CN106521609B - Ultra-thin Ni-based blade of composite diamond and preparation method thereof - Google Patents

Ultra-thin Ni-based blade of composite diamond and preparation method thereof Download PDF

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Publication number
CN106521609B
CN106521609B CN201610896446.6A CN201610896446A CN106521609B CN 106521609 B CN106521609 B CN 106521609B CN 201610896446 A CN201610896446 A CN 201610896446A CN 106521609 B CN106521609 B CN 106521609B
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diamond
blade
diamond particles
plating
ultra
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CN106521609A (en
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冉隆光
陈昱
刘学明
王余波
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Suzhou Sail Science & Technology Co Ltd
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Suzhou Sail Science & Technology Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated

Abstract

A kind of ultra-thin Ni-based blade of composite diamond and preparation method thereof, include in coating bath in the Ni-based electroplate liquids of every 1L increase by 0.1 4 g/L 18 μm of diamond particles, electric stirring leaf by plating trench bottom setting is kept stirring so that 18 μm of diamond uniforms are distributed in coating bath in Ni-based electroplate liquid;Qualified matrix prepared by machining, which is added in fixture, passes through pre-treatment, it is put into electroplating bath after the completion, it is electroplated using 1.5A electric currents, to increase by 10 50 μm of diamond particles of 0.1 1 g/L per hour in plating, and pass through electric stirring leaf high-speed stirred, plating 4 hours so that 18 μm and 10 50 μm of diamond particles are attached to matrix surface and form diamond and nickel-base plating coat.Two kinds of diamond particles of fine grained and thick pellet are equipped in different proportions, blade cutting intensity, rigidity and cutting quality are greatly improved, to meet the split requirement of different materials.

