CN106455347A - Method for improving graphic electroplating sandwich film - Google Patents
Method for improving graphic electroplating sandwich film Download PDFInfo
- Publication number
- CN106455347A CN106455347A CN201610915273.8A CN201610915273A CN106455347A CN 106455347 A CN106455347 A CN 106455347A CN 201610915273 A CN201610915273 A CN 201610915273A CN 106455347 A CN106455347 A CN 106455347A
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- CN
- China
- Prior art keywords
- plating
- copper
- pcb
- production plate
- shaped wire
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method used for improving a graphic electroplating sandwich film. A clip-shaped wire is designed. The graphic electroplating area is increased. The wire width of the clip-shaped wire is designed to be 0.30 to 0.35mm. According to the method, quality abnormalities of the electroplating sandwich film can be improved without increasing other production processes; the method is especially suitable for small batch production; the process is used to solve the quality defect of an easy electroplating sandwich film of a small batch production plate from design, wherein the difference of the to-be-plated area of a graph is more than 50%; adding other equipment or technological process is avoided; and the method has the advantages of low production and use cost and broad market prospect.
Description
Technical field
The invention belongs to pcb board field, it is more particularly related to a kind of improve the method that graphic plating presss from both sides film.
Background technology
Being placed an order by client affects, and produces the generally less than 3PNL that feeds intake.CS face is differed 50% with SS face two sides area to be plated
More than, such production plate is in graphic plating, and because being affected by electric force lines distribution is electroplated, the less one side of area to be plated undertakes reality
Electric current is larger, causes copper electroplating layer thickness to exceed build, bad so as to produce plating folder film.With electronic industrial products court
Short, put down, soon, little direction is constantly developed.Requirement to PCB is also changed therewith.And in graphic plating operation, because receiving
Client's amount of placing an order is little, and line pattern area difference is larger, so often there is plating folder film to scrap defect, has a strong impact on operation life
Produce plan and hand over the phase.
Content of the invention
Problem to be solved by this invention is to provide a kind of method for improving graphic plating folder film.
To achieve these goals, the technical scheme that the present invention takes is：
A kind of method for improving graphic plating folder film, comprises the steps：
(1) sawing sheet
First PCB production plate is cut into consistent specification by cutting machine, then pass through trimmer and repaired, described
The speed of cutting machine is 20-40m/s；
(2) drill
PCB production plate after sawing sheet is drilled to substrate by boring machine in drilling room, the rotating speed of drill bit is
150-160m/min, the temperature control of the room that drills is at 18-22 DEG C；
(3) heavy copper/electric plating of whole board
Electroless copper and electric plating of whole board is carried out after drilling, and copper copper-plated thickness in hole is 3-5um；
(4) outer graphics transfer
Then the logicalnot circuit region of the one side of PCB production plate is selected to increase back-shaped wire.Area less one to be plated is selected (
Face)；
(5) graphic plating
By outer graphics transfer PCB production plate graphics field of exposing electroplated, described image plating time be
60-120min, copper copper facing thickness in hole is 15-25um；
(6) film is moved back
Then the PCB production plate after electroplating image carries out moving back film by moving back film liquid medicine；
(7) etch
Then the copper face that exposes for producing plate by PCB is etched, and forms circuitous pattern；
(8) stannum is moved back
Then passing through tin stripper carries out moving back stannum process to coating, then carries out choosing wire and AOI detection, forms pcb board；
(9) operation is normally descended
Then the detection operation of performance after molding and molding is carried out to pcb board.
Preferably, in described step (4), the live width of back-shaped wire is set to 0.30-0.35mm.
Preferably, in described step (4), the connected mode of back-shaped wire is overall series system.
Preferably, in described step (4), after outer graphics transfer, the area difference on PCB production plate two sides is set to 30-
50%.
Preferably, in described step (5), the thickness of image plating is 15-25um.
Preferably, the temperature of described step (7) middle etching is 45-55 DEG C, and the time of the etching is 0.5-1min.
Beneficial effect：The invention provides a kind of improve the method that graphic plating presss from both sides film, back-shaped wire is designed, can be increased
Graphic plating area, the back-shaped wire live width is designed as 0.30-0.35mm, and the method not only can improve plating folder film quality
Abnormal, and other production procedures need not be increased, it is particularly well-suited to small lot batch manufacture and small lot is solved from design using this flow process
Production plate, the quality defect of film is pressed from both sides in the easily plating more than 50% of figure area difference to be plated, and need not increase other equipment or work
Skill flow process, production and application low cost, wide market.
