1≤N≤12.First optical waveguide group runs through matrix 41, and the first light wave
The second end face A2 that group extends to matrix 41 from the first end face A1 of matrix 41 is led, first end face A1 is opposite with second end face A2
's.Include a first optical waveguide group, and first light wave it should be noted that illustrate only optical fiber in Fig. 5 and be fanned out to device 4
Leading group altogether includes 6 the first optical waveguides 42, and in practical application, it can also include the first light of more than one which, which is fanned out to device 4,
Waveguide group, the quantity for the first optical waveguide that each first optical waveguide group includes can not also be 6, and the embodiment of the present invention does not make this
It limits.Optionally, the material of matrix 41 can be fluoropolymer resin, quartz glass or borosilicate glass.
Fig. 6 is a kind of first end face schematic diagram provided in an embodiment of the present invention, it should be noted that the Optical fibre fan in Fig. 6
Device 4 includes 12 the first optical waveguide groups out, and each first optical waveguide group altogether include 7 the first optical waveguides 42 namely Fig. 6 with
The number for the first optical waveguide for including in the number and the first optical waveguide group of the first optical waveguide group in Fig. 5 is different.But Fig. 5 and
In first end face A1 in Fig. 6, the signal cross-talk between the first adjacent optical waveguide 42 of any two is respectively less than or is equal to 40dB
(Chinese: decibel).
Fig. 7 is a kind of second end face schematic diagram provided in an embodiment of the present invention, and optical fiber is fanned out to the second end of device 4 in Fig. 7
Face shares 38 the first optical waveguides 42, but does not show that this 38 the first optical waveguides 42 from several first optical waveguide groups.Please
In conjunction with Fig. 5 and Fig. 7, the second end face A2 of device 4 is fanned out in optical fiber, and the spacing of the first adjacent optical waveguide 42 of any two can be with
More than or equal to 30 microns, and the end of all first optical waveguides 42 of second end face is respectively positioned on same straight line.It needs
Bright, the bending radius that the optical fiber in the embodiment of the present invention is fanned out to the first optical waveguide of each of device can be greater than or wait
In 5 millimeters.
Further, the optical fiber connector 5 in Fig. 4 may include at least one optical fiber, each optical fiber may include N root
Fibre core, each fibre core are in contact with first optical waveguide, optical signal can be in contact in fibre core and the fibre core
It is transmitted between one optical waveguide, and damage when optical signal carries out coupled transfer between each fibre core and the first optical waveguide being in contact
Consumption is less than or equal to 2dB.
Exemplary, the silicon optical chip 6 in Fig. 4 may include at least one second optical waveguide group, and the second optical waveguide group includes N
The second optical waveguide of root, every one first optical waveguide are in contact with second optical waveguide, optical signal can in the first optical waveguide and
Transmitted between the second optical waveguide that first optical waveguide is in contact, and optical signal every one first optical waveguide and be in contact second
Loss when carrying out coupled transfer between optical waveguide is respectively less than or is equal to 3dB.
In conclusion optical fiber is fanned out to the first optical waveguide in device point due in optical mode plate provided in an embodiment of the present invention
It is not in contact with the second optical waveguide in the fibre core and silicon optical chip in optical fiber connector, optical signal is connected in optical fiber
Connect device, optical fiber is fanned out to device and your silicon optical chip between transmit.And optical fiber connector includes at least one optical fiber, each optical fiber
Include again N root fibre core, in the density for needing to improve optical fiber, can be realized by increasing the quantity of fibre core in optical fiber, and
Increase optical fiber in fibre core quantity when, optical fiber be fanned out to device can permit the first optical waveguide being in contact with adjacent fibre core away from
From smaller, therefore, the density of optical fiber can be further improved, and then further improve the optical signal capacity of optical fiber.
In the embodiment of the present invention, optical fiber is fanned out to device between optical fiber connector and silicon optical chip, and optical fiber is fanned out to device
First end face can be in contact with the interface end of optical fiber connector, the second end face that optical fiber is fanned out to device can be with silicon optical chip
Interface end be in contact.
