CN106583955B - A kind of wire soldering method of detection chip fixed-direction - Google Patents
A kind of wire soldering method of detection chip fixed-direction Download PDFInfo
- Publication number
- CN106583955B CN106583955B CN201611148880.2A CN201611148880A CN106583955B CN 106583955 B CN106583955 B CN 106583955B CN 201611148880 A CN201611148880 A CN 201611148880A CN 106583955 B CN106583955 B CN 106583955B
- Authority
- CN
- China
- Prior art keywords
- pattern lines
- search range
- similarity
- standard
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Image Analysis (AREA)
Abstract
The invention discloses a kind of wire soldering method following steps of detection chip fixed-direction: (1) obtaining the pattern lines at least one standard search range area on standard chips and corresponding position and stored；(2) according to the pattern lines of the position acquisition chip corresponding position of storage；The pattern lines of acquisition on corresponding position and the pattern lines in standard search range area are subjected to similarity-rough set.Using method of the invention, the incorrect LED chip in position can be prejudged, avoid the occurrence of the waste because of LED chip and fluorescent glue caused by consolidating instead, can also be improved the molding efficiency of non-defective unit LED component, while the accuracy of judgement can be improved using the present invention.
Description
Technical field
The present invention relates to LED wire soldering methods, the especially wire soldering method of detection chip fixed-direction.
Background technique
The advantages that because of the energy conservation of LED, brightness height, long, environmentally friendly service life, LED has been widely used, for forward LED
For device, the processes such as fixation, bonding wire, encapsulation fluorescent glue, the solidification through chip are generally required.
The wire soldering method of existing positive cartridge chip is that chip is transported on the board of bonding equipment, then routing, after routing
The encapsulation for carrying out fluorescent glue, is then solidified, most checked whether there is admittedly anti-LED component later, although by this method
The process that the LED component that is capable of detecting when admittedly anti-LED component, but detected has already been through bonding wire and fluorescent glue encapsulation,
In this way, the chip in solid anti-LED component cannot reuse, and fluorescent glue can be wasted, while solid anti-LED component
Can be by bonding wire and encapsulation fluorescent glue, therefore, the molding efficiency of the LED component of non-defective unit can reduce.
Summary of the invention
The object of the present invention is to provide a kind of wire soldering methods of detection chip fixed-direction, utilize method of the invention, energy
The incorrect chip in position is prejudged in bonding wire, avoids the occurrence of the wave because of chip and fluorescent glue caused by consolidating instead
Take, can also be improved the molding efficiency of non-defective unit LED component, while the accuracy of judgement can be improved using the present invention.
In order to achieve the above objectives, a kind of wire soldering method of detection chip fixed-direction, includes the following steps:
(1) it determines the pattern lines at least one standard search range area on standard chips and corresponding position and carries out
Storage；
(2) chip pair is detected according to the position acquisition of the pattern lines in the standard search range area of the standard chips of storage
Answer the pattern lines of position；The pattern lines of acquisition on corresponding position and the pattern lines in standard search range area are subjected to phase
Compare like degree；If the similarity of pattern lines and the pattern lines in standard search range area is not less than default similarity value, sentence
Disconnected chip position is correct, subsequent wire bonding process is carried out, if pattern lines is similar to the pattern lines in standard search range area
Degree is less than default similarity value, then judges that chip position is incorrect, and issue alarm signal, without subsequent wire bonding process.
The present invention, before bonding wire, by the pattern lines of chip to determine whether having the incorrect situation of chip position, such as
Fruit chip malposition then will appear alarm, the process there is no need to carry out subsequent bonding wire, encapsulate fluorescent glue, in time will
Chip removes and carries out arrangement next time, will not influence the normal use of chip, therefore, will not be due to chip position is incorrect
Fluorescent glue and chip are wasted, and bonding wire, encapsulation fluorescence glue process, therefore, raising will not be entered because chip position is incorrect
Yields.Whether the position due to judging chip by the way of of the invention is correct, the accuracy of judgement is high.
Further, when determining the pattern lines in standard search range area, according to the pattern line in standard search range area
The size and location in the size adjustment standard search range area of the pattern lines difference of road and standard chips other positions, thus
The phenomenon that can determine that out unique comparison other, avoiding the occurrence of erroneous judgement.
