CN106558513B

CN106558513B - Detection device and detection method thereof

Info

Publication number: CN106558513B
Application number: CN201610160490.0A
Authority: CN
Inventors: 廖茂发; 梁文钦
Original assignee: Siliconware Precision Industries Co Ltd
Current assignee: Siliconware Precision Industries Co Ltd
Priority date: 2015-09-25
Filing date: 2016-03-21
Publication date: 2021-03-30
Anticipated expiration: 2036-03-21
Also published as: CN106558513A

Abstract

A detection device and a detection method thereof comprise: the detection device comprises a detection machine for detecting the electrical connection end of the substrate, an image capturer for capturing an image of the electrical connection end detected by the detection machine, and a first computer electrically connected with the image capturer, wherein the first computer comprises a computer and a messenger computer, the computer is used for calculating and analyzing the image of the electrical connection end, and the messenger computer is used for sending a signal or controlling the detection machine according to the result analyzed by the computer, so the detection device informs or controls the detection machine to stop detection action by the computer and the messenger computer.

Description

Detection device and detection method thereof

Technical Field

The present invention relates to a testing technique, and more particularly, to a testing apparatus and a testing method thereof for semiconductor manufacturing processes.

Background

With the trend of electronic products toward multi-functions and mobility, semiconductor packaging technology has been developed to high-density Chip Scale Package (CSP). In the development of the packaging technology, ball grid array packaging has become the most important packaging method at present, and ball grid array packaging with Multi-Chip Module (MCM) is more important. During the packaging process, a test is usually performed to determine whether the condition of the electrical contact pads is good.

In a conventional probe testing machine for testing an electrical contact pad or a bump (bump) thereon, a poking mark is generated on the electrical contact pad or the bump in the process of poking the electrical contact pad or the bump by a probe, and if the poking mark is shifted, the process is prone to be poor in the next stage.

As shown in fig. 1A, a conventional probe inspection machine 1 includes a probe device 10 having a plurality of probes 100, a positioning device 11 and a driving device 12, wherein the probes 100 can electrically contact with electrical contact pads 80 (or bumps) on a chip 8 (or a wafer), so that the probes 100 are stamped on the electrical contact pads 80 (or bumps), such as normal scratches P shown in fig. 1A', to achieve the purpose of electrical inspection.

In testing, if the positioning deviation is caused by vibration or other problems, the probe 100 is misaligned, so that the probe 100 is pressed against the edge of the electrical contact pad 80 (or bump), such as the bad scratch P 'shown in fig. 1A', thereby easily causing the bad process of the next stage.

Therefore, it is known that the probe inspection machine 1 is installed with a Charge-coupled Device (CCD) (not shown) to find the bad scratch P' before the next stage of the process.

However, knowing the identification capability of the ccd of the prober 1 results in a failure rate as high as 90%, and the prober 1 needs to stop the probe detection during the identification, which is time consuming and inefficient.

In addition, although an optical inspection machine (not shown) may be installed on the production line to specially inspect the scratches and stabs of the wafers in batch, if two machines (i.e., the probe inspection machine 1 and the optical inspection machine) are installed on the production line, not only the cost is too high, but also the batch inspection is time-consuming.

Therefore, how to overcome the above problems of the prior art has become an issue to be solved.

Disclosure of Invention

In view of the above-mentioned shortcomings of the known technology, the present invention provides a detection apparatus and a detection method thereof, which can save labor hours and achieve good effect, and can reduce cost without installing a machine on a production line.

The detection apparatus of the present invention includes: the detector is used for detecting the electrical condition of the electrical connection end of the substrate; an image capturing device for capturing the image of the electrical connection end after the detection of the electrical connection end by the detection machine; and the first computer is electrically connected with the image capturer and comprises a computer and a commander, wherein the computer calculates and analyzes the image of the electrically connected end, and the commander is used for sending a signal or controlling the detector according to the result analyzed by the computer.