Specific embodiment
Embodiment 1：
A kind of method for improving graphic plating folder film, comprises the steps：
(1) sawing sheet
First PCB production plate is cut into consistent specification by cutting machine, then pass through trimmer and repaired, described
The speed of cutting machine is 20m/s；
(2) drill
PCB production plate after sawing sheet is drilled to substrate by boring machine in drilling room, the rotating speed of drill bit is
150m/min, the temperature control of the room that drills is at 18 DEG C；
(3) heavy copper/electric plating of whole board
Electroless copper and electric plating of whole board is carried out after drilling, and copper copper-plated thickness in hole is 3um；
(4) outer graphics transfer
Then the logicalnot circuit region of the one side of PCB production plate is selected to increase back-shaped wire.Area less one to be plated is selected (
Face), the live width of the back-shaped wire is set to 0.30mm, and the connected mode of the back-shaped wire is overall series system, described
After outer graphics transfer, the area difference on PCB production plate two sides is set to 30%；
(5) graphic plating
By outer graphics transfer PCB production plate graphics field of exposing electroplated, described image plating time be
60min, it is 15um that copper copper facing thickness in hole is the thickness of 15um, described image plating；
(6) film is moved back
Then the PCB production plate after electroplating image carries out moving back film by moving back film liquid medicine；
(7) etch
Then the copper face that exposes for producing plate by PCB is etched, and forms circuitous pattern, and the temperature of the etching is 45
DEG C, the time of the etching is 0.5min；
(8) stannum is moved back
Then passing through tin stripper carries out moving back stannum process to coating, then carries out choosing wire and AOI detection, forms pcb board；
(9) operation is normally descended
Then the detection operation of performance after molding and molding is carried out to pcb board.
Embodiment 2：
A kind of method for improving graphic plating folder film, comprises the steps：
(1) sawing sheet
First PCB production plate is cut into consistent specification by cutting machine, then pass through trimmer and repaired, described
The speed of cutting machine is 30m/s；
(2) drill
PCB production plate after sawing sheet is drilled to substrate by boring machine in drilling room, the rotating speed of drill bit is
155m/min, the temperature control of the room that drills is at 20 DEG C；
(3) heavy copper/electric plating of whole board
Electroless copper and electric plating of whole board is carried out after drilling, and copper copper-plated thickness in hole is 4um；
(4) outer graphics transfer
Then the logicalnot circuit region of the one side of PCB production plate is selected to increase back-shaped wire.Area less one to be plated is selected (
Face), the live width of the back-shaped wire is set to 0.33mm, and the connected mode of the back-shaped wire is overall series system, described
After outer graphics transfer, the area difference on PCB production plate two sides is set to 40%；
(5) graphic plating
By outer graphics transfer PCB production plate graphics field of exposing electroplated, described image plating time be
90min, it is 20um that copper copper facing thickness in hole is the thickness of 20um, described image plating；
(6) film is moved back
Then the PCB production plate after electroplating image carries out moving back film by moving back film liquid medicine；
(7) etch
Then the copper face that exposes for producing plate by PCB is etched, and forms circuitous pattern, and the temperature of the etching is 50
DEG C, the time of the etching is 0.75min；
(8) stannum is moved back
Then passing through tin stripper carries out moving back stannum process to coating, then carries out choosing wire and AOI detection, forms pcb board；
(9) operation is normally descended
Then the detection operation of performance after molding and molding is carried out to pcb board.
Embodiment 3
A kind of method for improving graphic plating folder film, comprises the steps：
(1) sawing sheet
First PCB production plate is cut into consistent specification by cutting machine, then pass through trimmer and repaired, described
The speed of cutting machine is 40m/s；
(2) drill
PCB production plate after sawing sheet is drilled to substrate by boring machine in drilling room, the rotating speed of drill bit is
160m/min, the temperature control of the room that drills is at 22 DEG C；
(3) heavy copper/electric plating of whole board
Electroless copper and electric plating of whole board is carried out after drilling, and copper copper-plated thickness in hole is 5um；
(4) outer graphics transfer
Then the logicalnot circuit region of the one side of PCB production plate is selected to increase back-shaped wire.Area less one to be plated is selected (
Face), the live width of the back-shaped wire is set to 0.35mm, and the connected mode of the back-shaped wire is overall series system, described
After outer graphics transfer, the area difference on PCB production plate two sides is set to 50%；
(5) graphic plating
By outer graphics transfer PCB production plate graphics field of exposing electroplated, described image plating time be
120min, it is 25um that copper copper facing thickness in hole is the thickness of 25um, described image plating；
(6) film is moved back
Then the PCB production plate after electroplating image carries out moving back film by moving back film liquid medicine；
(7) etch
Then the copper face that exposes for producing plate by PCB is etched, and forms circuitous pattern, and the temperature of the etching is 55
DEG C, the time of the etching is 1min；
(8) stannum is moved back
Then passing through tin stripper carries out moving back stannum process to coating, then carries out choosing wire and AOI detection, forms pcb board；
(9) operation is normally descended
Then the detection operation of performance after molding and molding is carried out to pcb board.
After above method, sample is taken out respectively, measurement result is as follows：
Can be drawn according to above table data, when the parameter of embodiment 2, the plating folder film after improvement compares prior art
The defect incidence rate and area difference rate of the plating folder film after preparation is low, and production and application rate of cost reduction height, now more favourable
Improvement in plating folder film.
