CN106486727B - Microstrip isolation structure for reducing crosstalk - Google Patents
Microstrip isolation structure for reducing crosstalk Download PDFInfo
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- CN106486727B CN106486727B CN201510522296.8A CN201510522296A CN106486727B CN 106486727 B CN106486727 B CN 106486727B CN 201510522296 A CN201510522296 A CN 201510522296A CN 106486727 B CN106486727 B CN 106486727B
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Abstract
The invention discloses a micro-strip isolation structure for reducing crosstalk, which comprises a micro-strip line, a first dielectric layer and a second dielectric layer, wherein the micro-strip line is provided with a plurality of grooves which are periodically arranged; and one of the two resistors is connected with one end of the microstrip line, the other one of the two resistors is connected with the other end of the microstrip line, and the two resistors are both grounded, wherein the plurality of grooves are periodically arranged on the outer side of the microstrip line in a sub-wavelength mode, the arrangement period length of the plurality of grooves is far shorter than the wavelength of a transmission signal generated by external crosstalk outside the adjacent microstrip line in the sub-wavelength mode, and the plurality of grooves are used for inhibiting the permeation of electromagnetic waves.
Description
Technical Field
A microstrip structure, especially a microstrip structure for isolating adjacent transmission lines.
Background
In recent years, in high frequency circuits or digital high speed systems, with the increase of signal transmission rate and the smaller external dimensions of electronic components, the electronic circuits are more densely arranged, and the frequency of microwave circuits is also increased. Therefore, crosstalk between lines is becoming more and more serious. Crosstalk (crosstalk) is caused by an electromagnetic coupling that affects adjacent transmission lines when a signal is transmitted through a transmission channel (transmission channel), and an upper coupling voltage and a coupling current are added to the disturbed signal. The too large crosstalk will affect the working efficiency of the system, even cause circuit false triggering, and further cause the system to be unable to work normally. In addition, in a main board or a high-speed circuit, if an electronic circuit needs to be turned according to an actual design, crosstalk is often suppressed by increasing the interval between microstrip lines or increasing the rising and falling of a digital signal, but the problem of crosstalk cannot be effectively solved.
In view of the fact that the conventional method does not effectively solve the problem of crosstalk between lines, it is desirable to provide a novel isolation microstrip line structure for isolating crosstalk between microstrip lines and reducing the conversion effect of differential-mode to common-mode conversion.
Disclosure of Invention
The invention mainly takes the edge etching sub-wavelength periodic ripple of the traditional microstrip line and connects a resistor matched with the periodic microstrip line group reactance as an isolation transmission line. Because the microstrip line leads the edge current into the groove to form an approximate closed loop, the self-inductance of the circuit is favorably improved, the magnetic field is restrained near a self lead, and the crosstalk caused by mutual inductance to the adjacent traditional microstrip line can be effectively reduced. Along with the difference of the structure and the depth inside the groove, different constraint effects are generated on the magnetic field, and the isolation effect of the two traditional microstrip lines is also influenced. Because the coupling quantity of signals between the sub-wavelength periodic line and the traditional microstrip line is very small, and the coupled signals can be led into the grounding plate through the resistor connected with the sub-wavelength periodic metal line, two microstrip lines or strip lines which normally transmit signals can be effectively isolated. The microstrip line with the periodic structure can be a microstrip line with a single grounding plane or a strip line structure with the upper part and the lower part grounded.
The present invention relates generally to a microstrip line isolation circuit, and more particularly to a microstrip line isolation circuit, which includes a microstrip line, a ground line, a.
The invention aims to provide a microstrip isolation structure for reducing crosstalk, which comprises a microstrip line, a microstrip line and a microstrip line, wherein the microstrip line is provided with a plurality of grooves which are periodically arranged; and one of the two resistors is connected with one end of the microstrip line, the other resistor is connected with the other end of the microstrip line, and both the two resistors are grounded, wherein the plurality of grooves are periodically arranged on the outer side of the microstrip line in a sub-wavelength mode, the sub-wavelength mode is that the arrangement period length of the plurality of grooves is far shorter than the wavelength of a transmission signal generated by external crosstalk outside the adjacent microstrip line, and the plurality of grooves are used for inhibiting the penetration of electromagnetic waves.
In an embodiment of the present invention, the plurality of grooves are periodically arranged outside the microstrip line in a sub-wavelength manner, and the plurality of grooves have the following two arrangement manners: are periodically arranged at two corresponding outer sides of the microstrip line and are periodically arranged at a single outer side of the microstrip line.
In an embodiment of the invention, the plurality of groove structures are structures in which a rectangular concave body is periodically arranged in combination with a rectangular convex body.