The invention also provides a detection method, which comprises the following steps: providing the detection device; detecting the electrical connection end of the substrate by the detector; after the detecting machine detects the electrical connection end, the image capturing device captures an image of the electrical connection end; after the image of the electrical connecting end is captured by the image capturing device, the computer is made to calculate the difference between the preset position of the electrical connecting end and the position of the electrical connecting end in the image of the electrical connecting end; and making the command transmitter send out a signal or control the detector according to the result analyzed by the computer.

In the foregoing detection apparatus and detection method, the detection apparatus includes: a probe device having a plurality of probes, each of which is brought into contact with the electrical connection terminal to inspect the electrical condition of the substrate; and a positioning device for fixing the substrate and moving the substrate in a three-dimensional axial direction. For example, the probe is capsule-shaped, cylindrical, oval-cylindrical, square-cylindrical, conical, or pyramidal.

In the foregoing detecting apparatus and the detecting method, the image capturing device includes a charge coupled device for capturing an image to form the image of the electrical connection terminal.

In the above-mentioned detection apparatus and detection method, the detection apparatus further includes a second computer electrically connected to the detector and the image capturing device, and the second computer further includes a control device for controlling the detector. For example, the command engine and the control device are Advanced reduced instruction set machines (Advanced RISC machines, ARM).

In the above-mentioned detecting apparatus and the detecting method, the first computer further includes an image processor, which pre-stores a preset image of the electrical connection end to make a comparison image of the electrical connection end image and the preset image, so that the computer can calculate and analyze the comparison image.

In the foregoing testing apparatus and the testing method thereof, the cross-sectional shape of the electrical connection end is one of a group consisting of a capsule shape, a circle, a square, a polygon, a closed curve, a strip, and a long and narrow closed curve.

In the foregoing detecting apparatus and detecting method, the detecting apparatus further includes an identification area, and the identification area includes: a contour inspection unit that optically detects a positioning notch on the substrate; the optical character recognition unit is used for recognizing the code symbols on the substrate and recording the positioning notches of the substrate; a turntable for carrying the substrate; and a robot arm for moving the substrate to the recognition area and the inspection machine.

In view of the above, the detecting apparatus and the detecting method thereof of the present invention mainly process the image signal by the first computer, so that the probe detection operation is not affected when the probe detection is performed, and the detecting apparatus does not need to suspend the probe detection for the CCD image identification, thereby effectively shortening the CCD image identification time and success rate, enabling the detecting apparatus to continuously perform the probe electrical detection on the substrate, and simultaneously processing the probe stamp displacement or the bad identification of the scratch damage of the substrate.

Therefore, the invention informs or controls the detector to stop the detection action by the design of the first computer, and can have a plurality of image operation modes to set the optimal identification and calculation mode according to different substrates to be detected, so compared with the prior art, the invention not only saves labor hour and has good effect, but also does not need to arrange a machine on a production line, thereby reducing the cost.

Drawings

FIG. 1A is a schematic diagram of a known probe inspection machine;

FIG. 1A' is a schematic plan view of a conventional probe card for probing a test machine with scratches pressed on the electrical contact pads;

FIG. 2 is a schematic diagram of the structure of the detecting device of the present invention;

FIG. 2A is a schematic diagram of a default image of the inspection apparatus of the present invention;

FIG. 2B is a schematic diagram of an image of an electrical connection terminal of a substrate captured by the inspection apparatus of the present invention;

FIGS. 2C and 2C' are schematic diagrams of comparison images calculated by the inspection apparatus of the present invention;

FIG. 3A is a partial schematic view of the detection apparatus of the present invention; and

fig. 3B is a partially enlarged perspective view of the inspection apparatus of the present invention.

