CN106457510A - Polishing pad and method for producing same - Google Patents
Polishing pad and method for producing same Download PDFInfo
- Publication number
- CN106457510A CN106457510A CN201580013168.9A CN201580013168A CN106457510A CN 106457510 A CN106457510 A CN 106457510A CN 201580013168 A CN201580013168 A CN 201580013168A CN 106457510 A CN106457510 A CN 106457510A
- Authority
- CN
- China
- Prior art keywords
- grinding
- isocyanates
- grinding pad
- alkoxysilyl
- polyurethane resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000005498 polishing Methods 0.000 title abstract description 8
- 239000012948 isocyanate Substances 0.000 claims abstract description 51
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 48
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 44
- 125000005370 alkoxysilyl group Chemical group 0.000 claims abstract description 31
- 238000006243 chemical reaction Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 24
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 238000000227 grinding Methods 0.000 claims description 158
- 238000000034 method Methods 0.000 claims description 47
- 239000000203 mixture Substances 0.000 claims description 38
- 238000005187 foaming Methods 0.000 claims description 35
- -1 Oxygen alkanes Chemical class 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000003756 stirring Methods 0.000 claims description 19
- 239000007789 gas Substances 0.000 claims description 15
- 239000004970 Chain extender Substances 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 239000006185 dispersion Substances 0.000 claims description 10
- 150000002148 esters Chemical class 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000004094 surface-active agent Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 claims description 7
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000008676 import Effects 0.000 claims description 4
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- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- OWIKHYCFFJSOEH-UHFFFAOYSA-N Isocyanic acid Chemical compound N=C=O OWIKHYCFFJSOEH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
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- 239000000376 reactant Substances 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- 239000004202 carbamide Substances 0.000 claims 1
- 150000002118 epoxides Chemical class 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 239000006260 foam Substances 0.000 abstract description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 3
- 125000004432 carbon atom Chemical group C* 0.000 abstract 2
- 125000002947 alkylene group Chemical group 0.000 abstract 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 abstract 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 16
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- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
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- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 3
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- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
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- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 3
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- AKCRQHGQIJBRMN-UHFFFAOYSA-N 2-chloroaniline Chemical compound NC1=CC=CC=C1Cl AKCRQHGQIJBRMN-UHFFFAOYSA-N 0.000 description 2
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- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- OHJMTUPIZMNBFR-UHFFFAOYSA-N biuret Chemical group NC(=O)NC(N)=O OHJMTUPIZMNBFR-UHFFFAOYSA-N 0.000 description 2
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- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
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- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- AVWRKZWQTYIKIY-UHFFFAOYSA-N ureidocarboxylic acid Natural products NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 2
- FEOHYDSNGHIXOM-WLDMJGECSA-N (3R,4R,5S,6R)-3-amino-6-(hydroxymethyl)-2-methyloxane-2,4,5-triol Chemical compound CC1(O)[C@H](N)[C@@H](O)[C@H](O)[C@H](O1)CO FEOHYDSNGHIXOM-WLDMJGECSA-N 0.000 description 1
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- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical class O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
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- 239000000178 monomer Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920001282 polysaccharide Polymers 0.000 description 1
- 239000005017 polysaccharide Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N sec-butylidene Natural products CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3225—Polyamines
- C08G18/3237—Polyamines aromatic
- C08G18/3243—Polyamines aromatic containing two or more aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3225—Polyamines
- C08G18/325—Polyamines containing secondary or tertiary amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
- C08G18/3855—Low-molecular-weight compounds having heteroatoms other than oxygen having sulfur
- C08G18/3863—Low-molecular-weight compounds having heteroatoms other than oxygen having sulfur containing groups having sulfur atoms between two carbon atoms, the sulfur atoms being directly linked to carbon atoms or other sulfur atoms
- C08G18/3865—Low-molecular-weight compounds having heteroatoms other than oxygen having sulfur containing groups having sulfur atoms between two carbon atoms, the sulfur atoms being directly linked to carbon atoms or other sulfur atoms containing groups having one sulfur atom between two carbon atoms
- C08G18/3868—Low-molecular-weight compounds having heteroatoms other than oxygen having sulfur containing groups having sulfur atoms between two carbon atoms, the sulfur atoms being directly linked to carbon atoms or other sulfur atoms containing groups having one sulfur atom between two carbon atoms the sulfur atom belonging to a sulfide group
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4833—Polyethers containing oxyethylene units
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/71—Monoisocyanates or monoisothiocyanates
- C08G18/718—Monoisocyanates or monoisothiocyanates containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
- C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/83—Chemically modified polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/83—Chemically modified polymers
- C08G18/837—Chemically modified polymers by silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/30—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by mixing gases into liquid compositions or plastisols, e.g. frothing with air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0041—Foam properties having specified density
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2201/00—Foams characterised by the foaming process
- C08J2201/02—Foams characterised by the foaming process characterised by mechanical pre- or post-treatments
- C08J2201/022—Foams characterised by the foaming process characterised by mechanical pre- or post-treatments premixing or pre-blending a part of the components of a foamable composition, e.g. premixing the polyol with the blowing agent, surfactant and catalyst and only adding the isocyanate at the time of foaming
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2205/00—Foams characterised by their properties
- C08J2205/04—Foams characterised by their properties characterised by the foam pores
- C08J2205/052—Closed cells, i.e. more than 50% of the pores are closed
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2207/00—Foams characterised by their intended use
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
- C08J2375/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/10—Block- or graft-copolymers containing polysiloxane sequences
- C08J2483/12—Block- or graft-copolymers containing polysiloxane sequences containing polyether sequences
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
The purpose of the present invention is to provide: a polishing pad having a high polishing rate and excellent planarizing properties; and a method for producing the polishing pad. A polishing pad having, formed therein, a polishing layer comprising a polyurethane resin foam, said polishing pad being characterized in that a polyurethane resin, which is a material used for forming the polyurethane resin foam, has an alkoxysilyl group introduced into a side chain thereof, wherein the introduction of the alkoxysilyl group is achieved by the reaction of a urethane or urea group in an isocyanate-terminal prepolymer with an isocyanate group in an alkoxysilyl-group-containing isocyanate represented by general formula (1). (In the formula, X represents OR1 or OH; R1 s independently represent an alkyl group having 1 to 4 carbon atoms; and R2 represents an alkylene group having 1 to 6 carbon atoms.)
