CN106502205A - A kind of engraving machine water-cooled main shaft temperature control system and control method - Google Patents
A kind of engraving machine water-cooled main shaft temperature control system and control method Download PDFInfo
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- CN106502205A CN106502205A CN201710015504.4A CN201710015504A CN106502205A CN 106502205 A CN106502205 A CN 106502205A CN 201710015504 A CN201710015504 A CN 201710015504A CN 106502205 A CN106502205 A CN 106502205A
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- 238000000034 method Methods 0.000 title claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000004065 semiconductor Substances 0.000 claims abstract description 34
- 230000005855 radiation Effects 0.000 claims abstract description 13
- 239000002826 coolant Substances 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 17
- 238000005057 refrigeration Methods 0.000 claims description 11
- 230000002159 abnormal effect Effects 0.000 claims description 5
- 239000013078 crystal Substances 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 230000000306 recurrent effect Effects 0.000 claims description 3
- 238000003754 machining Methods 0.000 abstract description 5
- 230000008602 contraction Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 3
- 101000629937 Homo sapiens Translocon-associated protein subunit alpha Proteins 0.000 description 2
- 101000629913 Homo sapiens Translocon-associated protein subunit beta Proteins 0.000 description 2
- 101000629921 Homo sapiens Translocon-associated protein subunit delta Proteins 0.000 description 2
- 101000697347 Homo sapiens Translocon-associated protein subunit gamma Proteins 0.000 description 2
- 102100026231 Translocon-associated protein subunit alpha Human genes 0.000 description 2
- 102100026229 Translocon-associated protein subunit beta Human genes 0.000 description 2
- 102100026226 Translocon-associated protein subunit delta Human genes 0.000 description 2
- 102100028160 Translocon-associated protein subunit gamma Human genes 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/406—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
- G05B19/4065—Monitoring tool breakage, life or condition
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37616—Use same monitoring tools to monitor tool and workpiece
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention relates to a kind of engraving machine water-cooled main shaft temperature control system and control method.The outlet of water-cooled main shaft enters mouth by the first connecting tube and water of radiation and is connected, the water of radiation outlet is connected with tank entry by the second connecting tube, the tank outlet is connected with electronic flowmeter entrance by the 3rd connecting tube, the electronic flowmeter outlet is connected with water circulating pump entrance by the 4th connecting tube, the water circulating pump outlet is connected with water-cooled spindle inlet by the 5th connecting tube, control system and semiconductor chilling plate, temperature sensor, electronic flowmeter connects, power module is used for being radiating module, semiconductor chilling plate, control system, electronic flowmeter, water circulating pump provides electric energy.The present invention can show and control the temperature of engraving machine water-cooled main shaft in real time so that temperature holding is constant in the course of the work for engraving machine water-cooled main shaft, so as to improve the impact that engraving machine water-cooled main shaft is caused to machining accuracy because of contraction that temperature change is produced.
Description
Technical field
The present invention relates to a kind of spindle cooling device, is related to a kind of engraving machine water-cooled main shaft temperature control system and controlling party
Method.
Background technology
Numerous studies show that, in the factors for affecting Digit Control Machine Tool machining accuracy, Thermal Error accounts for the 40% of machine tool error
~70%.And main shaft is then one of main pyrotoxin.The main shaft of most engraving machine lathe all adopts water-cooled main shaft at present.Carving
The life-span of water-cooled main shaft can be not only shortened in quarter machine water-cooled main shaft long-term work at high operating temperatures, and water-cooled main shaft is because of temperature change
Change the machining accuracy that the contraction for producing can have a strong impact on engraving machine.
Content of the invention
It is an object of the invention to provide a kind of engraving machine water-cooled main shaft temperature control system and control method, present invention system
System is not only rational in infrastructure, simple, and temperature control is accurate, cooling effect is efficient, maintenance management is convenient.
