CN106523943A - LED lamp for household illumination - Google Patents

LED lamp for household illumination Download PDF

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Publication number
CN106523943A
CN106523943A CN201610985949.0A CN201610985949A CN106523943A CN 106523943 A CN106523943 A CN 106523943A CN 201610985949 A CN201610985949 A CN 201610985949A CN 106523943 A CN106523943 A CN 106523943A
Authority
CN
China
Prior art keywords
panel
led
substrate
heat
shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610985949.0A
Other languages
Chinese (zh)
Inventor
胡成林
张志波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Sanshuo Optoelectronics Technology Co Ltd
Original Assignee
Chongqing Sanshuo Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chongqing Sanshuo Optoelectronics Technology Co Ltd filed Critical Chongqing Sanshuo Optoelectronics Technology Co Ltd
Priority to CN201610985949.0A priority Critical patent/CN106523943A/en
Publication of CN106523943A publication Critical patent/CN106523943A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The invention belongs to the technical field of illumination, and in particular, relates to an LED lamp for household illumination. The LED lamp for household illumination comprises a substrate integrated with LED beads on the surface, a shell connected with the substrate, and a control panel electrically connected with the LED beads; the shell is connected with multiple first heat dissipating pieces; multiple heat dissipating holes are formed in the shell; the shell includes a first panel and a second panel connected with the substrate; a through hole is formed in the first panel; a semiconductor refrigeration chip is connected into the through hole; a cold end of the semiconductor refrigeration chip is connected with the substrate, and is connected with a heat tube; the tail end of the heat tube is wound on the outer wall of the shell, and is connected with the multiple first heat dissipating pieces; multiple reflecting cups are arranged on the first panel and the second panel; and the widths of one ends, near the reflecting cups, of the first heat dissipating pieces are larger than the widths of one ends, far from the reflecting cups, of the first heat dissipating pieces. The LED lamp for household illumination is used for solving the problem of low heat dissipating efficiency in traditional LED lamps for household illumination.