When it includes at least two first optical waveguide groups that optical fiber, which is fanned out to device, the edge of two adjacent the first optical waveguide groups
Between minimum range can be greater than or equal to 250 microns.The mode field diameter of each fibre core in optical fiber connector can be equal to phase
The optical fiber of contact is fanned out to the mode field diameter of the first optical waveguide in device, and the mould field that optical fiber is fanned out to every one first optical waveguide in device is straight
Diameter can be equal to the mode field diameter of the second optical waveguide in the silicon optical chip being in contact.It is exemplary, the mode field diameter of the first optical waveguide
3 microns can be greater than or equal to, and be less than or equal to 15 microns；The mode field diameter of fibre core can be greater than or equal to 3 microns, and small
In or equal to 15 microns；The mode field diameter of second optical waveguide can also be greater than or equal to 3 microns, and be less than or equal to 15 microns.
It should be noted that laser incising can be carried out in matrix 41 when manufacture optical fiber shown in fig. 5 is fanned out to device 4
It writes, so that the refractive index of 41 inner part position of matrix changes, to obtain the first optical waveguide 42.Due to provided by the invention
Optical fiber is fanned out to device and does not carry out drawing cone during manufacture, and during using optical mode plate, without to optical fiber into
Row draws cone, so that the reliability of the optical mode plate during use is stronger.Further, silicon optical chip can go out light with edge,
And the optical fiber is fanned out to one end that silicon optical chip is arranged in device, optical fiber connector is arranged in the other end that optical fiber is fanned out to device, makes
The height for obtaining entire optical mode plate is lower, the small volume of occupied space.
It may include 7 that optical fiber, which is fanned out to each of device the first optical waveguide group close to one end of optical fiber connector, in Fig. 6
The end of first optical waveguide, at this point, each optical fiber in optical fiber connector also may include 7 fibre cores.Each first optical waveguide
It is in contact with a fibre core in optical fiber connector, and is connect with the fibre core direct-coupling being in contact.It is exemplary, each first
Optical waveguide group can also include 4 the first optical waveguides or 9 the first optical waveguides, with each first optical waveguide group include 7 in Fig. 6
For a first optical waveguide.
Further, when it includes at least three first optical waveguide groups that optical fiber, which is fanned out to device, at this point, at least three first light
Waveguide group is respectively positioned on same straight line in the end of first end face.Exemplary, 12 the first optical waveguide groups in Fig. 6 can arrange
Cheng Yilie, the straight line where this 12 the first optical waveguide groups can be straight line X, 7 the first light in each first optical waveguide group
The end of any three the first optical waveguides in waveguide is not located on the same line, but in this 12 the first optical waveguide groups
The end of all first optical waveguides is respectively positioned on first end face.That is, the optical fiber is fanned out to one end and the one-dimensional coupling of silicon optical chip of device
It closes, the other end is coupled with optical fiber connector two dimension.
Exemplary, the end face of the first optical waveguide of each of Fig. 7 42 can be with second light wave in silicon optical chip
It leads and is in contact, enable the optical signal in each first optical waveguide 42 to be transmitted to the second optical waveguide being in contact, that is, each
First optical waveguide 42 is all made of spot-size converter (English: spot size converter；Referred to as: the SSC) mode and phase coupled
Second optical waveguide coupled connection of contact.But what needs to be explained here is that, in the first optical waveguide by the way of SSC coupling
When with the second optical waveguide coupled connection, one end that all second optical waveguides in the silicon optical chip are in contact with the first optical waveguide is needed
It is located on the same line, namely forms a line.When the optical fiber being fanned out to device and silicon optical chip is placed on substrate, light
Fibre is fanned out to multiple first optical waveguides in device and forms a line close to one end of silicon optical chip, multiple second light in silicon optical chip
Waveguide forms a line close to one end that optical fiber is fanned out to device, and the height of the one end of each first optical waveguide close to silicon optical chip with
Height of each second optical waveguide close to one end that optical fiber is fanned out to device is identical, and so, each first optical waveguide can
It is in contact with second optical waveguide.