For achieving the above object, the technical scheme is that：A kind of engraving machine water-cooled main shaft temperature control system, including
Water-cooled main shaft, the first connecting tube, water of radiation row, the second connecting tube, water tank, the 3rd connecting tube, electronic flowmeter, the 4th connection
Pipe, water circulating pump, the 5th connecting tube, radiating module, semiconductor chilling plate, control system, temperature sensor and power module；Institute
The outlet for stating water-cooled main shaft enters mouth by the first connecting tube with the water of radiation and is connected, and the water of radiation outlet passes through second
Connecting tube is connected with the tank entry, and the tank outlet is connected with the electronic flowmeter entrance by the 3rd connecting tube,
Electronic flowmeter outlet is connected with the water circulating pump entrance by the 4th connecting tube, and the water circulating pump is exported and passes through the
Five connecting tubes are connected with water-cooled spindle inlet, the control system and the semiconductor chilling plate, temperature sensor, electronic flow
Meter connection, the power module are used for carrying for radiating module, semiconductor chilling plate, control system, electronic flowmeter, water circulating pump
For electric energy.
In an embodiment of the present invention, the control system include single-chip microcomputer and be connected with the single-chip microcomputer reset circuit,
Crystal oscillating circuit, key circuit, semiconductor refrigeration plate drive circuit, LCD display circuit, warning circuit；The key circuit includes
Four buttons, respectively function key, digital plus key, numeral subtract key and determination key
In an embodiment of the present invention, the single-chip microcomputer adopts STM32F103C8T6 chips.
In an embodiment of the present invention, the semiconductor refrigeration plate drive circuit includes first to fourth solid-state relay,
The first input end of the first solid-state relay, the first input end of the 4th solid-state relay are connected and are connected to STM32F103C8T6 cores
The PA9 pins of piece, the first input end of the second solid-state relay, the first input end of the 3rd solid-state relay are connected and are connected to
The PA8 pins of STM32F103C8T6 chips, the first outfan of the first solid-state relay, the second solid-state relay first defeated
Go out to hold to be connected and be connected to 15V power ends, the second outfan of the first solid-state relay, the first outfan phase of the 3rd solid-state relay
It is connected to the first end of the semiconductor chilling plate, the second outfan of the second solid-state relay, the of the 4th solid-state relay
One outfan is connected and is connected to the second end of the semiconductor chilling plate, the second input of first to fourth solid-state relay,
Second outfan of three solid-state relays, the second outfan of the 4th solid-state relay are connected to GND ends.
In an embodiment of the present invention, the radiating module includes radiator fan and aluminum radiating fin.
In an embodiment of the present invention, the semiconductor chilling plate is installed on above the radiating module.
In an embodiment of the present invention, the electronic flowmeter is used for whether detection normally to be followed from the coolant that water tank flows out
Ring.
In an embodiment of the present invention, the temperature sensor is installed on water-cooled main shaft, for detecting water-cooled main shaft temperature
Degree；The temperature sensor adopts DS18B20.
In an embodiment of the present invention, the power module includes 3.3V mu balanced circuits, 5V mu balanced circuits.
Present invention also offers a kind of control based on a kind of engraving machine water-cooled main shaft temperature control system described above
Method, comprises the steps,
S1：Start control system, setting by the key circuit of control system includes water-cooled main shaft temperature and water-cooled main shaft temperature
Degree warning bound parameter；
S2：Temperature sensor, electronic flowmeter detect water-cooled main shaft temperature, coolant recurrent state respectively and are transferred to control system
System；
S3：Control system control semiconductor chilling plate work, to ensure water-cooled main shaft in normal temperature, if water-cooled main shaft temperature
Exceed setting warning bound or coolant circulation is abnormal, then reported to the police by the warning circuit of control system.
Compared to prior art, the invention has the advantages that：
1st, compared to traditional engraving machine water-cooled spindle cooling device without temp. control function, this system adopts closed loop temperature control
System processed, can show and control the temperature of engraving machine water-cooled main shaft in real time；Ensure engraving machine process part when, water-cooled main shaft
Temperature keeps constant；
2nd, cool down by natural heat dissipation compared to the cooling of traditional engraving machine water-cooled spindle cooling device coolant, this system is relied on
Semiconductor chilling plate, water-cooled row and radiator fan radiate to coolant, and not only radiating efficiency is high, and works as ambient temperature mistake
Gao Shi, control system can control main shaft temperature below ambient temperature, so as to ensure that the machining accuracy of engraving machine；
3rd, open cycle water-cooling structure is used compared to traditional engraving machine water-cooled spindle cooling device, this system is using closing
Formula recirculated water cooling structure, whole water-cooling circulating system are completely closed, not there is a problem of that coolant is volatilized, and impurity cannot be introduced into following
Ring water-cooling system, therefore management service is convenient；
4th, the control system in engraving machine water-cooled main shaft cooling thermostatic control system can show main shaft temperature value in real time, work as main shaft
When temperature occurs abnormal, control system can send alarm signal, remind user to be processed in time；
5th, can be with Real Time Observation water passage circulation system equipped with electronic flowmeter in engraving machine water-cooled main shaft cooling thermostatic control system
Circulatory condition, when waterway circulating situation is abnormal, control system can send alarm signal, remind user to be located in time
Reason.
