CN106572213A - Terminal, substrate assembly and manufacturing method thereof - Google Patents
Terminal, substrate assembly and manufacturing method thereof Download PDFInfo
- Publication number
- CN106572213A CN106572213A CN201610974085.2A CN201610974085A CN106572213A CN 106572213 A CN106572213 A CN 106572213A CN 201610974085 A CN201610974085 A CN 201610974085A CN 106572213 A CN106572213 A CN 106572213A
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- Prior art keywords
- substrate
- luminescence unit
- light
- metallic region
- region
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/03—Combinations of cameras with lighting apparatus; Flash units
- G03B15/05—Combinations of cameras with electronic flash apparatus; Electronic flash units
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Abstract
The invention discloses a terminal, a substrate assembly and a manufacturing method thereof. A light-emitting unit is arranged on a substrate with a multi-layer structure. The multi-layer structure of the substrate includes a target metal layer and a circuit layer. The target metal layer is provided with a metal region exposed to the surface of the substrate. The light-emitting unit is electrically connected with the circuit layer and is used for emitting the light under the excitation of the circuit layer. The position of the metal region is matched with the position of the light-emitting region of the light-emitting unit, so that the light emitted by the light-emitting unit is reflected. The front shell of the terminal is provided with a hollow region for accommodating the display region of a display assembly. The rear shell of the terminal is provided with a hollow region for accommodating the light-emitting region of a flash assembly and a hollow region for accommodating the framing region of a camera assembly. Therefore, when the light goes down, the light emitted by the light-emitting unit can be reflected through the metal region to be supplied to a user during the framing and shooting process of the user by means of the camera assembly. In this way, the loss of the light is reduced, and the flash effect is further enhanced. The satisfaction degree of the user experience is improved.
Description
Technical field
The present invention relates to field of terminal, more particularly, it relates to a kind of terminal, board unit and preparation method thereof.
Background technology
Development and the fast growth of mobile Internet with intelligent terminal, people also get over to the configuration requirement of mobile terminal
Come higher, wherein, even more there is increasing people to yearn for high-quality shooting, nowadays, flash lamp is substantially into intelligent end
The standard configuration at end, the image that flash lamp can make up insufficient light and cause is dim, the defect such as fuzzy, such that it is able to great
Improving a part of light of its luminescence unit transmitting in the environmental suitability of camera assembly, but current flash lamp can be inhaled by substrate
Receive, namely the light of luminescence unit transmitting can not be widely-available for users completely in flash lamp, can be lost due to the absorption of substrate
Fall a part, therefore, the inadequate problem of intensity of illumination is often occurred in practical application, have impact on Consumer's Experience.
The content of the invention
The technical problem to be solved in the present invention is：A part of light of its luminescence unit transmitting can be by substrate in flash lamp
Absorb and lose, so as to the problem for causing intensity of illumination inadequate, for the technical problem, there is provided a kind of terminal, board unit
And preparation method thereof.
To solve above-mentioned technical problem, the present invention provides a kind of board unit, including：Substrate, and it is arranged on the base
The luminescence unit of plate surface；The substrate includes multiple structure, and the multiple structure includes objective metal layer and line layer, institute
State objective metal layer and there is the exposed metallic region on the substrate surface；The luminescence unit electrically connects with the line layer
Connect, and for lighting under the exciting of the line layer；The light-emitting zone of the position of the metallic region and the luminescence unit
It is adapted, for reflecting the light that the luminescence unit sends.
Wherein, the metallic region is located at the lower section of the luminescence unit and extends luminescence unit institute overlay area
Outside；Or, the metallic region surrounds the luminescence unit surrounding, and the metallic region forms closed loop；Or, the gold
The one side or surface of luminescence unit described in category region adjacent.
Wherein, the luminescence unit includes LED chip group, and LED chip group includes at least one LED chip.
Wherein, board unit also includes support member, and luminescence unit is arranged on the substrate surface by the support member.
Wherein, the support member is structure as a whole with substrate.
Wherein, board unit also includes translucent cover, and translucent cover is installed on substrate, and for by luminescence unit and the gold
Belong to region shade together.
Wherein, the substrate includes pcb board.
Wherein, the objective metal layer and the line layer are same layer structure, and the objective metal layer has line areas
Domain and the metallic region.
Further, present invention also offers a kind of terminal, including shell, and the display group being installed in the shell
Part, camera assembly, flash component and the substrate in any one board unit as described above, the flash component include it is above-mentioned arbitrarily
The luminescence unit and objective metal layer that are arranged on the substrate surface in a kind of board unit, the objective metal layer has naked
The metallic region being exposed on the substrate surface；The shell includes fore shell and back cover, and the fore shell has the display group
The exposed hollow region in viewing area of part；The back cover has the output optical zone domain of flash component is exposed hollow
Region, and by the exposed hollow region of the view area of the camera assembly；The output optical zone domain bag of the flash component
Include the light-emitting zone and metallic region of luminescence unit in the board unit.