When the number for the first optical waveguide that the first optical waveguide group includes is greater than or equal to 3, and is less than or equal to 12, namely
As 3≤N≤12, it is fanned out to the second end face of device in optical fiber, the spacing of all two adjacent the first optical waveguides is all the same, makes
The end for obtaining multiple first optical waveguides of second end face is equidistantly arranged on same straight line.
Optionally, Fig. 8 is the structural schematic diagram of another optical mode plate provided in an embodiment of the present invention, as shown in figure 8, optical mode
Plate 7 can also include substrate 9, and optical fiber is fanned out to device 4 and silicon optical chip 6 is arranged on the same surface of substrate 9, and Optical fibre fan
Device 4 is located at the edge of substrate 9 out, and the material of substrate can be ceramics.
In a first aspect, optical fiber can be fanned out to device and light first when installing optical mode plate provided in an embodiment of the present invention
Fiber connector is of coupled connections, specifically, the optical fiber in the first optical waveguide that optical fiber can be fanned out in device and optical fiber connector
Alignment, enables optical fiber to be fanned out to device and is of coupled connections with optical fiber connector, and optical fiber be fanned out to device and optical fiber connector it
Between coat optical path glue, enable optical path glue that optical fiber is fanned out to device and be effectively fixedly connected with optical fiber connector, so guarantee
Optical fiber is fanned out to device and can effectively be of coupled connections with optical fiber connector always.
After optical fiber to be fanned out to device and is of coupled connections with optical fiber connector, optical fiber can be fanned out to device and silicon optical chip coupling
Connection is closed, specifically, such as silicon optical chip can be flowed back by sn-ag alloy first by silicon optical chip face-down bonding on substrate
It is welded on substrate, and generates during the welding process collapse non-uniform situation in order to prevent, can be set in silicon optical chip side
Some supporting blocks are counted, to avoid unevenly collapsing, and correspondence markings point is separately designed on silicon optical chip and substrate and realizes standard
Determine position.Further, silicon optical chip face-down bonding when on substrate, can also passed through into plant gold goal on silicon optical chip
Mode processes metal salient point, and then silicon optical chip is assembled on substrate by the way of ultrasonic welding and thermal compression welding, is needed
Illustrate, it, can be to avoid unevenly collapsing by the way of ultrasonic welding and thermal compression welding by silicon optical chip face-down bonding
It generates.
It is then possible to by the way of being fanned out to the top of device using fixture grip optical fiber, draw optical fiber be fanned out to device
The mode at top is fixed using optical fiber is fanned out to device in such a way that optical fiber is fanned out to bottom device setting piezoelectric ceramics,
And (namely the two-way fibre core in lightening optical fibers connector enables optical signal in two-way fibre core using the method for active coupling
Device transmission is enough fanned out to silicon optical chip by optical fiber, staff can be fanned out to the phase of device to silicon optical chip with optical fiber at this time
Carrying out sextuple adjusting to position can stop when the coupling efficiency of the optical signal in the two-way fibre core reaches maximum to silicon light
The relative position that chip is fanned out to device with optical fiber is adjusted, and determines that silicon optical chip at this time and optical fiber are fanned out to the opposite position of device
Set best), enable silicon optical chip to be fanned out to device with optical fiber and be of coupled connections, finally, and being fanned out to device in silicon optical chip and optical fiber
Optical path glue is coated between part, and by optical path adhesive curing, so that silicon optical chip is fanned out to device with optical fiber and is fixedly connected, and then guarantees light
Fibre is fanned out to device and can effectively be of coupled connections with silicon optical chip always.
Second aspect, when installing optical mode plate provided in an embodiment of the present invention, can also first by optical fiber be fanned out to device with
Silicon optical chip is of coupled connections, when optical fiber being fanned out to device and silicon optical chip is of coupled connections, can also first by silicon optical chip with
Optical fiber is fanned out to device alignment, enables silicon optical chip to be fanned out to device with optical fiber and is of coupled connections, then can in silicon optical chip and
Optical fiber is fanned out to coating optical path glue between device, and by optical path adhesive curing, so that optical fiber is fanned out to device can have always with silicon optical chip
Effect be of coupled connections, finally, again by the optical mode plate together with silicon optical chip face-down bonding on substrate.Specifically, by the light
Template face-down bonding together with silicon optical chip can process metal by way of planting gold goal on silicon optical chip when on substrate
Then silicon optical chip and optical mode plate are assembled on substrate by salient point by the way of ultrasonic welding.It should be noted that due to
It after coating optical path glue, needs that silicon optical chip and optical mode plate are fixed on substrate by way of ultrasonic welding, therefore, in order to anti-
Optical path glue is only damaged during ultrasonic welding, the material of optical path glue is needed with high temperature resistant (such as can be with resistance to 200 degrees Celsius)
Property.
