CN106520003A - Thermal conductive graphite tape used for laptops - Google Patents

Thermal conductive graphite tape used for laptops Download PDF

Info

Publication number
CN106520003A
CN106520003A CN201610787557.3A CN201610787557A CN106520003A CN 106520003 A CN106520003 A CN 106520003A CN 201610787557 A CN201610787557 A CN 201610787557A CN 106520003 A CN106520003 A CN 106520003A
Authority
CN
China
Prior art keywords
graphite
film
kapton
pet film
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610787557.3A
Other languages
Chinese (zh)
Inventor
金闯
梁豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sidike New Materials Jiangsu Co Ltd
Original Assignee
Sidike New Materials Jiangsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sidike New Materials Jiangsu Co Ltd filed Critical Sidike New Materials Jiangsu Co Ltd
Priority to CN201610787557.3A priority Critical patent/CN106520003A/en
Publication of CN106520003A publication Critical patent/CN106520003A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/0427—Coating with only one layer of a composition containing a polymer binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/156—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is calendered and immediately laminated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/522—Graphite
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/66—Specific sintering techniques, e.g. centrifugal sintering
    • C04B2235/661—Multi-step sintering
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/12—Ceramic
    • C09J2400/123—Ceramic in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating

Abstract

The present invention discloses a thermal conductive graphite tape used for laptops. The tape contains a first thermal conductive adhesive layer, a graphite layer and a second thermal conductive adhesive layer. The graphite layer is prepared by the following technological method, and the method comprises the following steps: coating upper and lower surfaces of a polyimide film processed in step one with a layer of a graphite modifier to prepare a processed polyimide film; heating the processed polyimide film to 800 DEG C and keeping the temperature, and then raising the temperature to 1200 DEG C to prepare a prefired carbonized film; calendaring the prefired carbonized film obtained in step four by using a calender; raising the temperature to 2400 DEG C and keeping the temperature, and then raising the temperature to 2900 DEG C, so as to prepare a mainly fired graphite film; and calendaring the mainly fired graphite film obtained in step five to prepare the graphite layer. According to the invention, the tape is protected against local overheating, the uniformity of the thermal conductivity of the tape is achieved and the stability and reliability of heat dissipation performance of the product are improved in the meanwhile.