Description of the drawings
Fig. 1 is schematic structural view of the invention.
Fig. 2 is control system measurement and control of temperature structure chart.
Fig. 3 is STM32F103C8T6 single-chip microcomputers pinoutss of the present invention.
Fig. 4 is crystal oscillating circuit of the present invention, reset circuit figure.
Fig. 5 is power module circuitry schematic diagram of the present invention.
Fig. 6 is warning circuit schematic diagram of the present invention.
Fig. 7 is key circuit schematic diagram of the present invention.
Fig. 8 is semiconductor refrigeration plate drive circuit schematic diagram of the present invention.
Fig. 9 is LCD display circuit schematic diagram of the present invention.
Figure 10 is temperature sensor DS18B20 circuit theory diagrams of the present invention.
Figure 11 is electronic flowmeter schematic diagram of the present invention.
In figure：1- water-cooled main shafts；The first connecting tubes of 2-；The 5th connecting tubes of 3-；4- water circulating pumps；The 4th connecting tubes of 5-；6-
Electronic flowmeter；The 3rd connecting tubes of 7-；8- water tanks；The second connecting tubes of 9-；10- water of radiation is arranged；11- radiating modules；12- quasiconductors
Cooling piece；13- temperature sensors；14- control systems；15- power modules.
Specific embodiment
Below in conjunction with the accompanying drawings, technical scheme is specifically described.
As shown in figure 1, a kind of engraving machine water-cooled main shaft cools down thermostatic control system：Including water-cooled main shaft 1, the first connecting tube
2nd, water of radiation arrange the 10, second connecting tube 9, water tank 8, the 3rd connecting tube 7, electronic flowmeter 6, the 4th connecting tube 5, water circulating pump 4,
5th connecting tube 3, radiating module 11, semiconductor chilling plate 12, control system 14, temperature sensor 13 and power module 15.Institute
The outlet for stating water-cooled main shaft 1 is connected by the first connecting tube 2 and the water of radiation 10 entrances of row, and 10 outlet of water of radiation row is logical
Cross the second connecting tube 9 to be connected with 8 entrance of the water tank, the outlet of the water tank 8 is by the 3rd connecting tube 7 and the electronic flowmeter
6 entrances are connected, and the outlet of the electronic flowmeter 6 is connected with 4 entrance of the water circulating pump by the 4th connecting tube 5, the circulation
The outlet of water pump 4 is connected with 1 entrance of water-cooled main shaft by the 5th connecting tube 3；The radiating module 11 includes radiator fan and aluminium
Fan backing；The semiconductor chilling plate 12 is installed on above the radiating module 11；The electronic flowmeter 6 is used for detection from water
The coolant that case flows out（Coolant can adopt Hypon coolant 028872）Whether normal circulation；The temperature sensor 13 is installed
For measurement main shaft temperature in real time above main shaft；The temperature sensor adopts DS18B20.
As shown in figs. 2-11, the control system include single-chip microcomputer and be connected with the single-chip microcomputer reset circuit, crystal oscillator electricity
Road, key circuit, semiconductor refrigeration plate drive circuit, LCD display circuit, warning circuit, the single-chip microcomputer also with temperature sensor,
Electronic flowmeter connects.As shown in figure 3, the single-chip microcomputer adopts STM32F103C8T6 chips.As shown in fig. 7, key circuit bag
Four buttons are included, respectively function key, digital plus key, numeral subtracts key and determination key.For set temperature value, warning bound etc.
Parameter；Single-chip microcomputer controls semiconductor refrigeration chip heating or refrigeration by solid-state relay；Temperature sensor is used for measuring main shaft temperature
Degree；LCD display circuit is used for showing design temperature, observed temperature, alarm parameters etc.；Warning circuit is used for main shaft temperature exception feelings
The warning of condition.
As shown in fig. 6, the warning circuit is made up of resistance, audion, buzzer.