After optical fiber to be fanned out to device and is of coupled connections with silicon optical chip, optical fiber can be fanned out to device and optical fiber connector coupling
Connection is closed, and its mode being of coupled connections can be of coupled connections with reference to optical fiber is fanned out to device in first aspect with optical fiber connector
Concrete mode.
Further, the optical mode plate in the present embodiment can also include protective cover, and protective cover is fixed on the surface of the substrate, and
The surface of protective cover and substrate forms a receiving portion, and optical fiber is fanned out to device and is located in the receiving portion.It is worth noting that, matrix
First end face and the unprotected cover of second end face are blocked.Further, positioned at least one first light wave of first end face
The end of the end and at least one the first optical waveguide group positioned at the second end face of leading group is not hidden by the protective cover
Gear.
In conjunction with shown in attached drawing 8, protective cover 83 includes top plate B1 and at least three side plates (B3, B4 and B5), side plate B3 and side
Plate B4 be it is opposite, side plate B3 and side plate B4 have first side, side plate B3 first while and side plate B4 first while with
Top plate B1 is in contact, and side plate B5 includes at least three sides, is in contact respectively with top plate B1, side plate B3 and side plate B4.Side plate B3 is also
Including the second side, and the second of side plate B3 while with side plate B3 first while be opposite；Side plate B4 also includes the second side, and side plate
The second of B4 while with side plate B4 first while be opposite.Protective cover 83 further includes the first fixed part and the second fixed part, described
First fixed part and second fixed part and are fixed on the surface of substrate 9 in protective cover 83 each parallel to the surface of substrate 9
In the case of, the surface of first fixed part and second fixed part with substrate 9 fits.It should be noted that described
One side of first fixed part is overlapped with the second side of side plate B3, one side of second fixed part and the second side weight of side plate B4
It closes.
Optionally, Fig. 9 is the structural schematic diagram of another optical mode plate provided in an embodiment of the present invention, incorporated by reference to Fig. 8 and figure
9, optical mode plate further include: adapter 82, adapter 82 are socketed on optical fiber connector 5.Further, Figure 10 is that the present invention is implemented
A kind of partial structural diagram for optical mode plate shown in Fig. 9 that example provides, as shown in Figure 10, the two sides of adapter 82 are provided with two
A buckle structure (one of buckle structure is K1), the baffle on the third surface of protective cover 83 is fanned out to the table of device close to optical fiber
Bayonet is provided on face, the baffle on the 4th surface of protective cover is fanned out on the surface of device close to optical fiber is provided with bayonet K2, and two
A buckle structure can be clamped with the bayonet on third surface and the bayonet K2 on the 4th surface respectively.That is, passing through adapter 82
Clamping with protective cover 83 can be realized the company that the optical fiber in optical fiber connector and protective cover 83 in adapter 82 is fanned out to device
It connects.
In addition, the baffle on the 5th surface of protective cover 83 can be right when adapter 82 and protective cover 83 to be clamped
Silicon optical chip plays a protective role, and prevents from damaging silicon optical chip during clamping.