Further, the present invention also provides a kind of board unit manufacture method, including：
The substrate of multiple structure is made, the multiple structure includes objective metal layer and line layer, described many making
Some surface regions that the objective metal layer is reserved during Rotating fields exposed can be made on the substrate surface
For the metallic region, if or leading to overetched mode after the multiple structure completes and making the objective metal layer
Dry surface region it is exposed on the substrate surface as the metallic region；With the metallic region on the substrate surface
The position being adapted is installed by luminescence unit so that the metallic region can be reflected the light that the luminescence unit sends.
Beneficial effect
Terminal, board unit proposed by the invention and preparation method thereof, by setting on the substrate with multiple structure
Luminescence unit is put, the multiple structure of substrate includes objective metal layer and line layer, and objective metal layer has exposed in substrate surface
On metallic region, luminescence unit and line layer are electrically connected with, for lighting under the exciting of line layer, and the position of metallic region
Put and be adapted with the light-emitting zone of luminescence unit, to reflect the light that luminescence unit sends, it is aobvious that terminal fore shell is provided with receiving
Show the hollow region of component viewing area, terminal back cover is provided with the hollow region in receiving flash component output optical zone domain and receiving is taken the photograph
As the hollow region of component view area, thus, work as dim light, user carries out finding a view when shooting, lights by camera assembly
The light that unit sends runs past the reflection of metallic region and is supplied to user, it is possible to reduce the loss of light, increased sudden strain of a muscle and closes
The intensity of illumination of lamp, so as to can further strengthen flash effect, improves the satisfaction of Consumer's Experience.
Description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is the hardware architecture diagram for realizing the optional mobile terminal of each embodiment one of the invention；
Fig. 2 is the first structure schematic diagram of board unit in the embodiment of the present invention one；
Fig. 3 is the second structural representation of board unit in the embodiment of the present invention one；
Fig. 4 is the 3rd structural representation of board unit in the embodiment of the present invention one；
Fig. 5 is the 4th structural representation of board unit in the embodiment of the present invention one；
Fig. 6 is the structural representation of substrate and support member in the embodiment of the present invention two；
Fig. 7 is the first structure schematic diagram of terminal in the embodiment of the present invention three；
Fig. 8 is the second structural representation of terminal in the embodiment of the present invention three；
Fig. 9 is the schematic flow sheet of the manufacture method of board unit in the embodiment of the present invention four.
Specific embodiment
It should be appreciated that specific embodiment described herein is not intended to limit the present invention only to explain the present invention.
The mobile terminal of each embodiment of the invention is realized referring now to Description of Drawings.In follow-up description, use
For represent element such as " module ", " part " or " unit " suffix only for be conducive to the present invention explanation, itself
Not specific meaning.Therefore, " module " can be used mixedly with " part ".
Mobile terminal can be implemented in a variety of manners.For example, the terminal described in the present invention can include such as moving
Phone, smart phone, notebook computer, digit broadcasting receiver, PDA (personal digital assistant), PAD (panel computer), PMP
The mobile terminal of (portable media player), guider etc. and such as numeral TV, desk computer etc. are consolidated
Determine terminal.Hereinafter it is assumed that terminal is mobile terminal, however, it will be understood by those skilled in the art that, except being used in particular for movement
Outside the element of purpose, construction according to the embodiment of the present invention can also apply to the terminal of fixed type.
Fig. 1 is the hardware architecture diagram for realizing the optional mobile terminal of each embodiment one of the invention.
Mobile terminal 1 00 can include A/V (audio/video) input block 110, user input unit 120, output unit
130th, memorizer 140, controller 150 and power subsystem 160 etc..Fig. 1 shows the mobile terminal with various assemblies, but
It should be understood that, it is not required that implement all components for illustrating, can alternatively implement more or less of component, will be below
Describe the element of mobile terminal in detail.
A/V input blocks 110 are used to receive audio or video signal.A/V input blocks 110 can include camera 111, phase
Static images or the image of video that 111 pairs, machine is obtained in Video Capture pattern or image capture mode by image capture apparatus
Data are processed.Picture frame after process may be displayed on display module 131.Picture frame Jing after the process of camera 111 can
In to be stored in memorizer 140 (or other storage mediums), two or more cameras can be provided according to the construction of mobile terminal
111。
User input unit 120 can generate key input data to control each of mobile terminal according to the order of user input
Plant operation.User input unit 120 allows the various types of information of user input, and can include keyboard, metal dome, touch
Plate (for example, detection is due to the sensitive component of the change of touched and caused resistance, pressure, electric capacity etc.), roller, rocking bar etc.
Deng.Especially, when touch pad is superimposed upon in the form of layer on display module 131, touch screen can be formed.
Output unit 130 can include display module 131.Display module 131 may be displayed in mobile terminal 1 00 and process
Information.For example, when mobile terminal 1 00 is in telephone calling model, display module 131 can show and converse or other are logical
The related user interface (UI) of letter (for example, text messaging, multimedia file download etc.) or graphic user interface
(GUI).When mobile terminal 1 00 is in video calling pattern or image capture mode, display module 131 can show capture
Image and/or reception image, UI or GUI of video or image and correlation function etc. are shown.
Meanwhile, when the display module 131 and touch pad touch screen with formation superposed on one another in the form of layer, display module
131 can serve as input equipment and output device.Display module 131 can include liquid crystal display (LCD), thin film transistor (TFT)
In LCD (TFT-LCD), Organic Light Emitting Diode (OLED) display, flexible display, three-dimensional (3D) display etc. at least
It is a kind of.Some in these display may be constructed such that transparence to allow user from outside viewing, and this is properly termed as transparent
Display, typical transparent display can be, for example, TOLED (transparent organic light emitting diode) display etc..According to specific
The embodiment wanted, mobile terminal 1 00 can include two or more display modules (or other display devices), for example, move
Dynamic terminal can include outside display module (not shown) and internal display module (not shown).Touch screen can be used for detection and touch
Input pressure and touch input position and touch input area.
Memorizer 140 can store software program for the process and control operation performed by controller 150 etc., Huo Zheke
With the data (for example, telephone directory, message, still image, video etc.) for temporarily storing own Jing outputs or will export.And
And, memorizer 140 can be storing the vibration of various modes with regard to exporting when touching and being applied to touch screen and audio signal
Data.
The overall operation of the generally control mobile terminal of controller 150.For example, controller 150 is performed and voice call, data
The related control of communication, video calling etc. and process.In addition, controller 150 can be included for reproducing (or playback) many matchmakers
The multi-media module 151 of volume data, multi-media module 151 can be constructed in controller 150, or is so structured that and control
Device 150 is separated.Controller 150 can be with execution pattern identifying processing, by the handwriting input for performing on the touchscreen or picture
Draw input and be identified as character or image.
Power subsystem 160 receives under control of the controller 150 external power or internal power and provides operation each unit
Appropriate electric power needed for part and component.
Various embodiments described herein can be with using such as computer software, hardware or its any combination of calculating
Machine computer-readable recording medium is implementing.For hardware is implemented, embodiment described herein can be by using application-specific IC
(ASIC), digital signal processor (DSP), digital signal processing device (DSPD), programmable logic device (PLD), scene can
Programming gate array (FPGA), processor, controller, microcontroller, microprocessor, it is designed to perform function described herein
Implementing, in some cases, such embodiment can be implemented at least one in electronic unit in controller 150.
For software is implemented, the embodiment of such as process or function can with allow to perform the single of at least one function or operation
Software module is implementing.Software code can be come by the software application (or program) write with any appropriate programming language
Implement, software code can be stored in memorizer 140 and be performed by controller 150.
Based on the hardware configuration of above-mentioned mobile terminal, the present invention provides a kind of terminal, board unit and preparation method thereof.
It is described in detail below by way of specific embodiment.
Embodiment one
In order to strengthen the light-gathering of flash lamp, the loss of the light that flash lamp sends is reduced, present embodiments provide one kind
The component of substrate 21, including substrate 21, and it is arranged on the luminescence unit 22 on the surface of substrate 21；Wherein, the substrate in the present embodiment
21 include multiple structure, and multiple structure includes objective metal layer 23 and line layer, and objective metal layer 23 has exposed in substrate
Metallic region on 21 surfaces, specifically may refer to shown in Fig. 2, and the luminescence unit 22 in the present embodiment electrically connects with line layer
Connect, and for lighting under the exciting of line layer；The position of metallic region is adapted with the light-emitting zone of luminescence unit 22, is used for
The light that luminescence unit 22 sends is reflected.It should be noted that the shape on the surface of substrate 21 in the present embodiment can be
Arbitrary shape, for example, can be the various regular shapes such as square, rectangle, parallel four deformation, or it is other each
Plant irregularly shaped.Moreover, it is to be understood that the objective metal layer 23 in the present embodiment can have multiple structure for this
Any one layer of metal level in substrate 21, it should be noted that the objective metal layer 23 in the present embodiment can be layers of copper, also may be used
Being other metal levels.
It should be appreciated that the exiting surface of the luminescence unit 22 in the present embodiment can or and base parallel with the surface of substrate 21
The surface of plate 21 is vertical, or at a certain angle with the surface shape of substrate 21, specifically can be according to actual application scenarios by developing
Personnel are flexibly arranged.It should be noted that in the present embodiment, developer can pass through to change suitable luminescence unit 22, or
Person changes luminescence unit 22 and realizes the conversion of light-emitting zone with the specific connected mode in the surface of substrate 21.
Certainly, luminescence unit 22 can have various with the annexation on the surface of substrate 21 in the present embodiment, for example, this enforcement
Luminescence unit 22 in example can be arranged on the surface of substrate 21 by itself plane, it is also possible to by itself one
Point or line are arranged on the surface of substrate 21.In addition, it should be noted that the objective metal layer 23 in the present embodiment can be with line
Road floor is same layer structure, and now objective metal layer 23 has land and metallic region, of courses, the mesh in the present embodiment
Mark metal level 23 can also be located at line layer lower section, or can also be positioned at the top of line layer, as long as objective metal layer 23 has
There is the exposed metallic region on the surface of substrate 21, wherein, the shape of metallic region can be arbitrary in the present embodiment
Shape, can be the various regular shapes such as circle, annular, square, rectangle for example, or it is other irregular
The size of metallic region can also flexibly be set by developer according to actual application scenarios in shape, and the present embodiment
Put.
Below.Luminescence unit in the present embodiment 22 is illustrated with the position relationship of metallic region, in the present embodiment, is sent out
Light unit 22 can be with the position relationship of metallic region：Metallic region is located at the lower section of luminescence unit 22 and extends luminous single
Outside first 22 overlay areas, specifically may refer to shown in Fig. 3, it is no in Fig. 3 to send out in order to embody the position of metallic region
Light unit 22 is drawn on the base plate (21.
In the present embodiment, luminescence unit 22 can also be with the position relationship of metallic region：Metallic region is around luminous single
First 22 surroundings are arranged, and metallic region forms closed loop, specifically may refer to shown in Fig. 4, in order to embody the position of metallic region,
Luminescence unit 22 do not drawn on the base plate (21 in Fig. 4.
In the present embodiment, luminescence unit 22 can also be with the position relationship of metallic region：Metallic region is neighbouring luminous single
The one side or surface of unit 22 is arranged, and specifically be may refer to shown in Fig. 5, in order to embody the position of metallic region, in Fig. 5
Luminescence unit 22 is not drawn on the base plate (21.It should be appreciated that the specific set location of metallic region can in the present embodiment
Specifically arranged with the light-emitting zone by developer in practical application.
Of course, luminescence unit 22 can also have other modes, example with the set-up mode of metallic region in the present embodiment
Such as, luminescence unit 22 can also be separately positioned on the adjacently situated surfaces of substrate 21 with metallic region, as long as meeting setting for metallic region
Seated position is adapted with the light-emitting zone of luminescence unit 22.
It should be appreciated that the luminescence unit 22 in the present embodiment can be that (Light Emitting Diode send out LED
Optical diode) chipset, wherein, LED chip group includes at least one LED chip, of courses, the luminous list in the present embodiment
Unit 22 can also be light emitting package body or luminous pedestal, for example, it may be LED package or LED base, of course, LED
Packaging body can be surface mount LED, or pinned LED.
Furthermore, it is necessary to illustrate, the luminescence unit 22 in the present embodiment can be arranged on the table of substrate 21 by support member
Face, wherein, the support member in the present embodiment can be common connector, for support chain luminescence unit 22, for example, this reality
It can be support base, support column, elasticity bolt etc. to apply the support member in example.Of course, the luminescence unit 22 in the present embodiment
Can be directly welded on support member；Can also be connected with support member by elasticity bolt or other mechanical connection manners,
Now luminescence unit 22 can realize the electric connection with line layer by external circuit.
It should be noted that the support member in the present embodiment can be structure as a whole with substrate 21, namely support member and base
Plate 21 is an entirety, that is to say that the support member in the present embodiment is non-removable with substrate 21, so, easily facilitates module
Metaplasia is produced, and productivity ratio is improved, when to arrange luminescence unit 22 on the base plate (21, it is possible to be directly fixed on luminescence unit 22
On support member, without arranging the support member that can support luminescence unit 22 on the base plate (21 again, assembling stream can be simplified
Journey, reduces the demand to human resourcess, improve production efficiency.Of course, the support member in the present embodiment can also with substrate 21
It is independent, when to arrange luminescence unit 22 on the base plate (21, can first securing supports on the base plate (21, then by luminescence unit
22 are arranged on the surface of substrate 21 by support member, in addition also, it should be noted that the substrate in the present embodiment can be PCB
(Printed Circuit Board, printed circuit) plate.
In the present embodiment, in order to protect luminescence unit 22, can also include in the component of substrate 21 that the present embodiment is provided
Translucent cover, that is to say can be in the present embodiment substrate 21 on translucent cover is installed, for by luminescence unit 22 and metallic region
Shade together, for example, the translucent cover in the present embodiment can be soft light cover, the harder direct projection that can be sent luminescence unit 22
Light changes into soft scattered light, can play a part of softening intense light, can further improve the experience of user.
The board unit that the present embodiment is provided, by arranging luminescence unit in substrate surface, substrate includes multiple structure, its
In, multiple structure includes objective metal layer and line layer, and objective metal layer has the exposed metallic region in substrate surface, sends out
Light unit is electrically connected with line layer, and for lighting under the exciting of line layer, the position of metallic region is arranged and luminous list
Unit light-emitting zone be adapted because metal have can be with the characteristic of reflection light, the metallic region in the present embodiment can
To reflect the light that luminescence unit sends, therefore the utilization rate that luminescence unit emits beam is improve, reduce the damage of light
Lose, further enhancing flash effect, improve the satisfaction of Consumer's Experience.
Embodiment two
In order to be better understood from the present invention, the present embodiment provides a kind of more specific board unit, including pcb board and
The LED chip group on pcb board surface is arranged on, wherein, pcb board has multiple structure, including line layer and objective metal layer, and mesh
Mark metal level has the exposed metallic region on pcb board surface, and LED chip group is electrically connected with line layer, and in circuit
Light under the exciting of layer, the position of metallic region is adapted with the light-emitting zone of LED chip group, for sending to LED chip group
Light reflected.It should be appreciated that the shape of the pcb board in the present embodiment can be arbitrary shape, for example, Ke Yiwei
The various regular shapes such as positive way, rectangle, parallel four deformation, or it is other various irregularly shaped.
Additionally, the light-emitting zone of the LED chip group in the present embodiment can it is parallel with pcb board surface or with pcb board surface
Vertically, it is or at a certain angle with pcb board surface shape, specifically can flexibly be set by developer according to actual application scenarios
Put.Certainly, LED chip group can have various with the annexation on pcb board surface in the present embodiment, for example, in the present embodiment
LED chip group can be arranged on pcb board surface by itself plane, it is also possible to by itself point or line
It is arranged on pcb board surface.
It should be noted that the objective metal layer in the present embodiment can be same layer structure with line layer, now target
Metal level has land and metallic region, of courses, and the objective metal layer in the present embodiment can also be located under line layer
Side, or the top of line layer can also be located at, as long as objective metal layer has exposed metallic region on the surface of the substrate i.e.
Can, certainly, the shape of metallic region can also be arbitrary shape in the present embodiment, can be circle, annular, just for example
The various regular shapes such as square, rectangle, or it is other irregularly shaped, and in the present embodiment metallic region face
Product size can also flexibly be arranged by developer according to actual application scenarios.
LED chip group has various with the position relationship of metallic region in the present embodiment, in the present embodiment with LED chip group with
Metallic region is illustrated as a example by the same surface of pcb board, and wherein metallic region in the lower section of LED chip group and can extend
Go out outside LED chip group institute overlay area；Metallic region can also surround LED chip group surrounding, and metallic region forms closed loop；
Metallic region can be arranged with the one side of neighbouring LED chip group or surface；Certainly, metallic region is concrete in the present embodiment
Set location can specifically be arranged with the light-emitting zone by developer in practical application.
Furthermore, it is necessary to illustrate, the LED chip group in the present embodiment can be arranged on pcb board 61 by support member 24
Surface, specifically may refer to shown in Fig. 6, wherein, the support member 24 in the present embodiment can be common connector, for propping up
Support link LED chip group, for example, the support member 24 in the present embodiment can be support base, support column, elasticity bolt etc..When
So, the LED chip group in the present embodiment can be directly welded on support member 24；Can also by elasticity bolt or other
Mechanical connection manner be connected with support member 24, now LED chip group can by external circuit realize it is electrical with line layer
Connection.It should be noted that the support member 24 in the present embodiment can be structure as a whole with pcb board 61, namely support member 24 with
Pcb board 61 is an entirety, so, easily facilitates modularized production, improves productivity ratio, when arranging LED core on pcb board 61
During piece group, it is possible to directly LED chip group is fixed on support member 24, can be with without arranging on pcb board 61 again
The support member 24 of LED chip group is supported, manpower can be saved.Of course, the support member 24 in the present embodiment also may be used with pcb board 61
With independent, when to arrange LED chip group on pcb board 61, can first securing supports 24 on pcb board 61, then by LED
Chipset is arranged on the surface of pcb board 61 by support member 24.
In the present embodiment, in order to protect LED chip group, can also include in the component of pcb board 61 that the present embodiment is provided
Translucent cover, that is to say can be in the present embodiment pcb board 61 on translucent cover is installed, for by LED chip group and metallic region
Shade together, for example, the translucent cover in the present embodiment can be soft light cover, the harder direct projection that can be sent LED chip group
Light changes into soft scattered light, can play a part of softening intense light, can further improve the experience of user.
Certainly the objective metal layer in the present embodiment can be specifically layers of copper, then corresponding metallic region can be metal
The region that copper is formed.
The board unit that the present embodiment is provided, can improve the utilization rate that luminescence unit emits beam, and reduce the damage of light
Lose, further enhancing flash effect, improve the satisfaction of Consumer's Experience.
Embodiment three
The present embodiment provides a kind of terminal, and the terminal that the present embodiment is provided is illustrated with reference to Fig. 7 and Fig. 8, wraps
Shell is included, and is installed in the display module in shell, camera assembly, flash component and the above-mentioned board unit of any one
Substrate.
Flash component in the present embodiment includes being arranged on the luminous of substrate surface in above-mentioned any one board unit
Unit and objective metal layer, wherein objective metal layer have the exposed metallic region in substrate surface；Shell in the present embodiment
Including fore shell and back cover.Fore shell 72 has the exposed hollow region in the viewing area of display module 71, specifically can join
As shown in Figure 7, back cover 83 has the exposed hollow region in output optical zone domain of flash component 82, and by camera assembly 81
The exposed hollow region of view area, specifically may refer to shown in Fig. 8, wherein, substrate in terminal inner, so figure
7th, it is not shown in Fig. 8.The output optical zone domain of flash component 82 includes the light-emitting zone and metallic region of luminescence unit.
It should be noted that the size of the hollow region that fore shell 72 has can be naked according to display module 71 in the present embodiment
Expose outside part size arranging, likewise, the size of two hollow regions that the present embodiment back cover 83 has can also divide
It is not exposed in the size of outer portion and the view area of camera assembly 81 is naked is exposed on the external according to the output optical zone domain of flash component 82
Point size arranging.
Display module 71 in the present embodiment can include display floater, wherein it is possible to pass through using various liquid crystal displays
Configuring display floater, the camera assembly 81 in the present embodiment includes photographic head to the forms such as device, light emitting diode, and user can lead to
Crossing the photographic head of terminal carries out shooting of finding a view.
The terminal that the present embodiment is provided, when the situation in dim light, can pass through the luminescence unit in flash component
To shooting process light filling, due to the light that luminescence unit sends it is most of exposed in substrate table all by the objective metal layer of substrate
The metallic region in face is reflected to user, therefore the light that can be sent from luminescence unit in largely reduction flash component
Loss, the satisfaction of Consumer's Experience can be lifted.
Example IV
The present embodiment provides a kind of manufacture method of board unit, specifically may refer to shown in Fig. 9, including：
S901：Make the substrate of multiple structure.
It should be appreciated that the multiple structure of the substrate in the present embodiment includes objective metal layer and line layer, wherein
Objective metal layer has exposed metallic region on the surface of the substrate, and specific manufacture method can be：Making multiple structure
During reserved target metal level some surface regions, enable the surface region exposed on the surface of the substrate as metal
Region, it should be appreciated that can be exposed on the surface of the substrate as metallic region using the whole surface region of objective metal layer,
Can also reserved target metal level portion surface area, make the exposed conduct on the surface of the substrate in this reserved portion surface area
Metallic region；Or some surface districts of objective metal layer can be made to lead to overetched mode after multiple structure completes
Domain is exposed on the surface of the substrate as metallic region, accordingly, can make the whole table of objective metal layer to lead to overetched mode
Face region is exposed on the surface of the substrate as metallic region, it is also possible to which leading to overetched mode makes the part surface of objective metal layer
Region is exposed on the surface of the substrate as metallic region.
Here, need to illustrate the etching mode of multiple structure, can be with multiple structure in the present embodiment
After the completion of substrate manufacture, the material of substrate surface is removed by using chemical reaction or physical shock, make objective metal layer
Some surface regions energy are exposed on a surface of a substrate.
S902：The position being adapted with metallic region on the surface of the substrate is installed by luminescence unit so that metallic region can
The light that luminescence unit sends is reflected.
Here, it should be noted that the shape of the substrate of the multiple structure made in the present embodiment can be arbitrary shape
Shape, can be the various regular shapes such as square, rectangle, parallelogram for example, or it is other various irregular
Shape.Moreover, it is to be understood that the objective metal layer in the present embodiment can have appointing in the substrate of multiple structure for this
Meaning layer of metal layer, it should be noted that the objective metal layer in the present embodiment can be layers of copper, or other metals
Layer.
It should be appreciated that the light-emitting zone of the luminescence unit in the present embodiment can or and substrate parallel with substrate surface
Surface is vertical, or at a certain angle with substrate surface shape, specifically can be according to actual application scenarios by developer's spirit
It is living to arrange.It should be noted that in the present embodiment, developer by the suitable luminescence unit of replacing, or can more change
Light unit realizes the conversion of light-emitting zone with the specific connected mode of substrate surface.
Certainly, luminescence unit can have various with the annexation of substrate surface in the present embodiment, for example, in the present embodiment
The plane that luminescence unit itself can be passed through installs the luminescence unit on the surface of the substrate, it is also possible to by luminescence unit
The point or line of itself installs the luminescence unit on the surface of the substrate.In addition, it should be noted that in the present embodiment
Objective metal layer can be same layer structure with line layer, and now objective metal layer has land and metallic region, certainly
, the objective metal layer in the present embodiment can also be located at below line layer, or can also be located at the top of line layer.Its
In, the shape of metallic region can be arbitrary shape in the present embodiment, can be circle, annular, square, length for example
The various regular shapes such as square, or it is other irregularly shaped, and in the present embodiment metallic region size
Can also flexibly be arranged according to actual application scenarios by developer.
However, it should be understood that in the present embodiment, luminescence unit can be arranged in substrate surface metallic region,
Luminescence unit can also be arranged on outside the metallic region of substrate surface, the specific installation site of luminescence unit can be by exploit person
Member determines according to the position of actual application scenarios or metallic region and size.Below, it is single to lighting in the present embodiment
Unit illustrates with the set location of metallic region, for example, metallic region can be arranged on into the lower section of luminescence unit and be extended
Go out outside luminescence unit institute overlay area；Or, metallic region is centered around into luminescence unit surrounding, metallic region forms closed loop；
Or, metallic region is positioned adjacent to into the one side or surface of luminescence unit.
Of course, luminescence unit there can also be other modes with the set-up mode of metallic region in the present embodiment, for example,
Luminescence unit and metallic region can be separately positioned on the adjacently situated surfaces of substrate, if meet the set location of metallic region with
The light-emitting zone of luminescence unit is adapted.
It should be appreciated that the luminescence unit in the present embodiment can be that (Light Emitting Diode's LED light
Diode) chipset, wherein, LED chip group includes at least one LED chip, of courses, the luminescence unit in the present embodiment
Light emitting package body or luminous pedestal are can also be, for example, it may be LED package or LED base, of course, LED encapsulation
Body can be surface mount LED, or pinned LED.
Furthermore, it is necessary to explanation, in the present embodiment, can be arranged on substrate table by luminescence unit by support member
Face, wherein, the support member in the present embodiment can be common connector, for support chain luminescence unit, for example, this enforcement
Support member in example can be support base, support column, elasticity bolt etc..Of course, in the present embodiment, can be by luminous list
Unit is directly welded on support member；Can also be by luminescence unit by elasticity bolt or other mechanical connection manners and support
Part is connected, and the electric connection of luminescence unit and line layer now can be realized by external circuit.
It should be noted that the support member in the present embodiment can be structure as a whole with substrate, namely support member and substrate
It is an entirety, so, easily facilitates modularized production, productivity ratio is improved, when to arrange luminescence unit on substrate, so that it may
So that directly luminescence unit is fixed on support member, without arranging on substrate the support that can support luminescence unit again
Part, can save manpower.Of course, the support member in the present embodiment and substrate can also be independent, when arranging on substrate
During luminescence unit, can first securing supports on substrate, then luminescence unit is arranged on into substrate surface by support member.
In the present embodiment, in order to protect luminescence unit, can be with the board unit manufacture method that the present embodiment is provided
It is included on substrate and translucent cover is installed, for by luminescence unit and metallic region together shade, wherein, it is transparent in the present embodiment
Cover can be soft light cover, the harder direct light that luminescence unit sends can be changed into into soft scattered light, can play soft
Change the effect of intense light, can further improve the experience of user.
The board unit manufacture method that the present embodiment is provided, the light that can be sent to luminescence unit by metallic region is carried out
Reflection, improves the utilization rate that luminescence unit emits beam, and reduces the loss of light, further enhancing flash effect, is lifted
The satisfaction of Consumer's Experience.
It should be noted that herein, term " including ", "comprising" or its any other variant are intended to non-row
His property is included, so that a series of process, method, article or device including key elements not only include those key elements, and
And also include other key elements being not expressly set out, or also include for this process, method, article or device institute inherently
Key element.In the absence of more restrictions, the key element for being limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
Also there is other identical element in the process of key element, method, article or device.
The embodiments of the present invention are for illustration only, do not represent the quality of embodiment.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can add the mode of required general hardware platform to realize by software, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on such understanding, technical scheme is substantially done to prior art in other words
Going out the part of contribution can be embodied in the form of software product, and the computer software product is stored in a storage medium
In (such as ROM/RAM, magnetic disc, CD), including some instructions are used so that a station terminal equipment (can be mobile phone, computer takes
Business device, air-conditioner, or network equipment etc.) perform method described in each embodiment of the invention.
Embodiments of the invention are described above in conjunction with accompanying drawing, but be the invention is not limited in above-mentioned concrete
Embodiment, above-mentioned specific embodiment is only schematic, rather than restricted, one of ordinary skill in the art
Under the enlightenment of the present invention, in the case of without departing from present inventive concept and scope of the claimed protection, can also make a lot
Form, these are belonged within the protection of the present invention.
Claims (10)
1. a kind of board unit, it is characterised in that include：Substrate, and it is arranged on the luminescence unit of the substrate surface；It is described
Substrate includes multiple structure, and the multiple structure includes objective metal layer and line layer, and the objective metal layer has exposed
Metallic region on the substrate surface；The luminescence unit is electrically connected with the line layer, and in the circuit
Light under the exciting of layer；The position of the metallic region is adapted with the light-emitting zone of the luminescence unit, for described
The light that light unit sends is reflected.
2. board unit as claimed in claim 1, it is characterised in that the metallic region is located at the lower section of the luminescence unit
And extend outside luminescence unit institute overlay area；
Or, the metallic region surrounds the luminescence unit surrounding, and the metallic region forms closed loop；
Or, one side or surface of the metallic region adjacent to the luminescence unit.
3. board unit as claimed in claim 1, it is characterised in that the luminescence unit includes LED chip group, the LED
Chipset includes at least one LED chip.
4. board unit as claimed in claim 1, it is characterised in that also including support member, the luminescence unit is by described
Support member is arranged on the substrate surface.
5. board unit as claimed in claim 4, it is characterised in that the support member is structure as a whole with the substrate.
6. board unit as claimed in claim 1, it is characterised in that also include：Translucent cover, the translucent cover is installed on described
On substrate, and for by the luminescence unit and the metallic region together shade.
7. board unit as claimed in claim 1, it is characterised in that the substrate includes pcb board.
8. the board unit as described in any one of claim 1-7, it is characterised in that the objective metal layer and the line layer
For same layer structure, the objective metal layer has land and the metallic region.
9. a kind of terminal, it is characterised in that including shell, and be installed on the display module in the shell, camera assembly, sudden strain of a muscle
Substrate in optical assembly and the board unit as described in any one of claim 1-8, the flash component includes any one of 1-8 institute
The luminescence unit and objective metal layer that are arranged on the substrate surface in the board unit stated, the objective metal layer has naked
The metallic region being exposed on the substrate surface；The shell includes fore shell and back cover, and the fore shell has the display group
The exposed hollow region in viewing area of part；The back cover has the output optical zone domain of flash component is exposed hollow
Region, and by the exposed hollow region of the view area of the camera assembly；The output optical zone domain bag of the flash component
Include the light-emitting zone and metallic region of luminescence unit in the board unit.
10. a kind of manufacture method of board unit, it is characterised in that include：
The substrate of multiple structure is made, the multiple structure includes objective metal layer and line layer, making the multilamellar knot
During structure reserve the objective metal layer some surface regions can it is exposed on the substrate surface as institute
Stating metallic region, or lead to overetched mode after the multiple structure completes makes some tables of the objective metal layer
Face region it is exposed on the substrate surface as the metallic region；
The position being adapted with the metallic region on the substrate surface is installed by luminescence unit so that the metallic region energy
It is enough that the light that the luminescence unit sends is reflected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610974085.2A CN106572213A (en) | 2016-10-28 | 2016-10-28 | Terminal, substrate assembly and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610974085.2A CN106572213A (en) | 2016-10-28 | 2016-10-28 | Terminal, substrate assembly and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106572213A true CN106572213A (en) | 2017-04-19 |
Family
ID=58539970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610974085.2A Pending CN106572213A (en) | 2016-10-28 | 2016-10-28 | Terminal, substrate assembly and manufacturing method thereof |
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| Country | Link |
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| CN (1) | CN106572213A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653787A (en) * | 2016-11-21 | 2017-05-10 | 努比亚技术有限公司 | Substrate assembly and terminal |
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| CN201739793U (en) * | 2009-11-18 | 2011-02-09 | 王默文 | LED lamp |
| CN202404341U (en) * | 2011-11-14 | 2012-08-29 | 叶仰山 | Flash lamp structure of camera module of hand-held electronic device |
| CN103401967A (en) * | 2013-08-09 | 2013-11-20 | 上海华勤通讯技术有限公司 | Mobile terminal and touch screen thereof |
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| US20070145401A1 (en) * | 2005-12-27 | 2007-06-28 | Sharp Kabushiki Kaisha | Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device |
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