In an embodiment of the invention, the groove structure has a rectangular concave body combined with a rectangular convex body, and the plurality of groove structures are continuous periodic structures, and at the opening of each groove, each rectangular convex body has two first extending portions extending in parallel to the center of each groove.
In an embodiment of the present invention, the plurality of groove structures are hairpin structures, each hairpin structure has a plurality of Z-shaped protrusions and is a continuous periodic structure, and the plurality of Z-shaped protrusions includes:
a first extending part which is arranged at the opening of each groove and extends to the center of each groove in parallel; and
a second extending part, which is arranged at the middle section of each Z-shaped convex body and extends to the center of each groove in parallel;
wherein, the extending directions of the first extending part and the second extending part are opposite.
In an embodiment of the invention, the plurality of groove structures are continuous and periodic structures having a plurality of J-shaped protrusions, and the J-shaped protrusions have a hook-shaped portion and are bent toward the inner side of the groove.
In an embodiment of the invention, the groove structure has a rectangular concave body combined with a rectangular convex body, and the plurality of groove structures are continuous periodic structures, and at the opening of each groove, each rectangular convex body has a first extending portion extending in parallel to the center of each groove.
In an embodiment of the invention, the groove structure is a cross-shaped structure and has a bottom groove at the bottom of the groove, the groove structure further has a rectangular concave body combined with a rectangular convex body, and the plurality of groove structures are continuous periodic structures, and at the opening of each groove, each rectangular convex body has two first extending portions extending in parallel to the center of each groove.
In an embodiment of the present invention, two resistors are matched with the microstrip line.
Drawings
FIG. 1 is a first embodiment of a two-sided groove having a rectangular concave in combination with a rectangular convex structure;
FIG. 2 is a second embodiment of the two outer grooves having bi-directional first elongated member structures;
FIG. 3 is a top and side view of a second embodiment of two lateral grooves with bi-directional first elongated member structures;
FIG. 4 is a third embodiment in which the two outer recesses have a hairpin configuration;
FIG. 5 is a top and side view of a third embodiment with hairpin formations in the two outer grooves;
FIG. 6 is a fourth embodiment in which the two outer grooves have a J-shaped protrusion configuration;
figure 7 is a fifth embodiment of a one-way first elongate member configuration with two outboard grooves;
FIG. 8 is a sixth embodiment in which the two outer grooves have a cruciform configuration;
fig. 9 is a top view and a side view of a seventh embodiment in which two outer grooves have a rectangular concave combined with a rectangular convex structure and are located between two microstrip lines for transmission;
fig. 10 is a top view and a side view of an eighth embodiment in which two outer grooves have a rectangular concave combined with a rectangular convex structure and are located between differential microstrip lines for transmission;
figure 11 is a ninth embodiment of a single outboard slot having a unidirectional first elongated member configuration;
figure 12 is a tenth embodiment of a single outboard slot having a bi-directional first elongate member configuration;
FIG. 13 is an eleventh embodiment of a single outboard groove having a rectangular concavity in combination with a rectangular convexity configuration;
FIG. 14 is a twelfth embodiment of a single outboard groove having a J-shaped protrusion configuration;
FIG. 15 is a thirteenth embodiment with a single outer recess having a hairpin configuration;
fig. 16 is a simulation result of S-parameters of two microstrip lines having an isolation structure, wherein the isolation structure is a seventh embodiment in which two outer grooves in fig. 9 have a rectangular concave body combined with a rectangular convex body structure and are located between two microstrip lines for transmission;
fig. 17 shows a fourteenth embodiment of an isolation structure, in which two outer grooves have a rectangular concave combined with a rectangular convex structure and are located between a set of smooth differential microstrip lines for transmission and one smooth microstrip line, in top and side views;
fig. 18 is a result of S-parametric simulation in which an isolated microstrip line is introduced in a microstrip line and a differential line, wherein the isolation structure is the fourteenth embodiment in fig. 17.
Description of reference numerals: 11-a microstrip line; 111-differential microstrip line; 15-rectangular concave body; 16-rectangular convex body; 17-a first extension; 18-a second extension; 20-Z-shaped convex bodies; 21-a substrate; 30-J shaped convex body; 31-hook-shaped part; 51-a groove; 53-bottom groove; 55-resistance; 61-a first port; 62-a second port; 63-a third port; 64-a fourth port; a-sub-wavelength period microstrip on-line single-packet opening width; a1, a2, a3, a4, a6, a 7-groove relative dimensions; b-the groove depth of the periodic microstrip line; b1, b2, b3, b4, b5, b6, b7, b 8-groove corresponding dimensions; w-microstrip line width; w1, W2, W3, W4-the spacing dimension of the microstrip lines; d-period length of the periodic microstrip line; h-substrate height; t-the thickness of the metal layer; r-dielectric constant.