Optionally, Figure 11 is the partial structural diagram of another kind optical mode plate shown in Fig. 9 provided in an embodiment of the present invention,
As shown in figure 11, the two sides of optical fiber connector 5 are additionally provided with two groups of pilot pins (wherein one group of pilot pin L1 as shown in figure 11),
The baffle on the third surface of protective cover 83 is provided with one group of location hole close to the surface of adapter, the 4th surface of protective cover 83
Baffle is provided with one group of location hole close to the surface of adapter, and two groups of pilot pins are corresponded with two groups of location holes, each positioning
Needle is inserted into corresponding location hole.Specifically, designing position of each pilot pin on optical fiber connector 5, and it is each
Location hole needs to guarantee after each pilot pin is inserted into corresponding location hole, optical fiber connector 5 at the position on protective cover 83
The first optical waveguide that interior optical fiber can be fanned out in device with the optical fiber inside protective cover 83 is effectively of coupled connections.So that
When installing the optical mode plate, pilot pin insertion location hole only can be realized that optical fiber is fanned out to device and optical fiber connector
Be of coupled connections, the fast speed of optical mode plate is installed, efficiency is higher.
That is, optical fiber connector and optical fiber are being fanned out to device in each aspect of two aspects of above-mentioned installation optical mode plate
When part is of coupled connections, it can also use and pilot pin is inserted into location hole, and the mode that buckle structure is clamped with bayonet is realized,
It is not limited in the embodiment of the present invention.
Above embodiments are in such a way that optical fiber is fanned out to the first optical waveguide in device using CCS coupling and in silicon optical chip
The second optical waveguide coupled connection, optionally, which is fanned out to multiple first optical waveguides in device can also be with silicon optical chip
In multiple second optical waveguides using evanescent wave coupling by the way of be of coupled connections.
That is, optical fiber, which is fanned out to device, to be superposed with silicon optical chip, silicon light core is superimposed upon as optical fiber is fanned out to device
The top of piece.At this point, optical fiber, which is fanned out to multiple first optical waveguides in device, can be located at Optical fibre fan close to one end of silicon optical chip
The matrix of device is corresponded close to the surface of silicon optical chip, multiple first optical waveguides and multiple second optical waveguides out, and each
First optical waveguide is all made of mode and the corresponding second optical waveguide coupled connection of evanescent wave coupling.Further, silicon optical chip
It is also provided with groove close to the surface that optical fiber is fanned out to device, can be filled in groove can be used in the viscous of optical signal transmission
It connects glue (such as optical path glue), bonded adhesives is fanned out to device and silicon optical chip for being bonded optical fiber, and optical fiber is enabled to be fanned out to device and silicon
Optical chip is fixedly connected.Optionally, it can also be not provided with groove on silicon optical chip, is needing for optical fiber to be fanned out to device and silicon light
It, can be by label (English: Mark) point coating bonded adhesives on silicon optical chip, so that bonded adhesives will when chip is fixedly connected
Optical fiber is fanned out to device and is fixedly connected with silicon optical chip.Exemplary, each first optical waveguide is at a distance from corresponding second optical waveguide
2 microns can be less than or equal to, so that the coupling efficiency that optical fiber is fanned out to device and silicon optical chip is higher.
It should be noted that when optical fiber is fanned out to and is of coupled connections by the way of device is coupled with silicon optical chip using evanescent wave,
The end of multiple second optical waveguides in silicon optical chip is without arranging point-blank, correspondingly, optical fiber is fanned out in device
The end of multiple first optical waveguides without arrangement point-blank.
In conclusion due in optical mode plate provided in an embodiment of the present invention, optical fiber, which is fanned out in device, to be provided with optical fiber and is fanned out to
Device, and optical fiber is fanned out to the both ends of device and is able to connect with silicon optical chip and fiber coupling, and the optical fiber includes at least
One fibre core can be realized in the density for needing to improve optical fiber by increasing the quantity of fibre core in optical fiber, and increase light
In fibre when the quantity of fibre core, optical fiber be fanned out to device can permit two adjacent fibre cores distance it is smaller, therefore, can be further
Raising optical fiber density, and then further improve the optical signal capacity of optical fiber.
The embodiment of the invention provides a kind of communication equipment, which may include: optical fiber and optical mode plate, optical fiber and
Optical signal can be transmitted between optical mode plate, wherein optical mode plate can be Fig. 4, Fig. 8 or optical mode plate shown in Fig. 9.