Power module 15 exports multiple DC voltages（As shown in Figure 5）, fan Hot-air fan respectively in radiating module 11, half
Conductor cooling piece 12, control system 14, electronic flowmeter 6, water circulating pump 4 provide power supply.
As shown in fig. 7, the semiconductor refrigeration plate drive circuit includes first to fourth solid-state relay（SSR1、SSR2、
SSR3、SSR4）, the first input end of the first solid-state relay, the first input end of the 4th solid-state relay are connected and are connected to
The PA9 pins of STM32F103C8T6 chips, the first input end of the second solid-state relay, the 3rd solid-state relay first defeated
Enter end and be connected to be connected to the PA8 pins of STM32F103C8T6 chips, the first outfan of the first solid-state relay, the second solid-state after
First outfan of electrical equipment is connected and is connected to 15V power ends, the second outfan of the first solid-state relay, the 3rd solid-state relay
First outfan is connected and is connected to the first end of the semiconductor chilling plate, and the second outfan of the second solid-state relay, the 4th consolidate
First outfan of state relay is connected and is connected to the second end of the semiconductor chilling plate, and the of first to fourth solid-state relay
Two inputs, the second outfan of the 3rd solid-state relay, the second outfan of the 4th solid-state relay are connected to GND ends.
Solid-state relay SSR1 and SSR4 conducting during refrigeration, semiconductor chilling plate red lead wire connect the positive black lead of power supply and connect
Power supply ground semiconductor chilling plate refrigeration；Solid-state relay SSR2 and SSR3 conducting during heating, semiconductor chilling plate red lead wire connect
Power supply ground black lead connects the positive semiconductor refrigeration chip heating of power supply.
Present system specific work process is as follows：
Before engraving machine workpieces, first pass through control system and set main shaft temperature, and the parameter such as main shaft temperature alarming bound,
After determining parameter, engraving machine water-cooled main shaft cooling thermostatic control system is started working, and water circulating pump is by coolant suction water-cooled master
In the water channel of axle, after coolant is flowed through in the water channel of water-cooled main shaft, the heat for taking away water-cooled main shaft enters water of radiation row, by peace
The semiconductor chilling plate of water of radiation row is mounted in, radiating and cooling is carried out to coolant, is then circulated again.Control system in the course of processing
Unite and main shaft temperature is gathered by the temperature sensor installed in water-cooled main shaft, then according to set temperature value and observed temperature value
Difference drives the control semiconductor chilling plate work of solid-state relay output control signal, when machining so as to precise control engraving,
The temperature constant of water-cooled main shaft.
Present invention also offers a kind of control based on a kind of engraving machine water-cooled main shaft temperature control system described above
Method, comprises the steps,
S1：Start control system, setting by the key circuit of control system includes water-cooled main shaft temperature and water-cooled main shaft temperature
Degree warning bound parameter；
S2：Temperature sensor, electronic flowmeter detect water-cooled main shaft temperature, coolant recurrent state respectively and are transferred to control system
System；
S3：Control system control semiconductor chilling plate work, to ensure water-cooled main shaft in normal temperature, if water-cooled main shaft temperature
Exceed setting warning bound or coolant circulation is abnormal, then reported to the police by the warning circuit of control system.
It is more than presently preferred embodiments of the present invention, all changes that is made according to technical solution of the present invention, produced function are made
During with scope without departing from technical solution of the present invention, protection scope of the present invention is belonged to.
Claims (10)
1. a kind of engraving machine water-cooled main shaft temperature control system, it is characterised in that：Including water-cooled main shaft, the first connecting tube, radiating
Water row, the second connecting tube, water tank, the 3rd connecting tube, electronic flowmeter, the 4th connecting tube, water circulating pump, the 5th connecting tube, dissipate
Thermal modules, semiconductor chilling plate, control system, temperature sensor and power module；The outlet of the water-cooled main shaft passes through first
Connecting tube enters mouth with the water of radiation and is connected, and the water of radiation outlet is by the second connecting tube and the tank entry phase
Even, the tank outlet is connected with the electronic flowmeter entrance by the 3rd connecting tube, and the electronic flowmeter outlet passes through
4th connecting tube is connected with the water circulating pump entrance, and the water circulating pump outlet is by the 5th connecting tube and water-cooled spindle inlet
It is connected, the control system is connected with the semiconductor chilling plate, temperature sensor, electronic flowmeter, the power module is used
In providing electric energy for radiating module, semiconductor chilling plate, control system, electronic flowmeter, water circulating pump.