Further, it when determining the pattern lines in standard search range area, first determines standard eyespot, is with standard eyespot
Center determines standard search range area, in this way, the position in standard search range area can be determined more accurately.
Further, the standard eyespot is the standard soldering board on standard chips.
Further, the phenomenon that only including a pad in same standard search range area, avoiding the occurrence of erroneous judgement, into
One step improves the accuracy of judgement.
Further, step (2) method particularly includes:
(a) eyespot being detected on chip is first identified according to the position of storage；
(b) the search range area that pattern lines obtains, the search range area that pattern lines obtains are determined centered on eyespot
Similarity-rough set is carried out with the pattern lines in the standard search range area of corresponding position.
By the eyespot of identification chip, the position of search range is determined, can thus improve and standard search range position
The goodness of fit set.
Further, the detailed process of step (b) are as follows:
1) expand the search range of pattern lines, search range and corresponding position with the pattern lines centered on eyespot
On standard search range area in pattern lines be compared, if the similarity compared is not less than default similarity, sentence
Disconnected detected chip position is correct, if the similarity compared is less than default similarity, carries out following step 2)；
2) search range of further expansion pattern lines, with the mark on the search range and corresponding position of the pattern lines
Pattern lines in quasi- search range area is compared, if the similarity compared is not less than default similarity, judgement is tested
It is correct to survey chip position, if the similarity compared is less than default similarity, carries out following step 3)；
3) above-mentioned steps 2 repeatedly) until the search range and standard search range area that expand pattern lines it is in the same size, when
When the search range area of pattern lines is consistent with standard search range area, if the similarity compared is not less than default similarity,
Then judge that chip position is correct, if the similarity compared is less than default similarity, judges that detected chip position is incorrect.
Using the above method, first determines eyespot, search range is then gradually expanded according to the result of the comparison, in this way, energy
The treating capacity for reducing data, can improve the efficiency of similarity-rough set, and can be further improved the precision compared.
Further, " if the similarity compared is less than preset similarity " is specific in step 3) further include: if compare
When similarity is less than default similarity, search range and the pre-stored detected chip surface area for expanding pattern lines are big
It is small consistent, it will be enlarged by being detected pattern in chip surface area on the pattern and corresponding position in the search range of rear pattern lines
Lines is compared, if the similarity compared is not less than default similarity, judges that chip position is correct, if the phase compared
It is less than default similarity like degree, then judges that chip position is incorrect.Chip can not be still determined within the scope of standard search in this way
When whether position is correct, the search range of corresponding lines is expanded to detected chip surface area, so as to further
Ensure the accuracy detected.
Further, pattern lines is obtained with camera system, the camera system includes that video camera, adjustable relaying are saturating
Mirror, clear glass, aperture, beam splitter, direct wide angle vertical red LED, direct wide angle vertical blue led and object lens, video camera, adjustable relaying are saturating
Mirror, clear glass and aperture are successively laterally arranged, and video camera is connect with controller, and light beam device is located at the front of aperture, direct wide angle vertical
Red LED is located at the top of beam splitter, and direct wide angle vertical blue led is located at the side of beam splitter, and object lens are located at the lower section of light beam device,
It is chip rest area below object lens.In this way, the pattern being more clear can be obtained.
Further, with the contrast of lighting system adjustment pattern lines, lighting system includes vertical illuminator, inclination photograph
Funerary objects, low angle oblique illumination device and broad light, vertical illuminator include direct wide angle vertical red LED and direct wide angle vertical blue led,
Be respectively equipped with oblique illumination device in at least two sides of chip rest area, chip rest area at least side and be located at oblique illumination
The lower section of device be equipped with low angle oblique illumination device, chip rest area periphery and be located at low angle oblique illumination device below set
There is broad light.Preferable contrast is obtained by the light distribution of above-mentioned luminaire, further increases the clarity of pattern.
Detailed description of the invention
Fig. 1 is the schematic diagram of camera system and lighting system.
Fig. 2 is the schematic diagram of standard chips.
Fig. 3 is the schematic diagram for being detected chip.
Fig. 4 is the schematic diagram of another detected chip.