The invention provides a kind of improve the method that graphic plating presss from both sides film, back-shaped wire is designed, graphic plating can be increased
Area, the back-shaped wire live width is designed as 0.30-0.35mm, and the method not only can improve plating folder film quality exception, and
Other production procedures need not be increased, be particularly well-suited to small lot batch manufacture and small lot batch manufacture plate is solved using this flow process from design,
Figure area to be plated is differed more than 50%, easily the quality defect of plating folder film, and need not increase other equipment or technological process,
Production and application low cost, wide market.
Above-described is only the preferred embodiment of the present invention, it is noted that for one of ordinary skill in the art
For, without departing from the concept of the premise of the invention, some deformation can also be made and improved, these belong to the present invention
Protection domain.
Claims (6)
1. a kind of improve graphic plating press from both sides film method, it is characterised in that comprise the steps：
(1) sawing sheet
First PCB production plate is cut into consistent specification by cutting machine, then pass through trimmer and repaired, the sawing sheet
The speed of machine is 20-40m/s；
(2) drill
PCB production plate after sawing sheet is drilled to substrate by boring machine in drilling room, the rotating speed of drill bit is 150-
160m/min, the temperature control of the room that drills is at 18-22 DEG C；
(3) heavy copper/electric plating of whole board
Electroless copper and electric plating of whole board is carried out after drilling, and copper copper-plated thickness in hole is 3-5um；
(4) outer graphics transfer
Then select PCB production plate logicalnot circuit region increase back-shaped wire (when selecting area to be plated less)；
(5) graphic plating
The graphics field of exposing of the PCB production plate of outer graphics transfer is electroplated, the time of described image plating is 60-
120min, copper copper facing thickness in hole is 15-25um；
(6) film is moved back
Then the PCB production plate after electroplating image carries out moving back film by moving back film liquid medicine；
(7) etch
Then the copper face that exposes for producing plate by PCB is etched, and forms circuitous pattern；
(8) stannum is moved back
Then passing through tin stripper carries out moving back stannum process to coating, then carries out choosing wire (choosing except back-shaped wire) and AOI detection, shape
Become pcb board；
(9) operation is normally descended
Then the detection operation of performance after molding and molding is carried out to pcb board.
2. according to a kind of method of the improvement graphic plating folder film described in claim 1, it is characterised in that：In step (4)
The live width of back-shaped wire is set to 0.30-0.35mm.
3. according to a kind of method of the improvement graphic plating folder film described in claim 1, it is characterised in that：In step (4)
The connected mode of back-shaped wire is overall series system.
4. according to a kind of method of the improvement graphic plating folder film described in claim 1, it is characterised in that：In step (4)
After outer graphics transfer, the area difference on PCB production plate two sides is set to 30-50%.
5. according to a kind of method of the improvement graphic plating folder film described in claim 1, it is characterised in that：In step (5)
The thickness of image plating is 15-25um.
6. according to a kind of method of the improvement graphic plating folder film described in claim 1, it is characterised in that：In step (7)
The temperature of etching is 45-55 DEG C, and the time of the etching is 0.5-1min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610915273.8A CN106455347A (en) | 2016-10-20 | 2016-10-20 | Method for improving graphic electroplating sandwich film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610915273.8A CN106455347A (en) | 2016-10-20 | 2016-10-20 | Method for improving graphic electroplating sandwich film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106455347A true CN106455347A (en) | 2017-02-22 |
Family
ID=58175635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610915273.8A Pending CN106455347A (en) | 2016-10-20 | 2016-10-20 | Method for improving graphic electroplating sandwich film |
Country Status (1)
| Country | Link |
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| CN (1) | CN106455347A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111225517A (en) * | 2019-12-03 | 2020-06-02 | 厦门弘信电子科技集团股份有限公司 | Hole pattern electroplating method for FPC |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697666A (en) * | 2009-10-16 | 2010-04-21 | 深圳崇达多层线路板有限公司 | Circuit board plating device and method |
| CN202841678U (en) * | 2012-07-25 | 2013-03-27 | 广东达进电子科技有限公司 | Outer-layer structure of circuit board |
| CN103619125A (en) * | 2013-11-28 | 2014-03-05 | 深圳市景旺电子股份有限公司 | PCB electroplating method for improving electroplating uniformity |
-
2016
- 2016-10-20 CN CN201610915273.8A patent/CN106455347A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697666A (en) * | 2009-10-16 | 2010-04-21 | 深圳崇达多层线路板有限公司 | Circuit board plating device and method |
| CN202841678U (en) * | 2012-07-25 | 2013-03-27 | 广东达进电子科技有限公司 | Outer-layer structure of circuit board |
| CN103619125A (en) * | 2013-11-28 | 2014-03-05 | 深圳市景旺电子股份有限公司 | PCB electroplating method for improving electroplating uniformity |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111225517A (en) * | 2019-12-03 | 2020-06-02 | 厦门弘信电子科技集团股份有限公司 | Hole pattern electroplating method for FPC |
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Application publication date: 20170222 |
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