CN106471563A - Method for manufacturing display module using optically transparent resin - Google Patents
Method for manufacturing display module using optically transparent resin Download PDFInfo
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- CN106471563A CN106471563A CN201580036632.6A CN201580036632A CN106471563A CN 106471563 A CN106471563 A CN 106471563A CN 201580036632 A CN201580036632 A CN 201580036632A CN 106471563 A CN106471563 A CN 106471563A
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- optical clear
- clear resin
- substrate
- display module
- solidification
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- 239000011347 resin Substances 0.000 title claims abstract description 106
- 229920005989 resin Polymers 0.000 title claims abstract description 106
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 230000003287 optical effect Effects 0.000 claims description 95
- 238000007711 solidification Methods 0.000 claims description 37
- 230000008023 solidification Effects 0.000 claims description 37
- 230000004888 barrier function Effects 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 12
- 230000000873 masking effect Effects 0.000 claims description 11
- 239000004033 plastic Substances 0.000 claims description 11
- 229920003023 plastic Polymers 0.000 claims description 11
- 230000008569 process Effects 0.000 claims description 11
- 238000001723 curing Methods 0.000 claims description 9
- 239000004568 cement Substances 0.000 claims description 6
- 239000006059 cover glass Substances 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- 238000013007 heat curing Methods 0.000 claims description 4
- 239000004973 liquid crystal related substance Substances 0.000 claims description 4
- 238000000016 photochemical curing Methods 0.000 claims description 4
- 230000035699 permeability Effects 0.000 claims description 3
- 239000010408 film Substances 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 25
- 239000007788 liquid Substances 0.000 description 18
- 230000008901 benefit Effects 0.000 description 12
- 208000031481 Pathologic Constriction Diseases 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 210000001215 vagina Anatomy 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 5
- 238000007665 sagging Methods 0.000 description 5
- 230000005574 cross-species transmission Effects 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001548 drop coating Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052724 xenon Inorganic materials 0.000 description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 210000004556 brain Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000005336 safety glass Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The present invention relates to a novel method for manufacturing a display module, and more particularly, to a method for manufacturing a display module using an optically transparent resin, which includes a step of applying one optically transparent resin to a substrate, and then selectively curing the resin by ultraviolet scanning using a shutter-type LED bar or by scanning using a mask. The manufacturing method of the present invention uses one kind of optically transparent resin, and after the optically transparent resin is applied to a substrate, the optically transparent resin is selectively cured by an ultraviolet scanning using a shutter or a mask method, thereby controlling defects such as overflow (overflow), Bubbles (Bubbles), and Voids (Voids), improving the workability and productivity, and minimizing the defects of parts, and thus can be applied to display modules including display panels, touch screen panels, and various functional substrates.
Description
Technical field
The present invention relates to new display module manufacture method, more specifically, it is related to a kind of utilization optical clear resin
Display module manufacture method is it is characterised in that include being coated on after substrate by a kind of optical clear resin, by using shutter side
The ultraviolet scanning of the LED strip of formula or the scanning using mask, optionally implement the step solidifying.
Background technology
Recently, due to the generalization of smart mobile phone, panel computer, the intelligent epoch formally open.If original mobile phone
It is absorbed in communication function, then, nearest smart machine, in addition to communication function, shows replacement desktop computer, notebook electricity
The performance of the level of brain etc..
Therefore, emphasize necessity and the importance of high-performance display device further, especially mobile device and flat board are set
The requirement of standby outdoor observability and image quality characteristic is continuously increased.
Comply with this trend, if with optics transparent resin (optically clear resin (OCA, optical lens ming tree
Fat), optically clear adhesive (OCA, optically clear adhesive) or liquid optically clear
Adhesive (LOCA, Liquid optical clear binding agent)) space between filling touch panel and display device (LCD, OLED)
(air gap), then outdoor observability and comprehensive observability raising effect are very big, due to the raising of display device performance, right
Lifting monolithic article image has an immense impact on.Now, the system in space as smart mobile phone, is all eliminated with optics transparent resin
Product become the market mainstream, and it presents the trend gradually expanding panel computer, notebook computer etc. to.
According to this trend, in market, develop the equipment of variform drastically.These equipment are according to use
Purpose, is laminated multiple substrates or thin film and uses, one of these substrates optical clear used above resin and together bond
(bonding).
Optical clear resin is compared with adhesive tape, then operation is easily, has outstanding calking (gap filling) ability, because
And the manufacture view in display application apparatus, popular in part with optical clear resin (OCR or LOCA).But,
Optical clear resin is liquid form, thus when being coated substrate it is important to note that avoiding importing between the substrates
Bubble (bubbles) or empty (voids).
In addition, optical clear resin, according to manufacture method, can be difficult to control to various parameter, in mechanism section or control unit
In point, coherency declines, and more can lead to the defect of the exterior quality of higher part fraction defective or end article.This opposite
Yield and manufacturing cost also can produce no small impact.
Due to this reason, the display module manufacture method using optical clear resin (shows dress in picture display device
Put) manufacture view be taken as key factor, developing now the many quadrat methods with regard to this.
As the representative illustration of this manufacture method, there is Y map (Y map) method and utilize two kinds of optical clear resins
Barrier (DAM) method of (OCR or LOCA) material.But, this manufacture method has various problem, with regard to Y map (Y map)
For method, overflow (Overflow) control problem maximum, for barrier (DAM) method, have using two kinds of optical clears
The problems such as boundary face vestige between operation control problem that resin material leads to and foreign material.In addition to this problem,
The bad problem of product leading to because generating bubble or cavity after bonding is also the problem of needs solution.In addition, in large area
In the case of, due to the weight of adhesive base plate and sagging etc. during bonding, stable bonding also can become problem, thus also can cause not
Good.
Content of the invention
Technical task
In order to solve problem as above, it is an object of the invention to provide a kind of display of utilization optical clear resin
Module manufacturing methods, using a kind of optical clear resin, optical clear resin are coated on after substrate, using having installed shutter additional
The scan mode of Burdick lamp or masking regime, are optionally solidified such that it is able to being improved operation, productivity ratio and making portion
Part defect is minimized.
Problem solution
In order to reach described purpose, the present invention provides a kind of display module manufacture method of utilization optical clear resin, bag
Include：
1) apply a kind of step of optical clear resin (OCR or LOCA) on the first substrate；
2) i) using the Burdick lamp adding shutter (shutter), make described optical clear to scan (Scan) mode
The step that resin bed is optionally solidified to form barrier (DAM), next door or point (Dot), or
Ii) with using patterning mask (Mask) part needing photocuring is carried out using Burdick lamp scanning or
The mode comprehensively irradiated, makes the step that described optical clear resin bed is optionally solidified to form barrier, next door or point；
3) first substrate of described local solidification and the step of second substrate are bonded under vacuum or normal pressure；And
4) by using scanning or comprehensive irradiation of Burdick lamp, or the heat cure using heat, and make described bonding
First substrate and the completely crued step of second substrate.
In the present invention, described first substrate can be selected from LCD (Liquid Crystal Display) panel,
OLED (Organic Light Emitting Diods) panel, glass cover-plate (Cover glass) and plastic cement cover plate (Cover
The display floater (Display panel) of one or more of the group plastic) constituting.
In the present invention, in the selectivity solidification using scanner uni masking regime, the optical lens that are optionally cured
The refractive index of ming tree fat can be 1.30 to 1.70, state of cure can be 30% to 100% curing degree level, by more than
Solidified with stating horizontally selected property, barrier, next door or point can be formed, curing degree can be passed through FT-IR (Fourier
Transform infrared spectroscopy, Fourier transform infrared spectrometer) measurement.
In the utilization scanning of the present invention and the selectivity solidification of masking regime, for being scanned for mode, in ultraviolet
While lamp is scanned additional, shutter is installed on Burdick lamp, can to need solidification part and unwanted part, according to
Whether the operating of shutter implements selectivity solidification.That is, in the part not needing solidification, block shutter, need to solidify being directed to
Part, shutter open (Open), thus only solidification is implemented to the part needing solidification, thus solidified by selectivity, permissible
Form barrier, next door or point.
Secondly, for masking regime, by the pattern not needing the part solidifying formation to be not through ultraviolet
(Pattern) implement selectivity solidification, or be selectively adjusted curing degree using the mask that have adjusted permeability, so that
So that optical clear resin is cured on demand according to various pieces, thus barrier, next door or point can be formed.
In the present invention, described second substrate can use glass cover-plate for touch panel (Touch screen panel)
At least one of (Cover glass), glass cover-plate, plastic cement cover plate or thin film (Film).
In the present invention, the described bonding process using second substrate can be carried out under vacuum or normal pressure.
The present invention also provides the display module manufacturing according to described manufacture method.
The effect of invention
The display module manufacture method of the utilization optical clear resin according to the present invention, by using scanning or masking regime
Selectivity be solidified to form barrier, next door or point, the optical clear resin material such that it is able to prevent liquid flows to the first base
Spillover outside plate, only just can show screen effect using a kind of optical clear resin, thus with using two kinds of optics
The existing operation that transparent resin forms barrier is compared, and also has in the yield management aspect of store keeping, operation, adhesive article
Interesting advantage is additionally it is possible to solve the part of the boundary face vestige between the foreign material occurring using bi-material.
In addition, being not carried out, for by selectivity solidification, the part solidifying, because optical clear resin is with liquid condition
Exist, thus be conducive to controlling when bonding with second substrate it may happen that bubble and cavity, high product yield can be kept,
End article fraction defective also can significantly reduce.In addition, have develop into narrow frame (Narrow bezel) more can be accurate
Apply and control material to the advantage of desired location.
And, in the case that optical clear resin is applied to large-area substrates, due to substrate weight and sagging etc. and
Generating material overflows and Poor cohesion, in the present invention, is solidified to form barrier, next door or point by selectivity, so that
Optical clear resin can support large-area substrates, can improve operation, significantly reduces bad.
In addition, alignment (Align) dislocation after carrying out first substrate and second substrate bonding process, when between two substrates
When, first substrate and second substrate need to be separated in the past, after removing optical clear resin (OCR or LOCA), re-started operation, but
In the present invention, can execute and align (Align) with moving left and right in the state of second substrate in bonding first substrate, so
Afterwards, by being fully cured operation, operation can be completed.The reasons why why feasible this operation is is because, by implementing to select
Property solidification, uncured part exists with liquid condition, thus is feasible operation.Alignment can be executed after bonding
(Align) operation, thereby eliminates and needs to re-execute optical clear resin (OCR or LOCA) when alignment (Align) is bad
Removing step and the trouble of bonding process, have many advantages in terms of operation, time, expense.
Therefore, when implementing the display module bonding by scanning and masking regime, for diversification, diversified intelligence
Energy mobile phone, the divers dimensions of tablet device, can easily tackle, even if realizing large area as display, TV, by adjusting
The size of section ultraviolet lamp bar (Bar) or shutter and change mask, has and can be readily applied to various display device and make
The advantage making display module, is not only economically, also has interesting advantage in terms of productivity ratio.
The method of the present invention can apply to aobvious including display floater, touch panel and various functional base plate
Show module.
Brief description
Fig. 1 is the monolithically fabricated figure of the display module of one embodiment of the invention.
Fig. 2 is the precedence diagram representing the manufacturing process of one embodiment of the invention successively.
Fig. 3 to Figure 10 is the pie graph representing the manufacturing process of one embodiment of the invention successively.
Specific embodiment
Below, the method for the present invention and the representative illustration of device are described.This example is merely provided for helping understand this
Inventive embodiment, the method for prompting in this specification, even if part or all does not specify can also implement.I.e. although leading to
Cross embodiment to be fully described, but be not limited to this embodiment.In addition, at any time can be without departing from this specification
Changed in the limit of the thought of the embodiment illustrating and scope, in this specification, the accompanying drawing of prompting is only used for ease of explanation,
And non-limiting, be confined to accompanying drawing.
The display module of one embodiment of the invention is by first substrate, the optical clear resin (OCR that is coated on first substrate
Or LOCA), optical clear resin is implemented with selectivity solidification and bonding after the Burdick lamp implementing to solidify, selectivity solidification required
Shutter (shutter) and mask (mask) and be coated with optical clear resin first substrate bond and constitute display
The second substrate of module is constituted.
Fig. 1 represents the monolithically fabricated figure of the display module 100 of one embodiment of the invention.Display module 100 shown in Fig. 1
For selectivity solidification using scanning (scan) method, by first substrate 110, optical clear resin 120, Burdick lamp (UV
Or UV-LED) 130, shutter 140, second substrate 150 constitute.
Described first substrate 110 can be display floater (Display panel), for example, it is possible to be selected from LCD
(Liquid Crystal Display) panel, OLED (Organic Light Emitting Diods) panel, glass cover-plate
One or more of group that (Cover glass) and plastic cement cover plate (Cover plastic) are constituted.
The material of described referred to as optical clear resin 120 is it is meant that with the material reacting by ultraviolet and solidify be
Basic ultraviolet curing resin.Described optical clear resin 120 is used for eliminating in described first substrate 110 and second substrate
The purpose in the space (Air gap) existing between 150, therefore, the durability of display module and optical characteristics can improve.In addition,
Described optical clear resin 120 has bonding, adhesion properties, and described first substrate 110 can be made to engage with second substrate 150.
Described optical clear resin 120 can be solidified using ultraviolet, and preferred index has 1.30 to 1.70 levels.
Described optical clear resin 120 can be applied by desired zone on described first substrate 110 according to purpose
Apply, now, coating can be held using drop coating (Dispensing), silk screen (Screen) printing or slit die (Silt die) method
OK.
In addition, described optical clear resin 120 can include being solidified to form by means of selectivity barrier (DAM), every
Wall or point region (Dot).Curing degree to described barrier, next door or point region can be 30% to 100% about, more preferably protects
Hold 55% to 100% about, be adapted for carrying out the effect as barrier, next door or point.Described curing degree can pass through FT-IR
(Fourier tra nsform infrared spectroscopy) etc. measures.
The barrier, next door or the point that are solidified to form by selectivity can prevent from overflowing (Overflow), thus keeping material
The state of material region coating on demand, during carrying out bonding with second substrate 150, can not only play prevents material
The effect of flowing, and additionally it is possible to execution reply substrate weight and sagging support act in large-area substrates.
Described Burdick lamp 130 is bar (Bar) type, the selectivity solidification for optical clear resin 120 and with second
Implement the purpose of full cure, including finsen lamp, metalized lamp, gallium lamp, arc light, xenon lamp, UV-LED lamp etc. after substrate 150 bonding
The lamp of energy irradiation ultraviolet radiation (UV).When for UV-LED lamp, can be using LED core such as 365nm, 385nm, 395nm, 405nm
Piece and the lamp of UV can be irradiated, be preferably used in the outstanding UV-LED lamp of the aspects such as lamp life-span, radiating.In addition, the purple pointed out in Fig. 1
Outside line lamp 130 is stripe shape, can the inswept region needing solidification.
Described shutter 140 is installed in Burdick lamp 130, when Burdick lamp 130 is inswept, for being capable of selectivity solidification
Purpose, in the region needing solidification, shutter 140 does not block irradiation part completely, and in the region not needing solidification, shutter 140 hides
Be in the light transparent resin 120, enabling selectivity solidifies, thus after optical clear resin 120 coating, can be to needs
Part implements selectivity solidification.In addition, after bonding with second substrate 150, shutter 140 does not block Burdick lamp 130 completely, real
Apply irradiation, such that it is able to implement to irradiate comprehensively.
Described shutter 140, with respect to Burdick lamp 130, horizontally or vertically operates, such that it is able to respect to do not need irradiate
The part of Burdick lamp 130 and selectivity blocks, shutter 140 width can be adjusted, can achieve to the selection needing cured portion
Property light irradiation.As the material of shutter 140, as long as can stop Burdick lamp 130 ultraviolet pass through more than 90% material
Matter all can use, it is highly preferred that can be but and non-limiting for the metal that 98% ultraviolet passes through, plastics, glass etc. can be cut off
In this.
Described second substrate 150 can be can be by showing with safety glass, LCD glass, flexible panel plastic base etc.
The substrate showing panel bonding and manufacturing, can preferably be and use glass selected from touch panel (Touch screen p anel)
One or more of group that glass cover plate (Cover glass), glass cover-plate, plastic cement cover plate and thin film are constituted.
Described first substrate 110 and second substrate 150 can also mutually exchange use according to purpose.That is, operation is permissible
For, after coating optical clear resin 120 on second substrate 150, implementing side (Side) solidification, carrying out and first substrate
Overturn after 110 bonding, full cure is implemented by photocuring or heat cure.
Referring to Fig. 2 and Fig. 3, illustrate in greater detail the present invention.
The display module manufacture method of the utilization optical clear resin of the embodiment of the present invention includes：Apply on the first substrate
The step (P110) of optical clear resin；In described optical clear resin bed, with using the scanning of Burdick lamp or masking regime,
It is solidified to form the step (P120, P121) of barrier, next door or point region by selectivity；Using second substrate in vacuum or normal
The step (P130) of pressure bonding；And utilize Burdick lamp, with comprehensive or scan mode irradiate the first substrate of bonding and
The step (P140) of second substrate.
Specifically, first on the first substrate, optical clear resin (P110) is applied in slit die mode.
Then, in the case of scan mode, block the remainder in addition to the 2mm part of lamp side using shutter,
By UV-LED Burdick lamp with scan mode to coating optical clear resin implement in full scanning, be solidified to form by side
Barrier.Now, 2mm part UV-LED in side is not blocked by shutter and is opened wide all the time, is coated with the initial part of optical clear resin
Divide and end section, because shutter does not operate with not blocking UV-LED Burdick lamp completely, such that it is able in optical clear resin
Side solidification (P120) is all realized at four sides.
Then, in the case of masking regime, using the open block masks of grid stricture of vagina or point stricture of vagina, by Burdick lamp pair
The part needing solidification is implemented comprehensively or is scanned solidification.Part in addition to grid stricture of vagina and point stricture of vagina can be cut off the gold of ultraviolet
Genus or thin film etc. are sheltered, thus are not solidified by ultraviolet.Now, only grid stricture of vagina and point (Dot) stricture of vagina are partially exposed to mask,
Such that it is able to be formed selectively grid and point (P121).In addition, according to circumstances it is also possible to using adjusted the covering of permeability
Mould, is selectively adjusted curing degree by each several part, so that optical clear resin solidifies on demand.
Then, using described second substrate, implement the bonding with the first substrate being coated with optical clear resin, described viscous
Conjunction can realize (P130) under vacuum or condition of normal pressure.
Then, by the Burdick lamp of stripe shape or comprehensive irradiation type, real with the whole face of second substrate bonding to first substrate
Apply and be fully cured (P140).Now, according to circumstances, in addition to the photocuring using Burdick lamp, heat cure can also be used.
Fig. 3 is the pie graph representing the manufacturing process of one embodiment of the invention successively, and Fig. 4's to Figure 10 as described below is each
Step.
Fig. 4 illustrates the step that optical clear resin 120 is coated on first substrate 110.Optical clear resin 120 can
Applied it is preferable that slit die 160 coating method can be used with various method such as drop coating, slit die, silk screen printing.
Fig. 5 illustrates using UV-LED Burdick lamp 130, by scanning, optionally implements lateral parts and solidifies and shape
The step becoming barrier (Fig. 7,121).The material that described optical clear resin 120 is by mean of Burdick lamp 130 and reacts, solidifies
Material, described light source means ultraviolet light source (UV (Ultra-Violet)).As the species of ultraviolet light source, can be water
Silver, metal, gallium, xenon lamp, UV-LED lamp etc., as long as additionally, being capable of the lamp of irradiation ultraviolet radiation, then all can be applicable to described work
Sequence.
The step of Fig. 5 includes：When Burdick lamp 130 scans, optical clear resin is implemented by the movement of shutter 140
The operation of 120 selectivity side solidification.Thus implement side solidification, thus having the side of the optical clear resin 120 of fluidity
Face part is cured, and is prevented from spilling outside optical clear resin 120 flows out to first substrate 110 it is also possible to prevent
In the step of Fig. 9, flow out to the spilling outside substrate when first substrate 110 is with second substrate 150 bonding.In addition, being designed to
The size of Burdick lamp 130 and shutter 140 can be adjusted such that it is able to be applied to the display module of various model and size,
Therefore, it is possible to expense of greatly reducing investment outlay, improve operation and productivity ratio.
Fig. 7 represents barrier 121 region and the shape applying being formed at optical clear resin 120 by the operation of Fig. 5
The interior liquid region 122 that state exists.Described barrier 121 region prevents the spilling of optical clear resin 120, interior liquid region
122 are existed with liquid, thus in the bonding process of Fig. 9, can remove and lead to because of bubble (Bubbles) and empty (voids)
Defect.
Fig. 6 represents using the mask 180 being formed with next door or point stricture of vagina, implements to make use of stripe shape Burdick lamp 130 or comprehensive
The step that the selectivity of irradiation type Burdick lamp 170 is solidified to form next door (Fig. 8,121).
Described optical clear resin 120 as the material reacting and solidifying by means of Burdick lamp 130,170, only to logical
The part crossed the decorative pattern being engraved on mask 180 and pass through light implements selectivity solidification, thus forming next door (Fig. 8,121).Therefore,
The optical clear resin 120 with fluidity is exposed to the part of light and is cured such that it is able to prevent from flowing out to optical lens ming tree
Spillover outside the first substrate 110 of fat 120, is prevented from the weight of the second substrate 150 in the bonding of large-area substrates
Amount and the sagging spilling leading to, bubble and cavity are bad.In addition, by being designed to the size of mask 180 and next door, dot pattern
Need pattern such that it is able to be applied to the display module of various model and size, expense of can greatly reducing investment outlay, carry
Senior engineer's sequence and productivity ratio.
Fig. 8 represents next door (Fig. 8, the 121) region being formed by Fig. 6 operation by optical clear resin 120 and to apply
State exist interior liquid region (Fig. 8,122).Solidified by the selectivity of optical clear resin 120 is implemented, no
Optical clear resin 120 only can be made to be applied to the region of needs, and be prevented from overflowing, due to interior liquid region (figure
8,122) existed with liquid, thus in the bonding process of Fig. 9, the defect that bubble removing and cavity lead to can be gone.
Fig. 9 is to represent the step making optical clear resin 120 and second substrate 150 bonding being solidified to form by selectivity
Suddenly.Described bonding process can be carried out under normal pressure or vacuum, even if after bonding, optical clear resin 120 is internal to keep liquid
State state, therefore, it can substantially reduce bubble and cavity is bad.It is not necessary to vacuum chamber in the case of normal pressure bonding, compare vacuum
The investment cost of bonding is few, but it is long to have the bonding time, compared with vacuum bonding, bubble and the high shortcoming of empty fraction defective.With
Normal pressure bonding is contrary, and vacuum bonding has the advantages that the bonding time is fast, bubble and empty fraction defective are low, but pattern of wants vacuum
Chamber, has the shortcomings that investment cost is high.This bonding process can consider the size of display module to be manufactured, productivity ratio, work
Sequence etc. and properly select.
Figure 10 is represented and is irradiated by Burdick lamp comprehensively and the first substrate 110 and second substrate 150 of bonding has been implemented
The step of all solidstate.Irradiate comprehensively and can utilize stripe shape Burdick lamp 130, carried out it is also possible to utilize complete by comprehensive scanning
Face irradiation type Burdick lamp 170, implements by comprehensive irradiation to solidify.This operation can consider optical clear resin 120
Feature, operation and productivity ratio etc. and select.
As the record carrying out above, the method according to the invention, when bonding display module using optical clear resin
When, can control as original Y map mode shortcoming coating and bonding when spillover it is also possible to solve as use
The barrier mode shortcoming of two kinds of optical clear resins to using bi-material store keeping and operation control problem additionally it is possible to
Solve the mark problem occurring because of the interface between barrier and internal potting resin using foreign material.
In addition, in bonding, internal opticses transparent resin in addition to the sides is existed it is thus possible to greatly drop with liquid
The bubble that low adhesion operation leads to and cavity are bad.
Finally, adjusted by the size of shutter and mask and pattern is adjusted, be not only and realize narrow frame (Narrow
Bezel the smart machine) changed, can also tackle rapidly the display device of variation and diversification, have and can easily tackle
The advantage of the various requirement in market, this is also favourable in terms of equipment investment and productivity ratio.
The explanation of symbol
100 display modules, 110 first substrates, 120 optical clear resins, 121 barriers, next door, point region,
122 Liquid region (uncured), 130 stripe shape Burdick lamps, 140 shutters, 150 second substrates, 160 applicators
(Coater), 170 comprehensive irradiation type Burdick lamp, 180 masks.
Industrial utilization probability
The display module manufacture method of the utilization optical clear resin according to the present invention, by using scanning or masking regime
Selectivity be solidified to form barrier, next door or point, the optical clear resin material such that it is able to prevent liquid flows to the first base
Spillover outside plate, only just can show screen effect using a kind of optical clear resin, thus with using two kinds of optics
The original process that transparent resin forms barrier is compared, and also has in the yield management aspect of store keeping, operation, adhesive article
Interesting advantage is additionally it is possible to solve the part of the boundary face vestige between the foreign material occurring using bi-material.
In addition, being not carried out, for by selectivity solidification, the part solidifying, because optical clear resin is with liquid condition
Exist, thus be conducive to controlling when bonding with second substrate it may happen that bubble and cavity, high product yield can be kept,
End article fraction defective also can significantly reduce.In addition, have develop into narrow frame (Narrow bezel) more can be accurate
Apply and control material to the advantage of desired location.
And, in the case that optical clear resin is applied to large-area substrates, due to substrate weight and sagging etc. and
Generating material overflows and Poor cohesion, in the present invention, is solidified to form barrier, next door or point by selectivity, so that
Optical clear resin can support large-area substrates, can improve operation, significantly reduces bad.
In addition, alignment (Align) dislocation after carrying out first substrate and second substrate bonding process, when between two substrates
When, first substrate and second substrate need to be separated in the past, after removing optical clear resin (OCR or LOCA), re-started operation, but
In the present invention, can execute and align (Align) with moving left and right in the state of second substrate in bonding first substrate, so
Afterwards, by being fully cured operation, operation can be completed.The reasons why why feasible this operation is is because, by implementing to select
Property solidification, uncured part exists with liquid condition, thus is feasible operation.By make can execute after bonding right
(Align) operation together, thus eliminate when align (Align) bad when need to re-execute optical clear resin (OCR or
LOCA) the trouble of removing step and bonding process, has many advantages in terms of operation, time, expense.
Therefore, when implementing to bond by the display module of scanner uni masking regime, for diversification, diversified intelligence
Mobile phone, the divers dimensions of tablet device, can easily tackle, even if realizing large area as display, TV, by adjusting
The size of ultraviolet lamp bar (Bar) or shutter and change mask, has and can be readily applied to various display device and manufacture
The advantage of display module, is not only economically, also has interesting advantage in terms of productivity ratio.
The method of the present invention can apply to the display including display floater, touch panel and various functional base plate
Module.
Claims (9)
1. a kind of display module manufacture method of utilization optical clear resin is it is characterised in that include：
1) apply a kind of step of optical clear resin (OCR or LOCA) on the first substrate；
2) i) using the Burdick lamp adding shutter (shutter), make described optical clear resin to scan (Scan) mode
The step being solidified to form barrier (DAM), next door or point (Dot) layer-selective, or
Ii) scanning or comprehensive using Burdick lamp is carried out with the mask (Mask) using patterning to the part needing photocuring
The mode irradiated, makes the step that described optical clear resin bed is optionally solidified to form barrier, next door or point；
3) first substrate of described local solidification and the step of second substrate are bonded under vacuum or normal pressure；And
4) by using scanning or comprehensive irradiation of Burdick lamp, or the heat cure using heat, and make the first of described bonding
Substrate and the completely crued step of second substrate.
2. utilization optical clear resin according to claim 1 display module manufacture method it is characterised in that
Described step 1) first substrate be selected from LCD (Liquid Crystal Display, liquid crystal indicator) panel,
OLED (Organic Light Emitting Diods, organic electroluminescent LED) panel, glass cover-plate (Cover
Glass) and one or more of the group that constitutes of plastic cement cover plate (Cover plastic) display floater (Display
panel).
3. utilization optical clear resin according to claim 1 display module manufacture method it is characterised in that
Described step 1) optical clear resin refractive index be 1.30 to 1.70.
4. utilization optical clear resin according to claim 1 display module manufacture method it is characterised in that
In step 2) selectivity solidification in, the state of cure of the optical clear resin optionally solidifying is 30% to 100%
Curing degree level.
5. utilization optical clear resin according to claim 1 display module manufacture method it is characterised in that
In described step 2) i) in, the solidification of the selectivity of scan mode is while Burdick lamp is scanned, and is installed in
The shutter of Burdick lamp is blocked in the part not needing to solidify, and shutter is being opened for the part needing solidification
(Open), thus only making the partially selectively solidification of needs solidification.
6. utilization optical clear resin according to claim 1 display module manufacture method it is characterised in that
In described step 2) ii) in, the solidification of the selectivity of masking regime is by being not through to not needing the part solidifying to be formed
The pattern (Pattern) of ultraviolet and implement selectivity solidification, or using have adjusted the mask of permeability come optionally
Adjust curing degree, to make optical clear resin be cured on demand according to various pieces.
7. utilization optical clear resin according to claim 1 display module manufacture method it is characterised in that
Described step 3) described second substrate be to use glass cover-plate selected from touch panel (Touch screen panel)
One or more of group that (Cover glass), glass cover-plate, plastic cement cover plate and thin film (Film) are constituted.
8. utilization optical clear resin according to claim 1 display module manufacture method it is characterised in that
Described step 3) bonding process carry out under vacuum or normal pressure.
9. a kind of display module it is characterised in that
Method according to any one of claim 1 to 8 is fabricated by.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0088294 | 2014-07-14 | ||
| KR1020140088294A KR20160008307A (en) | 2014-07-14 | 2014-07-14 | Method for manufacturing display module using optically clear resin |
| PCT/KR2015/007243 WO2016010317A1 (en) | 2014-07-14 | 2015-07-13 | Method for manufacturing display module using optical clear resin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106471563A true CN106471563A (en) | 2017-03-01 |
Family
ID=55078742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580036632.6A Pending CN106471563A (en) | 2014-07-14 | 2015-07-13 | Method for manufacturing display module using optically transparent resin |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR20160008307A (en) |
| CN (1) | CN106471563A (en) |
| TW (1) | TW201609275A (en) |
| WO (1) | WO2016010317A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107450780A (en) * | 2017-08-09 | 2017-12-08 | 长沙市宇顺显示技术有限公司 | A kind of shade and the method with its making touch-control product |
| CN107526470A (en) * | 2017-08-23 | 2017-12-29 | 信利光电股份有限公司 | The glue fitting precuring fixture and sub-curing process of a kind of touch-screen |
| CN109963962A (en) * | 2016-11-10 | 2019-07-02 | Bnl欧洲镜片公司 | The equipment of the vapor deposition of coating on optical goods |
| CN110590190A (en) * | 2019-10-22 | 2019-12-20 | 中国计量大学 | Special workstation of stromatolite glass bonding processing |
| CN113905114A (en) * | 2021-09-03 | 2022-01-07 | Oppo广东移动通信有限公司 | Electronic equipment, display screen assembly and attaching method thereof |
| CN114367423A (en) * | 2022-01-17 | 2022-04-19 | 深圳市洲明科技股份有限公司 | Glue pouring method for display module lamp seams |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102040468B1 (en) * | 2016-01-26 | 2019-11-05 | 주식회사 엘지화학 | Method for manufacturing optical element |
| KR20180032719A (en) | 2016-09-22 | 2018-04-02 | 삼성디스플레이 주식회사 | Display device |
| KR102632168B1 (en) | 2016-09-27 | 2024-02-01 | 삼성디스플레이 주식회사 | Display device |
| KR102015035B1 (en) * | 2017-11-08 | 2019-08-27 | 엘지전자 주식회사 | Instrument Panel for vehicle |
| KR20200083839A (en) | 2018-12-31 | 2020-07-09 | 현대자동차주식회사 | Display structure using the optical film having low reflectance surface |
| KR102297923B1 (en) | 2020-10-20 | 2021-09-07 | 유버 주식회사 | Border curing device |
| KR102314872B1 (en) | 2020-10-21 | 2021-10-19 | 유버 주식회사 | Uv curing system apllying liquid crystal mask |
| KR102599659B1 (en) | 2021-07-12 | 2023-11-06 | 유버 주식회사 | Scan-type light curing device |
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| CN107526470A (en) * | 2017-08-23 | 2017-12-29 | 信利光电股份有限公司 | The glue fitting precuring fixture and sub-curing process of a kind of touch-screen |
| CN110590190A (en) * | 2019-10-22 | 2019-12-20 | 中国计量大学 | Special workstation of stromatolite glass bonding processing |
| CN113905114A (en) * | 2021-09-03 | 2022-01-07 | Oppo广东移动通信有限公司 | Electronic equipment, display screen assembly and attaching method thereof |
| CN114367423A (en) * | 2022-01-17 | 2022-04-19 | 深圳市洲明科技股份有限公司 | Glue pouring method for display module lamp seams |
| CN114367423B (en) * | 2022-01-17 | 2023-03-21 | 深圳市洲明科技股份有限公司 | Glue pouring method for lamp seams of display module |
Also Published As
| Publication number | Publication date |
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| TW201609275A (en) | 2016-03-16 |
| WO2016010317A1 (en) | 2016-01-21 |
| KR20160008307A (en) | 2016-01-22 |
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Application publication date: 20170301 |