Specific embodiment
The present invention will be described in further detail with reference to the accompanying drawings and detailed description.
A kind of wire soldering method of detection chip fixed-direction includes the following steps:
(1) it under the action of lighting system, is obtained on standard chips on bonding wire board by the camera system of bonding equipment
The pattern lines at least one standard search range area and corresponding position are simultaneously stored.As shown in Figure 1, the camera shooting system
System includes video camera 11, adjustable relay lens 12, clear glass 13, aperture 14, beam splitter 15, direct wide angle vertical red LED 16, wide-angle
Vertical blue led 17 and object lens 18.The successively laterally setting of video camera 11, adjustable relay lens 12, clear glass 13 and aperture 14, takes the photograph
Camera 11 is connect with controller, and beam splitter 15 is located at the front of aperture 14, and direct wide angle vertical red LED 16 is located at the upper of beam splitter 15
Side, direct wide angle vertical blue led 17 are located at the side of beam splitter, and it is core below object lens 18 that object lens 18, which are located at the lower section of light beam device 15,
Piece rest area.
Lighting system includes vertical illuminator, oblique illumination device 21, low angle oblique illumination device 22 and broad light 23, vertically
Luminaire includes direct wide angle vertical red LED 16 and direct wide angle vertical blue led 17, is respectively equipped in at least two sides of chip rest area
Oblique illumination device 21, at least side in chip rest area and the lower section positioned at oblique illumination device are equipped with low angle oblique illumination device
22, chip rest area periphery and be located at low angle oblique illumination device lower section be equipped with broad light 23.In the present embodiment, wide-angle
Vertical red LED indicates that angular field of view is big and vertically disposed red LED, and visual angle is 94 ° -118 °；And low angle inclination is shone
Angle where funerary objects indicates its light direction and chip rest area between plane is 30 ° -40 °.
In the present embodiment, by standard chips 30 standard positive electrode pad 31 and standard negative terminal pad 32 centered on formed
Standard search range area for be illustrated anti-solid anti-wire soldering method, specific step is.
(1) the pattern lines and corresponding position for determining at least one standard search range area on standard chips 30 are gone forward side by side
Row storage obtains the pattern lines in two standard search range areas on standard chips, is determining standard search model referring to fig. 2
When enclosing the pattern lines in area, first criterion of identification positive terminal pad 31 and standard negative terminal pad 32 are used as standard eyespot to determine position, with
Standard search range area is determined centered on standard eyespot, according to the pattern lines in standard search range area and other positions of standard chips
The size in the variant determining standard search range area of the pattern lines set avoids the occurrence of erroneous judgement convenient for the similarity-rough set of junior scholar
The phenomenon that, in the present embodiment, the pattern lines in two different standard search range areas also more works as difference.Furthermore, it desired to
The phenomenon that only including a pad in same standard search range area, avoiding the occurrence of judgement inaccuracy and erroneous judgement.
(2) referring to Fig. 3, according to the pattern lines of 40 corresponding position of position acquisition chip of storage；It will be on corresponding position
The pattern lines of acquisition and the pattern lines in standard search range area carry out similarity-rough set；Specific process are as follows:
(a) according to the eyespot on the position elder generation identification chip of storage；In this embodiment, eyespot is to be detected chip 40 just
Pole pad 41 and negative terminal pad 42.
(b) the search range area that pattern lines obtains, the search range area that pattern lines obtains are determined centered on eyespot
Similarity-rough set is carried out with the pattern lines in the standard search range area of corresponding position；In the present embodiment, pattern lines is obtained
Search range area and corresponding position standard search within the scope of pattern lines carry out similarity comparison algorithm using it is existing often
Similarity algorithm, the specific process of step (b) are as follows:
1) expand the search range of pattern lines, search range and corresponding position with the pattern lines centered on eyespot
On standard search range area in pattern lines be compared, if the similarity compared is not less than default similarity, sentence
Disconnected chip position is correct, if the similarity compared is less than default similarity, carries out following step 2)；
2) search range of further expansion pattern lines, with the mark on the search range and corresponding position of the pattern lines
Pattern lines in quasi- search range area is compared, if the similarity compared is not less than default similarity, judges chip
Position is correct, if the similarity compared is less than default similarity, carries out following step 3)；
3) above-mentioned steps 2 repeatedly) until the search range and standard search range area that expand pattern lines it is in the same size, when
When the search range area of pattern lines is consistent with standard search range area, if the similarity compared is not less than default similarity,
Then judge that chip position is correct, if the similarity compared is less than default similarity, judges that chip position is incorrect.Above-mentioned step
Rapid 1) -3) one preset value of expansion value of the search range of pattern lines, the preset value are less than the search of standard pattern lines every time in
The 1/2 of range side length or radius.