Description of the reference numerals

1 Probe detection machine

10,20a probe device

100,200 probe

11,20b positioning device

12,220 driving device

2 detection device

20 detection machine

201,330 Clamp

21 image capturing device

210 charge coupled device

22 second computer

221 control device

23 first computer

230 image processor

231 computer

232 telegraph game machine

30 identification area

31 contour checking unit

32 OCR unit

33 rotating disc

34 mechanical arm

4 wafer boat box

5 robot

8 chip

80 electric contact pad

9 base plate

90 electric connection end

A Preset image

B electrical connection terminal image

C comparison image

Difference in K, K

Normal scratch mark P

P' poor scratch

P' scratches.

Detailed Description

The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention may be practiced or carried out in various other embodiments, and its several details are capable of modification in various respects, all without departing from the spirit of the invention.

It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for understanding and reading the present disclosure, and are not used for limiting the conditions of the present disclosure, which will not be technically significant, and any structural modifications, ratio changes or size adjustments should be made within the scope of the present disclosure without affecting the function and the achievable purpose of the present disclosure. In the present specification, the terms "above", "first", "second" and "a" are used for the sake of clarity only, and are not intended to limit the scope of the present invention, and the relative relationship between them may be changed or adjusted without substantial technical changes.

Fig. 2 is a schematic view showing the detecting apparatus 2 of the present invention. As shown in fig. 2, the detection device 2 includes: a detecting machine 20, an image capturing device 21, a second computer 22 and a first computer 23.

The inspection machine 20 includes a probe apparatus 20a having a plurality of probes 200 and a positioning apparatus 20 b.

In the present embodiment, the inspection machine 20 is used for inspecting the electrical condition of the electrical connection 90 of the substrate 9, wherein the substrate 9 is a semiconductor board (e.g. a wafer) or a package substrate, and the electrical connection 90 is, for example, a pad, a bump or a conductive pillar.

In addition, the probe apparatus 20a is used to inspect the electrical property of the substrate 9 by each probe 200 contacting the electrical connection terminal 90, wherein the probe 200 is in the form of capsule, cylinder, oval column, square column, cone or pyramid, such as the scratch P "shown in fig. 2A, so as to match the force application, offset or force deformation of the probe 200 to pierce the oxide layer of the wafer, thereby meeting the requirements of high pin count and high frequency. In addition, the cross-sectional shape of the electrical connection 90 may be a capsule, a circle, a square, a polygon, or a closed curve, or a long or narrow closed curve, as shown in fig. 2A, so as to achieve the purpose of fine-pitch (fine-pitch) circuit design.

Also, the positioning device 20b is used to move the substrate 9 at different positions and angles in the three-dimensional axial direction (xyz) to facilitate the probes 200 to contact the electrical connection terminals 90.

In addition, a clamp (chuck)201 is disposed on the positioning device 20b to fix the substrate 9 and clamp the substrate 9 for rotation.

The image capturing Device 21 includes a Charge-coupled Device (CCD) 210.

In the present embodiment, the image capturing device 21 is used to capture (shoot) the image of the electrical connection end 90 detected by the probe 200.

The second computer 22 includes a driving device 220 and a control device 221.

In this embodiment, the control device 221 controls the probe device 20a and the positioning device 20b through the driving device 220, that is, the control device 221 calculates and determines the movement path of the probe device 20a and the positioning device 20b, and then transmits signals to the probe device 20a and the positioning device 20b, so that the driving device 220 moves the probe device 20a or the positioning device 20b to make the probe 200 contact the electrical connection end 90.

The first computer 23 is an industrial computer, electrically connected to the second computer 22 and the image capturing device 21, and the first computer 23 includes an image processor 230, a computer 231 and a command transmitter 232.

The image processor 230 has an Optical Character Recognition (OCR) function.

In the present embodiment, the image processor 230 is configured to store images, such as an imaginary image (not shown) of the electrical connector 90, a pre-set image a (various images shown in fig. 2A, but not limited thereto) of the electrical connector 90 detected by the detector 20, or an electrical connector image B captured by the image capturing device 21 (shown in fig. 2B). Therefore, the image processor 230 can generate a comparison image C (as shown in fig. 2C) from the electrical connection terminal image B and the predetermined image a.