Description

A kind of LED of home lighting
Technical field
The present invention relates to a kind of lighting technical field, more particularly to a kind of LED of home lighting.
Background technology
, due to its environmental protection, life-span length, energy consumption are low, small voltage, the advantage such as small current, obtain it for LED at present Fast development simultaneously gradually replaces other light fixtures, is favored by increasing user.Traditional tengsten lamp, incandescent lamp, fluorescence Lamp, halogen tungsten lamp are that, using electronics light field radioluminescence, filament light-emitting easily burns, the features such as heat deposition, optical attenuation, and household LED lamp Small volume, lightweight, epoxy encapsulation can bear high-strength mechanical shock and vibrations, not broken, and average life span reaches 3-5 ten thousand H, service life avoid Jing from often changing the hardship of lamp up to 3-5, the maintenance cost that can substantially reduce light fixture, but, LED dissipate Heat problem is also Important Problems, and heat dissipation problem badly influences the light efficiency of LED/light source and life-span.Traditional LED radiating efficiency It is low, cause LED light source temperature too high, so as to have influence on light efficiency and the life-span of LED.
The content of the invention
The present invention seeks to a kind of LED for being suitable to home lighting has been aimed to provide, for solving current home lighting LED The low problem of lamp radiating efficiency.
To realize above-mentioned technical purpose, the technical solution used in the present invention is as follows：
A kind of LED of home lighting, the LED include that surface is integrated with the substrate of LED lamp bead, connects the substrate Shell, electrically connect the control panel of the LED lamp bead；There are the first heat insulation layer, the shell between the shell and the substrate There is the first fin of multi-disc, on the shell, there are multiple louvres；The shell includes the first panel with the substrate connection, The first panel is provided with through hole, and the first panel is connected with semiconductor chilling plate, the semiconductor chilling plate in through hole Cold end and the substrate connection, the semiconductor chilling plate hot junction is connected with heat pipe, and the heat pipe is partly led away from described One end of body cooling piece in the shape of a spiral, the heat pipe away from the semiconductor chilling plate one ends wound the shell outer wall It is upper and be connected with the first fin described in multi-disc, the second panel that the first panel is oppositely arranged, the second panel and institute State, the heat pipe and the second panel and the heat pipe and the reflector it Between have the second heat insulation layer, the second fin of multi-disc is provided between the first panel and second panel.
Using the invention of above-mentioned technical proposal, during use, the cold end of semiconductor chilling plate passes through through hole and substrate connection.Half Conductor cooling piece hot junction is connected with heat pipe, and heat pipe is connected one end in swirl shape with semiconductor chilling plate hot junction, so as to can be preferably Absorb the heat in semiconductor chilling plate hot junction.Heat pipe passes across the edge that spaced reflector reaches first panel, heat pipe The other end in the shape of a spiral and is wrapped on the outer wall of shell.One end is connected heat pipe with the first fin of multi-disc in the shape of a spiral.First Heat sink is connected with shell, has multiple louvres on shell, and radiating orifice edge is plastics or rubber, makes what heat pipe brought out Heat is preferably distributed.First fin near reflector one end width ratio fin away from institute's reflector lamp one end width Greatly, be conducive to radiating of the heat sink to substrate.Second is connected between heat pipe and second panel and heat pipe and reflector adiabatic Layer, the making material of the second heat insulation layer is plastics or rubber.First panel scribbles heat-conducting silicone grease, semiconductor with the joint face of substrate The cold end of cooling piece is also coated with heat-conducting silicone grease with the joint face of substrate.
There is the second heat dissipating layer between first panel and second panel, preferably can radiate, improve radiating efficiency.
Further limit, the radiating orifice edge is plastics or rubber, low cost, good heat dissipation effect.
Further limit, first heat insulation layer is plastics or rubber, cost with the making material of second heat insulation layer It is low, good heat dissipation effect.
Further limit, the through hole is located at the first panel center, the heat pipe passes across spaced described Between reflector, preferably can radiate.
Further limit, the first panel is circle with the second panel, can preferably space layout.
Further limit, the first panel scribbles heat-conducting silicone grease, the semiconductor refrigerating with the joint face of the substrate The cold end of piece scribbles heat-conducting silicone grease with the joint face of the substrate, can reduce the thermal resistance of heat transfer, improves heat transfer efficiency.
Further limit, the first fin described in width ratio of first fin near described reflector one end away from The width of institute's reflector lamp one end is big, is conducive to radiating of the fin to substrate.
Further limit, the reflector is connected one end and is provided with the first rim of a cup with the first panel, the reflector with The second panel connects one end and is provided with the second rim of a cup, and the second panel is provided with and goes out light correspondingly with second rim of a cup Hole is arranged with lens, in order to avoid the heat in semiconductor chilling plate hot junction is passed in substrate.
Description of the drawings
The present invention can be further illustrated by the nonlimiting examples that accompanying drawing is given；
Structural representations of the Fig. 1 for a kind of LED of home lighting of an embodiment of the present invention；
Fig. 2 is the structural representation of shown multiple reflectors；
In accompanying drawing, the implication of each label is：A kind of LEDs of home lighting of 10-, 110- substrates, 111-LED lamp beads, 120- Shell, the first fin of 121-, 1211- louvres, 130- control panels, 141- first panels, 1411- resigning holes, 1412- lead to Hole, 142- second panels, 1421- light holes, 143- reflectors, the first rims of a cup of 1431-, the second rims of a cup of 1432-, 144- second dissipate Backing, 150- semiconductor chilling plates, 160- heat pipes.
Specific embodiment
In order that those skilled in the art may be better understood the present invention, with reference to the accompanying drawings and examples to this Bright technical scheme is further illustrated.