Description

Ultra-thin Ni-based blade of composite diamond and preparation method thereof
Technical field
The present invention relates to ultra-thin Ni-based blades of a kind of composite diamond and preparation method thereof.
Background technology
In the prior art, rigidity and cutting quality, the diamond coated deposition usually on blade base are cut in order to improve Layer, the size of the diamond particles in diamond deposition layer is all identical, is single, usual diamond and nickel-base plating coat Middle diamond is fine grained diamond, and blade cutting accuracy quality is higher, but easy fracture, and service life is shorter, and matrix will reach Certain thickness is not just easily broken, so current blade is generally relatively thick;And coarse diamond, intensity are higher, it is not easy to break, But cutting accuracy is not high.
Invention content
The technical problem to be solved in the present invention is to provide a kind of preparation methods of the ultra-thin Ni-based blade of composite diamond.
In order to solve the above-mentioned technical problem, a kind of technical solution that the present invention uses is:A kind of ultra-thin nickel of composite diamond The preparation method of base blade, including:
One, pass through coating bath in coating bath to increase the 1-8 μm of diamond particles of 0.1-4 g/L in the Ni-based electroplate liquids of every 1L The electric stirring leaf of bottom setting is kept stirring so that 1-8 μm of diamond uniform is distributed in coating bath in Ni-based electroplate liquid;
Two, the qualified matrix for preparing machining, which is added in fixture, passes through pre-treatment, is put into electroplating bath, uses after the completion 1.5A electric currents are electroplated, to increase the 10-50 μm of diamond particles of 0.1-1 g/L per hour in plating, and by electronic Paddle high-speed stirred is electroplated 4 hours so that 1-8 μm and 10-50 μm of diamond particles are attached to matrix surface and form Buddha's warrior attendant Stone and nickel-base plating coat;
Three, the matrix of the diamond particles after the completion of being electroplated to being compounded with 1-8 μm and 10-50 μm takes out from fixture, machine Process cylindrical grinding and lathe tool sword;
Four, it is packed into fixture after the completion of machining, is put into sodium hydroxide and goes out in sword liquid using 80 DEG C of 10 ~ 15min of temperature immersion It completes blade and goes out the laggard washing of mistake three of sword, be put into polishing fluid blade after completing polishing process using 32A electric currents 2min and process It completes.
In some embodiments, the Ni-based electroplating bath components include nickel sulfamic acid 350-600 g/L, boric acid 25- 55g/L, nickel chloride 5-30g/L.
In some embodiments, the step of fixture equipped with matrix being passed through into pre-treatment:
(1), comprising sodium hydroxide, sodium carbonate, sodium metasilicate mixing alkaline etching solution in impregnates 2 minutes and process three water It washes;
(2), impregnated 1 minute in the pickling solution comprising nitric acid water mixed liquid after by three washing;
(3), impregnated 1 minute in zinc dipping solution after by three washing.
In some embodiments, the electric stirring leaf, which is that rate is adjustable, can realize the high electric mixing to slowly run Mix leaf.
The scope of the present invention, however it is not limited to technical solution made of the specific combination of above-mentioned technical characteristic, while should also contain Lid carries out the arbitrary other technical solutions for combining and being formed by above-mentioned technical characteristic or its equivalent feature.Such as features described above with this Disclosed in application(But it is not limited to)Technical characteristic with similar functions is replaced mutually and the technical solution etc. that is formed.
Since above-mentioned technical proposal is used, the present invention has following advantages compared with prior art:Diamond and Ni-based plating There are fine grained and two kinds of diamond particles of thick pellet, fine grained and two kinds of diamond particles of thick pellet are in different proportions in layer It is equipped with, greatly improves blade cutting intensity and rigidity, the cutting quality of cutting blade is greatly improved, to meet cutting for different materials Requirement is cut, and at the same time effectively promoting cutting speed, improves working efficiency.
Specific implementation mode
A kind of ultra-thin Ni-based blade of composite diamond, including matrix, the diamond that is covered in described matrix and Ni-based plating Layer, include 1-8 μm and 10-50 μm of diamond particles in the diamond and nickel-base plating coat.Described matrix is aluminium alloy base Body, thickness 10mm, a diameter of 56-62mm.
Embodiment one:
Electroplating bath components and diamond content are as follows:
The Ni-based electroplating bath components include nickel sulfamic acid 350g/L, boric acid 30g/L, nickel chloride 7.5g/L, 0.5 g/L 2 μm of diamonds, 0.3g/L 30 μm of diamonds.
A kind of preparation method of the ultra-thin Ni-based blade of composite diamond:Including:
One, it to increase 2 μm of diamond particles of 0.5g/L in the Ni-based electroplate liquids of every 1L in coating bath, is set by plating trench bottom The electric stirring leaf set is kept stirring so that 2 μm of diamond uniforms are distributed in coating bath in Ni-based electroplate liquid;
Two, the qualified matrix for preparing machining, which is added in fixture, passes through pre-treatment, is put into electroplating bath, uses after the completion 1.5A electric currents are electroplated, and to increase 30 μm of diamond particles of 0.3g/L per hour in plating, and pass through electric stirring leaf High-speed stirred is electroplated 4 hours so that 2 μm and 30 μm of diamond particles are attached to matrix surface and form diamond and Ni-based plating Layer;
Three, the matrix of the diamond particles after the completion of being electroplated to being compounded with 2 μm and 30 μm takes out from fixture, machining mill Outer circle and lathe tool sword;
Four, it is packed into fixture after the completion of machining, is put into sodium hydroxide and goes out in sword liquid using 80 DEG C of 10 ~ 15min of temperature immersion It completes blade and goes out sword, i.e., erode unwanted body portion, laggard mistake three is washed, and is put into polishing fluid using 32A electricity Blade machines after stream 2min completes polishing process.Verification blade quality is detected and cut by quality inspection.Test:With cutting machine Speed of mainshaft 30.0K/min, rate of feed 35mm/s, cutting PCB material blade wear away 9 μm/1km(Per cutting material 1km blades Outer diameter consumes 9 μm), 15 μm of spring side.
Wherein, the step of fixture equipped with matrix passes through pre-treatment:Including:
(1), comprising sodium hydroxide, sodium carbonate, sodium metasilicate mixing alkaline etching solution in impregnates 2 minutes and process three water It washes;
(2), impregnated 1 minute in the pickling solution comprising nitric acid water mixed liquid after by three washing;
(3), impregnated 1-10 minutes in zinc dipping solution after by three washing.
Wherein, the electric stirring leaf, which is that rate is adjustable, can realize the high electric stirring leaf to slowly run.
Embodiment two:Electroplating bath components and diamond content are as follows:
The Ni-based electroplating bath components include nickel sulfamic acid 400g/L, boric acid 35g/L, nickel chloride 15g/L, 0.5g/L's 3 μm of diamonds, 30 μm of diamonds of 0.3g/L.Test:It is cut with cutting machine speed of mainshaft 30.0K/min, rate of feed 30mm/s It cuts PCB material blade and wears away 7 μm/1km(7 μm are consumed per cutting material 1km blade outer diameters), 12 μm of spring side.
Embodiment three:Electroplating bath components and diamond content are as follows:
The Ni-based electroplating bath components include nickel sulfamic acid 350g/L, boric acid 30g/L, nickel chloride 7.5g/L, 2g/L 3 μm diamond, 30 μm of diamonds of 0.3g/L.Test:It is cut with cutting machine speed of mainshaft 30.0K/min, rate of feed 20mm/s It cuts PCB material blade and wears away 5 μm/1km, 10 μm of cutting spring side.
Example IV:Electroplating bath components and diamond content are as follows:
The Ni-based electroplating bath components include nickel sulfamic acid 350g/L, boric acid 30g/L, nickel chloride 7.5g/L, 4 g/L's 2 μm of diamonds, 20 μm of diamonds of 0.6g/L.Test:It is cut with cutting machine speed of mainshaft 25.0K/min, rate of feed 15mm/s It cuts PCB material blade and wears away 12 μm/1km, 8 μm of cutting spring side.
Embodiment five:Electroplating bath components and diamond content are as follows:
The Ni-based electroplating bath components include nickel sulfamic acid 350g/L, boric acid 30g/L, nickel chloride 7.5g/L, 2 g/L's 2 μm of diamonds, 15 μm of diamonds of 0.8g/L.Test:It is cut with cutting machine speed of mainshaft 20.0K/min, rate of feed 10mm/s It cuts PCB material blade and wears away 20 μm/1km, 5 μm of cutting spring side.
Embodiment six:Electroplating bath components and diamond content are as follows:
The Ni-based electroplating bath components include nickel sulfamic acid 350g/L, boric acid 30g/L, nickel chloride 7.5g/L, 3g/L 5 μm diamond, 45 μm of diamonds of 0.3g/L.Test:It is cut with cutting machine speed of mainshaft 35.0K/min, rate of feed 30mm/s It cuts PCB material blade and wears away 3 μm/1km, 15 μm of cutting spring side.
In implementation one to embodiment six, the Ni-based electroplating bath components include nickel sulfamic acid 350-600 g/L, boric acid 25-55g/L, nickel chloride 5-30g/L, the proportioning are conventional Ni-based electroplate liquid proportioning, are not unfolded to illustrate.In the present invention, mainly Coarse diamond is mixed into plating with fine grained diamond.Wherein, there is fine grained and thick in diamond and nickel-base plating coat Expect that two kinds of diamond particles, two kinds of diamond particles of fine grained and thick pellet are equipped in different proportions, fine grained diamond is protected Cutting quality is demonstrate,proved, coarse diamond ensure that cutting quality guarantee cutter hub rigidity and intensity, increase fine grained in coating From the two different diamond particles of thick pellet to meet the split requirement of different materials to be cut, cut and at the same time effectively being promoted Speed is cut, working efficiency is improved.
As described above, we are illustrated fully according to spirit of the invention, but the present invention is not limited to above-mentioned reality Apply example and implementation.The practitioner of correlative technology field can carry out different in the range of the license of the technological thought of the present invention Variation and implementation.

Claims (4)

1. a kind of preparation method of the ultra-thin Ni-based blade of composite diamond, it is characterised in that:Including:
One, to increase the 1-8 μm of diamond particles of 0.1-4 g/L in the Ni-based electroplate liquids of every 1L in coating bath, by plating trench bottom The electric stirring leaf of setting is kept stirring so that 1-8 μm of diamond uniform is distributed in coating bath in Ni-based electroplate liquid;
Two, the qualified matrix for preparing machining, which is added in fixture, passes through pre-treatment, is put into electroplating bath after the completion, using 1.5A Electric current is electroplated, and to increase the 10-50 μm of diamond particles of 0.1-1 g/L per hour in plating, and passes through electric stirring Leaf high-speed stirred, be electroplated 4 hours so that 1-8 μm and 10-50 μm of diamond particles be attached to matrix surface formed diamond and Nickel-base plating coat;
Three, the matrix of the diamond particles after the completion of being electroplated to being compounded with 1-8 μm and 10-50 μm takes out from fixture, machines Cylindrical grinding and lathe tool sword;
Four, it is packed into fixture after the completion of machining, is put into sodium hydroxide and goes out in sword liquid to use 80 DEG C of 10 ~ 15min of temperature immersion to complete Blade goes out the laggard mistake three of sword and washes, and is put into polishing fluid blade after completing polishing process using 32A electric currents 2min and machines.
2. the preparation method of the ultra-thin Ni-based blade of composite diamond according to claim 1, it is characterised in that:It is described Ni-based Electroplating bath components include nickel sulfamic acid 350-600 g/L, boric acid 25-55g/L, nickel chloride 5-30g/L.
3. the preparation method of the ultra-thin Ni-based blade of composite diamond according to claim 1, it is characterised in that:Base will be housed The step of fixture of body passes through pre-treatment:
(1), comprising sodium hydroxide, sodium carbonate, sodium metasilicate mixing alkaline etching solution in impregnates 2 minutes and by three wash;
(2), impregnated 1 minute in the pickling solution comprising nitric acid water mixed liquid after by three washing;
(3), impregnated 1-10 minutes in zinc dipping solution after by three washing.
4. the preparation method of the ultra-thin Ni-based blade of composite diamond according to claim 1, it is characterised in that:It is described electronic Paddle, which is that rate is adjustable, can realize the high electric stirring leaf to slowly run.
CN201610896446.6A 2016-10-14 2016-10-14 Ultra-thin Ni-based blade of composite diamond and preparation method thereof Active CN106521609B (en)

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108130583B (en) * 2018-03-07 2019-07-12 上海新阳半导体材料股份有限公司 A kind of electroplating liquid composition, preparation method and the application of ultra-thin saw blade
CN108411355B (en) * 2018-03-30 2020-04-03 郑州磨料磨具磨削研究所有限公司 Blade edging method for hub-type electroplated ultrathin diamond cutting blade
CN108588799B (en) * 2018-06-06 2020-04-14 郑州磨料磨具磨削研究所有限公司 Sand feeding device of electroplated grinding wheel and preparation method
CN108546939B (en) * 2018-06-29 2024-04-12 郑州晶研科技有限公司 Electrochemical machining process and tool for ultrathin hub type diamond dicing blade
CN109518259B (en) * 2018-12-30 2020-04-10 苏州赛尔科技有限公司 Nickel-copper composite electroplating hub type scribing cutter and application thereof
CN109623676B (en) * 2018-12-30 2020-08-25 苏州赛尔科技有限公司 Hub type diamond ultrathin cutting blade for PCB and application thereof
CN112746304B (en) * 2020-12-28 2022-04-12 赛尔科技(如东)有限公司 Hub type scribing cutter, preparation method thereof and application thereof in gallium arsenide material processing
CN112831813B (en) * 2020-12-30 2022-04-08 苏州赛尔科技有限公司 Multilayer concentration diamond scribing knife and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003225867A (en) * 2002-01-31 2003-08-12 Mitsubishi Materials Corp Thin blade grinding wheel
CN101602231A (en) * 2009-06-26 2009-12-16 江苏锋菱超硬工具有限公司 The preparation method of electroplating diamond fret saw
CN101633158A (en) * 2009-07-30 2010-01-27 苏州赛力精密工具有限公司 Diamond grinding wheel for cutting silicon crystal circle and preparation method thereof
JP4661025B2 (en) * 2003-04-02 2011-03-30 三菱マテリアル株式会社 Metal bond grindstone and manufacturing method thereof
CN102162118A (en) * 2011-04-08 2011-08-24 江苏技术师范学院 Manufacturing method of nickel-based diamond slice
CN103590091A (en) * 2013-11-21 2014-02-19 沈阳仪表科学研究院有限公司 Machining method of multilayer ultrathin diamond blade

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003225867A (en) * 2002-01-31 2003-08-12 Mitsubishi Materials Corp Thin blade grinding wheel
JP4661025B2 (en) * 2003-04-02 2011-03-30 三菱マテリアル株式会社 Metal bond grindstone and manufacturing method thereof
CN101602231A (en) * 2009-06-26 2009-12-16 江苏锋菱超硬工具有限公司 The preparation method of electroplating diamond fret saw
CN101633158A (en) * 2009-07-30 2010-01-27 苏州赛力精密工具有限公司 Diamond grinding wheel for cutting silicon crystal circle and preparation method thereof
CN102162118A (en) * 2011-04-08 2011-08-24 江苏技术师范学院 Manufacturing method of nickel-based diamond slice
CN103590091A (en) * 2013-11-21 2014-02-19 沈阳仪表科学研究院有限公司 Machining method of multilayer ultrathin diamond blade

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