In conclusion optical fiber is fanned out in device and sets due in the optical mode plate in communication equipment provided in an embodiment of the present invention
It is equipped with optical fiber and is fanned out to device, and optical fiber is fanned out to the both ends of device and is able to connect with silicon optical chip and fiber coupling, and should
Optical fiber includes at least one fibre core, can be by increasing the quantity of fibre core in optical fiber come real in the density for needing to improve optical fiber
It is existing, and in increasing optical fiber when the quantity of fibre core, optical fiber be fanned out to device can permit two adjacent fibre cores distance it is smaller, because
This, can further improve the density of optical fiber, and then further improve the optical signal capacity of optical fiber.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (17)
1. a kind of optical mode plate, which is characterized in that the optical mode plate includes that optical fiber is fanned out to device, optical fiber connector and silicon optical chip,
The optical fiber is fanned out to device between the optical fiber connector and the silicon optical chip,
It includes matrix and at least one first optical waveguide group that the optical fiber, which is fanned out to device, and the first optical waveguide group runs through the base
Body, and the first optical waveguide group extends to the second end face of described matrix, the first end from the first end face of described matrix
Face and the second end face are opposite；
The first optical waveguide group includes the first optical waveguide of N root, and the bending radius of every one first optical waveguide is all larger than or is equal to 5 millis
Rice, wherein N is the integer more than or equal to 1 and less than or equal to 12；
Signal cross-talk between the first end face, adjacent two first optical waveguides is less than or equal to 40dB；
In the second end face, the spacing of two neighboring first optical waveguide is greater than or equal to 30 microns, and first light wave of N root
The end led is located on the same line；
The optical fiber connector includes at least one optical fiber, and each optical fiber includes N root fibre core, and the N root in same optical fiber is fine
Core is in contact one to one with the first optical waveguide of N root being located in same first optical waveguide group, optical signal in corresponding fibre core and
Loss when carrying out coupled transfer between the first optical waveguide is less than or equal to 2dB；
The silicon optical chip includes at least one second optical waveguide group, and the second optical waveguide group includes the second optical waveguide of N root, position
In the first optical waveguide of N root in same first optical waveguide group and the second optical waveguide of N root one in same second optical waveguide group
It is in contact to one, loss when optical signal carries out coupled transfer between corresponding first optical waveguide and the second optical waveguide is less than
Or it is equal to 3dB.
2. optical mode plate according to claim 1, which is characterized in that N be more than or equal to 3 and less than or equal to 12 it is whole
It is identical in the spacing of the second end face, the first optical waveguide of each adjacent two in the case where number.
3. optical mode plate according to claim 1 or 2, which is characterized in that the optical mode plate further includes substrate, the Optical fibre fan
Device and the silicon optical chip are arranged on the same surface of the substrate out, and the optical fiber is fanned out to device and is located at the base
The edge of plate.
4. optical mode plate according to claim 1 or 2, which is characterized in that
The material of described matrix is fluoropolymer resin, quartz glass or borosilicate glass.
5. optical mode plate according to claim 3, which is characterized in that
The material of described matrix is fluoropolymer resin, quartz glass or borosilicate glass.
6. according to claim 1, optical mode plate described in 2 or 5, which is characterized in that it includes at least two that the optical fiber, which is fanned out to device,
First optical waveguide group, the minimum range between the edge of two neighboring first optical waveguide group are greater than or equal to 250 microns.
7. optical mode plate according to claim 3, which is characterized in that it includes at least two first light that the optical fiber, which is fanned out to device,
Waveguide group, the minimum range between the edge of two neighboring first optical waveguide group are greater than or equal to 250 microns.
8. optical mode plate according to claim 4, which is characterized in that it includes at least two first light that the optical fiber, which is fanned out to device,
Waveguide group, the minimum range between the edge of two neighboring first optical waveguide group are greater than or equal to 250 microns.
9. according to claim 1, optical mode plate described in 2 or 5, which is characterized in that it includes at least three that the optical fiber, which is fanned out to device,
First optical waveguide group, at least three first optical waveguide group are located on the same line in the end of the first end face.
10. optical mode plate according to claim 3, which is characterized in that it includes at least three first that the optical fiber, which is fanned out to device,
Optical waveguide group, at least three first optical waveguide group are located on the same line in the end of the first end face.
11. optical mode plate according to claim 4, which is characterized in that it includes at least three first that the optical fiber, which is fanned out to device,
Optical waveguide group, at least three first optical waveguide group are located on the same line in the end of the first end face.
12. according to claim 1, optical mode plate described in 2,5,7,8,10 or 11, which is characterized in that the optical mode plate further include:
Protective cover, the protective cover is fixed on the surface of the substrate, and the surface of the protective cover and the substrate forms a receiving portion, institute
It states optical fiber and is fanned out to device and be located in described accommodation section.
13. optical mode plate according to claim 3, which is characterized in that the optical mode plate further include: protective cover, the protection
Cover is fixed on the surface of the substrate, and the surface of the protective cover and the substrate forms a receiving portion, and the optical fiber is fanned out to device
In described accommodation section.
14. optical mode plate according to claim 4, which is characterized in that the optical mode plate further include: protective cover, the protection
Cover is fixed on the surface of the substrate, and the surface of the protective cover and the substrate forms a receiving portion, and the optical fiber is fanned out to device
In described accommodation section.
15. optical mode plate according to claim 6, which is characterized in that the optical mode plate further include: protective cover, the protection
Cover is fixed on the surface of the substrate, and the surface of the protective cover and the substrate forms a receiving portion, and the optical fiber is fanned out to device
In described accommodation section.
16. optical mode plate according to claim 9, which is characterized in that the optical mode plate further include: protective cover, the protection
Cover is fixed on the surface of the substrate, and the surface of the protective cover and the substrate forms a receiving portion, and the optical fiber is fanned out to device
In described accommodation section.
17. a kind of communication equipment, which is characterized in that the communication equipment includes: optical fiber and as described in claim 1 to 16 is any
Optical mode plate,
Optical signal can be transmitted between the optical fiber and the optical mode plate.
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| CN201610935486.7A CN106597612B (en) | 2016-10-24 | 2016-10-24 | Optical mode plate and communication equipment |
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| US11880071B2 (en) | 2021-08-23 | 2024-01-23 | Corning Research & Development Corporation | Optical assembly for interfacing waveguide arrays, and associated methods |
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| CN108390256B (en) * | 2018-03-16 | 2021-06-01 | 青岛海信宽带多媒体技术有限公司 | Optical module and manufacturing method |
| US10809456B2 (en) * | 2018-04-04 | 2020-10-20 | Ii-Vi Delaware Inc. | Adiabatically coupled photonic systems with fan-out interposer |
| JP7087631B2 (en) * | 2018-04-25 | 2022-06-21 | 住友電気工業株式会社 | Manufacturing method of optical connection parts and optical connection parts |
| CN111025474B (en) * | 2019-11-05 | 2020-12-08 | 浙江大学 | Silicon waveguide mode coupler covering SU-8 cladding based on refractive index regulation |
| US11500160B2 (en) | 2020-05-29 | 2022-11-15 | Corning Research & Development Corporation | Multicore optical fiber fan-out assemblies and apparatuses |
| CN112505852B (en) * | 2020-12-08 | 2022-07-15 | 武汉光谷信息光电子创新中心有限公司 | Silicon-based chip adjusting device, coupling device and coupling method |
| CN112748504A (en) * | 2021-04-06 | 2021-05-04 | 苏州海光芯创光电科技股份有限公司 | Method for coupling silicon optical chip and planar optical waveguide chip |
| CN115407463A (en) * | 2021-05-26 | 2022-11-29 | 索尔思光电股份有限公司 | Optical device and assembling method thereof |
| US11914193B2 (en) | 2021-06-22 | 2024-02-27 | Corning Research & Development Corporation | Optical assembly for coupling with two-dimensionally arrayed waveguides and associated methods |
| CN113359252B (en) * | 2021-06-30 | 2022-03-18 | 长飞光纤光缆股份有限公司 | Multi-channel optical module with single fan-in fan-out based on MPO interface |
| CN113433629B (en) * | 2021-06-30 | 2022-03-18 | 长飞光纤光缆股份有限公司 | Multi-channel optical module with double fan-in fan-out based on MPO interface |
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