As shown in Figure 1 and Figure 2, a kind of LED of home lighting, LED include that surface is integrated with the substrate of LED lamp bead 110th, the shell 120 of connecting substrate, electrically connects the control panel 130 of LED lamp bead, and shell 120 has the first fin of multi-disc 121, outward Have on shell 120 between 1211 shell 120 of multiple louvres and substrate 110 and be connected with the first heat insulation layer；Shell 120 includes and substrate The first panel 141 of connection, first panel 141 are provided with through hole 1412, and first panel 141 is connected with semiconductor in through hole 1412 Cooling piece 150, the cold end of semiconductor chilling plate 150 are connected with substrate 110, and 150 hot junction of semiconductor chilling plate is connected with heat pipe 160, heat pipe 160 away from semiconductor chilling plate 150 one end in the shape of a spiral, the one end of heat pipe 160 away from semiconductor chilling plate 150 It is wrapped on the outer wall of shell 120 and is connected with the first fin of multi-disc 121, the second panel that first panel 141 is oppositely arranged 142, multiple reflectors 143, heat pipe 160 and second panel 142 and heat are provided between second panel 142 and first panel 141 There is the second heat insulation layer between pipe 160 and reflector 143, multi-disc second is provided between first panel 141 and second panel 142 and is radiated Piece 144.
It is preferred that radiating orifice edge is plastics or rubber, and such design, low cost, good heat dissipation effect.In fact, can root Other materials are selected according to concrete condition.
It is preferred that the first heat insulation layer is plastics or rubber, such design cost with the making material of second heat insulation layer It is low, good heat dissipation effect.In fact, other materials can be selected as the case may be.
It is preferred that through hole 1412 is located at 141 center of first panel, heat pipe 160 is passed across between spaced reflector 143. Such design, can make simple structure.In fact, other designs can be selected as the case may be.
It is preferred that first panel 141 is circle with second panel 142, such design can make thermal diffusivity more preferable.It is actual On, other designs can be selected as the case may be.
It is preferred that the joint face of first panel 141 and substrate 110 scribbles heat-conducting silicone grease, the cold end of semiconductor chilling plate with it is described The joint face of substrate 110 scribbles heat-conducting silicone grease, and such design can reduce the thermal resistance of heat transfer, improve heat transfer efficiency.It is actual On, other structure designs can be selected as the case may be.
It is preferred that the first fin 121 is away from institute described in width ratio of first fin 121 near 143 one end of the reflector The width of 143 one end of reflector lamp is big, and such design is conducive to radiating of the fin to substrate.In fact, can be according to concrete feelings Condition selects other structure designs.
It is preferred that reflector 143 is connected one end with first panel 141 is provided with the first rim of a cup 1431, reflector 143 and the second face The connection of plate 142 one end is provided with the second rim of a cup 1432, and second panel 142 is provided with and 1432 one-to-one light hole of the second rim of a cup 1421 are arranged with lens, such structure design, in order to avoid the heat in semiconductor chilling plate hot junction is passed in substrate.It is actual On, other structure designs can be selected as the case may be.
In the present embodiment, during use, when an electric current passes through it, because semiconductor chilling plate 150 is the instrument of a heat transfer, When the thermocouple centering that one piece of N-type semiconductor material and one piece of p-type semiconductor material are coupled to has electric current to pass through, between two ends Heat transfer will be produced, and heat will be transferred to the other end from one end, cold and hot end be formed so as to produce the temperature difference.Switch on power Afterwards, electron-hole pair is produced near upper contact, interior energy reduces, and temperature is reduced, and is outwardly absorbed heat, referred to as cold end.The other end is because of electricity To being combined, interior energy increases in son-hole, and temperature is raised, and to environment heat release, referred to as hot junction.The cold end of semiconductor chilling plate 150 is worn Cross through hole to be connected with substrate 110.150 hot junction of semiconductor chilling plate is connected with heat pipe 160, heat pipe 160 and semiconductor chilling plate 150 Hot junction connects one end in swirl shape, preferably to absorb the heat in 150 hot junction of semiconductor chilling plate.Heat pipe 160 is passed across Spaced reflector 143 reaches the edge of first panel 141, and 160 other end of heat pipe in the shape of a spiral and is wrapped in shell 120 Outer wall on.One end is connected heat pipe 160 with the first fin of multi-disc 121 in the shape of a spiral.First fin 121 and 120 phase of shell Connection, has multiple louvres 1211 on shell 120,1211 mouthfuls of edges of louvre are plastics or rubber, make what heat pipe 160 brought out Heat is preferably distributed.Width ratio first fin 121 of first fin 121 near 143 one end of reflector is reflective away from institute The width of 143 one end of lamp is big, is conducive to radiating of the heat sink to substrate 110.Heat pipe 160 and second panel 142 and heat pipe 160 The second heat insulation layer is connected between reflector 143, the making material of the second heat insulation layer is plastics or rubber.First panel 141 Heat-conducting silicone grease is scribbled with the joint face of substrate 110, cold end and the joint face of substrate 110 of semiconductor chilling plate 150 are also coated with leading Hot silicone grease, can reduce the thermal resistance of heat transfer, improve heat transfer efficiency.
The semiconductor chilling plate 150 connected in first panel 141 can carry out active heat removal, semiconductor to substrate 110 The heat in the hot junction of cooling piece 150 then can be passed in the first fin 121 of shell 120 by heat pipe 160, and the first radiating Width of first fin 121 away from 143 one end of institute's reflector lamp described in width ratio of the piece 121 near 143 one end of the reflector Greatly, be conducive to radiating of the fin to substrate 110, on shell 120, there are multiple louvres 1211, by the first fin of multi-disc 121st, heat quickly can be shed by louvre 1211, improve radiating efficiency.
A kind of LED of the home lighting for providing to the present invention above is described in detail, the explanation of specific embodiment It is only intended to help and understands the method for the present invention and its core concept.It should be pointed out that for the ordinary skill people of the art Member for, under the premise without departing from the principles of the invention, some improvement and modification can also be carried out to the present invention, these improve and Modification is also fallen in the protection domain of the claims in the present invention.

