CN106488648A - A kind of circuit board cooling structure and electronic equipment - Google Patents
A kind of circuit board cooling structure and electronic equipment Download PDFInfo
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- CN106488648A CN106488648A CN201610854294.3A CN201610854294A CN106488648A CN 106488648 A CN106488648 A CN 106488648A CN 201610854294 A CN201610854294 A CN 201610854294A CN 106488648 A CN106488648 A CN 106488648A
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- circuit board
- components
- electronic devices
- heat dissipating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
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- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of circuit board cooling structure and electronic equipment, include circuit board main body and the edges of boards around the setting of circuit board main body periphery including described circuit board cooling structure, main heat dissipating layer is set on edges of boards, electronic devices and components are set on circuit board main body, electronic devices and components are adjacent to the main heat dissipating layer setting of edges of boards.Implement the embodiment of the present invention, electronic devices and components are arranged near edges of boards, in time the heat that electronic devices and components send can be distributed using main heat dissipating layer, prevent heat to be gathered in the middle part of circuit board main body and lead to radiating effect not good, and then the high problem of the complete machine temperature that leads to.In addition, because the circuit board cooling structure of the present invention is using arranging main heat dissipating layer on the edges of boards of circuit board main body, instead of existing using being directly sticked by the way of graphite radiating material combines Copper Foil and thermal grease on electronic devices and components surface, the surface thickness of electronic devices and components need not be increased, structure is simple, and integral thickness is relatively thin.
Description
Technical field
The present invention relates to circuit board technology field, more particularly, to a kind of circuit board cooling structure and electronic equipment.
Background technology
At present, because the structure space of intelligent wrist-watch is little, therefore the overall structure in arranging electronic device is more tight
Gather.When electronic device works, because overall space is less, so area of dissipation is little, thus leading to caloric value big, complete machine temperature
High；Especially when by 3G (3rd-Generation G mobile communication) and 4G, (4rd-Generation forth generation moves
Communication technology) chip application when intelligent wrist-watch, because this chip caloric value is bigger, therefore generally using conventional graphite
Heat sink material with reference to Copper Foil and thermal grease etc. mode film attach on IC surface.
However, adopting aforesaid way, although certain radiating effect can be played, due to intelligent this body structure of wrist-watch
Space is little, pastes graphite radiating material on IC surface and combines Copper Foil and thermal grease, substantially increases the thickness on IC surface, from
And occupying certain space, whole machine thickness increased it is impossible to meet the demand reducing thickness.
Content of the invention
The embodiment of the invention discloses a kind of circuit board cooling structure and electronic equipment, sent out with solving chip and electronic device
The high problem of complete machine temperature that heat leads to greatly.
Embodiment of the present invention first aspect discloses a kind of circuit board cooling structure, including：
Described circuit board cooling structure includes circuit board main body and the plate around the setting of described circuit board main body periphery
Side, described edges of boards is provided with main heat dissipating layer, described circuit board main body is provided with electronic devices and components, and described electronic devices and components are adjacent
The main heat dissipating layer setting of closely described edges of boards.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described circuit board main body is multilamellar
Plate, each laminate is sequentially overlapped setting, and the laminate positioned at top is wiring layer, and the laminate positioned at bottom is substrate layer, described electricity
Sub- components and parts are on described wiring layer.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described circuit board main body is bilayer
Plate, including substrate layer and be stacked at wiring layer on described substrate layer, described electronic devices and components are on described wiring layer, described
The cable hole being communicated to described substrate layer is provided with wiring layer, described electronic devices and components are extremely described via described cable hole cabling
Substrate layer.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described substrate layer is copper foil layer, and
Auxiliary heat dissipation layer is provided with described substrate layer.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described auxiliary heat dissipation layer is plated on
On described substrate layer.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described auxiliary heat dissipation layer is Copper Foil
Layer or nickel-gold layer.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described main heat dissipating layer and described base
Form heat dissipation path, the heat that described electronic devices and components send is transferred to described base material via described main heat dissipating layer between material layer
Layer, and distribute via described substrate layer.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described circuit board main body is bilayer
Plate, including substrate layer and be stacked at wiring layer on described substrate layer, described electronic devices and components are on described wiring layer, described
The cable hole being communicated to described substrate layer is provided with wiring layer, described electronic devices and components are extremely described via described cable hole cabling
Substrate layer.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described circuit board main body is five layers
Hardened structure, is respectively sequentially overlapped the first base material layer, the first signals layer, secondary signal layer, the second substrate layer and the wiring of setting
Layer, described the first base material layer and the second substrate layer are stratum.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described first signals layer and second
The cabling via of connection is provided with signals layer, the holding wire of described electronic devices and components is via described cabling via cabling.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described circuit board main body is ten layers
Hardened structure, is respectively sequentially overlapped the first base material layer of setting, the first signals layer, secondary signal layer, the second substrate layer, the 3rd letter
Number floor, the 3rd substrate layer, the 4th signals layer, the 5th signals layer, the 4th substrate layer and wiring layer, described the first base material layer, second
Substrate layer, the 3rd substrate layer and the 4th substrate layer are stratum.