Detailed Description
The first embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is an embodiment in which the two outer grooves 51 have a structure of combining the rectangular concave body 15 and the rectangular convex body 16, as shown in fig. 1, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The plurality of grooves 51 are periodically arranged on two corresponding outer sides of the microstrip line 11 in a sub-wavelength manner, the plurality of grooves 51 are a structure in which a rectangular concave body 15 is periodically arranged and a rectangular convex body 16 is combined, on the sub-wavelength periodic microstrip line 11, the width of a single-packet opening of a single groove 51 is a, the width of a microstrip line is w, the period length of the periodic microstrip line is d, and the groove depth of the periodic microstrip line is b.
The second embodiment of the microstrip isolation structure for reducing crosstalk provided by the present invention is an embodiment in which the two outer grooves 51 have bidirectional first extending part structures, as shown in fig. 2, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The plurality of grooves 51 are periodically arranged on two corresponding outer sides of the microstrip line 11 in a sub-wavelength manner, the plurality of grooves 51 have a continuous periodic structure formed by combining a rectangular concave body 15 and a rectangular convex body 16, and each rectangular convex body 16 has two first extending portions 17 extending in parallel towards the center of each groove 51 at the opening of each groove 51. On the sub-wavelength periodic microstrip line 11, the width of the single-packet opening of the single groove 51 is a, the width of the microstrip line is w, the period length of the periodic microstrip line 11 is d, the groove depth of the periodic microstrip line is b, and the corresponding dimension b2 of the groove 51 is the thickness of the first extension portion 17. Fig. 3 shows the enlarged grooves 51 on both outer sides of fig. 2, with the first bi-directional extension structure in top and side views. The upper end is shown in top view and the lower end in side view in fig. 3, with groove 51 having corresponding dimension b2 being the thickness of first extension 17, groove 51 having corresponding dimension b1 being the depth of the groove within groove 51, groove 51 having corresponding dimension a6 being the extended length of first extension 17, and groove 51 having corresponding dimension a7 being the width of the bottom of groove 51. The lower end shown in fig. 3 is a side view, from bottom to top, the grounded metal layer has a thickness dimension t, the substrate having a dielectric constant r has a height h, the uppermost layer is a microstrip line 11 for reducing crosstalk, the microstrip line has a width w, the metal layer of the microstrip line 11 has a thickness dimension t, and the substrate 21.
The third embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is an embodiment in which the two outer grooves 51 have hairpin structures, and as shown in fig. 4, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The structure that the grooves 51 are periodically arranged on two corresponding outer sides of the microstrip line 11 in a sub-wavelength mode, the structure is provided with a plurality of Z-shaped convex bodies 20 and is in a continuous periodic structure, and the Z-shaped convex bodies 20 comprise a first extension part 17, a second extension part and a third extension part, wherein the first extension part is arranged at the opening of each groove 51 and extends towards the center of each groove 51 in parallel; and a second extension part 18 extending in parallel to the center of each groove 51 at the middle section of each Z-shaped protrusion 20; the extending directions of the first extending portion 17 and the second extending portion 18 are opposite. On the sub-wavelength periodic microstrip line 11, the width of the single-packet opening of the single groove 51 is a, the width of the microstrip line is w, the period length of the periodic microstrip line is d, and the groove depth of the periodic microstrip line is b. Fig. 5 is a top view and a side view of the enlarged two outer grooves 51 of fig. 4 with a hairpin structure, and fig. 5 is a top view of the upper end, where a corresponding dimension b3 of the groove 51 is the thickness of the second extension portion 18 and the first extension portion 17 in the groove depth direction, a corresponding dimension b4 of the groove 51 is the distance between the second extension portion 18 and the first extension portion 17, and a corresponding dimension b4 of the groove 51 is also the distance between the second extension portion 18 and the bottom of the groove 51. The width a of the single-pack opening of the single groove 51 is shown in fig. 5 as a corresponding dimension a2 of the groove 51, the spacing between the second extension 18 and the side of the groove 51 is a1, the corresponding dimension a3 of the groove 51 is the width of the bottom of the groove 51, and a4 is the distance between one side of the opening a2 and the side of the root of the first extension 17. The lower end shown in fig. 5 is a side view, from bottom to top, the grounded metal layer has a thickness dimension t, the substrate having a dielectric constant r has a height h, the uppermost layer is a microstrip line 11 for reducing crosstalk, the microstrip line has a width w, the metal layer of the microstrip line 11 has a thickness dimension t, and the substrate 21.
The fourth embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is an embodiment in which the two outer grooves 51 have a J-shaped protrusion 30 structure, as shown in fig. 6, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The plurality of grooves 51 are periodically arranged on the corresponding two outer sides of the microstrip line 11 in a sub-wavelength manner, and the J-shaped protrusion 30 has a hook portion 31 bent toward the inner side of the groove 51. On the sub-wavelength periodic microstrip line 11, the width of the single opening of the single groove 51 is a, the width of the microstrip line is w, the period length of the periodic microstrip line is d, the groove depth of the periodic microstrip line is b, the corresponding dimension b5 of the groove 51 is the groove depth inside the J-shaped protrusion 30, and the corresponding dimension b6 of the groove 51 is the depth of inward bending of the hook portion 31 of the J-shaped protrusion 30.
The fifth embodiment of the microstrip isolation structure for reducing crosstalk provided by the present invention is an embodiment in which two outer grooves 51 have a unidirectional first elongated structure, and as shown in fig. 7, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The plurality of grooves 51 are periodically arranged on two corresponding outer sides of the microstrip line 11 in a sub-wavelength manner, the plurality of grooves 51 have a continuous periodic structure in which a rectangular concave body 15 is combined with a rectangular convex body 16, and each rectangular convex body 16 has a first extending portion 17 extending in parallel to the center of each groove 51 at the opening of each groove 51. On the sub-wavelength periodic microstrip line 11, the width of the single-packet opening of the single groove 51 is a, the width of the microstrip line is w, the period length of the periodic microstrip line is d, the groove depth of the periodic microstrip line is b, and the corresponding dimension b2 of the groove 51 is the thickness of the first extension portion 17.
The sixth embodiment of the microstrip isolation structure for reducing crosstalk provided by the present invention is an embodiment in which the two outer grooves 51 have a cross-shaped structure, and as shown in fig. 8, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The plurality of grooves 51 are periodically arranged on the two corresponding outer sides of the microstrip line 11 in a sub-wavelength manner, the plurality of grooves 51 are cross-shaped, and have a bottom groove 53 at the bottom of the groove 51, and a rectangular concave body 15 is combined with a rectangular convex body 16 and is in a continuous periodic structure, and at the opening of each groove 51, each rectangular convex body 16 has two first extending parts 17 extending in parallel towards the center of each groove 51. On the sub-wavelength periodic microstrip line 11, the width of the single-packet opening of the single groove 51 is a, the width of the microstrip line is w, the period length of the periodic microstrip line is d, the depth from the inside of the periodic microstrip line 11 to the bottom groove 53 is b, the corresponding dimension b7 of the groove 51 is the thickness of the first extension portion 17, and the corresponding dimension b8 of the groove 51 is the groove width of the groove 51 located on the lower side of the first extension portion 17.
A seventh embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is shown in fig. 9, in which a microstrip line 11 with an isolation structure is located between microstrip lines 11 for transmitting signals at upper and lower sides, one end of the microstrip line 11 for transmitting signals at the upper side has a first port 61, and the other end has a second port 62; the microstrip line 11 for transmitting signals on the lower side has a third port 63 at one end and a fourth port 64 at the other end. Electromagnetic energy crosstalk generated by the microstrip line 11 for transmitting signals at the upper side can cause serious crosstalk to the microstrip line 11 at the lower side without passing through the microstrip isolation structure for reducing crosstalk provided by the invention, but the crosstalk of the microstrip line 11 for transmitting signals at the upper side to the microstrip line 11 at the lower side can be effectively inhibited by the microstrip isolation structure for reducing crosstalk provided by the invention, so that the microstrip isolation structure for reducing crosstalk provided by the invention has the functions of isolating and reducing electromagnetic energy crosstalk. Fig. 9 shows a microstrip isolation structure for reducing crosstalk, in which two outer grooves 51 in the first embodiment have a structure of combining a rectangular concave body 15 and a rectangular convex body 16, and as shown in the top view of fig. 9, the width of a single-packet opening of a single groove 51 is a, the period length of a periodic microstrip line is d, the groove depth of the periodic microstrip line is b, the space size of a microstrip line 11 is W1, which is the distance between an upper-side transmission signal microstrip line 11 and the microstrip line 11 of the isolation structure provided by the present invention. The gap size of the microstrip line 11 is W2, which is the distance between the microstrip line 11 for transmitting signals at the lower side and the microstrip line 11 of the isolation structure provided by the invention. The side view of the lower end shown in fig. 9 shows, from bottom to top, the thickness of the grounded metal layer is t, the height of the substrate with the dielectric constant r is h, the isolation structure at the uppermost layer is a microstrip line 11 for reducing crosstalk, the width of the microstrip line is w, and the thickness of the metal layer of the microstrip line 11 is t. However, in the microstrip line 11 for transmitting signals in the seventh embodiment, the microstrip isolation structure for reducing crosstalk provided by the present invention may be any one of the structures in fig. 1 to 8 and the first to sixth embodiments, or may be any one of the structures in fig. 11 to 15 and the ninth to thirteenth embodiments described below.
An eighth embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is shown in fig. 10, in which a microstrip line with an isolation structure is located between differential microstrip lines 111 for transmitting signals on upper and lower sides, the differential microstrip line 111 has two microstrip lines 11, one of the microstrip lines 11 (the first microstrip line) transmits a first transmission signal; and another microstrip line 11 (second microstrip line) parallel to the microstrip line 11 (first microstrip line) and configured to transmit a second transmission signal, where the second transmission signal and the first transmission signal are complementary signals with a phase difference of 180 °. One end of the differential microstrip line 111 for transmitting signals on the upper side is provided with a first port 61, and the other end is provided with a second port 62; the differential microstrip line 111 for transmitting signals on the lower side has a third port 63 at one end and a fourth port 64 at the other end. Electromagnetic energy crosstalk generated by the differential microstrip line 111 for transmitting signals on the upper side will cause significant crosstalk to the differential microstrip line 111 on the lower side without passing through the microstrip isolation structure for reducing crosstalk provided by the present invention. However, the crosstalk of the differential microstrip line 111 on the upper side for transmitting signals to the differential microstrip line 111 on the lower side is suppressed by the microstrip isolation structure for reducing crosstalk provided by the present invention, so the microstrip isolation structure for reducing crosstalk provided by the present invention has the specific effects of isolating and reducing electromagnetic energy crosstalk. As shown in fig. 10, in the microstrip isolation structure for reducing crosstalk, in the top view of the upper end shown in fig. 10, the width of the single-packet opening of the single groove 51 is a, the period length of the periodic microstrip line is d, and the groove depth of the periodic microstrip line is b. The gap dimension of the microstrip line 11 is W1, which is the gap between the differential microstrip lines 111 for signal transmission on the upper side. The gap size of the microstrip line 11 is W2, which is the distance between the differential microstrip line 111 for signal transmission on the upper side and the microstrip line 11 of the isolation structure provided by the invention. The gap dimension of the microstrip line 11 is W3, which is the distance between the differential microstrip line 111 for transmitting signals at the lower side and the microstrip line 11 of the isolation structure provided by the invention. The gap dimension of the microstrip line 11 is W4, which is the gap between the differential microstrip lines 111 for transmitting signals on the lower side. The side view of the lower end shown in fig. 10 shows, from bottom to top, the thickness of the grounded metal layer is t, the height of the substrate with the dielectric constant r is h, the middle isolation structure at the uppermost layer is the microstrip line 11 for reducing crosstalk, the microstrip line width of the isolation structure is w, and the differential microstrip line width of the transmission signal is w. The differential microstrip line 111 for transmitting signals is arranged on two sides of the uppermost layer, and the thickness of the metal layer of the microstrip line 11 is t. However, the microstrip isolation structure for reducing crosstalk provided by the present invention is located in the differential microstrip line 111 for transmitting signals in the eighth embodiment, and may be any one of the structures in fig. 1 to 8 and the first to sixth embodiments, or any one of the structures in fig. 11 to 15 and the ninth to thirteenth embodiments.
The ninth embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is an embodiment in which the single outer groove 51 has a unidirectional first elongated portion structure, and as shown in fig. 11, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The plurality of grooves 51 are a structure periodically arranged on one side of the microstrip line 11 in a sub-wavelength manner, and the groove 51 of the ninth embodiment has the same structure as that of the fifth embodiment except that the ninth embodiment is a groove 51 having a single outer side, and the fifth embodiment is a groove 51 having two outer sides.
The tenth embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is an embodiment in which the single outer groove 51 has a bidirectional first extended portion structure, and as shown in fig. 12, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The plurality of grooves 51 are a structure periodically arranged on one side of the microstrip line 11 in a sub-wavelength manner, and the groove 51 of the tenth embodiment has the same structure as that of the second embodiment except that the tenth embodiment has a groove 51 having a single outer side, and the second embodiment has grooves 51 having two outer sides.
The eleventh embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is an embodiment in which the single outer groove 51 has a structure in which the rectangular concave body 15 is combined with the rectangular convex body 16, as shown in fig. 13, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The plurality of grooves 51 are periodically arranged in a sub-wavelength manner on one side of the microstrip line 11, and the groove 51 of the eleventh embodiment has the same structure as that of the first embodiment except that the eleventh embodiment is a groove 51 having a single outer side, and the first embodiment is a groove 51 having two outer sides.
The twelfth embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is an embodiment in which the single outer groove 51 has a J-shaped protrusion 30 structure, and as shown in fig. 14, the microstrip isolation structure includes a microstrip line 11 and two resistors 55. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The plurality of grooves 51 are a structure that is periodically arranged on one side of the microstrip line 11 in a sub-wavelength manner, and the structure of the grooves 51 in the twelfth embodiment is the same as that in the fourth embodiment, except that the twelfth embodiment is a groove 51 having a single outer side, and the fourth embodiment is a groove 51 having two outer sides.
A thirteenth embodiment of the microstrip isolation structure for reducing crosstalk according to the present invention is an embodiment in which the single outer groove 51 has a hairpin structure, as shown in fig. 15, the microstrip isolation structure includes a microstrip line 11 and two resistors 55, both of the resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11. The microstrip line 11 has a plurality of grooves 51 arranged periodically; and one of the resistors 55 is connected to one end of the microstrip line 11, and the other resistor 55 is connected to the other end of the microstrip line 11. The plurality of grooves 51 are a structure that is periodically arranged on one side of the microstrip line 11 in a sub-wavelength manner, and the groove 51 of the thirteenth embodiment has the same structure as that of the third embodiment except that the thirteenth embodiment is a groove 51 having a single outer side, and the third embodiment is a groove 51 having two outer sides.
The microstrip isolation structure for reducing crosstalk is periodically arranged outside the microstrip line in a sub-wavelength mode through the plurality of grooves, the sub-wavelength mode is that the arrangement period length of the plurality of grooves is far shorter than the wavelength of a transmission signal generated by external crosstalk outside the adjacent microstrip line, and the plurality of grooves are used for inhibiting the penetration of electromagnetic waves and the sub-wavelength constraint of electromagnetic fields so as to block the crosstalk generated by the outside. For the microstrip isolation structure for reducing crosstalk provided by the present invention, the source of crosstalk generated from the outside may be generated by a microstrip line or a differential microstrip line for transmitting signals, as shown in fig. 9 and 10, where the microstrip line or the differential microstrip line of the source of crosstalk generated from the outside may be a conventional smooth line, as shown in fig. 9 and 10. In addition, the microstrip line or differential microstrip line from which the crosstalk generated from the outside is derived may be the microstrip line structure having a plurality of grooves as the isolation structure according to the present invention, for example, the microstrip line structure may be a structure in which a plurality of grooves are periodically arranged at the outer side of the microstrip line in a sub-wavelength manner for signal transmission, but the crosstalk generated from the transmission signal is derived accordingly. In addition, the crosstalk generated from the outside is not limited thereto, and any transmission signal source may be included.
The external crosstalk source of the microstrip isolation structure for reducing crosstalk provided by the present invention may be generated by a microstrip line and a differential microstrip line for transmitting signals, or any transmission signal source, however, in the microstrip isolation structure for reducing crosstalk provided by the present invention, one of the resistors 55 is connected to one end of the microstrip line 11, the other resistor 55 is connected to the other end of the microstrip line 11, both resistors 55 are grounded, and the two resistors 55 are matched with the microstrip line 11, so that the electromagnetic energy of crosstalk or penetration can be grounded via the matched resistor 55, thereby achieving the purposes of reducing crosstalk and providing the effect of suppressing electromagnetic wave penetration.
The two resistors 55 in the above embodiment are matched with the connected microstrip line 11, the connected microstrip line 11 is an isolation structure, and the wiring manner may be linear, arc, or approximately closed ellipse, circle, triangle, rectangle, or diamond, but not limited thereto. Therefore, in the microstrip isolation structure for reducing crosstalk provided by the present invention, the two resistors 55 and the connected microstrip line 11 can be wired on the circuit board, and specifically provide isolation and reduce crosstalk or penetration of electromagnetic energy between different groups of signal transmission sources (including microstrip lines and differential microstrip lines).
The present invention provides a specific simulation embodiment, in which the effect of suppressing crosstalk is simulated by using S parameters under the conditions of existence and absence of an isolation microstrip line, and fig. 16 shows the simulation result of S parameters of two microstrip lines with an isolation structure, where the isolation structure in fig. 16 is the structure in fig. 9, and fig. 9 shows a seventh embodiment in which two outer grooves have a rectangular concave body combined with a rectangular convex body structure 16 and are located between two microstrip lines for transmission. The S-parameter simulation in fig. 16 uses the circuit in fig. 9, and uses the lower two smooth microstrip lines 11 when using sub-wavelength periodic microstrip lines as the isolation structure, where the isolation structure circuit structure is schematically shown in fig. 9, and the result of the S-parameter simulation is shown in fig. 16, and the dielectric constant r of the board is 3.55, the width W of the microstrip line is 1.64mm, the spacing between microstrip lines is W1W 2W 1.64mm, the period length d of the microstrip line is 1.0mm, the depth b of the groove is 0.492mm, the thickness t of the metal plate is 0.035mm, and the thickness h of the substrate is 0.73 mm. In fig. 9, two resistors 55, one of the resistors 55 is connected to one end of the microstrip line of the isolation structure, the other resistor 55 is connected to the other end of the microstrip line of the isolation structure, and the resistor 55 is grounded; the first port is 61 and the second port is 62.
S in FIG. 1621The electromagnetic energy density transmitted from the first port 61 to the second port 62 of the upper smooth microstrip line 11 in fig. 9 is referred to; s in FIG. 1641The electromagnetic energy density transmitted by crosstalk between the upper smooth microstrip line 11 and the lower smooth microstrip line 11 in fig. 9 is measured from the first port 61 to the fourth port 64, and the two upper and lower lines are the electromagnetic energy density transmitted by crosstalk between the smooth microstrip lines 11. From the simulation result of FIG. 16, S shows21The value of the isolation microstrip line pair S is not greatly different from that of the isolation microstrip line pair S in two structures with the isolation microstrip line from 0 to 12GHz21Has little influence but suppresses crosstalk S41The effect of the microstrip line is obviously improved, taking 12GHz as an example, when the upper and lower two are smooth microstrip lines 11 and there is no isolation microstrip line with the isolation structure provided by the present invention, as the solid line represents the existing (there is no isolation microstrip line), S41-13.56 dB; when the upper and lower two isolated microstrip lines of the isolation structure provided by the invention exist between the smooth microstrip line 11, such asThe dotted line represents the isolation structure (with the isolation microstrip line) provided by the invention, S41Because-36.2667 dB, when there is the isolation microstrip line for suppressing crosstalk according to the present invention, the effect of the isolation structure for suppressing crosstalk between the upper and lower smooth microstrip lines 11 is significant.
The present invention provides another specific simulation embodiment, in which the effect of S-parameter simulation for suppressing crosstalk is achieved in the presence and absence of an isolation microstrip line, as shown in fig. 18, which is the result of S-parameter simulation for introducing an isolation microstrip line into a microstrip line and a differential line, where the isolation structure for suppressing crosstalk in fig. 18 is the structure in fig. 17. Referring to the structure in fig. 17, the microstrip line of the sub-wavelength periodic isolation structure provided in the present invention is used to isolate and suppress one microstrip line 11 on the lower side and another differential microstrip line 111 on the upper side, one smooth microstrip line 11 in fig. 17 is located on the lower side of the microstrip line of the isolation structure, and one set of smooth differential microstrip lines 111 in fig. 17 has two microstrip lines 11 located on the upper side of the microstrip line of the isolation structure, and the used materials are the same as the structure in fig. 9. The set of smooth differential microstrip lines 111 has two microstrip lines 11, wherein one microstrip line 11 (the first microstrip line) transmits a first transmission signal; and another microstrip line 11 (second microstrip line) parallel to the microstrip line 11 (first microstrip line) and configured to transmit a second transmission signal, which is a complementary signal having a phase difference of 180 ° with respect to the first transmission signal. One end of the differential microstrip line 111 for transmitting signals on the upper side is provided with a first port 61, and the other end is provided with a second port 62; one of the smooth microstrip lines 11 for transmitting signals at the lower side has a third port 63 at one end and a fourth port 64 at the other end. In addition, the structure of the upper set of smooth differential microstrip lines 111 (having two smooth microstrip lines 11) and the lower set of smooth microstrip lines 11, which are considered to simulate the effect of suppressing crosstalk by S-parameters, is shown in fig. 18 by w1, w2, w3 and w3, respectively.
S in FIG. 18dd21Referring to the upper set of smooth differential microstrip lines 111 in fig. 17, the electromagnetic energy density transmitted from the first port 61 to the second port 62, the set of smooth differential microstrip lines 111 has two microstrip lines 11; s in FIG. 18sd41Refers to the upper set of smooth differential microstrip lines 111 and the lower set of smooth differential microstrip lines in FIG. 17Between the side smooth microstrip lines 11, from the first port 61 to the fourth port 64, the electromagnetic energy density transmitted by crosstalk between the smooth microstrip lines 11 is on the upper and lower sides. From the simulation result of FIG. 18, Sdd21The value of the isolation microstrip line pair S is not much different from the two structures without the isolation microstrip line of the invention from 0 to 12GHz, and obviously, the isolation microstrip line pair Sdd21Has little influence but suppresses crosstalk Ssd41In terms of effect, the isolation microstrip line provided by the invention is obviously improved, taking 12GHz as an example, when the isolation microstrip line of the isolation structure of the invention does not exist, such as the solid line represents the existing (the isolation microstrip line does not exist), Ssd41When the isolated microstrip line of the isolation structure of the present invention is present, S represents the isolation structure of the present invention (the isolated microstrip line is present) as a dotted line — 18.99dBsd41Therefore, when the isolation microstrip line for suppressing crosstalk provided by the present invention exists, the effect of crosstalk between the structure of isolating the upper set of smooth differential microstrip lines 111 (having two smooth microstrip lines 11) and the lower one of the smooth microstrip lines 11 is significant.
The above description is only for the purpose of describing preferred embodiments or examples of the present invention by means of solving the problems, and is not intended to limit the scope of the present invention. The scope of the invention is to be determined by the following claims and their equivalents.
Claims (8)
1. A microstrip isolation structure for crosstalk reduction, comprising:
the microstrip line is provided with a plurality of grooves, the grooves are positioned on a single outer side or two corresponding outer sides of the microstrip line, and the grooves positioned on the same side are periodically arranged; and
one of the two resistors is connected with one end of the microstrip line, the other resistor is connected with the other end of the microstrip line, and the two resistors are both grounded;
the grooves are periodically arranged on the outer side of the microstrip line in a sub-wavelength mode, the arrangement period length of the grooves is far shorter than the wavelength of a transmission signal source adjacent to the microstrip line on the upper side, the grooves are used for inhibiting the penetration of electromagnetic waves and inhibiting the crosstalk of the transmission signal source on the upper side of the microstrip line to a transmission line on the lower side, the microstrip line is of a single linear structure between the transmission signal source on the upper side and the transmission line on the lower side, and no right-angle bending or winding structure exists between the starting end and the tail end of the microstrip line.
2. The microstrip isolation structure according to claim 1 wherein the plurality of grooves are formed by periodically arranging a rectangular concave body in combination with a rectangular convex body.
3. The microstrip isolation structure according to claim 1 wherein the groove has a rectangular concave body combined with a rectangular convex body, and the plurality of grooves are configured as a continuous periodic structure, and at the opening of each groove, each rectangular convex body has two first extending portions extending in parallel to the center of each groove.
4. The microstrip isolation structure for crosstalk reduction according to claim 1, wherein the plurality of slots are configured as a hairpin structure having a plurality of Z-shaped protrusions and a continuous periodic structure, and wherein the plurality of Z-shaped protrusions comprises:
a first extending part which is arranged at the opening of each groove and extends to the center of each groove in parallel; and
a second extending part, which is arranged at the middle section of each Z-shaped convex body and extends to the center of each groove in parallel;
wherein, the extending directions of the first extending part and the second extending part are opposite.
5. The microstrip isolation structure according to claim 1 wherein the plurality of grooves are formed in a continuous periodic structure with a plurality of J-shaped protrusions, the J-shaped protrusions having a hook and curving inward of the grooves.
6. The microstrip isolation structure according to claim 1 wherein the groove has a rectangular concave body combined with a rectangular convex body, and the plurality of grooves are configured as a continuous periodic structure, and at the opening of each groove, each rectangular convex body has a first extension portion extending in parallel to the center of each groove.
7. The microstrip isolation structure according to claim 1 wherein the notch has a cross-shaped configuration and has a bottom notch at the bottom of the notch, the notch further has a rectangular recess combined with a rectangular protrusion, and the configuration of the plurality of notches is a continuous periodic configuration, and at the opening of each notch, each rectangular protrusion has two first extensions extending in parallel toward the center of each notch.
8. The microstrip isolation structure of claim 1 wherein two resistors are matched to the microstrip line.
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| TW201419659A (en) * | 2012-11-06 | 2014-05-16 | Wistron Neweb Corp | Decoupling circuit and antenna device |
| TW201532338A (en) * | 2014-02-14 | 2015-08-16 | Univ Chung Hua | Differential-pair microstrip for low-crosstalk and high-frequency transmission |
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| TWI470872B (en) * | 2010-11-29 | 2015-01-21 | Univ Chung Hua | Microstrip line structures |
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