Claims (8)

1. a kind of LED of home lighting, it is described that the LED includes that surface is integrated with the substrate (110) of LED lamp bead, connection The shell (120) of substrate, electrically connects the control panel (130) of the LED lamp bead；It is characterized in that：The shell (120) has multi-disc First fin (121), has multiple louvres (1211) shell (120) and the substrate (110) on the shell (120) Between be connected with the first heat insulation layer, the shell (120) includes the first panel (141) with the substrate connection, described first Panel (141) is provided with through hole (1412), and the first panel (141) is connected with semiconductor chilling plate in through hole (1412) (150), the cold end of the semiconductor chilling plate (150) is connected with the substrate (110), semiconductor chilling plate (150) heat End is connected with heat pipe (160), the heat pipe (160) away from the semiconductor chilling plate (150) one end in the shape of a spiral, the heat Pipe (160) away from the semiconductor chilling plate (150) one ends wound on the outer wall of the shell (120) and with described in multi-disc First fin (121) connects, the second panel (142) that the first panel (141) is oppositely arranged, the second panel (142) multiple reflectors (143), the heat pipe (160) and the second panel are provided between the first panel (141) (142) and between the heat pipe (160) and the reflector (143) there are the second heat insulation layer, the first panel (141) and The second fin of multi-disc (144) is provided between two panels (142).
2. the LED of a kind of home lighting according to claim 1, it is characterised in that：Louvre (1211) the mouth side Edge is plastics or rubber.
3. the LED of a kind of home lighting according to claim 2, it is characterised in that：First heat insulation layer with it is described The making material of the second heat insulation layer is plastics or rubber.
4. the LED of a kind of home lighting according to claim 3, it is characterised in that：The through hole (1412) is located at institute First panel (141) center is stated, the heat pipe (160) is passed across between the spaced reflector (143).
5. the LED of a kind of home lighting according to claim 4, it is characterised in that：The first panel (141) and institute State second panel (142) and be circle.
6. the LED of a kind of home lighting according to claim 5, it is characterised in that：The first panel (141) and institute The joint face for stating substrate (110) scribbles heat-conducting silicone grease, cold end and the substrate (110) of the semiconductor chilling plate (150) Joint face scribbles heat-conducting silicone grease.
7. the LED of a kind of home lighting according to claim 6, it is characterised in that：First fin (121) is leaned on Width of first fin (121) away from institute reflector lamp (143) one end described in the width ratio of nearly described reflector (143) one end Greatly.
8. according to it is described require 7 described in a kind of home lighting LED, it is characterised in that：The reflector (143) with it is described First panel (141) connection one end is provided with the first rim of a cup (1431), and the reflector (143) is with the second panel (142) even Connect one end and be provided with the second rim of a cup (1432), the second panel (142) is provided with one-to-one with second rim of a cup (1432) Light hole (1421) light hole is arranged with lens.
CN201610985949.0A 2016-11-09 2016-11-09 LED lamp for household illumination Pending CN106523943A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610985949.0A CN106523943A (en) 2016-11-09 2016-11-09 LED lamp for household illumination

