CN106531671A - 一种针测机晶圆传输机构手臂 - Google Patents

一种针测机晶圆传输机构手臂 Download PDF

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CN106531671A
CN106531671A CN201510697234.0A CN201510697234A CN106531671A CN 106531671 A CN106531671 A CN 106531671A CN 201510697234 A CN201510697234 A CN 201510697234A CN 106531671 A CN106531671 A CN 106531671A
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mechanical
mechanical hand
wafer
fingers
finger
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沈顺金
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Yin Guwei
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Anhui Chaoyuan Semiconductor Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

本发明公开了一种针测机晶圆传输机构手臂，涉及半导体制造设备技术领域，包括支架、机械手，所述机械手与支架固定连接，所述机械手包括机械手掌和机械手指，所述机械手指包括两个机械手内指和两个机械手外指，所述两个机械手内指的间距大于相邻机械手内指与机械手外指之间的间距，所述机械手掌、机械手内指、机械手外指上表面开设有真空孔。本发明传输机构手臂，机械手设计成机械手掌和机械手指，通过设置多个机械手指来增加手臂与晶圆的接触面积，在机械手掌和机械手指上表面开设真空孔和内部真空设计，增大手臂与晶圆的吸力，避免传输机构手臂在晶圆转换时发生晶圆掉落，有效地减小产品报废的风险。

Description

一种针测机晶圆传输机构手臂
技术领域
本发明涉及半导体制造设备技术领域，尤其涉及一种针测机晶圆传输机构手臂。
背景技术
晶圆是指硅半导体集成电路制作所用的硅芯片，由于其形状为圆形，故称为晶圆。在硅芯片上可加工制作成各种电路组件结构，而成为有特定电性功能之IC产品。半导体的生产和制造在不断的发展中形成了完善的生产流程。一般是芯片电路设计-晶圆的制造-晶圆的测试-晶圆的切割研磨-芯片的封装-成品芯片的测试。晶圆的测试对该芯片的成本控制尤其重要，晶圆的测试可以将功能缺陷的芯片找出，不进入后期较大成本的封装中，节约了整体的成本。同时也对上一工序-晶圆的制造提供改良的指导方向。晶圆的测试是将晶圆从工作台上移送到针测机测试头下面，并将探针卡上的针脚压在晶粒上，形成良好的电气接触。全自动针测机还要根据测试***的测试结果，给不合格的晶粒打上墨印。晶圆传输机构的主要工作是将晶舟内晶圆传输至承载盘作测试之用。但是在晶圆的传输过程中，传输机构手臂在晶圆转换时容易发生晶圆掉落，从而造成产品报废的风险。
发明内容
本发明的目的针对上述现有技术的问题，提供一种针测机晶圆传输机构手臂，机械手设计成机械手掌和机械手指，通过设置多个机械手指来增加手臂与晶圆的接触面积，在机械手掌和机械手指上表面开设真空孔和内部真空设计，增大手臂与晶圆的吸力，避免传输机构手臂在晶圆转换时发生晶圆掉落，有效地减小产品报废的风险。
为实现上述目的，本发明采用的技术方案是：
一种针测机晶圆传输机构手臂，包括支架、机械手，所述机械手与支架固定连接，所述机械手包括机械手掌和机械手指，所述机械手指包括两个机械手内指和两个机械手外指，所述两个机械手内指的间距大于相邻机械手内指与机械手外指之间的间距，所述机械手掌、机械手内指、机械手外指上表面开设有真空孔。
进一步地，所述支架为金属支架。
进一步地，所述支架与机械手通过螺栓固定连接。
进一步地，所述机械手为陶瓷机械手。
进一步地，所述陶瓷机械手为中空密封陶瓷机械手。
本发明的有益效果：一种针测机晶圆传输机构手臂，机械手设计成机械手掌和机械手指，通过设置多个机械手指来增加手臂与晶圆的接触面积，在机械手掌和机械手指上表面开设真空孔和内部真空设计，增大手臂与晶圆的吸力，避免传输机构手臂在晶圆转换时发生晶圆掉落，有效地减小产品报废的风险。
附图说明
图1为本发明传输机构手臂结构图；
相关元件符号说明：
1、支架；2、机械手；3、机械手掌真空孔；4、机械手内指；5、机械手内指真空孔；6、机械手外指真空孔；7、机械手外指。
具体实施方式
为了使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体图示，进一步阐述本发明。
具体实施时，结合图1，一种针测机晶圆传输机构手臂，包括支架1、机械手2，机械手2与支架1固定连接，机械手2包括机械手掌和机械手指，机械手指包括两个机械手内指4和两个机械手外指7，两个机械手内指的间距大于相邻机械手内指与机械手外指之间的间距，机械手掌、机械手内指、机械手外指上表面分别开设有机械手掌真空孔3、机械手内指真空孔5和机械手外指真空孔6。
支架可以为金属支架，支架可以与机械手通过螺栓固定连接。为了使机械手能够对晶圆有更好的吸力，机械手设计成真空结构。机械手设计成陶瓷机械手，陶瓷机械手可以为中空密封陶瓷机械手。
针测机晶圆传输机构手臂，针测机晶圆传输机构手臂受力面积和内部真空结构上做了相应设计，机械手臂受力面积增大2倍，承载晶圆能力将增加一倍，增大手臂与晶圆的吸力，避免传输机构手臂在晶圆转换时发生晶圆掉落，有效地减小产品报废的风险。
上面所述的实施例仅仅是对本发明的优选实施方式进行描述，并非对本发明的构思和范围进行限定。在不脱离本发明设计构思的前提下，本领域普通人员对本发明的技术方案做出的各种变型和改进，均应落入到本发明的保护范围。

Claims (5)

1.一种针测机晶圆传输机构手臂，包括支架、机械手，所述机械手与支架固定连接，所述机械手包括机械手掌和机械手指，其特征在于：所述机械手指包括两个机械手内指和两个机械手外指，所述两个机械手内指的间距大于相邻机械手内指与机械手外指之间的间距，所述机械手掌、机械手内指、机械手外指上表面开设有真空孔。
2.按照权利要求1所述的一种针测机晶圆传输机构手臂，其特征在于：所述支架为金属支架。
3.按照权利要求2所述的一种针测机晶圆传输机构手臂，其特征在于：所述支架与机械手通过螺栓固定连接。
4.按照权利要求1所述的一种针测机晶圆传输机构手臂，其特征在于：所述机械手为陶瓷机械手。
5.按照权利要求4所述的一种针测机晶圆传输机构手臂，其特征在于：所述陶瓷机械手为中空密封陶瓷机械手。
CN201510697234.0A 2015-10-22 2015-10-22 一种针测机晶圆传输机构手臂 Withdrawn CN106531671A (zh)

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Cited By (1)

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CN114131621A (zh) * 2021-10-29 2022-03-04 赛莱克斯微***科技（北京）有限公司 一种晶圆运输机械手

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TWI237590B (en) * 2004-03-11 2005-08-11 Advanced Semiconductor Eng Wafer transport robot arm
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Application publication date: 20170322