As a kind of optional embodiment, in the first aspect of the embodiment of the present invention, described the first base material layer, second
Substrate layer, the 3rd substrate layer and the 4th substrate layer are copper foil layer, and described the first base material layer, the second substrate layer, the 3rd base material
Layer and the 4th substrate layer form heat dissipation path respectively with described main heat dissipating layer, the heat that the electronic devices and components of described wiring layer send
It is transferred to respectively, after described each heat dissipation path, shed via described the first base material layer via described main heat dissipating layer.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described first signals layer, the second letter
All offer, between number floor, the 3rd signals layer, the 4th signals layer and the 5th signals layer, the cabling via being interconnected, so that described
The holding wire of electronic devices and components can be via described cabling via cabling.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described electronic devices and components are extremely described
The distance between edges of boards are 1.5mm～3.0mm.
As a kind of optional embodiment, in embodiment of the present invention first aspect, described edges of boards are copper foil layer, described
Main heat dissipating layer is nickel-gold layer, and described main heat dissipating layer is plated on described edges of boards；Or
Described edges of boards are copper foil layer, and described main heat dissipating layer is graphite linings, and described main heat dissipating layer is attached on described edges of boards.
As a kind of optional embodiment, in embodiment of the present invention first aspect, the thickness of described main heat dissipating layer is
2.03um～8.12um.
Embodiment of the present invention second aspect discloses a kind of electronic equipment, and described electronic equipment includes equipment body and as above
The circuit board cooling structure stated, described circuit board cooling structure is in the housing of equipment body.
Compared with prior art, the embodiment of the present invention has the advantages that：
(1) good heat dissipation effect.The circuit board cooling structure that the present invention provides, by the edges of boards of circuit board main body periphery
It is provided with main heat dissipating layer, electronic devices and components are arranged near edges of boards, in time electronic devices and components can be sent using main heat dissipating layer
Heat distributed, prevent heat to be gathered in the middle part of circuit board main body and lead to radiating effect not good, and then the whole machine leading to
The high problem of temperature.
(2) structure is simple, and integral thickness is relatively thin.The circuit board cooling structure of the present invention is using the edges of boards in circuit board main body
The main heat dissipating layer of upper setting, instead of existing using directly combining Copper Foil and dissipate in the electronic devices and components surface graphite radiating material that is sticked
The mode of hot silica gel, need not increase the surface thickness of electronic devices and components, and structure is simple, and integral thickness is relatively thin.
(3) processing technique is simple.The circuit board cooling structure of the present invention is using setting master on the edges of boards of circuit board main body
Heat dissipating layer, therefore, when being processed technique to circuit board main body, therefore, processing technique is simple, is conducive to saving processing
Processing procedure.
Brief description
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, below by use required in embodiment
Accompanying drawing be briefly described it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ability
For the those of ordinary skill of domain, on the premise of not paying creative work, can also be obtained other attached according to these accompanying drawings
Figure.