In addition, the predetermined image a is, for example, a correct image (i.e. a correct needle position, i.e. a scratch P, which should be left on the electrical connection end 90 by the probe 200) of the electrical connection end 90 detected by the detecting machine 20, which is manually selected and stored in the database of the image processor 230.

In addition, the electrical connection terminal image B is the position of the trace left by the probe 200 on the electrical connection terminal 90, i.e. the scratch P ".

The computer 231 is an image calculator, which is used to calculate the comparison image C, i.e. the difference K (as shown in fig. 2C) between the preset image a of the electrical connection terminal 90 detected by the detector 20 and the electrical connection terminal image B in the image captured by the image capturing device 21, wherein the difference K is the needle position offset of the probe 200 left on the electrical connection terminal 90.

In this embodiment, the calculation method of the computer 231 may be wafer scratch comparison, non-continuity determination, focus adjustment, depth, range adjustment, or other methods.

In addition, the computer 231 can adjust the focal length, depth and range of the substrate 9 captured by the CCD image according to various identification calculation methods and the setting of the operator.

Moreover, in order to enhance the image determination effect, the computer 231 may be added with a graphic chip with gray scale enhancement function to achieve 16384 (2)¹⁴) Identification effect above gray scale.

When the difference K '(as shown in fig. 2C') exceeds the normal range (i.e. the position offset is too large), the commander 232 sends a pause signal to the control device 221 to stop the probe device 20a or the positioning device 20 b. The command engine 232 and the control device 221 are Advanced reduced instruction set machines (Advanced RISC machines, ARM for short), for example.

The detection method is carried out by using the detection equipment 2 of the invention, and the steps are as follows:

the method comprises the following steps: the control device 221 actuates the probe 200 of the inspection machine 20 to electrically inspect the electrical connection terminal 90 of the substrate 9 (e.g., wafer).

As shown in fig. 3A and 3B, in the present embodiment, a pre-positioning operation is performed, that is, a robot 5 is used to take out a Wafer (i.e., a substrate 9) in a Wafer Cassette (Wafer Cassette)4 or a Wafer (i.e., a substrate 9) cut into a strip shape and attached to a blue tape, and then the robot 5 is used to place the substrate 9 on the recognition area 30 of the inspection apparatus 2.

Specifically, a profile checking unit (profile)31, an optical character recognition unit (OCR)32, a set of turntables 33 with clamps 330, and a set of robots 34 are disposed in the recognition area 30.

The contour inspecting means 31 optically detects a positioning notch (notch) on the substrate 9.

The optical character recognition unit 32 recognizes the code symbol on the substrate 9 and records the positioning gap of each substrate 9.

When the OCU 32 recognizes and records the substrate 9, the robot 34 takes the substrate 9 out of the fixture 330 and sends it to the probe inspection area of the inspection apparatus 2.

Step two: the CCD 210 of the image capturing device 21 captures the image of the electrical connection terminal 90 and transmits the image to the first computer 23.

In the present embodiment, after electrically inspecting the substrate 9, the ccd 210 is moved to above the substrate 9 for photographing.

In another embodiment, the driving device 220 can make the positioning device 22b move the substrate 9 to the position below the CCD 210 for taking a photograph.

Step three: the first computer 23 determines whether the substrate 9 is damaged. First, the image processor 230 makes a comparison image C of the electrical connection end image B captured by the image capturing device 21 and the predetermined image a; then, the computer 231 performs calculation and analysis on the comparison image C to obtain the result of the difference K, K'.

In this embodiment, after the computer 231 performs the identification calculation on the comparison image C, the computer transmits the identification result to the messenger 232, so that the messenger 232 sends a signal to the control device 221 according to the identification result, and then the detection apparatus 2 continues to perform the probe detection operation or the interrupt operation.