Description

For the conductive graphite adhesive tape of notebook computer
Technical field
The present invention relates to a kind of conductive graphite adhesive tape for notebook computer, belongs to double faced adhesive chip technology field.
Background technology
As modern microelectronic technology high-speed develops, electronic equipment（Such as notebook computer, mobile phone, panel computer etc.）Increasingly Become ultra-thin, light, this structure causes electronic equipment internal power density to significantly improve, the heat produced by operation is difficult Discharge, be easy to rapid accumulation and form high temperature.On the other hand, high temperature can reduce the performance of electronic equipment, reliability and use the longevity Life.Therefore, Current electronic industry proposes higher and higher requirement for the heat sink material as heat control system core component, urgently Need a kind of high-efficiency heat conduction, light material to transfer heat away from rapidly, ensure that electronic equipment normally runs.
In prior art, Kapton is mostly used for flexible PCB, although has and is obtained using polyimide film sintered Graphite heat radiation fin, so as to be covered on thermal source, but be constrained to Kapton product quality and performances the good and the bad not Together, the performance of the two-sided pad pasting heat dispersion of radiating has been had influence on, has there is following technical problem：Radiating is uneven, adhesive tape easily occurs Hot-spot, the heat dispersion that improve product is unstable, reliability performance is poor, is unfavorable for product quality management control, affects product Competitiveness.
The content of the invention
It is an object of the present invention to provide a kind of conductive graphite adhesive tape for notebook computer, this is used for leading for notebook computer Hot graphite glue band is both vertically and horizontally improve heat conductivility, it is to avoid adhesive tape hot-spot, realizes adhesive tape and leads Heat dispersion stability, the reliability of product while the uniformity of hot property, is improve, the cost of product is greatly reduced.
For reaching above-mentioned purpose, the technical solution used in the present invention is：A kind of conductive graphite glue for notebook computer Band, the two-sided pad pasting of the radiating are fitted between radiating piece and heat generating components, and the two-sided pad pasting of the radiating includes light strippable PET Film and re-release type PET film, be disposed between this light strippable PET film and re-release type PET film the first heat conduction adhesive layer, Graphite linings and the second heat conduction adhesive layer；The graphite linings are obtained by following process, and this process is comprised the following steps：
Step one, Kapton is risen to into 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature；
Step 2, one layer graphite modified dose is coated with the upper and lower surface of the Kapton through step one and is processed Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP；
The graphite modified dose of component by following weight portion is constituted：20 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 13 parts, 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, 3 parts of dimethyl silicone polymer；
Step 3, the Kapton after process is warming up to into 800 DEG C, 1200 DEG C are being warming up to after insulation, are being cooled down after insulation, So as to obtain the carbonized film of pre-burned；
Step 4, rolled using calender the step 4 pre-burned carbonized film；
Step 5,2400 DEG C are warming up to, after insulation, are warming up to 2900 DEG C again, cooled down after insulation, so as to obtain the graphite of main firing Film；
The graphite film of the main firing obtained by step 6 and then step 5 is rolled so as to obtain the graphite linings.
In above-mentioned technical proposal, further improved scheme is as follows：
1st, in such scheme, step 4 acquisition graphite film is carried out into calendering process.
2nd, in such scheme, the grammes per square metre of the light strippable PET film peeling force is 5 ~ 10g/m2, re-release type PET The grammes per square metre of film peeling force is 50 ~ 100g/m2。
As above-mentioned technical proposal is used, the present invention has following advantages and effect compared with prior art：
Conductive graphite adhesive tape of the present invention for notebook computer, in its structure, graphite linings are coated with one layer of stone by upper and lower surface The Kapton of black modifying agent is prepared from, and improves in heat conductivility both vertically and horizontally, it is to avoid adhesive tape Hot-spot, realizes the uniformity of adhesive tape heat conductivility；Secondly, its be located at graphite modified dose of Kapton surface by Benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, poly dimethyl silicon Oxygen alkane constitute, be coated on Kapton, the pin hole being filled with heating process, improve degree of crystallinity while, also overcome It is uneven caused by thermal contraction is excessive, improve graphite linings biaxial tension performance；Again, Kapton surface has stone Black modifying agent, improves graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and rolls the pre-burning using calender The carbonized film of system, it is to avoid the volume contraction in fold and graphitization sintering process, improves compactness and degree of crystallinity, further Improve in heat conductivility both vertically and horizontally.
Specific embodiment
With reference to embodiment, the invention will be further described：
Embodiment：A kind of conductive graphite adhesive tape for notebook computer, the two-sided pad pasting of the radiating fit in radiating piece 1 and send out Between thermal part 2, the two-sided pad pasting that radiates includes light strippable PET film 3 and re-release type PET film 4, this light strippable PET The first heat conduction adhesive layer 5, graphite linings 6 and the second heat conduction adhesive layer 7 is disposed between film 3 and re-release type PET film 4；Institute State graphite linings 6 to obtain by following process, this process is comprised the following steps：
Step one, Kapton is risen to into 250 DEG C with 4 ~ 6 degree/min speed from room temperature, kept for 0.9 ~ 1.1 hour, then With 2.5 ~ 3.5 degree/min, 400 DEG C are risen to, after being kept for 1 hour, be down to room temperature；
Step 2, one layer graphite modified dose is coated with the upper and lower surface of the Kapton through step one and is processed Kapton afterwards, the graphite modified dose of component by following weight portion are constituted, as shown in table 1：Benzophenone tetracid It is 20 parts of dianhydride, 13 parts of pyromellitic acid anhydride, 28 parts of MDA, 31 parts of dimethylformamide, 2 parts of ethylene glycol, poly- 3 parts of dimethyl siloxane；Graphite modified dose of viscosity is 45000CP.
Step 3,800 DEG C are risen to the speed of 4 ~ 6 degree/min, kept for 0.9 ~ 1.1 hour；Again with the speed of 9 ~ 11 degree/min Degree rises to 1200 DEG C, cools down, so as to obtain the carbonized film of pre-burned after preserving 0.9 ~ 1.1 hour；
Step 4, rolled using calender the step 4 pre-burned carbonized film；
Step 5,2400 DEG C are risen to the speed of 19 ~ 21 degree/min, kept for 0.9 ~ 1.1 hour, then with the speed of 19 ~ 21 degree/min Degree rises to 2900 DEG C, cools down, so as to obtain the graphite film of main firing after being kept for 1.8 ~ 2.2 hours；
The graphite film of the main firing obtained by step 6 and then step 5 is rolled so as to obtain the graphite linings 6.
Step 6 acquisition graphite linings are carried out into calendering process.
The grammes per square metre of above-mentioned light 1 peeling force of strippable PET film is 5 ~ 10g/m2, 2 peeling force of re-release type PET film gram Weight is 50 ~ 100g/m2。
During using above-mentioned conductive graphite adhesive tape for notebook computer, in its structure, graphite linings are applied by upper and lower surface The Kapton for covering one layer graphite modified dose is prepared from, and improves in heat conductivility both vertically and horizontally, Adhesive tape hot-spot is avoided, the uniformity of adhesive tape heat conductivility is realized；Secondly, which is located at the graphite on Kapton surface Modifying agent is by benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride, MDA, dimethylformamide, ethylene glycol, poly- Dimethyl siloxane is constituted, and is coated on Kapton, and the pin hole being filled with heating process improves degree of crystallinity same When, also overcome thermal contraction it is excessive caused by it is uneven, improve graphite linings biaxial tension performance；Again, Kapton Surface has graphite modified dose, improves graphite linings and heat conduction adhesive layer heat conductivility in two-sided pad pasting, and adopts calender pressure Prolong the carbonized film of the pre-burned, it is to avoid the volume contraction in fold and graphitization sintering process, improve compactness and knot Brilliant degree, further increases in heat conductivility both vertically and horizontally.
Above-described embodiment technology design only to illustrate the invention and feature, its object is to allow person skilled in the art Scholar will appreciate that present disclosure and implement according to this, can not be limited the scope of the invention with this.It is all according to the present invention Equivalence changes or modification that Spirit Essence is made, should all be included within the scope of the present invention.

Claims (3)

1. a kind of conductive graphite adhesive tape for notebook computer, the two-sided pad pasting of the radiating fit in radiating piece and heat generating components Between, the two-sided pad pasting of the radiating includes light strippable PET film and re-release type PET film, this light strippable PET film and re-release The first heat conduction adhesive layer, graphite linings and the second heat conduction adhesive layer is disposed between type PET film；It is characterized in that：The stone Layer of ink is obtained by following process, and this process is comprised the following steps：
Step one, Kapton is risen to into 250 DEG C from room temperature, after rising to 400 DEG C after insulation, be down to room temperature；
Step 2, one layer graphite modified dose is coated with the upper and lower surface of the Kapton through step one and is processed Kapton afterwards, described graphite modified dose of viscosity is 30000 ~ 48000CP；
The graphite modified dose of component by following weight portion is constituted：20 parts of benzophenone tetracarboxylic dianhydride, pyromellitic acid anhydride 13 parts, 28 parts of MDA, 30 ~ 35 parts of dimethylformamide, 1.5 ~ 2.5 parts of ethylene glycol, dimethyl silicone polymer 2 ~ 3 Part；
Step 3, the Kapton after process is warming up to into 800 DEG C, 1200 DEG C are being warming up to after insulation, are being cooled down after insulation, So as to obtain the carbonized film of pre-burned；
Step 4, rolled using calender the step 4 pre-burned carbonized film；
Step 5,2400 DEG C are warming up to, after insulation, are warming up to 2900 DEG C again, cooled down after insulation, so as to obtain the graphite of main firing Film；
The graphite film of the main firing obtained by step 6 and then step 5 is rolled so as to obtain the graphite linings.
2. the conductive graphite adhesive tape for notebook computer according to claim 1, it is characterised in that：By the step 4 Obtaining graphite linings carries out calendering process.
3. the conductive graphite adhesive tape for notebook computer according to claim 1, it is characterised in that：It is described light exfoliated The grammes per square metre of PET film peeling force is 5 ~ 10g/m2, the grammes per square metre of the re-release type PET film peeling force is 50 ~ 100g/m2。
CN201610787557.3A 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops Pending CN106520003A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610787557.3A CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410037378.9A CN103763892B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device
CN201610787557.3A CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410037378.9A Division CN103763892B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device