In step 3) " if the similarity compared be less than default similarity " step specifically further includes, if the similarity compared
When less than default similarity, search range and the detected chip surface area for expanding pattern lines are in the same size, if compared
Similarity be not less than default similarity, then judge that chip position is correct, if the similarity compared is less than preset similarity
When, then judge that chip position is incorrect.It can still can determine that chip position is when standard search range areas determines wrong in this way
It is no correct, to further increase the accuracy of detection.
After comparison, if pattern lines is similar not less than presetting to the similarity of the pattern lines in standard search range area
Angle value then judges that chip position is correct, carries out subsequent wire bonding process, if the pattern line of pattern lines and standard search range area
The similarity on road is less than default similarity value, then judges that chip position is incorrect, and issue alarm signal, without subsequent weldering
Line procedures.
The step of Fig. 4 is the chip of another pattern, realizes method of the invention is same as described above.
In the present embodiment, the position of storage refers to the corresponding storage location of the corresponding pattern lines of standard chips, can lead to
Coordinate is crossed to determine.Determination is more actually needed in default similarity value, for example, within the scope of 90%-100% i.e. be considered to meet it is similar
What degree required, illustrate that the position of chip is correct.
The present invention, before bonding wire, by the pattern lines of chip to determine whether having the incorrect situation of chip position, such as
Fruit chip malposition then will appear alarm, the process there is no need to carry out subsequent bonding wire, encapsulate fluorescent glue, in time will
Chip removes and carries out arrangement next time, will not influence the normal use of chip, therefore, will not be due to chip position is incorrect
Fluorescent glue and chip are wasted, and bonding wire, encapsulation fluorescence glue process, therefore, raising will not be entered because chip position is incorrect
Yields.Whether the position due to judging chip by the way of of the invention is correct, the accuracy of judgement is high.
By the eyespot of identification chip, the position of search range is determined, can thus improve and standard search range position
The goodness of fit set, and first determine eyespot, search range is then gradually expanded according to the result of the comparison, in this way, number can be reduced
According to treating capacity, the efficiency of similarity-rough set can be improved, and can be further improved the precision compared.
Claims (8)
1. a kind of wire soldering method of detection chip fixed-direction, it is characterised in that include the following steps:
(1) it determines the pattern lines at least one standard search range area on standard chips and corresponding position and is stored up
It deposits；
(2) according to the pattern lines of the position acquisition chip corresponding position of storage；By the pattern lines of the acquisition on corresponding position
Similarity-rough set is carried out with the pattern lines in standard search range area；If the pattern lines of pattern lines and standard search range area
Similarity be not less than default similarity value, then judge that chip position is correct, carry out subsequent wire bonding process, if pattern lines with
The similarity of the pattern lines in standard search range area is less than default similarity value, then judges that chip position is incorrect, and issue
Alarm signal, without subsequent wire bonding process；
Step (2) method particularly includes:
(a) according to the eyespot on the position elder generation identification chip of storage；
(b) centered on eyespot determine pattern lines obtain search range area, pattern lines obtain search range area with it is right
The pattern lines in the standard search range area of position is answered to carry out similarity-rough set；
The detailed process of step (b) are as follows:
1) search range for expanding pattern lines centered on eyespot, on the search range and corresponding position with the pattern lines
Pattern lines in standard search range area is compared, if the similarity compared is not less than default similarity, judges core
Piece position is correct, if the similarity compared is less than default similarity, carries out following step 2)；
2) search range of further expansion pattern lines is searched with the standard on the search range and corresponding position of the pattern lines
Pattern lines in rope range area is compared, if the similarity compared is not less than default similarity, judges chip position
Correctly, if the similarity compared is less than default similarity, following step 3 is carried out)；
3) above-mentioned steps 2 repeatedly) until the search range and standard search range area that expand pattern lines it is in the same size, work as pattern
When the search range area of lines is consistent with standard search range area, if the similarity compared is not less than default similarity, sentence
Disconnected chip position is correct, if the similarity compared is less than default similarity, judges that chip position is incorrect.