Fig. 1 is the structural representation of circuit board cooling structure disclosed in the embodiment of the present invention one；
Fig. 2 is the cross-sectional view of Fig. 1；
Fig. 3 is the cross-sectional view of the circuit board cooling structure that the embodiment of the present invention two provides；
Fig. 4 is the cross-sectional view of the circuit board cooling structure that the embodiment of the present invention three provides；
Fig. 5 is the cross-sectional view of the circuit board cooling structure that the embodiment of the present invention four provides.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on this
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of not making creative work
Apply example, broadly fall into the scope of protection of the invention.
The embodiment of the invention discloses a kind of circuit board cooling structure and electronic equipment, can solve the problem that existing electronic equipment
Internal electronic component caloric value is big and the not good problem of radiating effect.
Circuit board cooling structure provided in an embodiment of the present invention, including circuit board main body and around circuit board main body week
The edges of boards of edge setting, this edges of boards are provided with main heat dissipating layer, this circuit board main body are provided with electronic devices and components, this electronics unit device
Part is adjacent to the main heat dissipating layer setting of this edges of boards.
In the present embodiment, this circuit board main body can be lamina or multi-layer sheet.
When this circuit board main body is lamina, this circuit board main body only includes wiring layer, and this electronic devices and components is located at this
On wiring layer, this main heat dissipating layer is on the edges of boards of this wiring layer.
When this circuit board main body is multi-layer sheet, each laminate is sequentially overlapped setting, and the laminate positioned at top is wiring layer,
Laminate positioned at bottom is substrate layer, and this electronic devices and components is on wiring layer.
Specifically, this substrate layer be copper foil layer, i.e. this substrate layer as stratum, in order to the cabling of this electronic devices and components
And signal transmission.Auxiliary heat dissipation layer is provided with this substrate layer, with the heat that produces when this electronic devices and components via this substrate layer
When distributing, the purpose accelerated radiating, strengthen radiating effect can be played using this auxiliary heat dissipation layer.Preferably, this auxiliary
Heat dissipating layer can be copper foil layer or nickel-gold layer, this auxiliary heat dissipation layer also electrodepositable on this substrate layer, to guarantee this auxiliary heat dissipation layer
Firmly it is attached on this substrate layer.
When being radiated, between this main heat dissipating layer and substrate layer, form heat dissipation path, the heat that electronic devices and components send
It is transferred to this substrate layer via this main heat dissipating layer, and is distributed by this substrate layer, with reaching, electronic devices and components are radiated
Purpose.
Below with reference to accompanying drawing, circuit board cooling structure provided in an embodiment of the present invention is described in detail.
Embodiment one
See also Fig. 1 and Fig. 2, the structural representation of the circuit board cooling structure 10 providing for the embodiment of the present invention one
Figure.This circuit board cooling structure 10 includes circuit board 11 and the edges of boards 12 around the setting of this circuit board main body 11 periphery, should
Main heat dissipating layer 12a is provided with edges of boards 12, this circuit board main body 11 is provided with electronic devices and components 11a, and this electronic devices and components
11a is adjacent to the main heat dissipating layer 12a setting of this edges of boards 12.By the way of on the edges of boards 12 of circuit board, main heat dissipating layer 12a is set,
Then by electronic devices and components 11a adjacent to this main heat dissipating layer 12a setting, thus when this electronic devices and components 11a work gives out heat
When, by this main heat dissipating layer 12a, this heat can be distributed such that it is able to be avoided this electronic devices and components 11a in heat of high temperature
Lower work and the failure problems that are likely to result in.
Specifically, as shown in Fig. 2 this circuit board main body 11 is lamina, including wiring layer 11b, this electronic devices and components 11a
It is arranged on this wiring layer 11b, and this wiring layer 11b is copper foil layer.It is understood that in other embodiment, this circuit board
Main body 11 can be also multi-layer sheet, and when this circuit board main body 11 is multi-layer sheet, each laminate is sequentially overlapped setting, positioned at top
Laminate is above-mentioned wiring layer 11b, and this electronic devices and components 11a is on this wiring layer 11b.Laminate positioned at bottom is substrate layer,
And auxiliary heat dissipation layer is provided with this substrate layer.For example, when described circuit board main body be multi-layer sheet when, its can for doubling plate, three
Laminate, four laminates, five laminates or more laminate etc..
In the present embodiment, this electronic devices and components 11a is CPU (CPU), and this electronic devices and components 11a can pass through
Surface mounting technology (SMT) is sticked on this wiring layer 11b.Preferably, this electronic devices and components 11a to the distance of this edges of boards 12 is
1.5mm～3.0mm is such that it is able to enable the heat that electronic devices and components 11a sends in time by the main radiating on edges of boards 12
Layer 12a distributes, and improves radiating efficiency.Preferably, this this electronic devices and components 11a to this edges of boards 12 distance be 1.5mm or
3mm, with the main heat dissipating layer 12a near this edges of boards 12, and then is conducive to radiating.It is understood that in other embodiments, should
Electronic devices and components 11a also can be arranged according to actual cloth member situation to the distance of this edges of boards 12.
In the present embodiment, this edges of boards 12 is copper foil layer, and this main heat dissipating layer 12a covers on this edges of boards 12.
Further, this main heat dissipating layer 12a is nickel-gold layer, and this main heat dissipating layer 12a is plated on this edges of boards 12.This main radiating
Layer 12a is using nickel-gold layer and by the way of being plated on this edges of boards 12 it can be ensured that this main heat dissipating layer 12a attachment on this edges of boards 12
It is also possible to make the better heat-radiation effect of this main heat dissipating layer 12a while ability, and then be conducive to improving this heat dissipation for circuit board knot
The integral heat sink effect of structure 10.Preferably, the thickness of this main heat dissipating layer 12a is 2.03um～8.12um, wherein, dissipates because this is main
Thermosphere 12a is nickel-gold layer, and therefore, in plating, the thickness of the nickel dam of its plating is 2um～8um, the thickness of the layer gold of its plating
For 0.03um～0.12um.Therefore, the thickness of this main heat dissipating layer 12a can be 2.03um, 3um, 4um, 5um, 6um, 8.12um etc..
It is understood that in other embodiments, the thickness of this main heat dissipating layer 12a also can arrange according to the actual requirements thicker,
For example, 2um～9um etc..
As the another embodiment of the present embodiment, this main heat dissipating layer 12a can be also graphite linings, this main heat dissipating layer 12a
It is attached on this edges of boards 12.By the way of graphite linings, similarly can play radiating effect, meanwhile, using the side of graphite linings
Formula can be easy to the processing of this main heat dissipating layer 12a and this edges of boards 12, and processing technique is simple.
The circuit board cooling structure 10 that the embodiment of the present invention one provides, by main heat dissipating layer 12a is arranged on edges of boards 12, so
Afterwards electronic devices and components 11a is arranged adjacent to this edges of boards 12, thus this electronic devices and components 11a can be sent out by this main heat dissipating layer 12a
The heat going out distributes.Additionally, by control this main heat dissipating layer 12a thickness so that this circuit board cooling structure 10 whole
Body thickness, in tolerance interval, substitutes and existing leads to whole using being directly sticked heat sink material on electronic devices and components 11a surface
The mode that individual board structure of circuit thickness increases, structure is simple and radiating effect is good.
Embodiment two
Refer to Fig. 3, the structural representation of the circuit board cooling structure 20 providing for the embodiment of the present invention two.The present invention is real
The difference applying example two with embodiment one is：
This circuit board main body 21 is doubling plate, including substrate layer 21a and be stacked at wiring layer 21b on this substrate layer 21a,
Electronic devices and components 21c is on this wiring layer 21b, and is provided with, on this wiring layer 21b, the cable hole being communicated to this substrate layer 21a
(not shown), this electronic devices and components 21c is via this cable hole cabling to this substrate layer 21a.
Specifically, this substrate layer 21a is copper foil layer, and this substrate layer 21a is stratum, to guarantee this electronic devices and components 21c
Signal transmission.The main heat dissipating layer 22a of this substrate layer 21a and this edges of boards 22 forms heat dissipation path, in order to by electronic devices and components
The heat that 21c sends is distributed in time.
Further, in order to improve the radiating effect of this circuit board cooling structure 20 further, this substrate layer 21a is arranged
There is auxiliary heat dissipation layer 211, this auxiliary heat dissipation layer 211 is graphite linings, copper foil layer or cupro-nickel layer gold.This auxiliary heat dissipation layer 211 and plate
Form heat dissipation path (as shown by arrows in FIG.) between the main heat dissipating layer 22a on side 22, thus this electronic devices and components 21c is sent
Heat is transferred to this auxiliary heat dissipation layer 211 via this main heat dissipating layer 22a, and then distributes heat via this auxiliary heat dissipation layer 211
Go out.Form the mode of heat dissipation path using auxiliary heat dissipation layer 211 plus main heat dissipating layer 22a, this circuit can be improved further
The radiating effect of plate radiator structure 20.
Preferably, the thickness of this auxiliary heat dissipation layer 211 can be arranged according to the actual requirements, for example 2um～10um.Certainly, should
The thickness of auxiliary heat dissipation layer 211 can be also 2.03um～8.12um with the consistency of thickness of this main heat dissipating layer 22a.
The circuit board cooling structure 20 that the embodiment of the present invention two provides, is doubling plate by arranging this circuit board main body 21,
And auxiliary heat dissipation layer 211 is set on substrate layer 21a, this main heat dissipating layer 22a is helped further using this auxiliary heat dissipation layer 211
Radiated, thus greatly increasing the radiating effect of circuit board cooling structure 20.
Embodiment three
Refer to Fig. 4, the cross-sectional view of the circuit board cooling structure 30 providing for the embodiment of the present invention three.The present invention
It is in place of embodiment three and the difference of the embodiment of the present invention two：
This circuit board main body 31 is five laminates, is respectively sequentially overlapped the first base material layer 311, first signals layer of setting
312nd, secondary signal layer 313, the second substrate layer 314 and wiring layer 315, this first base material layer 311 and this second substrate layer 314 are equal
For stratum, electronic devices and components 315a is on this wiring layer 315.
In the present embodiment, this first base material layer 311 and the second substrate layer 314 are copper foil layer, to realize as stratum
While meeting cabling, the heat that also as heat dissipating layer, this electronic devices and components 315a can be sent distributes.Specifically, this
One substrate layer 311 and the second substrate layer 314 form heat dissipation path, this electronic devices and components with the main heat dissipating layer 32a of this edges of boards 32
The heat that 315a sends is transferred to this second substrate layer 314 and this first base material layer 311 via this main heat dissipating layer 32a, and via
This first base material layer 311 distributes.
Further, this first base material layer 311 is provided with auxiliary heat dissipation layer 311a, the material of this auxiliary heat dissipation layer 311a
For Copper Foil or nickel gold.This auxiliary heat dissipation layer 311a can strengthen the radiating effect of this first base material layer 311 further, therefore, when
When heat transfer is to this first base material layer 311, can quickly in time heat be given out by this auxiliary heat dissipation layer 311a
Go, be conducive to improving the radiating effect of this first base material layer 311.Preferably, this auxiliary heat dissipation layer 311a can be using the side of plating
Formula is plated on this first base material layer 311, so that it is guaranteed that this auxiliary heat dissipation layer 311a is firmly attached to this first base material all the time
On layer 311.
Further, for the ease of the cabling of this electronic devices and components 315a, in this first signals layer 312 and secondary signal layer
Be provided with cable hole (not shown) between 313 so that the holding wire of electronic devices and components can via described cabling via cabling, with
Realize signal transmission.
The radiator structure 30 of the circuit board that the embodiment of the present invention three provides, is five layers by arranging this circuit board main body 31
Plate, then utilizes this first base material floor 311 and the second substrate layer 314 to form radiating road with the main heat dissipating layer 32a on this edges of boards 32
The radiator structure of this circuit board, such that it is able to the heat sending electronic devices and components 315a in time is distributed in time, is improved in footpath
30 radiating effect.Additionally, arranging auxiliary heat dissipation layer 311a using on the first base material layer 311, can further enhance this
The radiating effect of one substrate layer 311.
Example IV
Refer to Fig. 5, the cross-sectional view of the circuit board cooling structure 40 providing for the embodiment of the present invention four.The present invention
It is in place of example IV and the difference of the embodiment of the present invention three：
This circuit board main body 41 is ten laminates, is respectively sequentially overlapped the first base material layer 411, first signals layer of setting
412nd, secondary signal layer 413, the second substrate layer 414, the 3rd signals layer 415, the 3rd substrate layer 416, the 4th signals layer 417,
Five signals layers 418, the 4th substrate layer 419 and wiring layer 420, this first base material layer 411, the second substrate layer 414, the 3rd substrate layer
416 and the 4th substrate layer 419 be stratum.
In the present embodiment, this first base material layer 411, the second substrate layer 414, the 3rd substrate layer 416 and the 4th substrate layer
419 are copper foil layer, and this first base material layer 411, the second substrate layer 414, the 3rd substrate layer 416 and 419 points of the 4th substrate layer
Not with this edges of boards formation heat dissipation path (as shown by arrows in FIG.), the heat warp that the electronic devices and components 420a of wiring layer 420 sends
It is transferred to respectively after heat dissipation path by this edges of boards 42, shed via the first base material layer 411.Specifically, this first base material layer 411,
Second substrate layer 414, the 3rd substrate layer 416 and the 4th substrate layer 419 respectively with this edges of boards 42 on main heat dissipating layer 42a formed scattered
Hot path, thus after this electronic devices and components 420a gives off heat, this electronic devices and components 420a can be sent out by this main heat dissipating layer 42a
The heat going out is transferred to the 4th substrate layer 419, the 3rd substrate layer 416, the second substrate layer 414 successively up to this first base material layer
411, and then distribute.Simultaneously as this first base material layer 411, the second substrate layer 414, the 3rd substrate layer 416 and the 4th base
Material layer 419 is copper foil layer, therefore, is respectively provided with certain radiating effect, thus when heat via the 4th substrate layer 419, the
Three substrate layers 416, the second substrate layer 414 and this first base material layer 411 are successively disperseed, therefore, it is possible to avoid heat to concentrate
Situation around this electronic devices and components 420a, radiating effect is good.
Further, auxiliary heat dissipation layer 411a is provided with this first base material layer 411, and this auxiliary heat dissipation layer 411a
Material is Copper Foil or nickel gold.This auxiliary heat dissipation layer 411a can strengthen the radiating effect of this first base material layer 411 further, because
Heat, when in heat transfer to this first base material layer 411, can quickly be dissipated in time by this by this auxiliary heat dissipation layer 411a
Send out, be conducive to improving the radiating effect of this first base material layer 411.Preferably, this auxiliary heat dissipation layer 411a can be using plating
Mode be plated on this first base material layer 411, so that it is guaranteed that this auxiliary heat dissipation layer 411a be firmly attached to all the time this first
On substrate layer 411.
This first signals layer 412, secondary signal layer 413, the 3rd signals layer 415, the 4th signals layer 417 and the 5th signals layer
The cabling via (not shown) being interconnected all is offered, so that the holding wire of electronic devices and components 420a can be via between 418
Described cabling via cabling, to realize signal transmission.
The circuit board cooling structure 40 that the embodiment of the present invention four provides, is ten laminates by arranging this circuit board main body 41,
Then the part interval in setting the first base material layer 411, the second substrate layer 414, the 3rd substrate layer 416 and the 4th substrate layer 419
It is arranged between each signals layer, make this first base material layer 411, the second substrate layer 414, the 3rd substrate layer 416 and simultaneously
Four substrate layers 419 are copper foil layer, and as stratum such that it is able to realize signal normal transmission, and this first base can be utilized
The main heat dissipating layer 42a of material layer 411, the second substrate layer 414, the 3rd substrate layer 416 and the 4th substrate layer 419 and edges of boards 42 forms scattered
Hot path, and then the heat that the electronic devices and components 420a on the wiring layer 420 at top is sent distributes.
Additionally, the embodiment of the present invention additionally provides a kind of electronic equipment with foregoing circuit plate radiator structure (not scheming
Show), this electronic equipment includes equipment body and above-mentioned circuit board cooling structure, and this equipment body includes housing, this circuit board
Radiator structure is contained in the housing of this equipment body.
Circuit board cooling structure provided in an embodiment of the present invention and electronic equipment, by the edges of boards in circuit board main body periphery
On be provided with main heat dissipating layer, by electronic devices and components near edges of boards arrange, in time electronic devices and components can be sent out using main heat dissipating layer
The heat going out is distributed, and prevents heat to be gathered in the middle part of circuit board main body and leads to radiating effect not good, so lead to whole
The high problem of machine temperature.Further, since the circuit board cooling structure of the present invention is using setting master on the edges of boards of circuit board main body
Heat dissipating layer, instead of existing using directly combining Copper Foil and thermal grease in the electronic devices and components surface graphite radiating material that is sticked
Mode, need not increase the surface thickness of electronic devices and components, and structure is simple, and integral thickness is relatively thin.
Above circuit board cooling structure a kind of disclosed in the embodiment of the present invention and electronic equipment are described in detail, this
Apply specific case in literary composition the principle of the present invention and embodiment are set forth, the explanation of above example is only intended to
Help understand circuit board cooling structure and its core concept of the present invention；Simultaneously for one of ordinary skill in the art, foundation
The thought of the present invention, all will change in specific embodiments and applications, and in sum, this specification content is not
It is interpreted as limitation of the present invention.
Claims (16)
1. a kind of circuit board cooling structure it is characterised in that described circuit board cooling structure include circuit board main body and around
In the edges of boards of described circuit board main body periphery setting, described edges of boards are provided with main heat dissipating layer, described circuit board main body is arranged
There are electronic devices and components, described electronic devices and components are adjacent to the main heat dissipating layer setting of described edges of boards.
2. circuit board cooling structure according to claim 1 is it is characterised in that described circuit board main body is multi-layer sheet, often
One laminate is sequentially overlapped setting, and the laminate positioned at top is wiring layer, and the laminate positioned at bottom is substrate layer, described electronics unit device
Part is on described wiring layer.
3. circuit board cooling structure according to claim 2 is it is characterised in that described substrate layer is copper foil layer and described
Auxiliary heat dissipation layer is provided with substrate layer.
4. circuit board cooling structure according to claim 3 is it is characterised in that described auxiliary heat dissipation layer is plated on described base
On material layer.
5. the circuit board cooling structure according to claim 3 or 4 is it is characterised in that described auxiliary heat dissipation layer is copper foil layer
Or nickel-gold layer.
6. the circuit board cooling structure according to Claims 2 or 3 is it is characterised in that described main heat dissipating layer and described base material
Form heat dissipation path, the heat that described electronic devices and components send is transferred to described substrate layer via described main heat dissipating layer between layer,
And distribute via described substrate layer.
7. the circuit board cooling structure according to Claims 2 or 3 it is characterised in that described circuit board main body be doubling plate,
Including substrate layer and be stacked at wiring layer on described substrate layer, described electronic devices and components on described wiring layer, described cloth
The cable hole being communicated to described substrate layer is provided with line layer, described electronic devices and components are via described cable hole cabling to described base
Material layer.
8. the circuit board cooling structure according to Claims 2 or 3 is it is characterised in that described circuit board main body is five laminates
Structure, is respectively sequentially overlapped the first base material layer, the first signals layer, secondary signal layer, the second substrate layer and the wiring layer of setting,
Described the first base material layer and the second substrate layer are stratum.
9. circuit board cooling structure according to claim 8 is it is characterised in that described first signals layer and secondary signal layer
On be provided with the cabling via of connection, the holding wire of described electronic devices and components is via described cabling via cabling.
10. the circuit board cooling structure according to Claims 2 or 3 is it is characterised in that described circuit board main body is ten laminates
Structure, is respectively sequentially overlapped the first base material layer of setting, the first signals layer, secondary signal layer, the second substrate layer, the 3rd signal
Layer, the 3rd substrate layer, the 4th signals layer, the 5th signals layer, the 4th substrate layer and wiring layer, described the first base material layer, the second base
Material layer, the 3rd substrate layer and the 4th substrate layer are stratum.
11. circuit board cooling structures according to claim 10 are it is characterised in that described the first base material layer, the second base material
Layer, the 3rd substrate layer and the 4th substrate layer are copper foil layer, and described the first base material layer, the second substrate layer, the 3rd substrate layer and
4th substrate layer forms heat dissipation path respectively with described main heat dissipating layer, the heat that the electronic devices and components of described wiring layer send via
After described main heat dissipating layer is transferred to described each heat dissipation path respectively, shed via described the first base material layer.
12. circuit board cooling structures according to claim 10 are it is characterised in that described first signals layer, secondary signal
All offer, between layer, the 3rd signals layer, the 4th signals layer and the 5th signals layer, the cabling via being interconnected, so that described electricity
The holding wire of sub- components and parts can be via described cabling via cabling.
13. circuit board cooling structures according to claim 1 are it is characterised in that described electronic devices and components are to described edges of boards
The distance between be 1.5mm～3.0mm.
14. circuit board cooling structures according to claim 1 to 13 any one are it is characterised in that described edges of boards are copper
Layers of foil, described main heat dissipating layer is nickel-gold layer, and described main heat dissipating layer is plated on described edges of boards；Or
Described edges of boards are copper foil layer, and described main heat dissipating layer is graphite linings, and described main heat dissipating layer is attached on described edges of boards.
15. circuit board cooling structures according to claim 1 are it is characterised in that the thickness of described main heat dissipating layer is
2.03um～8.12um.
16. a kind of electronic equipments are it is characterised in that described electronic equipment includes equipment body and as any in claim 1 to 15
Circuit board cooling structure described in one, described circuit board cooling structure is in the housing of equipment body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610854294.3A CN106488648A (en) | 2016-09-26 | 2016-09-26 | A kind of circuit board cooling structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610854294.3A CN106488648A (en) | 2016-09-26 | 2016-09-26 | A kind of circuit board cooling structure and electronic equipment |
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| CN106488648A true CN106488648A (en) | 2017-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610854294.3A Pending CN106488648A (en) | 2016-09-26 | 2016-09-26 | A kind of circuit board cooling structure and electronic equipment |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109639947A (en) * | 2018-12-25 | 2019-04-16 | 维沃移动通信有限公司 | Camera module and terminal device |
| CN112822876A (en) * | 2020-12-28 | 2021-05-18 | 广州广合科技股份有限公司 | Printed circuit board embedded with three-dimensional metal base and processing method thereof |
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| JPH10223809A (en) * | 1997-02-07 | 1998-08-21 | Denki Kagaku Kogyo Kk | Power module |
| CN103079364A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board |
| CN105527752A (en) * | 2015-12-25 | 2016-04-27 | 厦门天马微电子有限公司 | Backlight module and display device thereof |
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- 2016-09-26 CN CN201610854294.3A patent/CN106488648A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10223809A (en) * | 1997-02-07 | 1998-08-21 | Denki Kagaku Kogyo Kk | Power module |
| CN103079364A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board |
| CN105527752A (en) * | 2015-12-25 | 2016-04-27 | 厦门天马微电子有限公司 | Backlight module and display device thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109639947A (en) * | 2018-12-25 | 2019-04-16 | 维沃移动通信有限公司 | Camera module and terminal device |
| CN112822876A (en) * | 2020-12-28 | 2021-05-18 | 广州广合科技股份有限公司 | Printed circuit board embedded with three-dimensional metal base and processing method thereof |
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