Publications (1)

Publication Number Publication Date
CN106520003A true CN106520003A (en) 2017-03-22

Family

ID=50531025

Family Applications (21)

Application Number Title Priority Date Filing Date
CN201610696862.1A Active CN106304780B (en) 2014-01-26 2014-01-26 Manufacturing process for high thermal conductivity graphite film
CN201610696475.8A Pending CN106318251A (en) 2014-01-26 2014-01-26 Manufacture method of thermal transfer film
CN201610700227.6A Pending CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product
CN201610787557.3A Pending CN106520003A (en) 2014-01-26 2014-01-26 Thermal conductive graphite tape used for laptops
CN201610777340.4A Pending CN106398566A (en) 2014-01-26 2014-01-26 Double-face pad pasting with heat radiation
CN201610696479.6A Pending CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610777536.3A Pending CN106349965A (en) 2014-01-26 2014-01-26 preparing method of heat-conducting adhesive tape for consumer electronic product
CN201610704135.5A Pending CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610696474.3A Pending CN106318250A (en) 2014-01-26 2014-01-26 Preparation process of thermal double-sided adhesive tape
CN201610705884.XA Pending CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610777537.8A Pending CN106398567A (en) 2014-01-26 2014-01-26 Pressure sensitive adhesive tape for notebook computer
CN201610777925.6A Active CN106427180B (en) 2014-01-26 2014-01-26 Preparation method for the two-sided pad pasting of soaking
CN201610787521.5A Pending CN106535560A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers
CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610705947.1A Active CN106304783B (en) 2014-01-26 2014-01-26 Thermal conductivity both-sided adhesive graphite flake
CN201610778259.8A Pending CN106634658A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop
CN201610777909.7A Pending CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
CN201610787504.1A Pending CN106520002A (en) 2014-01-26 2014-01-26 Heat-conducting pressure-sensitive double-sided tape
CN201410037378.9A Active CN103763892B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device
CN201610777339.1A Pending CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape

Family Applications Before (3)

Application Number Title Priority Date Filing Date
CN201610696862.1A Active CN106304780B (en) 2014-01-26 2014-01-26 Manufacturing process for high thermal conductivity graphite film
CN201610696475.8A Pending CN106318251A (en) 2014-01-26 2014-01-26 Manufacture method of thermal transfer film
CN201610700227.6A Pending CN106413340A (en) 2014-01-26 2014-01-26 Heat conducting adhesive film for electronic product

Family Applications After (17)

Application Number Title Priority Date Filing Date
CN201610777340.4A Pending CN106398566A (en) 2014-01-26 2014-01-26 Double-face pad pasting with heat radiation
CN201610696479.6A Pending CN106332521A (en) 2014-01-26 2014-01-26 Manufacturing method for double-sided adhesive graphite flake
CN201610777536.3A Pending CN106349965A (en) 2014-01-26 2014-01-26 preparing method of heat-conducting adhesive tape for consumer electronic product
CN201610704135.5A Pending CN106281087A (en) 2014-01-26 2014-01-26 Heat-conducting double-sided adhesive tape
CN201610696474.3A Pending CN106318250A (en) 2014-01-26 2014-01-26 Preparation process of thermal double-sided adhesive tape
CN201610705884.XA Pending CN106332522A (en) 2014-01-26 2014-01-26 High-heat-conductivity graphite film
CN201610794749.7A Pending CN106398570A (en) 2014-01-26 2014-01-26 High-compactness graphite soaking adhesive tape
CN201610777537.8A Pending CN106398567A (en) 2014-01-26 2014-01-26 Pressure sensitive adhesive tape for notebook computer
CN201610777925.6A Active CN106427180B (en) 2014-01-26 2014-01-26 Preparation method for the two-sided pad pasting of soaking
CN201610787521.5A Pending CN106535560A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting graphite paste films for flat computers
CN201610799197.9A Pending CN106381083A (en) 2014-01-26 2014-01-26 Isothermal pressure-sensitive adhesive tape used for intelligent mobile phones
CN201610705947.1A Active CN106304783B (en) 2014-01-26 2014-01-26 Thermal conductivity both-sided adhesive graphite flake
CN201610778259.8A Pending CN106634658A (en) 2014-01-26 2014-01-26 Manufacturing process for heat-conducting adhesive tape used for laptop
CN201610777909.7A Pending CN106366971A (en) 2014-01-26 2014-01-26 High-heat-conductivity double-sided adhesive tape
CN201610787504.1A Pending CN106520002A (en) 2014-01-26 2014-01-26 Heat-conducting pressure-sensitive double-sided tape
CN201410037378.9A Active CN103763892B (en) 2014-01-26 2014-01-26 Heat conduction graphite patch for microelectronic device
CN201610777339.1A Pending CN106349964A (en) 2014-01-26 2014-01-26 Process for preparing heat-conduction double-sided adhesive tape