2. the wire soldering method of detection chip fixed-direction according to claim 1, it is characterised in that: determining standard search
When the pattern lines in range area, according to the pattern of the pattern lines in the standard search range area of acquisition and standard chips other positions
The difference size of lines determines the size and location in standard search range area.
3. the wire soldering method of detection chip fixed-direction according to claim 2, it is characterised in that: determining standard search
When the pattern lines in range area, standard eyespot is first determined, standard search range area is determined centered on standard eyespot.
4. the wire soldering method of detection chip fixed-direction according to claim 3, it is characterised in that: the standard eyespot
For the standard soldering board on standard chips.
5. the wire soldering method of detection chip fixed-direction according to claim 4, it is characterised in that: searched in the same standard
It only include a pad in rope range area.
6. the wire soldering method of detection chip fixed-direction according to claim 1, it is characterised in that: in step 3) " if than
Compared with similarity be less than default similarity when " it is specific further include: if the similarity compared is less than default similarity, expand pattern
The search range of lines and pre-stored detected chip surface area are in the same size, will be enlarged by the search model of rear pattern lines
Pattern in enclosing is compared with pattern lines in chip surface area is detected on corresponding position, if the similarity compared is not
Less than default similarity, then judge that chip position is correct, if comparison similarity be less than default similarity, judge chip position
It sets incorrect.
7. the wire soldering method of detection chip fixed-direction according to claim 1, it is characterised in that: obtained with camera system
Pattern lines, the camera system include that video camera, adjustable relay lens, clear glass, aperture, beam splitter, direct wide angle vertical are red
Color LED, direct wide angle vertical blue led and object lens, video camera, adjustable relay lens, clear glass and aperture are successively laterally arranged, camera shooting
Machine is connect with controller, and light beam device is located at the front of aperture, and direct wide angle vertical red LED is located at the top of beam splitter, direct wide angle vertical
Blue led is located at the side of beam splitter, and it is chip rest area below object lens that object lens, which are located at the lower section of light beam device,.
8. the wire soldering method of detection chip fixed-direction according to claim 1 or 6, it is characterised in that: use lighting system
The contrast of pattern lines is adjusted, lighting system includes vertical illuminator, oblique illumination device, low angle oblique illumination device and scattering
Lamp, vertical illuminator include direct wide angle vertical red LED and direct wide angle vertical blue led, are distinguished in at least two sides of chip rest area
Equipped with oblique illumination device, chip rest area at least side and be located at the lower section of oblique illumination device and be equipped with low angle oblique illumination
Device, the periphery in chip rest area and the lower section positioned at low angle oblique illumination device are equipped with broad light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611148880.2A CN106583955B (en) | 2016-12-13 | 2016-12-13 | A kind of wire soldering method of detection chip fixed-direction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611148880.2A CN106583955B (en) | 2016-12-13 | 2016-12-13 | A kind of wire soldering method of detection chip fixed-direction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106583955A CN106583955A (en) | 2017-04-26 |
| CN106583955B true CN106583955B (en) | 2019-05-03 |
Family
ID=58802323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611148880.2A Active CN106583955B (en) | 2016-12-13 | 2016-12-13 | A kind of wire soldering method of detection chip fixed-direction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106583955B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1182921A (en) * | 1996-09-17 | 1998-05-27 | 株式会社日立制作所 | Graph testing method and device |
| CN101320426A (en) * | 2007-06-06 | 2008-12-10 | 夏普株式会社 | Image processing device and method, image forming device and image processing system |