2. a kind of engraving machine water-cooled main shaft temperature control system according to claim 1, it is characterised in that：The control system
System includes single-chip microcomputer and the reset circuit that be connected with the single-chip microcomputer, crystal oscillating circuit, key circuit, semiconductor chilling plate driving are electric
Road, LCD display circuit, warning circuit；The key circuit includes that four buttons, respectively function key, digital plus key, numeral subtract
Key and determination key.
3. a kind of engraving machine water-cooled main shaft temperature control system according to claim 2, it is characterised in that：The single-chip microcomputer
Using STM32F103C8T6 chips.
4. a kind of engraving machine water-cooled main shaft temperature control system according to claim 3, it is characterised in that：The quasiconductor
Refrigeration piece driving circuit includes first to fourth solid-state relay, the first input end of the first solid-state relay, the 4th solid-state after
The first input end of electrical equipment is connected and is connected to the PA9 pins of STM32F103C8T6 chips, the first input of the second solid-state relay
End, the first input end of the 3rd solid-state relay are connected and are connected to the PA8 pins of STM32F103C8T6 chips, the first solid-state relay
First outfan of device, the first outfan of the second solid-state relay are connected and are connected to 15V power ends, and the of the first solid-state relay
Two outfans, the first outfan of the 3rd solid-state relay are connected and are connected to the first end of the semiconductor chilling plate, the second solid-state
Second outfan of relay, the first outfan of the 4th solid-state relay are connected and are connected to the second of the semiconductor chilling plate
End, the second input of first to fourth solid-state relay, the second outfan of the 3rd solid-state relay, the 4th solid-state relay
The second outfan be connected to GND ends.
5. a kind of engraving machine water-cooled main shaft temperature control system according to claim 1, it is characterised in that：The radiating mould
Block includes radiator fan and aluminum radiating fin.
6. a kind of engraving machine water-cooled main shaft temperature control system according to claim 1, it is characterised in that：The quasiconductor
Cooling piece is installed on above the radiating module.
7. a kind of engraving machine water-cooled main shaft temperature control system according to claim 1, it is characterised in that：The electron stream
Gauge is used for coolant that detection flowed out from water tank whether normal circulation.
8. a kind of engraving machine water-cooled main shaft temperature control system according to claim 1, it is characterised in that：The temperature is passed
Sensor is installed on water-cooled main shaft, for detecting water-cooled main shaft temperature；The temperature sensor adopts DS18B20.
9. a kind of engraving machine water-cooled main shaft temperature control system according to claim 1, it is characterised in that：The power supply mould
Block includes 3.3V mu balanced circuits, 5V mu balanced circuits.
10. a kind of control method based on a kind of arbitrary described engraving machine water-cooled main shaft temperature control system of claim 1-9,
It is characterized in that：Comprise the steps,
S1：Start control system, setting by the key circuit of control system includes water-cooled main shaft temperature and water-cooled main shaft temperature
Degree warning bound parameter；
S2：Temperature sensor, electronic flowmeter detect water-cooled main shaft temperature, coolant recurrent state respectively and are transferred to control system
System；
S3：Control system control semiconductor chilling plate work, to ensure water-cooled main shaft in normal temperature, if water-cooled main shaft temperature
Exceed setting warning bound or coolant circulation is abnormal, then reported to the police by the warning circuit of control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710015504.4A CN106502205A (en) | 2017-01-10 | 2017-01-10 | A kind of engraving machine water-cooled main shaft temperature control system and control method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710015504.4A CN106502205A (en) | 2017-01-10 | 2017-01-10 | A kind of engraving machine water-cooled main shaft temperature control system and control method |
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Family
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| CN201710015504.4A Pending CN106502205A (en) | 2017-01-10 | 2017-01-10 | A kind of engraving machine water-cooled main shaft temperature control system and control method |
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| CN108723885A (en) * | 2018-08-06 | 2018-11-02 | 天长市永鑫制冷设备有限公司 | A kind of cooling device of air conditioner parts numerical control machine |
| CN110880433A (en) * | 2019-09-12 | 2020-03-13 | 江苏赛洋机电科技有限公司 | Cooling mode for main shaft of numerical control machine tool |
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Application publication date: 20170315 |