Country Status (1)

Country Link
CN (21) CN106304780B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020155846A1 (en) * 2019-01-31 2020-08-06 常德力元新材料有限责任公司 Graphite adhesive tape and preparation method therefor

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106231865A (en) * 2016-07-29 2016-12-14 芜湖迈特电子科技有限公司 A kind of Novel heat-conducting graphite flake and manufacture method thereof
CN107473212A (en) * 2017-07-11 2017-12-15 广东思泉新材料股份有限公司 A kind of synthetic method of synthetic graphite and native graphite mixing coiled material
CN107266076A (en) * 2017-07-12 2017-10-20 合肥东恒锐电子科技有限公司 A kind of manufacturing process of the heat conduction pad pasting of mobile phone
CN107551392A (en) * 2017-08-29 2018-01-09 成都三乙医疗科技有限公司 A kind of thermal conducting piece for thermotherapy
CN107889341A (en) * 2017-11-01 2018-04-06 镇江博昊科技有限公司 A kind of unmanned plane circuit control panel and its manufacture method with the high guided membrane of electrographite
CN108249433B (en) * 2018-03-21 2023-04-07 无锡汉成新材料科技有限公司 Blowing device and production method of graphite film
CN108455580A (en) * 2018-04-04 2018-08-28 苏州天煜新材料科技有限公司 A kind of graphene film weblike material and preparation method thereof
CN109280501A (en) * 2018-08-22 2019-01-29 江苏博之高新材料科技有限公司 A kind of smart phone soaking pressure sensitive adhesive tape
CN109819629A (en) * 2019-01-16 2019-05-28 苏州世沃电子科技有限公司 A kind of fire-retardant crack resistance type graphite heat radiation fin and preparation method thereof
CN110092374A (en) * 2019-05-28 2019-08-06 宇冠芯龙(武汉)科技有限公司 A kind of preparation method and graphite film material of electrographite film
CN113853093A (en) * 2020-06-28 2021-12-28 昆山威斯泰电子技术有限公司 High-heat-conductivity soft cushion and preparation method thereof
CN113444499B (en) * 2021-06-25 2022-03-11 深圳市三科斯电子材料有限公司 Double-sided adhesive high-thermal-conductivity synthetic graphite flake and preparation method thereof
CN113880595B (en) * 2021-11-16 2023-03-28 江西鸿美新能源科技有限公司 Graphite film with high heat conductivity in vertical direction and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101289544A (en) * 2007-04-18 2008-10-22 宇部兴产株式会社 Process for producing polyimide film and polyimide film
CN103045119A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient
CN103043657A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Graphite radiation fin for adhesive tapes
CN103059758A (en) * 2012-12-18 2013-04-24 苏州斯迪克新材料科技股份有限公司 Heat conducting adhesive tape for electronic device and preparation method thereof
CN202936356U (en) * 2012-11-01 2013-05-15 斯迪克新型材料（江苏）有限公司 Double-sided adhesive for heat dissipation of electronic elements
CN103144387A (en) * 2007-05-17 2013-06-12 株式会社钟化 Graphite film and graphite composite film

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003261889A1 (en) * 2003-09-02 2005-03-29 Kaneka Corporation Filmy graphite and process for producing the same
CN2696285Y (en) * 2004-04-27 2005-04-27 天瑞企业股份有限公司 Radiation structure of elatroluminescent display element
WO2011007510A1 (en) * 2009-07-13 2011-01-20 パナソニック株式会社 Graphite sheet and heat transfer structure using same
KR101125266B1 (en) * 2010-02-17 2012-03-21 그린스타 주식회사 Heat radiating sheet comprising adhesives with improved heat conductivity
JP5460569B2 (en) * 2010-12-17 2014-04-02 株式会社カネカ Film-like graphite and method for producing the same
CN103415467B (en) * 2011-03-28 2015-04-22 株式会社钟化 Process for producing graphite film
CN103045199A (en) * 2011-10-13 2013-04-17 张彪 Process for preparing drilling fluid based on control of dosage of viscosity reducer
CN202322703U (en) * 2011-11-07 2012-07-11 吴志高 Adhesive tape with heat conduction performance
CN103059761B (en) * 2012-12-28 2014-09-03 斯迪克新型材料（江苏）有限公司 High-heat conductivity coefficient graphite heat-radiation adhesive tape
CN203181498U (en) * 2013-03-25 2013-09-04 深圳市跨越电子有限公司 A graphite film with high thermal conductivity
CN203243663U (en) * 2013-04-24 2013-10-16 常州碳元科技发展有限公司 High heat conductivity graphite film heat-dissipating structure applied to shell of electronic terminal
CN203289811U (en) * 2013-05-27 2013-11-13 苏州沛德导热材料有限公司 A graphite heat conduction and wave absorption device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101289544A (en) * 2007-04-18 2008-10-22 宇部兴产株式会社 Process for producing polyimide film and polyimide film
CN103144387A (en) * 2007-05-17 2013-06-12 株式会社钟化 Graphite film and graphite composite film
CN202936356U (en) * 2012-11-01 2013-05-15 斯迪克新型材料（江苏）有限公司 Double-sided adhesive for heat dissipation of electronic elements
CN103059758A (en) * 2012-12-18 2013-04-24 苏州斯迪克新材料科技股份有限公司 Heat conducting adhesive tape for electronic device and preparation method thereof
CN103045119A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Heat-dissipating double-sided adhesive tape with ultrahigh heat conductivity coefficient
CN103043657A (en) * 2012-12-28 2013-04-17 苏州斯迪克新材料科技股份有限公司 Graphite radiation fin for adhesive tapes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020155846A1 (en) * 2019-01-31 2020-08-06 常德力元新材料有限责任公司 Graphite adhesive tape and preparation method therefor

Also Published As

Publication number Publication date
CN106318251A (en) 2017-01-11
CN106398570A (en) 2017-02-15
CN106304780A (en) 2017-01-04
CN103763892B (en) 2017-01-11
CN106349965A (en) 2017-01-25
CN106349964A (en) 2017-01-25
CN106318250A (en) 2017-01-11
CN106398567A (en) 2017-02-15
CN106304780B (en) 2019-01-01
CN106535560A (en) 2017-03-22
CN106381083A (en) 2017-02-08
CN106634658A (en) 2017-05-10
CN106304783A (en) 2017-01-04
CN106427180B (en) 2018-09-18
CN103763892A (en) 2014-04-30
CN106398566A (en) 2017-02-15
CN106427180A (en) 2017-02-22
CN106413340A (en) 2017-02-15
CN106366971A (en) 2017-02-01
CN106332521A (en) 2017-01-11
CN106332522A (en) 2017-01-11
CN106281087A (en) 2017-01-04
CN106520002A (en) 2017-03-22
CN106304783B (en) 2019-01-01

Similar Documents

Publication Publication Date Title
CN106520003A (en) Thermal conductive graphite tape used for laptops
CN105969224B (en) Equal thermal bonding tape for electronic device
CN107043108B (en) Cooling fin manufacturing process for smart phone
CN106987214A (en) Radiating stone paster for electronic equipment
CN105038626B (en) Compound two-sided tape
CN106393842B (en) Stretch-proof graphite dissipates pad pasting

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170322