In addition, the identification calculation method of the computer 231 includes at least three methods:

the first method comprises the following steps: correct image scanning comparison. First, a substrate 9 (e.g. a wafer or a chip) determined to be normal is provided for CCD scanning and capturing, and images are stored in the image processor 230, and the computer 231 sets these correct images as the reference parameters for determination. Then, the probe test and image capture are performed on the new substrate 9, the obtained image is stored in the image processor 230, and the computer 231 compares the newly captured image with a predetermined correct image to determine whether the new substrate 9 is good. Then, according to the identification result, the commander 232 sends a signal to the control device 221 to control the probe test to continue or interrupt.

And the second method comprises the following steps: the blank image is self-calculated. First, the computer 231 performs calculation directly on the basis of the blank substrate 9 (i.e., without stitches) to estimate an image of a normal substrate 9 and set the image as a reference parameter for determination. Then, the probe test and the image capture are performed on the new substrate 9, the obtained image is stored in the image processor 230, and the computer 231 compares the newly captured image with the estimated correct image to determine whether the new substrate 9 is good. Then, according to the identification result, the commander 232 sends a signal to the control device 221 to control the probe test to continue or interrupt.

And the third is that: and (4) judging the light refraction angle generated by the scratch in a discontinuous manner. When the substrate 9 is in a normal condition, the light rays are refracted to a fixed angle; if the substrate 9 has abnormal scratches or defects, the refraction angle of the light beam will change, and the computer 231 can determine whether the substrate 9 has scratches, defects, or probe pin shift by calculating whether the refraction angle of the light beam is abnormal.

It should be understood that the identification calculation method of the computer 231 is not limited to the above, and thus, the present invention is described herein.

Step four: the first computer 23 notifies or controls the inspection machine 20 to continue or interrupt the electrical inspection. For example, when the difference K' exceeds the normal value, the command transmitter 232 sends a pause signal to the control device 221 to stop the operation of the detector 20.

In this embodiment, after the probe electrical test is finished, the inspection apparatus 2 records which electrical connection terminals 90 of the substrate 9 have electrical problems. If the first computer 23 does not recognize the probe pin position deviation or the substrate 9 has scratch damage, the inspection apparatus 2 will terminate the probe test, and the robot 34 will clamp the substrate 9 and send it to other areas for other tests.

In addition, if the first computer 23 recognizes the pin-punching displacement or the substrate 9 has scratch damage, the first computer 23 will notify or control the control device 221 to send out a warning signal or suspend the operation of the inspection apparatus 2 to wait for the correction by the operator.

Therefore, the present invention uses the first computer 23 to process the image signal specially, so as to perform the probe detection without affecting the probe detection operation, so that the detection device 2 does not need to suspend the probe detection for performing the CCD image recognition, thereby effectively shortening the CCD image recognition time and success rate, enabling the detection device 2 to continuously perform the probe electrical detection on the substrate 9 (such as a wafer or a chip), and simultaneously processing the bad recognition of the probe stamping position deviation or the scratch damage of the substrate 9.

In summary, the detection apparatus and the detection method thereof of the present invention add the first computer and the image capturing device to the detection apparatus, and the first computer has the following two functions:

first, the detection machine can be notified or controlled to stop the detection action.

The second and multiple image operation modes are to set the best identification calculation mode corresponding to different substrates to be tested.

Therefore, the working hours are saved, the effect is good, and a machine table does not need to be arranged on a production line, so the cost can be reduced.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Modifications and variations can be made to the above-described embodiments by those of ordinary skill in the art without departing from the spirit and scope of the present invention. Therefore, the scope of the invention should be determined from the following claims.

Claims

1. A detection apparatus, characterized in that the detection apparatus comprises:

the detector is used for detecting the electrical condition of the electrical connection end of the substrate;

the image capturer is used for capturing an image of the electrical connection end after the electrical connection end of the substrate is detected by the detector;

the computer has drawing chip with gray scale strengthening function, and the computer identifying and calculating method includes the non-continuous judgment of the refraction angle of the light ray produced by the scratch.

2. The inspection apparatus of claim 1, wherein the inspection machine comprises:

a probe device having a plurality of probes, each of which is brought into contact with the electrical connection terminal to inspect the electrical condition of the substrate; and

and the positioning device is used for fixing the substrate and moving the substrate in a three-dimensional axial direction.

3. The inspection apparatus of claim 2 wherein the probe is capsule-shaped, cylindrical, square cylindrical, conical or pyramidal.

4. The inspection apparatus of claim 1, wherein the image grabber comprises a charge-coupled device for capturing images as images of the electrical connections.

5. The apparatus of claim 1, wherein the instruction Machine is an Advanced reduced instruction set Machine (Advanced RISC Machine, ARM).

6. The inspection apparatus according to claim 1, wherein the first computer further comprises an image processor for pre-storing a predetermined image of the electrical connection terminal to make a comparison image of the electrical connection terminal image and the predetermined image for the computer to calculate and analyze.

7. The detecting apparatus according to claim 1, wherein the cross-sectional shape of the electrical connection terminal is one of the group consisting of a capsule shape, a circular shape, a polygonal shape, a closed curve, and a long strip shape.

8. The detecting apparatus according to claim 1, wherein the cross-sectional shape of the electrical connection terminal is a closed curve of a square or a narrow length.

9. The inspection apparatus of claim 1, wherein the inspection apparatus further comprises an identification area, the identification area comprising:

a contour inspection unit that optically detects a positioning notch on the substrate;

the optical character recognition unit is used for recognizing the code symbols on the substrate and recording the positioning notches of the substrate;

a turntable for carrying the substrate; and

a robot for moving the substrate to the recognition area and the inspection machine.

10. The inspection apparatus according to claim 1, wherein the inspection apparatus further comprises a second computer electrically connected to the inspection machine for inspecting the electrical connection terminals of the substrate and the image capturing device for capturing images of the electrical connection terminals, and the second computer has a control device for controlling the inspection machine to inspect the electrical conditions of the electrical connection terminals of the substrate.

11. A detection method, characterized in that the detection method comprises:

providing a test device according to claim 1;

detecting the electrical connection end of the substrate by the detector;

after the detecting machine detects the electrical connection end, the image capturing device captures an image of the electrical connection end;

after the image of the electrical connecting end is captured by the image capturing device, the computer is made to calculate the difference between the preset position of the electrical connecting end and the position of the electrical connecting end in the image of the electrical connecting end; and

based on the result analyzed by the computer, the command transmitter is made to send out a signal or control the detector.

12. The inspection method of claim 11, wherein the inspection machine comprises:

13. The detection method of claim 12, wherein the probe is capsule-shaped, cylindrical, square column-shaped, conical or pyramidal.

14. The inspection method of claim 11, wherein the image grabber comprises a charge coupled device for capturing images as images of the electrical connections.

15. The method of claim 11, wherein the instruction Machine is an Advanced reduced instruction set Machine (Advanced RISC Machine, ARM).

16. The method according to claim 11, wherein the first computer further comprises an image processor for pre-storing a predetermined image of the electrical connection terminal to make a comparison image of the electrical connection terminal image and the predetermined image, so that the computer can calculate and analyze the comparison image to obtain the difference.

17. The method according to claim 11, wherein the cross-sectional shape of the electrical connection terminal is one of the group consisting of capsule, circle, polygon, closed curve, and strip.

18. The detecting method according to claim 11, wherein the cross-sectional shape of the electrical connection terminal is a closed curve of a square or a narrow length.

19. The inspection method of claim 11, wherein the inspection apparatus further comprises an identification area, and the identification area comprises:

a turntable for carrying the substrate; and