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610985949.0A CN106523943A (en) 2016-11-09 2016-11-09 LED lamp for household illumination

Publications (1)

Publication Number Publication Date
CN106523943A true CN106523943A (en) 2017-03-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610985949.0A Pending CN106523943A (en) 2016-11-09 2016-11-09 LED lamp for household illumination

Country Status (1)

Country Link
CN (1) CN106523943A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109084285A (en) * 2018-09-10 2018-12-25 台山鸿隆光电科技有限公司 A kind of heat dissipating method and radiator of LED light
CN110107823A (en) * 2019-05-21 2019-08-09 江苏天楹之光光电科技有限公司 A kind of high photosynthetic efficiency, the LED light of good heat dissipation
CN112762377A (en) * 2021-01-06 2021-05-07 义乌峯珩贸易有限公司 Explosion-proof LED working lamp

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201237200Y (en) * 2008-07-15 2009-05-13 东莞市贻嘉光电科技有限公司 Heat radiating device of LED reflectoscope
CN104456211A (en) * 2014-12-05 2015-03-25 东莞市闻誉实业有限公司 LED lamp with refrigerating piece
CN204922895U (en) * 2015-07-17 2015-12-30 英德市朝旭照明电器有限公司 Novel heat radiation structure of shot -light
CN105333321A (en) * 2015-11-30 2016-02-17 江门市美饰家照明有限公司 High-power LED bulb lamp

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201237200Y (en) * 2008-07-15 2009-05-13 东莞市贻嘉光电科技有限公司 Heat radiating device of LED reflectoscope
CN104456211A (en) * 2014-12-05 2015-03-25 东莞市闻誉实业有限公司 LED lamp with refrigerating piece
CN204922895U (en) * 2015-07-17 2015-12-30 英德市朝旭照明电器有限公司 Novel heat radiation structure of shot -light
CN105333321A (en) * 2015-11-30 2016-02-17 江门市美饰家照明有限公司 High-power LED bulb lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109084285A (en) * 2018-09-10 2018-12-25 台山鸿隆光电科技有限公司 A kind of heat dissipating method and radiator of LED light
CN110107823A (en) * 2019-05-21 2019-08-09 江苏天楹之光光电科技有限公司 A kind of high photosynthetic efficiency, the LED light of good heat dissipation
CN112762377A (en) * 2021-01-06 2021-05-07 义乌峯珩贸易有限公司 Explosion-proof LED working lamp

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Application publication date: 20170322