| CN101493889A (en) * | 2008-01-23 | 2009-07-29 | 华为技术有限公司 | Method and apparatus for tracking video object |
| CN103456650A (en) * | 2007-03-13 | 2013-12-18 | 库利克和索夫工业公司 | Eyepoint training method for wire bond and related semiconductor processing operation |
| CN103489195A (en) * | 2013-10-11 | 2014-01-01 | 胡晓彤 | Method for detecting can body pattern direction of metal can |
| CN103902960A (en) * | 2012-12-28 | 2014-07-02 | 北京计算机技术及应用研究所 | Real-time face recognition system and method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9008398B2 (en) * | 2012-10-26 | 2015-04-14 | Varian Medical Systems, Inc. | Template matching method for image-based detection and tracking of irregular shaped targets |
-
2016
- 2016-12-13 CN CN201611148880.2A patent/CN106583955B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1182921A (en) * | 1996-09-17 | 1998-05-27 | 株式会社日立制作所 | Graph testing method and device |
| CN103456650A (en) * | 2007-03-13 | 2013-12-18 | 库利克和索夫工业公司 | Eyepoint training method for wire bond and related semiconductor processing operation |
| CN101320426A (en) * | 2007-06-06 | 2008-12-10 | 夏普株式会社 | Image processing device and method, image forming device and image processing system |
| CN101493889A (en) * | 2008-01-23 | 2009-07-29 | 华为技术有限公司 | Method and apparatus for tracking video object |
| CN103902960A (en) * | 2012-12-28 | 2014-07-02 | 北京计算机技术及应用研究所 | Real-time face recognition system and method thereof |
| CN103489195A (en) * | 2013-10-11 | 2014-01-01 | 胡晓彤 | Method for detecting can body pattern direction of metal can |
Non-Patent Citations (3)
| Title |
|---|
| 全自动晶片焊线机视觉检测***的研究;段锦等;《半导体技术》;20090430;第34卷(第4期);第361-364页 |
| 基于局部背景特征点的目标定位和跟踪;张铁等;《中南大学学报》;20160930;第47卷(第9期);第3040-3049页 |
| 基于机器视觉的表面贴装晶片检测与定位技术研究;陆健;《中国优秀硕士学位论文全文数据库（信息科技辑）》;20100215;第三章 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106583955A (en) | 2017-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2018201835A1 (en) | Signal light state recognition method, device and vehicle-mounted control terminal and motor vehicle | |
| EP1962226B1 (en) | Image recognition device for vehicle and vehicle head lamp controller and method of controlling head lamps | |
| US7839303B2 (en) | Vehicle detecting apparatus | |
| CN103185549A (en) | Board inspection apparatus and method | |
| CN106093073B (en) | Base board defect location positioning method and device and system | |
| CN106218492B (en) | A kind of night running light automatic switching control equipment and switching method | |
| CN108120353B (en) | Fire transmission hole detection device and method based on intelligent camera | |
| TW200814870A (en) | Method of setting reference data for inspection of fillets and inspection device using same | |
| CN108648175B (en) | Detection method and device | |
| CN206029021U (en) | A device that is used for surperficial copper -plated liquid crystal display panel of radium carving | |
| CN107144227B (en) | A kind of municipal rail train pantograph pan on-line thickness testing and method | |
| TWI697656B (en) | Line shape inspection device and line shape inspection method | |
| CN209215426U (en) | LED component automatic checkout system | |
| CN109580648A (en) | Screwdriver bit detection method and detection device | |
| CN103913459A (en) | Lamp head tin scolding contact qualified rate detecting device and method | |
| CN103076158A (en) | CCD (Charge Coupled Device) directly-distributed light type detection machine | |
| CN106583955B (en) | A kind of wire soldering method of detection chip fixed-direction | |
| CN108818015B (en) | Positioning fixture and precision detection process thereof | |
| JP4007578B2 (en) | Headlamp irradiation range control method and headlamp apparatus | |
| JP2004086417A (en) | Method and device for detecting pedestrian on zebra crossing | |
| CN107655407A (en) | The method for detecting the apparatus and method and mounted lens of the position of LED phosphor | |
| CN108705689B (en) | Automatic tool setting process method for repairing surface microdefects of large-caliber precise optical crystal | |
| CN111307424A (en) | Automobile lamp nondestructive detector based on light source brightness detection | |
| WO2021134996A1 (en) | Defect determining method and system for led support | |
| CN102829891B (en) | Visual detection system for judging material temperature and posture and detection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |