CN106568411B - A kind of tin film thickness test method based on different surfaces difference in height - Google Patents
A kind of tin film thickness test method based on different surfaces difference in height Download PDFInfo
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- CN106568411B CN106568411B CN201610996570.XA CN201610996570A CN106568411B CN 106568411 B CN106568411 B CN 106568411B CN 201610996570 A CN201610996570 A CN 201610996570A CN 106568411 B CN106568411 B CN 106568411B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
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Abstract
A kind of tin film thickness test method based on different surfaces difference in height, belongs to metal material micro-force sensing field.Before tin film deposition, the regional area on metal substrate surface to be deposited places coating, in tin film deposition process, the region completes without tin deposition, deposition and takes coating away, metal substrate occurs and exposes area, the area edge forms tin film surface and exposes the difference in height of metal substrate surface, i.e. tin film thickness.On this basis, cover the profile for having above-mentioned difference in height position with probe-type contourgraph test sample surface, when probe slips over above-mentioned difference in height, can move downward, the distance moved downward is tin film thickness.Then, different parts tin film thickness is calculated according to respective profile image, then takes arithmetic average, be the tin film thickness that the present invention measures.The high-acruracy survey of tin film thickness in any metal substrate can be achieved in the present invention, and technique is relatively simple, at low cost, can effectively solve Current electronic manufacture in tin film thickness precise measurement there are the problem of.
Description
Technical field
The invention belongs to metal material micro-force sensing fields, are related to a kind of tin film thickness test based on different surfaces difference in height
Method.
Background technique
Currently, in the encapsulation at different levels inside electronic product, mainly pass through solder connection, thermocompression bonding, ultrasonic bond etc.
Technology realizes the interconnection of different components.It is completed under miniature scale in view of these interconnection techniques, thus is referred to as micro-force sensing
Technology.Wherein, due to low cost, high reliability the features such as, solder attachment technique is most widely used.Even, in very big model
In enclosing, solder connection is the connection method of unique feasible during Electronic products manufacturing.The typical case of solder connection in electronic product
Structure be metal substrate/solder layer/metal substrate, be higher than solder layer fusing point and lower than metal substrate fusing point at a temperature of, liquid
Metal substrate is soaked, fills gap and interfacial reaction formation intermetallic compound occurs with metal substrate by state solder, thus real
Now connect.After the completion of connection, the solder joint of formation can realize the electrical connection and mechanical connection of each inter-module.
Metallic tin due to have it is non-toxic, at low cost, be easily obtained, wetability is good under fusing point lower (232 DEG C) and liquid
The features such as good, becomes the preferred material of solder layer in solder connection.Correspondingly, metal substrate Chang Weitong, silver, gold, nickel, in cobalt
It is one or more of.Under electronic manufacture micro-force sensing scale, the thickness of required tin solder layer is only micron order.Therefore, connect as solder
The important step connect often needs tin solder layer depositing to metal substrate surface before proceeding.Clearly for what is deposited
Tin film, thickness are answered precisely controlled, this is because being directed to the tin film of micron order thickness, the difference of thickness will lead to be formed
The performance of solder joint has very big difference, if actual deposition thickness and expected thickness have relatively large deviation, is obtained after the completion of connection
The performance of solder joint relatively large deviation can occur with expection, seriously affect Quality of electronic products.Make the thickness for depositing tin film by essence
Really control, need to accurately know the deposition rate of tin film under certain deposition parameter, and this requires for certain under this deposition parameter
The thickness of tin film obtained by sedimentation time carries out precise measurement.
Currently, mainly there are timing liquid flow method, drop thickness measuring method, weighing method, magnetic survey for the measurement method of film thickness
Thick method, vortex thickness measuring method, x-ray method, ellipsometry method and metallography.But for the essence of tin film thickness in electronic manufacture
There is limitation in really measurement, the above method.Wherein, timing liquid flow method, drop thickness measuring method are both needed to the film surface change that detects by an unaided eye
Change to judge Film Fractionation terminal, and then calculate film thickness, therefore often there is large error.Weight method is heavy by measurement film
The variation of product front and back sample mass determines film quality, and then calculates film thickness.For the tin film of micron order thickness, quality is very
It is small, it is difficult to precise measurement be carried out by weight method, and be highly prone to external environmental interference in measurement process and lead to large error.
Magnetic gaugemeter method is for measuring nonmagnetic film thickness in magnetic matrix, although tin film is nonmagnetic, when metal substrate (such as copper,
Silver) when not having magnetism, the method cannot measure.Eddy current test method mainly measures non-on nonmagnetic conductive metallic matrix lead
The thickness of conductive film on the thickness or non-conductive matrix of conductive film.However, tin film and metal substrate are provided with electric conductivity, therefore should
Method can not measure the thickness of tin film in metal substrate.When X-ray ga(u)ging method measures tin film thickness, if the atomic number of metal substrate
Number is close (as silver-colored, 47) with the atomic number (50) of tin, then measuring accuracy can decline to a great extent, and the equipment that this method uses is made
Valence is high, and X-ray also can generate injury to human body.When ellipsometer method tests tin film thickness, the microrelief of tin film surface can be made
Difficulty is collected at optical path, and then measuring accuracy is caused to decline.Tin film thickness is tested for metallography, is needed first to sample section
It inlayed, ground respectively, polishing treatment, and the Mohs' hardness of tin is only 1.5, ten sub-primes are soft, in grinding and polishing process,
Tin film is highly prone to damage, and causes tin film in metallographic section to have defect, and then influence test result.Obviously, metallography microscope is utilized
Method tests tin film thickness, not only complex procedures, and the success rate for preparing sample is low, past to prepare qualified metallographic section
It is taken a significant amount of time toward needs.But it is more intuitive in view of metallography, using the method as arbitration in the embodiment of the present invention
Method, to judge test result accuracy.
In view of the above-mentioned problems, need to develop it is a kind of can in any metal substrate of high-acruracy survey tin film thickness method.This
Invention a kind of tin film thickness test method based on different surfaces difference in height is provided, can to tin film thickness in any metal substrate into
Row high-acruracy survey, and technique is relatively simple, economic cost is low, will not cause harm to the human body.This method is opened in tin film deposition
Coating is placed in metal substrate face regional area to be deposited before beginning, coated region in tin film deposition process is caused not have
Tin deposition, after deposition is completed and takes coating away, this region can expose metal substrate, will form tin film in this edges of regions
Surface and the difference in height for exposing metal substrate surface, i.e. tin film thickness.After this, being covered using probe-type contourgraph measurement is had
The sample surface profiles of above-mentioned difference in height obtain respective profile image, can be calculated the difference in height according to image.It should be noted that
It is to expose the formation in area for metal substrate, chemical dissolution method, pressure breaking method, mask method are also the method being contemplated that.So
And tin residual will cause using chemical dissolution method, and then influence measuring accuracy.When using pressure breaking method, optional equipment pressure is needed
Power device increases cost and easily scratches metal substrate surface after pressing scratches tin film, equally will affect measuring accuracy.Separately
Outside, sufficiently complex and at high cost using the technique of mask method.Therefore, it is used in the present invention preparatory in metal substrate face to be deposited
The method for placing coating formed substrate expose area have many advantages, such as it is simple, economy, work well.
Summary of the invention
The tin film thickness test method based on different surfaces difference in height that it is an object of that present invention to provide a kind of.Start in tin film
Before deposition, coating is placed in metal substrate face regional area to be deposited, after this treatment, the region Wuxi during the deposition process
Film deposits, and after the completion of deposition, coating is taken away, which becomes metal substrate and expose area, will form in this edges of regions
Tin film surface and the difference in height for exposing metal substrate surface, i.e. tin film thickness.To guarantee follow-up test precision, coating is taken away
Afterwards, the metal substrate surface of exposing should not have other materials residual, therefore need to selectively clean to the region.
After localized metallic substrate exposing area is formed, the probe of contourgraph is placed in tin film surface, and set sliding distance.It needs
It should be noted that the form that tin film deposition is stacked gradually with tin crystal grain is completed, thus tin film surface is microcosmic there is also by a small margin
It is uneven.After starting contourgraph, probe is gently slided along tin film surface, and the microcosmic injustice of tin film surface can make probe in the same of sliding
Shi Fasheng moves up and down accordingly, when probe, which slips over metal substrate, exposes area edge, can be moved by a relatively large margin downwards, to
The distance of lower movement is exactly tin film surface and the difference in height for exposing metal substrate surface formation, i.e. tin film thickness.Then, probe meeting
Continue to slide along metal substrate surface, until reaching preset sliding distance.Obviously, probe motion track, which can be reflected, slips over position
The surface profile of upper sample.The displacement sensor of contourgraph exports corresponding electric signal according to probe motion situation, and electric signal is through one
After series of processes, the surface profile for slipping over sample on position will be shown, according to contour images, by the metal substrate of exposing
Surface is thought of as datum level, calculates the difference in height that can just obtain slipping over tin film surface and the metal substrate surface of exposing in position,
That is tin film thickness.
1. a kind of tin film thickness test method based on different surfaces difference in height, it is characterised in that the following steps are included:
Step 1: a kind of metal is provided as substrate；
Step 2: a face of selected metal substrate is used as to tin film depositional plane, is treated depositional plane and is surface-treated；
Step 3: the regional area in metal substrate face to be deposited places coating, then carries out tin film deposition；
Step 4: after tin film deposits, set coating is taken away, sample surfaces metal substrate occur and expose area；
Step 5: for formation metal substrate expose area, be dried again after cleaning or without being cleaned,
It is dried；
Step 6；Contourgraph probe is placed in tin film surface, sliding distance is set, starts contourgraph, probe starts to slide,
It when probe, which slips over metal substrate, exposes area edge, can move downward, then continue along the metal substrate surface sliding exposed, directly
Terminate to sliding；
Step 7；After probe slides, the surface profile image of sample is obtained, according to image, it is sliding that probe is calculated
It crosses tin film surface and metal substrate in position and exposes area's surface height difference, i.e. tin film thickness.
2. further, tin film deposition is carried out using one of plating, chemical plating, vapor deposition method.
3. further, if tin film is using plating, chemical plating method deposition, after placing coating, plating solution during the deposition process
Coated region can not be penetrated into, if tin film is deposited using vapor deposition method, coating should be able to be subjected to the height not less than 150 DEG C
Temperature.
4. further, if tin film is deposited using electro-plating method, and coating is insulating materials, then metal substrate face to be deposited
Coated region shape is equilateral triangle, and square is round, one kind of regular hexagon.
5. further, the tin film thickness is micron order.
6. further, the regional area area is no more than the 50% of the metal substrate face gross area to be deposited.
7. further, shape, the size of the coating should be with capped metal substrate face regional areas one to be deposited
It causes.
8. further, after coating is taken away, if the metal substrate surface exposed has glue residua, needing to clean removing residual glue
Fall, then be dried, if the metal substrate surface exposed without glue residua, is not necessarily to cleaning at this time, is dried.
9. further, the probe sliding is carried out in different location；Difference is calculated respectively according to different location contour images
Position tin film surface and metal substrate expose the difference in height on area surface, i.e. different location tin film thickness, then take arithmetic average, just
It is the tin film thickness measured.
10. further, the obtained sample surface profiles image should be the surface profile that probe slips over sample on position
Image often completes primary sliding in a position, will obtain an image.
The technical solution adopted by the invention is as follows:
A kind of tin film thickness test method based on different surfaces difference in height, comprising the following steps:
Step 1: a kind of metal is provided as substrate；The metal is preferably copper foil, silver foil piece, nickel foil piece, goldleaf
One of piece, cobalt paillon；
Step 2: for the metal substrate chosen in step 1, selecting a face, as to tin film depositional plane, to guarantee
Its flatness, cleannes are surface-treated the face；The surface treatment method is preferably successively ground, is polished, clearly
It washes, cold wind drying；
Step 3: after step 2 is handled, first the regional area in metal substrate face to be deposited places coating, then carries out
Tin film deposition；
For the regional area, position is preferably the middle part in face to be deposited, and area is preferably that face to be deposited is total
The 30% of area is preferably shaped to equilateral triangle, square, round, one of regular hexagon；
If in tin film deposition process, substrate face to be deposited needs to immerse in liquid, then the coating of the placement is preferably
Adhesive waterproof tape, and should closely be pasted with institute overlay area, if in tin film deposition process, substrate face to be deposited is not necessarily to immerse liquid,
Then the coating of the placement is preferably one of sheet glass, silicon wafer；
For the coating, size should be consistent with face coated region to be deposited, and the purpose for placing coating is
Prevent substrate coated region from having tin deposition in tin film deposition process；
For the tin film, with a thickness of micron order, deposition method be preferably plating, chemical plating, sputtering, vapor deposition, from
One of son plating；Step 4: after the completion of tin film deposition, set coating is taken away, metal substrate exposing occur in sample surfaces
Area, the edges of regions form the difference in height for exposing metal substrate surface and tin film surface, i.e. tin film thickness；
Described should be avoided when taking coating away causes to damage to periphery tin film, takes method away and is preferably gently pressed from both sides with tweezers
Firmly coating is slowly removed；
Step 5: area surface is exposed for the metal substrate of formation, is dried again after cleaning or without carrying out
Cleaning is dried；
It is described needs or without being cleaned, being dried, reason is after taking coating away, the metal liner of exposing
Bottom surface has glue residua sometimes, to avoid influencing testing precision, need to wash removing residual glue, then be dried, and
Sometimes glue residua is not had, at this time without cleaning, drying process；
The cleaning method is preferably successively cleaned in acetone, ethanol analysis are pure；The drying means is preferably
Cold wind drying；
Step 6: being placed in tin film surface for contourgraph probe, sets sliding distance, probe is first along tin film after contourgraph starting
Surface sliding, when slipping over metal substrate exposed area edge, probe can be moved downward, and then be continued along the metal substrate exposed
Surface sliding, until reaching preset sliding distance, probe stops sliding；
The contourgraph probe should be vertically disposed at tin film surface, it is preferable that probe is placed in metal substrate and exposes area edge
Neighbouring tin film surface；
The probe sliding should be carried out in sample surfaces different location, and these positions should be able to represent different parts tin film thickness
Degree, quantity is preferably 3~4；
The sliding distance of the setting, it should be ensured that probe can slip over metal substrate and expose area edge；
The probe moves downward, and moves downward the difference in height for the metal substrate surface that distance is tin film surface and exposing,
That is tin film thickness；
Step 7: after step 6, different location sample surface profiles are shown in a coordinate system, according to respective wheel
The metal substrate surface of exposing is thought of as datum level by wide image, can be calculated each position tin film surface and metal substrate is exposed
The difference in height on area surface, i.e. tin film thickness calculate its arithmetic average then for obtained different location tin film thickness, should
Average value is just the tin film thickness measured；
It, need to be before tin film deposits in metal substrate face part to be deposited for tin film thickness test method proposed by the present invention
Coating is placed in region, and after the completion of tin film deposits, which becomes metal substrate and expose area, which forms tin film surface
With the difference in height for exposing metal substrate surface, i.e. tin film thickness, this process have the characteristics that it is simple, economy, work well.Gold
After category substrate exposing area is formed, the sample surface profiles comprising being formed difference in height are surveyed using probe-type contourgraph
Amount, and then obtain tin film thickness.The high-acruracy survey of tin film thickness in any metal substrate can be achieved in the present invention, and technique is more
Simply, at low cost, it is harmless.Obviously, the present invention can effectively solve tin film thickness precise measurement institute in Current electronic manufacture
There are the problem of.
Detailed description of the invention
Fig. 1 a~1e: coating schematic diagram is placed in metal substrate Middle face region to be deposited in the embodiment of the present invention；
Fig. 2: there is the sectional schematic diagram behind metal substrate exposing area in sample surfaces in the embodiment of the present invention；
Fig. 3: contourgraph probe is placed in metal substrate exposing area edge tin film surface schematic diagram nearby in the embodiment of the present invention；
Fig. 4 a~4e: middle probe sliding position schematic diagram of the embodiment of the present invention；
Fig. 5 a~5c: sample different location surface profile in the embodiment of the present invention 1；
Fig. 6: the metallographic section of tin film in the embodiment of the present invention 1；
Fig. 7 a~7d: sample different location surface profile in the embodiment of the present invention 2；
Fig. 8: the metallographic section of tin film in the embodiment of the present invention 2；
Fig. 9 a~9d: sample different location surface profile in the embodiment of the present invention 3；
Figure 10: the metallographic section of tin film in the embodiment of the present invention 3；
Figure 11 a~11d: sample different location surface profile in inventive embodiments 4；
Figure 12: the metallographic section of tin film in the embodiment of the present invention 4；
Figure 13 a~13c: sample different location surface profile in the embodiment of the present invention 5；
Figure 14: the metallographic section of tin film in the embodiment of the present invention 5；
Description of symbols:
1-copper foil；2-adhesive waterproof tapes；3-nickel foil pieces；4-silver foil pieces；5-silicon wafers；
6-gold foils；7-sheet glass；8-cobalt paillons；9-metal substrates；10-tin films；
11-metal substrates expose area；12-tin film surfaces and exposing metal substrate surface difference in height；
13-contourgraph probes；14-copper substrates expose area；15-nickel substrates expose area；
16-silver-colored substrates expose area；17-golden substrates expose area: 18-cobalt substrates expose area
Specific embodiment
Below with reference to specific drawings and examples, the invention will be further described.
Embodiment 1:
A kind of tin film thickness test method based on different surfaces difference in height of the present invention can be realized by following steps:
(1) provide copper foil as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm,1mm；
(2) it selectes the surface that a length and width is respectively 10mm, 10mm to be used as to tin film depositional plane, copper foil be carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream to its face to be deposited carry out grinding and
Mechanical polishing processing, will be inlayed using acetone after grinding and polishing and impregnate with resin, be taken out copper foil, be cleaned with deionized water,
Subsequent cold wind drying, obtains that face to be deposited is smooth, clean copper foil；
It (3) is 30mm prior to one area of Middle face to be deposited before tin film starts deposition2Equilateral triangle region paste it is anti-
Glue band is as coating, as shown in Figure 1a, then carries out tin film deposition using electric plating method；It should be noted that should incite somebody to action
Adhesive waterproof tape is cut out to consistent with equilateral triangle area size, and adhesive waterproof tape should closely be pasted with face to be deposited, purpose
Being to prevent in electroplating process plating solution to penetrate into the region makes the region locally have tin deposition, and then avoids test result by shadow
It rings；
(4) after the completion of being electroplated, adhesive waterproof tape is gently clamped with tweezers, is slowly removed it, copper substrate occur in sample surfaces
Expose area, which forms tin film surface and copper substrate exposes the difference in height on area surface, at this time sample section such as Fig. 2 institute
Show；
(5) cleaned out for copper substrate is exposed remaining glue in area, successively with acetone, ethanol analysis it is pure to the region into
Row cleaning, then carries out cold wind drying to the region；
(6) contourgraph probe is vertically disposed at the tin film surface near copper substrate exposing area edge, sees Fig. 3, setting is slided
Dynamic distance is 450 μm, and probe sliding carries out respectively according to position shown in Fig. 4 a；
(7) after the completion of probe sliding, the surface profile of position 1., 2., 3. is obtained, respectively as shown in Fig. 5 a, 5b, 5c, according to
According to contour images, the brass bottom surface of exposing is thought of as datum level, calculating out position, 1., 2., 3. place's tin film thickness is respectively
2.05 μm, 2.01 μm, 2.01 μm calculate its arithmetic average, obtain tin film thickness for obtained different location tin film thickness
It is 2.02 μm；
In view of metallography is more intuitive, sample tin film thickness is tested using metallography, by metallographic
The result that microscopy measures is as standard, to judge the tin film thickness accuracy that the present embodiment measures.The metallographic section of tin film, such as
Shown in Fig. 6, section different location tin film thickness is measured, obtaining average thickness is 2.04 μm.It follows that the present embodiment
The tin film thickness measured, compared with the tin film thickness that metallography obtains, deviation ratio is only 0.98%.
Embodiment 2:
A kind of tin film thickness test method based on different surfaces difference in height of the present invention can be realized by following steps:
(1) provide nickel foil piece as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm,1mm；
(2) it selectes the surface that a length and width is respectively 10mm, 10mm to be used as to tin film depositional plane, nickel foil piece be carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream to its face to be deposited carry out grinding and
Mechanical polishing processing, will be inlayed using acetone after grinding and polishing and impregnate with resin, be taken out nickel foil piece, be cleaned with deionized water,
Subsequent cold wind drying, obtains that face to be deposited is smooth, clean nickel foil piece；
It (3) is 30mm prior to one area of Middle face to be deposited before tin film starts deposition2Square area paste marine glue
Band is used as coating, as shown in Figure 1 b, then carries out tin film deposition using the method for chemical plating；It should be noted that should will prevent
Water adhesive tape cutting is extremely consistent with square region domain sizes, and adhesive waterproof tape should closely be pasted with face to be deposited, and its object is to anti-
Only plating solution penetrates into the region region is made locally to have a tin deposition in plating process, and then can avoid test result and be affected；
(4) after the completion of chemical plating, adhesive waterproof tape is gently clamped with tweezers, is slowly removed it, nickel lining occur in sample surfaces
Bottom exposing area, which forms tin film surface and nickel substrate exposes the difference in height on area surface, at this time sample section such as Fig. 2
It is shown；
(5) cleaned out for nickel substrate is exposed remaining glue in area, successively with acetone, ethanol analysis it is pure to the region into
Row cleaning, then carries out cold wind drying to the region；
(6) contourgraph probe is vertically disposed at the tin film surface near nickel substrate exposing area edge, sees Fig. 3, setting is slided
Dynamic distance is 550 μm, and probe sliding carries out respectively according to position shown in Fig. 4 b；
(7) after the completion of probe sliding, the surface profile of position 1., 2., 3., 4. is obtained, respectively such as Fig. 7 a, 7b, 7c, 7d institute
Show, according to contour images, the nickel substrate surface of exposing be thought of as datum level, calculate out position 1., 2., 3., 4. locate tin film thickness
Respectively 4.02 μm of degree, 4.02 μm, 3.98 μm, 4.00 μm calculate its arithmetic mean for obtained different location tin film thickness
Value, obtaining tin film thickness is 4.01 μm；
In view of metallography is more intuitive, sample tin film thickness is tested using metallography, by metallographic
Microscopy measures result as standard, to judge the tin film thickness accuracy that the present embodiment measures.The metallographic section of tin film is such as schemed
Shown in 8, section different location tin film thickness is measured, obtaining average thickness is 4.05 μm.It follows that the present embodiment is surveyed
The tin film thickness obtained, compared with the tin film thickness that metallography obtains, deviation ratio is only 0.99%.
Embodiment 3:
A kind of tin film thickness test method based on different surfaces difference in height of the present invention can be realized by following steps:
(1) provide silver foil piece as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm,1mm；
(2) it selectes the surface that a length and width is respectively 10mm, 10mm to be used as to tin film depositional plane, silver foil piece be carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream to its face to be deposited carry out grinding and
Mechanical polishing processing, will be inlayed using acetone after grinding and polishing and impregnate with resin, be taken out silver foil piece, be cleaned with deionized water,
Subsequent cold wind drying, obtains that face to be deposited is smooth, clean silver foil piece；
It (3) is 30mm prior to one area of Middle face to be deposited before tin film starts deposition2Border circular areas place a silicon wafer make
Tin film deposition then is carried out using the method for sputtering as illustrated in figure 1 c for coating；It should be noted that silicon wafer should be cut out
It is extremely consistent with circular region size；
(4) after the completion of sputtering, silicon wafer is gently clamped with tweezers, is slowly removed it, sample surfaces silver-colored substrate occur and expose
Area, which forms tin film surface and silver-colored substrate exposes the difference in height on area surface, and sample section is as shown in Figure 2 at this time；
(5) contourgraph probe is vertically disposed at the tin film surface near silver-colored substrate exposing area edge, sees Fig. 3, setting is slided
Dynamic distance is 600 μm, and probe sliding carries out respectively according to position shown in Fig. 4 c；
(6) after the completion of probe sliding, the surface profile of position 1., 2., 3., 4. is obtained, respectively such as Fig. 9 a, 9b, 9c, 9d institute
Show, according to contour images, the silver-colored substrate surface of exposing be thought of as datum level, calculate out position 1., 2., 3., 4. locate tin film thickness
Degree is 6.00 μm, and then obtaining tin film thickness is 6.00 μm；
In view of metallography is more intuitive, sample tin film thickness is tested using metallography, by metallographic
Microscopy measures result as standard, to judge the tin film thickness accuracy that the present embodiment measures.The metallographic section of tin film is such as schemed
Shown in 10, section different location tin film thickness is measured, obtaining average thickness is 6.04 μm.It follows that the present embodiment
The tin film thickness measured, compared with the tin film thickness that metallography obtains, deviation ratio is only 0.66%.
Embodiment 4:
A kind of tin film thickness test method based on different surfaces difference in height of the present invention can be realized by following steps:
(1) provide gold foil as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm,1mm；
(2) it selectes the plane that a length and width is respectively 10mm, 10mm to be used as to tin film depositional plane, gold foil be carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream to its face to be deposited carry out grinding and
Mechanical polishing processing, will be inlayed using acetone after grinding and polishing and impregnate with resin, be taken out gold foil, be cleaned with deionized water,
Subsequent cold wind drying, obtains that face to be deposited is smooth, clean gold foil；
It (3) is 30mm prior to one area of Middle face to be deposited before tin film starts deposition2Positive six border region place a glass
Piece is as coating, as shown in Figure 1 d, then carries out tin film deposition using the method for vapor deposition；It should be noted that should be by glass
Piece is cut out to consistent with regular hexagon area size；
(4) after the completion of being deposited, sheet glass is gently clamped with tweezers, is slowly removed it, sample surfaces go out cash substrate dew
Area out, which forms tin film surface and golden substrate exposes the difference in height on area surface, at this time sample section such as Fig. 2 institute
Show；
(5) contourgraph probe is vertically disposed at the tin film surface near golden substrate exposing area edge, sees Fig. 3, setting is slided
Dynamic distance is 450 μm, and probe sliding carries out respectively according to position shown in Fig. 4 d；
(6) probe sliding after the completion of, obtain the surface profile of position 1., 2., 3., 4., respectively as Figure 11 a, 11b, 11c,
Shown in 11d, according to contour images, the golden substrate surface of exposing is thought of as datum level, calculate out position 1., 2., 3., 4. locate tin
Film thickness is respectively 8.00 μm, 8.00 μm, 8.05 μm, 7.98 μm calculate it and count for obtained different location tin film thickness
Average value, obtaining tin film thickness is 8.01 μm；
In view of metallography is more intuitive, sample tin film thickness is tested using metallography, by metallographic
Microscopy measures result as standard, to judge the tin film thickness accuracy that the present embodiment measures.The metallographic section of tin film is such as schemed
Shown in 12, section different location tin film thickness is measured, obtaining average thickness is 8.07 μm.It follows that the present embodiment
The tin film thickness measured, compared with the tin film thickness that metallography obtains, deviation ratio is only 0.74%.
Embodiment 5:
A kind of tin film thickness test method based on different surfaces difference in height of the present invention can be realized by following steps:
(1) provide cobalt paillon as metal substrate, using wire cutting be cut into length be respectively 10mm,
10mm,1mm；
(2) it selectes the plane that a length and width is respectively 10mm, 10mm to be used as to tin film depositional plane, cobalt paillon be carried out cold
After inlaying, be utilized respectively 2000#, 3000# waterproof abrasive paper and 1 μm of granularity diamond polishing cream to its face to be deposited carry out grinding and
Mechanical polishing processing, will be inlayed using acetone after grinding and polishing and impregnate with resin, be taken out cobalt paillon, be cleaned with deionized water,
Subsequent cold wind drying, obtains that face to be deposited is smooth, clean cobalt paillon；
It (3) is 30mm prior to one area of Middle face to be deposited before tin film starts deposition2Equilateral triangle region place one
Silicon wafer is as coating, as shown in fig. le, then carries out tin film deposition using the method for ion plating；It should be noted that should incite somebody to action
Silicon wafer is cut out to consistent with equilateral triangle area size；
(4) after the completion of ion plating, silicon wafer is gently clamped with tweezers, is slowly removed it, cobalt substrate dew occur in sample surfaces
Area out, which forms tin film surface and cobalt substrate exposes the difference in height on area surface, at this time sample section such as Fig. 2 institute
Show；
(5) contourgraph probe is vertically disposed at the tin film surface near cobalt substrate exposing area edge, sees Fig. 3, setting is slided
Dynamic distance is 450 μm, and probe sliding carries out respectively according to position shown in Fig. 4 e；
(6) after the completion of probe sliding, the surface profile of position 1., 2., 3. is obtained, respectively as shown in Figure 13 a, 13b, 13c,
According to contour images, the cobalt substrate surface of exposing is thought of as datum level, calculating out position, 1., 2., 3. place's tin film thickness is distinguished
Its arithmetic average is calculated, tin is obtained for obtained different location tin film thickness for 10.01 μm, 10.00 μm, 10.00 μm
Film thickness is 10.00 μm；
In view of metallography is more intuitive, sample tin film thickness is tested using metallography, by metallographic
Microscopy measures result as standard, to judge the tin film thickness accuracy that the present embodiment measures.The metallographic section of tin film is such as schemed
Shown in 14, section different location tin film thickness is measured, obtaining average thickness is 9.94 μm.It follows that the present embodiment
The tin film thickness measured, compared with the tin film thickness that metallography obtains, deviation ratio is only 0.6%.
Embodiments above is that further detailed description of the invention, and it cannot be said that specific implementation of the invention
It is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, present inventive concept is not being departed from
Under the premise of principle, several deduction or replace can also be made, all shall be regarded as belonging to protection scope of the present invention.
Claims (7)
1. a kind of tin film thickness test method based on different surfaces difference in height, it is characterised in that the following steps are included:
Step 1: a kind of metal is provided as substrate；
Step 2: a face of selected metal substrate is used as to tin film depositional plane, is treated depositional plane and is surface-treated；
Step 3: the regional area in metal substrate face to be deposited places coating, then carries out tin film deposition；
Step 4: after tin film deposits, set coating is taken away, sample surfaces metal substrate occur and expose area；
Step 5: area is exposed for the metal substrate of formation, is dried again after cleaning or without being cleaned, being dried
Processing；
Step 6；Contourgraph probe is placed in tin film surface, sliding distance is set, starts contourgraph, probe starts to slide, and works as spy
It when needle slips over metal substrate exposing area edge, can move downward, then continue along the metal substrate surface sliding exposed, up to sliding
It is dynamic to terminate；
Step 7；After probe slides, the surface profile image of sample is obtained, according to image, probe is calculated and slips over portion
Tin film surface and metal substrate expose area's surface height difference, i.e. tin film thickness in position；
The regional area area is no more than the 50% of the metal substrate face gross area to be deposited；
The probe sliding is carried out in different location；According to different location contour images calculate respectively different location tin film surface with
Metal substrate exposes the difference in height on area surface, i.e. different location tin film thickness, then takes arithmetic average, the tin film thickness exactly measured
Degree；
The obtained sample surface profiles image should be the surface profile image that probe slips over sample on position, often in one
Primary sliding is completed in position, will obtain an image.
2. a kind of tin film thickness test method based on different surfaces difference in height according to claim 1, it is characterised in that:
The tin film deposition, is carried out using one of plating, chemical plating, vapor deposition method.
3. a kind of tin film thickness test method based on different surfaces difference in height according to claim 2, it is characterised in that:
If tin film is using plating, chemical plating method deposition, after placing coating, plating solution can not penetrate into coating cover region during the deposition process
Domain, if tin film is deposited using vapor deposition method, coating should be able to be subjected to the high temperature not less than 150 DEG C.
4. a kind of tin film thickness test method based on different surfaces difference in height according to claim 2, it is characterised in that:
If tin film is deposited using electro-plating method, and coating is insulating materials, then metal substrate coated region shape in face to be deposited is
Equilateral triangle, square is round, one kind of regular hexagon.
5. a kind of tin film thickness test method based on different surfaces difference in height according to claim 1, it is characterised in that:
The tin film thickness is micron order.
6. a kind of tin film thickness test method based on different surfaces difference in height according to claim 1, it is characterised in that:
Shape, the size of the coating should be consistent with capped metal substrate face regional area to be deposited.
7. a kind of tin film thickness test method based on different surfaces difference in height according to claim 1, it is characterised in that:
After coating is taken away, if the metal substrate surface exposed has glue residua, need to wash removing residual glue, then place is dried
Reason, if the metal substrate surface exposed without glue residua, is not necessarily to cleaning at this time, is dried.
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| CN107869978B (en) * | 2017-10-13 | 2019-10-08 | 清华大学 | A kind of method for measuring thickness of electrochemical deposition nano thin-film |
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| CN110823158B (en) * | 2019-10-08 | 2021-07-27 | 广州兴森快捷电路科技有限公司 | Electroplating hole metal layer thickness measurement system |
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