Description
Technical field
The present invention relates to can stable and high grinding efficiency to the optical material of lens, reflecting mirror etc. or silicon wafer, hard disk
With the material of surface of glass substrate, aluminium base and the height requiring general metal grinding to process etc. put down
The grinding pad of smoothization processing.The grinding pad of the present invention is particularly well-suited to silicon wafer and its defines oxide skin(coating), metal above
The device of layer etc. carries out lamination in these oxide skin(coating)s and metal level and implements the operation planarizing before being formed.
Background technology
As the representative of the material of the surface requiring height, there are manufacture semiconductor integrated circuit (IC,
The disk of the referred to as monocrystal silicon of silicon wafer LSI).For silicon wafer, in order to, in the manufacturing process of IC, LSI etc., formation is used in
The reliable semiconductor bond of the various thin film that circuit is formed, lamination and each operation forming oxide skin(coating) and metal level
In it is desirable to its surface being carried out with high accuracy and flatly processing.In such attrition process operation, generally grinding pad is fixed
On the revolvable support disk being referred to as platen, the machining object of semiconductor wafer etc. is fixed on grinding pad, Ran Houtong
Cross both sides' motion, between platen and grinding pad, produce relative velocity, the more continuous grinding milk containing abrasive grains for the supply is to grinding
On mill pad, implement grinding operation.
Abrasive characteristic as grinding pad is it is desirable in the excellent flatness (planarity) and surface of grinding object thing
Uniformity, the fast characteristic of grinding rate.For the flatness of grinding object thing, table inner evenness, can be by floor height will be ground
Spring rate obtains a certain degree of improvement.For grinding rate, by grinding layer is formed foaming body, keep serosity in a large number
Measure, or grinding layer is formed as hydrophilic and lifted with improving holding capacity of serosity etc..
For example, in patent documentation 1, in order to improve grinding pad to the wellability of water it is proposed that containing (A) crosslinked elasticity
Body, (B) have the material of at least one functional group in carboxyl, amino, hydroxyl, epoxy radicals, sulfonic group and phosphate,
And water-soluble substanceses, and described (A) cross-linked elastomer is that the polymeric grinding pad making 1,2- polybutadiene crosslinking is used
The scheme of compositionss.
In patent documentation 2, in order that serosity is easy to immerse in grinding pad it is proposed that following grinding pad：It is by containing
There is a polyurethane resin of the copolymer compound with hydrophilic radical and urethane composition containing hydrophilizing agent formed
Grinding pad, this hydrophilizing agent is 7- glycol-two polyoxyethylene ether and 2 selected from 2,4,7,9- tetramethyl -5- decine -4,
4,7,9- tetramethyl -5- decine -4, at least one in 7- glycol, the compound that this has hydrophilic radical is epoxy
Oxide monomers.
In patent documentation 3, all good in order to obtain flatness, table inner evenness, grinding rate, grinding rate becomes
Change less and the excellent grinding pad of life characteristic is it is proposed that following scheme：
One of material composition as polyurethane resin foaming body, using comprising the oxirane with more than 25 weight %
Unit (- CH2CH2O- number-average molecular weight) is more than 500 hydrophilic macromolecule weight polyalcohol composition and isocyanate prepolymer composition
Hydrophilic isocyanate end prepolymer (B) being formed as material composition.
In patent documentation 4, in order to improve the hydrophilic of grinding layer it is proposed that following grinding layer：
That is, can by constitute grinding layer resin be dissolved in its organic solvent dissolvable, this grinding layer contains indissoluble or
Water-fast partially acylated polysaccharide constituents.
But, exist and form if hydrophilic grinding layer although grinding rate increases, but grinding object thing is flat
The problem that smooth property is deteriorated.
Prior art literature
Patent documentation
Patent documentation 1：No. 3826702 description of Japanese Patent No.；
Patent documentation 2：No. 3851135 description of Japanese Patent No.；
Patent documentation 3：No. 4189963 description of Japanese Patent No.；
Patent documentation 4：No. 5189440 description of Japanese Patent No..
Content of the invention
Invent technical problem to be solved
The present invention is to provide grinding rate fast and the excellent grinding pad of planarization characteristics and its manufacture method are as purpose.
Solve the technical scheme that technical problem is adopted
The present inventor is studied repeatedly to solving aforementioned problems, it is found that just be can solve the problem that by following grinding pads
Aforementioned problems, thus complete the present invention.
With regard to a kind of grinding pad, it is the grinding pad with the grinding layer being formed by polyurethane resin foaming body to the present invention,
Polyurethane resin as the formation material of described polyurethane resin foaming body passes through the amino first of isocyanates end prepolymer
Perester radical or the reaction of urea groups and the NCO of the isocyanates comprising alkoxysilyl shown in following formula (1),
Import alkoxysilyl in side chain：
(in formula, X is OR1Or OH, R1It is each independently the alkyl of carbon number 1～4, R2Alkylene for carbon number 1～6
Base).
As described above, the present invention has the feature importing alkoxysilyl on the side chain of polyurethane resin.Grind
Alkoxysilyl existing for layer surface is hydrolyzed by the water in serosity in grinding, grinding layer Surface Creation silanol group.
This silanol group is because being hydrophilic, so the hydrophilic grinding layer surface is enhanced.Its result is to improve the holding energy of serosity
Power, improves grinding rate.
On the other hand, alkoxysilyl is because being imported on the side chain of polyurethane resin, so polyurethane resin is difficult to
By slurry dilatancy.Alkoxysilyl existing for grinding layer inside because being difficult to contact with the water in serosity, so be difficult to by
Hydrolysis.Therefore the decline of the overall hardness of grinding layer can be suppressed only by grinding layer surface hydrophilic.Its result is the flat of grinding pad
Smoothization characteristic is difficult to reduce.
The described isocyanates preferably 3- NCO propyl-triethoxysilicane comprising alkoxysilyl.
With respect to the isocyanates end prepolymer of 100 weight portions, the described isocyanates comprising alkoxysilyl
Addition preferably 1～10 weight portion.Because alkoxysilyl is imported into the side chain of polyurethane resin, so by a small amount of
The importing of alkoxysilyl manifest hydrophilic.The addition of isocyanates comprising alkoxysilyl is less than 1 weight
In the case of amount part, the hydrophiling grinding layer surface is difficult to produce；If it exceeds during 10 weight portion, existing to be difficult to make and grind spy
The tendency of the excellent grinding layer of property.
With regard to a kind of manufacture method of grinding pad, this manufacture method is including by containing the pre-polymerization of isocyanates end to the present invention
The first composition of thing and the second composition containing chain extender carry out mixing, solidify, the operation of prepared polyurethane resin foaming body
Manufacture method,
Described operation is to add up to the condition that weight is 0.05～10 weight % to incite somebody to action with respect to first composition and second composition
Polysiloxane-based surfactant is added in the first composition containing isocyanates end prepolymer, then by described first composition
Stir with non-reactive gas, after modulation is using described non-reactive gas as bubble scattered bubble dispersion liquid, in described gas
The second composition containing chain extender is mixed in bubble dispersion liquid, solidification, the operation of prepared polyurethane resin foaming body；
Described second composition contains the isocyanates comprising alkoxysilyl shown in following formula (1)：
(in formula, X is OR1Or OH, R1It is each independently the alkyl of carbon number 1～4, R2Alkylene for carbon number 1～6
Base).
In previous building methods, by the carbamate groups of isocyanates end prepolymer or urea groups with comprise alcoxyl
The reaction of the NCO of the isocyanates of base silicyl, forms allophanic acid ester structure or biuret structure, can
Obtain the polyurethane resin that side chain has imported alkoxysilyl.
The described isocyanates preferably 3- NCO propyl-triethoxysilicane comprising alkoxysilyl.
With respect to the isocyanates end prepolymer of 100 weight portions, the described isocyanates comprising alkoxysilyl
Addition preferably 1～10 weight portion.
The present invention, with regard to a kind of manufacture method of semiconductor device, comprises using aforesaid grinding pad, grinding semiconductor is brilliant
The operation on the surface of piece.
Invention effect
The grinding pad of the present invention is the grinding pad that grinding rate is fast and planarization characteristics are excellent.In addition, the grinding of the present invention
Pad is because being changed into hydrophilic by serosity by grinding layer surface in grinding operation, so the coagulation change of the polishing particles in serosity
Difficulty, can effectively suppress to produce cut on grinding object thing.
Brief description
Fig. 1 is shown in the schematic configuration diagram of lapping device one used in CMP grinds.
Specific embodiment
The grinding pad of the present invention can be the grinding layer or grinding layer and its being only made up of polyurethane resin foaming body
The laminate of his layer (such as cushion etc.).
Polyurethane resin as the formation material of aforementioned polyurethane resin foaming body passes through isocyanates end prepolymer
Carbamate groups or urea groups and the isocyanates comprising alkoxysilyl shown in following formula (1) NCO
Reaction, side chain import alkoxysilyl：
(in formula, X is OR1Or OH, R1It is each independently the alkyl of carbon number 1～4, R2Alkylene for carbon number 1～6
Base).
Aforementioned polyurethane resin preferably contains and comprises alkoxyl first shown in isocyanates end prepolymer, above formula (1)
The reaction firming body of the polyurethane raw material composition of the isocyanates of silylation and chain extender.
Isocyanates end prepolymer passes through to make (high molecular weight polyols, low containing isocyanate prepolymer composition, polyol component
Molecujar weight polyol) etc. prepolymer feedstock composition reaction and obtain.
As isocyanate prepolymer composition, can be not particularly limited using the compound being known in polyurethane field.As isocyanide
Acid esters composition, can enumerate 2,4 toluene diisocyanate, 2,6- toluene di-isocyanate(TDI), 2,2 '-diphenyl methane two isocyanide
Acid esters, 2,4 '-methyl diphenylene diisocyanate, 4,4 '-methyl diphenylene diisocyanate, 1,5- naphthalene diisocyanate,
P- phenylene vulcabond, m- phenylene vulcabond, p- XDI, m- dimethylbenzene two Carbimide.
The aromatic diisocyanate of ester etc.；Ethylene diisocyanate, 2,2,4- trimethyl hexamethylene diisocyanates, 1,6- six
The aliphatic diisocyanate of methylene diisocyanate etc.；Isosorbide-5-Nitrae-cyclohexane diisocyanate, 4,4 '-dicyclohexyl-methane two
Ester ring type diisocyanate of isocyanates, isophorone diisocyanate, norbornene alkyl diisocyanate etc. etc..These can be single
Solely use, but also two or more shares.
As isocyanate prepolymer composition, in addition to aforesaid diisocyanate cpd, it is also possible to use the many of more than 3 senses
Sense polyisocyanate compound.As polyfunctional isocyanate compound, can be used market sale as デ ス モ ジ
ュ Le-N (Beyer Co., Ltd's system) or a series of two isocyanides of trade name デ ュ ラ ネ ト (industrial group of Asahi Chemical Industry system)
Acid esters adduct compound.
As high molecular weight polyols, the high molecular weight polyols being usually used using polyurethanes technology field, for example,
Polytetramethylene ether diol, Polyethylene Glycol etc. are the polyether polyol of representative；Polybutylene adipate is the polyester polyols of representative
The polyester of the illustrations such as the reactant of the polyester-diol of alcohol, polycaprolactone polyol, polycaprolactone etc and alkylene carbonate gathers
Carbonate polyol, so that ethylene carbonate and polyhydric alcohol is reacted, make organic dicarboxylic acid and obtained reaction mixing afterwards
Thing reacts the poly- carbon of the ester exchange reaction gained of polyester polycarbonate polyols, polyol and aryl carbonates of gained
Acid esters polyhydric alcohol etc..These can be used alone, but also two or more shares.
Weight average molecular weight for high molecular weight polyols is not particularly limited, from the elasticity of obtained polyurethane resin
From the viewpoint of characteristic etc., preferably 500～3000.When weight average molecular weight is less than 500, using the polyurethane obtained by this polyhydric alcohol
Resin does not have enough elastic characteristics, easily forms crisp polymer, and the grinding pad being formed by such polyurethane resin
Become really up to the mark, the reason the cut on grinding object thing surface can be become occurring.Furthermore, wear away because easy, from the life-span of grinding pad
From the viewpoint of also undesirable.On the contrary, weight average molecular weight is more than 3000, by using the polyurethane resin obtained by this polyhydric alcohol
The grinding pad deliquescing being formed, is difficult to obtain the flatness fully meeting.
In addition to above-mentioned high molecular weight polyols, also can share ethylene glycol, 1,2-PD, 1,3-PD, 1,
2- butanediol, 1,3 butylene glycol, BDO, 2,3-butanediol, 1,6- hexanediol, neopentyl glycol, Isosorbide-5-Nitrae-hexamethylene
Alkane dimethanol, 3- methyl isophthalic acid, 5- pentanediol, diethylene glycol, triethylene glycol, Isosorbide-5-Nitrae-bis- (2- hydroxyl-oxethyl) benzene, three hydroxyls
Methylpropane, glycerol, 1,2,6- hexane triols, tetramethylolmethane, tetra methylol hexamethylene, methyl glucosamine, Sorbitol, sweet
Dew sugar alcohol, dulcitol, sucrose, 2,2,6,6- tetra- (methylol) Hexalin, diethanolamine, N methyldiethanol amine, Yi Jisan
The low molecular weight polyols of ethanolamine etc..Also can share ethylene diamine, triethylenediamine, diphenylmethanediamiand and
The low-molecular-weight polyamine of diethylenetriamines etc..Monoethanolamine, 2- (2- aminoethylamino) ethanol, Yi Jidan also can be shared
The hydramine of Propanolamine etc..Can be used alone these low molecular weight polyols, low-molecular-weight polyamine etc., but also two or more shares.
Isocyanates end prepolymer is by using isocyanate prepolymer composition and polyol component etc. with NCO (NCO)
With reactive hydrogen (H*) equivalent proportion (NCO/H*) be usually 1.2～8, preferably 1.5～3 scope carry out reacting by heating and make
?.
Isocyanates end prepolymer has carbamate groups in intramolecular, also can have urea groups.
In front formula (1), X preferably OR1, R1Preferably methyl or ethyl.Comprise alcoxyl as what front formula (1) represented
The isocyanates of base silicyl, preferably use 3- NCO propyl-triethoxysilicane.
With respect to the isocyanates end prepolymer of 100 weight portions, preferably add 1～10 weight portion, more preferably add 1～5
The isocyanates of alkoxysilyl are comprised described in weight portion.
In isocyanates end prepolymer cures using chain extender.Chain extender is that at least have the work of more than 2
The organic compound of property hydrogen-based.As active hydrogen-based, for example, hydroxyl, primary amino radical or secondary amino group, sulfydryl (SH) etc..Specifically
For：4,4 '-di-2-ethylhexylphosphine oxide (o- chloroaniline) (MOCA), the chloro- p-PDA of 2,6- bis-, 4,4 '-di-2-ethylhexylphosphine oxide (2,3-
Dichloroaniline), double (methyl mercapto) -2,4- toluenediamine of 3,5-, double (methyl mercapto) -2,6- toluenediamine of 3,5-, 3,5-
Diethyltoluene -2,4- diamidogen, 3,5- diethyltoluene -2,6- diamidogen, propylene glycol-two-p- Aminobenzoate,
1,2- double (2- aminophenyl is thio) ethane, 4,4 '-diaminourea -3,3 '-diethyl -5,5 '-dimethyl diphenyl first
Alkane, N, N '-two-sec- butyl -4,4 '-diaminodiphenyl-methane, 3,3 '-diethyl -4,4 '-diaminourea hexichol
Methylmethane, m- benzene dimethylamine, N, N '-two-sec- butyl-p-phenylenediamine, m- phenylenediamine and p- benzene dimethylamine etc.
The many amines illustrating or above-mentioned low molecular weight polyols or low-molecular-weight polyamine.They can a kind use, two or more mixing
Can also.
Polyurethane resin foaming body can be obtained using the known urethane technology such as fusion method, solwution method, but
In view of cost and working environment etc., preferably with fusion method manufacture.
In order to be able to efficiently making the carbamate groups of described prepolymer or urea groups and comprising the different of alkoxysilyl
The NCO reaction of cyanate, forms allophanic acid ester structure or biuret structure, the isocyanates of aforementioned prepolymer
The ratio preferably 0.95～1.00 of the quantity of the active hydrogen-based (hydroxyl, amino) to chain extender for the quantity of base.
As the manufacture method of polyurethane resin foaming body, can be using the method, (inclusion of mechanical foaming method adding hollow ball
Mechanical scum silica frost method (Japanese：メ カ ニ カ Le Off ロ ス method)), chemical blowing process etc..
Spy is well the machinery of the polysiloxane-based surfactant that copolymer as polyalkylsiloxane and polyethers is used
Foaming.As polysiloxane-based surfactant, (eastern beautiful DOW CORNING organosilicon is public can be illustrated as SH-192 and L-5340
Department (レ ダ ウ conning シ リ コン company) system), B8443, B8465 (gold Schmidt company (go Le De
シ ュ ミ ッ ト company) system) etc. as suitable compound.Polysiloxane-based surfactant is preferably with 0.05～10 weight %, more
It is added in polyurethane raw material composition for 0.1～5 weight % well.
As needed, also can add in polyurethane raw material composition the stabilizer of antioxidant etc., lubricant, pigment,
Filler, antistatic agent, other additive.
Polyurethane resin foaming body can be separated foam type or continuous air bubbles type, but in order to prevent
Serosity within to grinding layer invades, and prevents the hydrolysis of the alkoxysilyl of presence inside grinding layer, preferably independent gas
Bubble type.
With regard to manufacturing the example of the method for the polyurethane resin foaming body of the micro air bubble type constituting grinding pad (grinding layer)
Son, carries out following explanation.The manufacture method of related polyurethane resin foaming body has following operation：
1) make the foamed process of the bubble dispersion liquid of isocyanates end prepolymer
Add polysiloxane-based surfactant in isocyanates end prepolymer (first composition), in non-reacted gas
Stir in the presence of body, so that non-reactive gas is disperseed as bubble, prepared bubble dispersion liquid.Under aforementioned prepolymer room temperature it is
In the case of solid, it is preheating to suitable temperature, melting uses.
2) isocyanates of alkoxysilyl and the mixed processes of chain extender are comprised
(second becomes with chain extender to add the isocyanates comprising alkoxysilyl in above-mentioned bubble dispersion liquid
Point), mixing, stirring, form foamable reaction liquid.
3) pour into a mould operation
Above-mentioned foamable reaction liquor stream is entered in mould.
4) curing process
The foamable reaction liquid heating that will flow in mould solidifies so as to react.
As the non-reactive gas forming bubble, preferably use the gas of incombustibility, be specifically enumerated as nitrogen, oxygen
The noble gases such as gas, carbon dioxide, helium and argon or the mixed gas of these gases.Using dry dewatered air
Cost is also ideal.
It is dispersed in the first composition containing polysiloxane-based surfactant as by non-reactive gas formation air bubble-shaped
Interior agitating device, can use known agitating device, it is not particularly limited.It is, for example, specifically homogenizer, dissolving dispersion machine
(Japanese：デ ィ ゾ Le バ), bi-axial planet type blender (Japanese：プ ラ ネ タ リ ミ キ サ) etc..For agitating device
The shape of stirring vane is not particularly limited, and preferably uses the stirring vane beating type obtaining micro air bubble.
The interpolation in the stirring and mixed processes of making bubble dispersion liquid in foamed process comprises alkoxysilyl
Isocyanates and the stirring that mixed of chain extender preferably use different agitating devices.Particularly stirring in mixed processes
Mix and can not be the stirring forming bubble, preferably use the agitating device of non-involvement air pocket.As such agitating device, fit
Share planet-shaped blender.The agitating device of foamed process and mixed processes also can use identical agitating device, as needed
The adjustment carrying out the stirring condition of the rotary speed adjustment to stirring vane etc. comes using proper.
In the manufacture method of polyurethane resin foaming body, mould is entered to foamable reaction liquor stream and carries out till not flowing
Foaming body obtained by reaction heated and solidify afterwards operation have improve foaming body physical characteristics effect, fabulous.?
Mould can be entered as by foamable reaction liquor stream, put it into the condition carrying out solidify afterwards in heating furnace, because even at this at once
Under conditions of sample, heat is not also passed to reacted constituent at once, so bubble diameter will not increase.Curing reaction enters at ambient pressure
Row can stablize bubble shape, thus ideal.
In polyurethane resin foaming body, even if using the known catalyst that can promote polyurethane reaction such as tertiary amines
Have no relations.The species of catalyst and addition flow into the flowing time of the mould of regulation shape to carry out after being contemplated that mixed processes
Select.
The manufacture of polyurethane resin foaming body can be to measure each composition, is put into the interval being stirred in container
Mode or continuously each composition and non-reactive gas are supplied agitating device, is stirred, and sends bubble dispersion
Liquid, the continuous mode of production of finished product.
Can also be that the prepolymer of the raw material as polyurethane resin foaming body is put in reaction vessel, put into thereafter bag
Isocyanates containing alkoxysilyl and chain extender, after stirring, flow in the injection mould of prescribed level, make block,
With plane shape or the food slicer with saw-like by the method for this block dicing, or also can in the stage of aforesaid injection mould,
Be formed as chip shape.
Preferably 30～200 μm of the mean air bubble diameter of polyurethane resin foaming body.If not in the case of this scope,
The planarity (flatness) of the grinding object thing after grinding can reduce.
The hardness of polyurethane resin foaming body is measured with ASKER-D durometer, preferably 40～70 degree, if ASKER-D
In the case that hardness is less than 40 degree, the planarity of grinding object thing declines；In addition more than 70 degree although planarity is good
Good, but the uniformity of grinding object thing can reduce.
The proportion of polyurethane resin foaming body preferably 0.5～1.3, if proportion is less than 0.5, the surface of grinding layer
Intensity decreases, the planarity of grinding object thing can decline；If 1.3, the number of bubbles grinding layer surface reduces,
Although planarity is good, grinding rate can reduce.
The present invention grinding pad (grinding layer) the lapped face contacting with grinding object thing preferably have holding and more
The surface configuration of new serosity.On the lapped face of the grinding layer being formed by foaming body, there are multiple openings, there is holding and update
The function of serosity, but in order to efficiently carry out the retentivity of serosity and the renewal of serosity, and prevent because with grinding object thing
The destruction adsorbed and grinding object thing is produced, preferably has sag and swell in lapped face.As long as sag and swell be to maintain and
Update the shape of serosity, to its no specific restriction, can be for example XY grid groove, concentric circles groove, through hole, the hole of not insertion,
Prism, cylinder, spiral groove, the combination of eccentric round shape groove, radial slot and these grooves.In addition, these sag and swells are usual
For having the construction of systematicness, but in order to form the holding of serosity and the construction that renewal property is good, within the specific limits can also
The spacing of change groove, well width and groove depth etc..
Manufacture method for aforementioned sag and swell is not particularly limited, for example, can be the use of the planing tool of prescribed level
(Japanese：バ イ ト) as instrument carry out the method for machine cut, by infusing resin into the mould with predetermined surface shape
Tool is so as to the manufacture method of solidification, manufacture method resin pressurizeed by the increased pressure board with predetermined surface shape, use light
Method that lithography is made, the method being made using printing maneuver, enter by using the laser of carbon dioxide laser etc.
Method that row makes etc..
The grinding pad of the present invention can also be the grinding pad being bonded aforesaid grinding layer and buffer substrate tablet.
Aforesaid buffer substrate tablet (cushion) is the buffer substrate tablet supplementing grinding layer characteristic.In order to take into account shifting relation
Planarity and uniformity both, buffer substrate tablet is necessary component in CMP.Planarity refers to there is pattern shape in grinding
The flatness of the drafting department during grinding object thing of produced minute asperities during one-tenth.And uniformity refers to the whole of grinding object thing
The uniformity of body.Planarity is improved by the characteristic of grinding layer, uniformity is improved by the characteristic of buffer substrate tablet.The present invention's
In grinding pad, buffer substrate tablet is preferably using the material more soft than grinding layer.
As aforesaid buffer substrate tablet, for example, can use the fiber of polyester non-woven fabric, nylon nonwoven fabrics, acrylic acid non-woven fabrics etc.
Non-woven fabrics or containing the such non-woven fabrics containing resin pickup of the polyester non-woven fabric being soaked with polyurethane, polyurethane foam, polyethylene bubble
The rubbery resin of the macromolecule resin foaming body of foam etc., butadiene rubber, different acrylic rubber etc., photoresist etc..
As the means being bonded grinding layer and buffer substrate tablet, for example, grinding layer and buffer substrate tablet are clamped with double faced adhesive tape, enter
The method of row pressurization.
Aforesaid double faced adhesive tape is that have the usual structure being provided with adhesion layer on the two sides of the base material of non-woven fabrics or film etc.
Material.If it is considered that the problem preventing serosity to be impregnated with etc. to buffer substrate tablet, preferably film is used as base material.In addition, as viscous
The composition of attached layer, can enumerate such as rubber adhesive or acrylic adhesives etc..If it is considered that the containing of metal ion
Amount, the metal ion content of acrylic adhesives is few, thus ideal.In addition, there is also grinding layer and buffer substrate tablet in group
Different situation on one-tenth, so the different materials of the composition of each adhesion layer of optional double faced adhesive tape, also can be viscous by each layer
Attached power is optimized adjustment.
The grinding pad of the present invention can also be provided with double faced adhesive tape on the face that it is adhered to platen.As this double faced adhesive tape, with
Same as before, using the material with usual structure that adhesion layer is provided with the two sides of base material.For example can be for no as base material
Spin cloth or film etc..If it is considered that grinding pad is peeled off from platen after using, preferably film is used as base material.In addition, as viscous
The composition of attached layer, can enumerate such as rubber adhesive or acrylic adhesives etc..If it is considered that the containing of metal ion
Amount, the metal ion content of acrylic adhesives is few, thus ideal.
Semiconductor device is obtained through the operation of the surface grinding to semiconductor wafer using aforementioned grinding pad.Semiconductor die
The piece usually lamination material of wiring metal and oxide-film on silicon.For semiconductor wafer Ginding process and
Lapping device is not particularly limited, for example can using grinding plate 2 shown in Fig. 1, that there is support grinding pad (grinding layer) 1,
Hold the support table (rubbing head) 5 of semiconductor wafer 4 and to the chip uniformly packing material of pressure, the feed mechanism of grinding agent 3
Lapping device etc. is carried out.Grinding pad 1 is for example fixed on grinding plate 2 by sticking double faced adhesive tape assembling.Grinding plate 2 and support
Platform 5 is configured to grinding pad 1 that they support respectively and semiconductor wafer 4 is in opposite position, each has rotary shaft
6、7.The side of support table 5 is provided with the pressing mechanism being expressed to semiconductor wafer 4 on grinding pad 1.During grinding, grind flat
Platform 2 and support table 5, while rotation, semiconductor wafer 4 are expressed on grinding pad 1, supply serosity, while being ground
Mill.To the flow of serosity, grinding is born a heavy burden, grinding plate rotation number and afer rotates number are not particularly limited, and suitably adjustment is carried out.
It is removed by the surface projections of this semiconductor wafer 4, is ground into flat condition, thereafter through patterning method, glue
The prepared semiconductor device such as close, encapsulate.Semiconductor device is used for calculus treatment device and memorizer etc..
Embodiment
By the following examples the present invention is described, but the present invention is not limited to these embodiments.
[mensure, evaluation methodology]
(mensure of mean air bubble diameter)
With microtome (Japanese：ミ Network ロ ト system カ ッ タ) to prepared polyurethane resin foaming body
Parallel slices are carried out with the condition being as thin as possible to below thickness 1mm, in this, as measurement sample.Micro- with scanning electron
Mirror (scientific system company of Hitachi (Japanese：サ イ エ Application ス シ ス テ system ズ society of Hitachi) system, S-3500N) 10 times shoot sample
Surface, then uses image analysis software (three paddy business Co., Ltd. (Japaneses：MIT ANI U Port レ シ ョ Application society) system,
WIN-ROOF), measure the round equivalent footpath (Japanese of whole bubbles of any range：Quite footpath), calculated averagely by this measured value
Bubble diameter.
(mensure of proportion)
Carried out according to JIS Z8807-1976.The polyurethane resin foaming body being obtained is cut into the bar shaped of 4cm × 8.5cm
Shape (thickness：Arbitrarily) as gravity test sample, it to be rested on 23 DEG C ± 2 DEG C of temperature, humidity 50% ± 5% for 16 hours
Environment in.In mensure, with gravimeter (Sai Duolisi company (Japanese:ザ Le ト リ ウ ス society) system) measure proportion.
(mensure of hardness)
Carried out according to JIS K6253-1997.The polyurethane resin foaming body being obtained is cut into 2cm × 2cm (thickness：Appoint
Meaning) size, as hardness measurement sample, it to be rested on 23 DEG C ± 2 DEG C of temperature, the ring of humidity 50% ± 5% for 16 hours
In border.During mensure, sample is overlapped to form as more than thickness 6mm.With durometer (macromolecule quantifier company system, ASKER-D type
Durometer), measure hardness.In addition, being immersed in 48 hours in water sample, take out sample thereafter, after gently wiping surface moisture away,
Measure hardness in the same way.
(evaluation of abrasive characteristic)
It is used MAT-ARW-8C1A (MAT (strain) system) as lapping device, to be ground characteristic using prepared grinding pad
Evaluation.Grinding rate passes through grinding in 60 seconds and forms the material that 1 μm of heat oxide film is formed on 8 inch silicon wafer, thus
When amount of grinding calculate.In the film thickness measuring of oxide-film, using light interference type film thickness measuring device (resistance to promise company system, device
Name：Nanospec).As grinding condition, in grinding using flow 120ml/ minute add silicon serosity as serosity (SS12,
Cabot Co., Ltd's system (Japanese：キ ャ ボ ッ ト society)).Grinding load is 4.5psi, grinding plate rotation number 93rpm, afer rotates
Number is 90rpm.
Planarization characteristics are evaluated by stock removal.After 0.5 μm of heat oxide film is piled up on 8 inch silicon wafer, enter
After the fixed patterning of professional etiquette, with 1 μm of oxide-film of p-TEOS accumulation, make with initial stage jump (Japanese：Segment difference) 0.5 μm of figure
The chip of case.With aforementioned condition, this chip is ground, after grinding, measures each jump, calculate stock removal.Stock removal refers to
Wide 270 μm of line with the line of 30 μm of steric pattern and wide 30 μm with 270 μm of steric pattern, aforementioned 2
The jump planting the line top of pattern is changed intoThe stock removal in 270 μm of space when following.The stock removal in 270 μm of space
Few situation represents that the stock removal of the part being not intended to grinding is few, and flatness is high.
The evaluation of cut is carried out as follows：
Grind 38 inches of false piece (dummy wafer) subject to the foregoing, thereafter to having piled up thickness's
The wafer grinding of 8 inches of heat oxide film 1 minute, then uses KLA-Tencor Teng Ke company (Japanese：KLA テ ンコ Le society) make lack
Sunken evaluating apparatus (Surfscan SP1) measure the streak having how many more than 0.19 μm on the chip after grinding.
Embodiment 1
Add polyethers prepolymer (Gu special company system, ア ジ プ レ Application L-325) 100 weight portions in reaction vessel
And polysiloxane-based surfactant (gold Schmidt's company system, B8465) 3 weight portions, mixing, it is adjusted to 70 DEG C, subtract
Pressure-off is steeped.Thereafter, with stirring vane with rotation number 900rpm high degree of agitation about 4 minutes so that bubble agitation to be entered reaction system
Interior.Thereafter, add 3- NCO propyl-triethoxysilicane (hereinafter referred to as 3-IPESi) 1 weight in reaction vessel
(NCO refers to 28.9 weight portions the 4,4 '-di-2-ethylhexylphosphine oxide (o- chloroaniline) (hereinafter referred to as MOCA) of part and pre-fusion to 120 DEG C
Number：1.0) after, stirring this mixed liquor within about 70 seconds, flow into the chunk (cast container) of dish-type.Lose flowing in this mixed liquor
The time point of property is put in stove, in 16 hours of 100 DEG C of solidify afterwards, prepared polyurethane resin foaming body block.
With flaking mill (Ya meter Imtech (Japanese：ア ミ テ ッ Network society) system, VGW-125) by about 80 DEG C aforementioned of heating
Polyurethane resin foaming body block is cut into slices, and prepared polyurethane resin foaming body piece, then, using buffing machine (Ya meter Imtech system)
The surface of this piece is processed by shot blasting until its thickness is 1.27mm, using as the piece that have adjusted thickness and precision.Will be through throwing
The piece of optical processing strikes out the size of diameter 61cm, using groove processing machine (Tyke promise company (Japanese：テ Network ノ society) system) to table
Face carries out groove width 0.25mm, separation 1.50mm, the groove processing of the concentric circles of groove depth 0.40mm, prepared grinding layer.Use
Stacking-up machine pastes double faced adhesive tape on the face of the groove processing face opposition side with this grinding layer, and (hydrops chemical industrial company manufactures, ダ
ブルタックテープ).Then, to buffer substrate tablet (Dongli Ltd.'s system, polyethylene, the ト implementing sided corona treatment
レ ペ Off, thickness 0.8mm) surface be processed by shot blasting, be affixed on aforementioned double faced adhesive tape using stacking-up machine.Furthermore, make
With stacking-up machine sticking two-faced adhesive tape, grinding pad is made on the another side of buffer substrate tablet.
Embodiment 2
Except by the addition of 3-IPESi in addition to 1 weight portion is changed into 5 weight portions, with method similarly to Example 1
Prepared grinding pad.
Embodiment 3
Polyethylene Glycol (PEG, the first industrial pharmaceutical company system, number-average molecular weight 1000) 40 weight are put in reaction vessel
Part, Polyethylene Glycol (PEG, the first industrial pharmaceutical company system, number-average molecular weight 600) 12.8 weight portions, DEG 6 weight portion,
Stirring, carries out the decompression dehydration of 1～2 hour, then, imports nitrogen, add TDI-80 after nitrogen displacement in removable flask
(41.2 weight portion).While temperature in reaction system is maintained at 70 DEG C about, stirring is until reaction finishes.To react
Knot is set to the almost certain time point (NCO% of NCO%：9.96), the vacuum deaerator of followed by about 2 hours, prepared hydrophilic is different
Cyanate end prepolymer (hereinafter referred to as hydrophilicity prepolymer).
In reaction vessel add polyethers prepolymer (Gu special company system, ア ジ プ レ Application L-325) 80 weight portions,
Hydrophilicity prepolymer 20 weight portion and polysiloxane-based surfactant (gold Schmidt's company system, B8465) 3 weight
Part, mixing, it is adjusted to 70 DEG C, vacuum deaerator.Thereafter, with stirring vane with rotation number 900rpm high degree of agitation about 4 minutes with
Bubble agitation is entered in reaction system.Thereafter, 3-IPESi 1 weight portion and pre-fusion are added in reaction vessel to 120
DEG C MOCA 29.4 weight portion (nco index：1.0), after, stirring this mixed liquor within about 70 seconds, the open mould flowing into buffed top (pours
Note container).The time point becoming do not have in the mobility of this mixed liquor is put in stove, in 16 hours of 100 DEG C of solidify afterwards, is obtained poly-
Urethane foamed resin block.Thereafter, grinding pad is obtained in the same manner as in Example 1.
Embodiment 4
In addition to being become the addition of 3-IPESi by 1 weight portion and turning to 5 weight portions, with side same as Example 3
Legal system obtains grinding pad.
Comparative example 1～3
In addition to the formula recorded using table 1, grinding pad is obtained in the same manner as in Example 1.
Table 1
The grinding pad of embodiment 1～4 is that grinding rate is fast, and the excellent grinding pad of planarization characteristics.In addition, can effectively press down
Cut is produced on combinations piece.On the other hand, the grinding pad grinding rate of comparative example 1～3 and planarization characteristics are inadequate.Furthermore, than
Can not suppress to produce cut on chip compared with the grinding pad of example 1 and 2.
The probability utilizing in industry
The grinding pad of the present invention can stable and high grinding efficiency to the optical material of lens, reflecting mirror etc. or silicon wafer,
The material of aluminium base and the surface of height requiring general metal grinding to process etc. carries out planarization processing.This
Bright grinding pad is particularly well-suited to silicon wafer and its defines the device of oxide skin(coating), metal level etc. above in these oxides
Layer and metal level carry out lamination and implement the operation planarizing before being formed.
Symbol description
1：Grinding pad (grinding layer)
2：Grinding plate
3：Grinding agent (serosity)
4：Grinding object thing (semiconductor wafer)
5：Support table (rubbing head)
6、7：Rotary shaft
Claims (7)
1. a kind of grinding pad, it is the grinding pad with the grinding layer being formed by polyurethane resin foaming body, as described poly- ammonia
The polyurethane resin of the formation material of ester foamed resin passes through carbamate groups or the urea of isocyanates end prepolymer
Base and the reaction of the NCO of the isocyanates comprising alkoxysilyl shown in following formula (1), import alkane in side chain
Epoxide silicyl：
In formula, X is OR1Or OH, R1It is each independently the alkyl of carbon number 1～4, R2Alkylidene for carbon number 1～6.
2. grinding pad as claimed in claim 1 is it is characterised in that the described isocyanates comprising alkoxysilyl are 3-
NCO propyl-triethoxysilicane.
3. grinding pad as claimed in claim 1 or 2 is it is characterised in that isocyanates end pre-polymerization with respect to 100 weight portions
Thing, the addition of the described isocyanates comprising alkoxysilyl is 1～10 weight portion.
4. a kind of manufacture method of grinding pad, this manufacture method is including by the first composition containing isocyanates end prepolymer
Carry out mixing with the second composition containing chain extender, solidify, the manufacture method of the operation of prepared polyurethane resin foaming body, its
It is characterised by：
Described operation is to add up to the condition that weight is 0.05～10 weight % by poly- silicon with respect to first composition and second composition
Oxygen alkanes surfactant is added in the first composition containing isocyanates end prepolymer, then by described first composition with non-
Reactant gas stirs, and after modulation is using described non-reactive gas as bubble scattered bubble dispersion liquid, divides in described bubble
The second composition containing chain extender is mixed in dispersion liquid, solidification, the operation of prepared polyurethane resin foaming body；
Described second composition contains the isocyanates comprising alkoxysilyl shown in following formula (1)：
In formula, X is OR1Or OH, R1It is each independently the alkyl of carbon number 1～4, R2Alkylidene for carbon number 1～6.
5. the manufacture method of grinding pad as claimed in claim 4 is it is characterised in that described comprise the different of alkoxysilyl
Cyanate is 3- NCO propyl-triethoxysilicane.
6. the manufacture method of the grinding pad as described in claim 4 or 5 is it is characterised in that Carbimide. with respect to 100 weight portions
Ester end prepolymer, the addition of the described isocyanates comprising alkoxysilyl is 1～10 weight portion.
7. a kind of manufacture method of semiconductor device requires any one of 1～3 it is characterised in that comprising usage right
Grinding pad, the operation on the surface of grinding semiconductor chip.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014051954A JP5871978B2 (en) | 2014-03-14 | 2014-03-14 | Polishing pad and manufacturing method thereof |
| JP2014-051954 | 2014-03-14 | ||
| PCT/JP2015/056517 WO2015137233A1 (en) | 2014-03-14 | 2015-03-05 | Polishing pad and method for producing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106457510A true CN106457510A (en) | 2017-02-22 |
Family
ID=54071679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580013168.9A Pending CN106457510A (en) | 2014-03-14 | 2015-03-05 | Polishing pad and method for producing same |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP5871978B2 (en) |
| KR (1) | KR20160132882A (en) |
| CN (1) | CN106457510A (en) |
| DE (1) | DE112015001247T5 (en) |
| TW (1) | TWI546315B (en) |
| WO (1) | WO2015137233A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112571303A (en) * | 2019-09-29 | 2021-03-30 | Skc株式会社 | Polishing pad, method for manufacturing the same, and polishing method using the same |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6697931B2 (en) * | 2016-04-01 | 2020-05-27 | 富士紡ホールディングス株式会社 | Polishing pad, polishing pad manufacturing method and polishing method |
| US20210276143A1 (en) * | 2018-05-11 | 2021-09-09 | Kuraray Co., Ltd. | Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad |
| KR102129664B1 (en) | 2018-07-26 | 2020-07-02 | 에스케이씨 주식회사 | Polishing pad, preparation method thereof, and polishing method applying of the same |
| KR102129665B1 (en) | 2018-07-26 | 2020-07-02 | 에스케이씨 주식회사 | Polishing pad, preparation method thereof, and polishing method applying of the same |
| US11628535B2 (en) | 2019-09-26 | 2023-04-18 | Skc Solmics Co., Ltd. | Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing pad |
| TWI761921B (en) | 2019-10-30 | 2022-04-21 | 南韓商Ｓｋｃ索密思股份有限公司 | Polishing pad, process for preparing the same, and process for preparing a semiconductor device using the same |
| KR102287923B1 (en) * | 2019-10-30 | 2021-08-09 | 에스케이씨솔믹스 주식회사 | Polishing pad, preparation method thereof, and preparation method of semiconductor device using same |
| KR102298114B1 (en) * | 2019-11-05 | 2021-09-03 | 에스케이씨솔믹스 주식회사 | Polishing pad, preparation method thereof, and preparation method of semiconductor device using same |
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- 2015-03-05 WO PCT/JP2015/056517 patent/WO2015137233A1/en active Application Filing
- 2015-03-05 CN CN201580013168.9A patent/CN106457510A/en active Pending
- 2015-03-05 KR KR1020167026859A patent/KR20160132882A/en unknown
- 2015-03-05 DE DE112015001247.8T patent/DE112015001247T5/en not_active Withdrawn
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| CN112571303B (en) * | 2019-09-29 | 2023-03-28 | Skc索密思株式会社 | Polishing pad, method for manufacturing the same, and polishing method using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160132882A (en) | 2016-11-21 |
| JP5871978B2 (en) | 2016-03-01 |
| DE112015001247T5 (en) | 2016-12-01 |
| WO2015137233A1 (en) | 2015-09-17 |
| TWI546315B (en) | 2016-08-21 |
| JP2015174177A (en) | 2015-10-05 |
| TW201544518A (en) | 2015-12-01 |
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