CN106449496A - Semiconductor wafer delivering method and semiconductor wafer delivering device - Google Patents
Semiconductor wafer delivering method and semiconductor wafer delivering device Download PDFInfo
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- CN106449496A CN106449496A CN201610638448.5A CN201610638448A CN106449496A CN 106449496 A CN106449496 A CN 106449496A CN 201610638448 A CN201610638448 A CN 201610638448A CN 106449496 A CN106449496 A CN 106449496A
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- semiconductor crystal
- wafer
- crystal wafer
- interlayer body
- sensor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
- H01L21/6779—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks the workpieces being stored in a carrier, involving loading and unloading
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Controlling Sheets Or Webs (AREA)
Abstract
The invention provides a semiconductor wafer delivering method and a semiconductor wafer delivering device. The provided method and device are used to deliver wafers in a container and an interlayer body to the next step. A workpiece delivering mechanism is used to take out an object from a container in a mode that the workpiece delivering mechanism holds the upper surface of the object. The upper surface of the object is detected by a first sensor so as to recognize the object. When the object is recognized as a wafer (W), the state of the lower surface of the wafer (W) is detected by a second sensor so as to detect whether there is an interlayer body (17) or not. When an interlayer body (17) is detected, a pushing mechanism (104) is used to push the interlayer body (17), which protrudes from the edge of the wafer (W) because the diameter of the interlayer body (17) is larger than the wafer (W), from the lateral side. Air is blown to the interlayer body, which is wrinkled by the push force, from a nozzle (101) so as to separate the interlayer body (17) from the wafer (W).
Description
Technical field
The present invention relates to after a kind of sheet material to protection, the interlayer body such as film and lining paper and back side grinding
Semiconductor crystal wafer (hereinafter appropriately referred to as " wafer ") differentiated and from alternately stacked be accommodated with interlayer body and
The carrying method of the semiconductor crystal wafer transferring out in the accommodating container of semiconductor crystal wafer and semiconductor crystal wafer
Conveyer device.
Background technology
In order to multiple semiconductor crystal wafers are transported to each operation and by semiconductor crystal wafer and sept (interlayer body)
It is laminated in the way of alternately stacked and be accommodated in accommodating container.Taken out of with adsorbing holding using conveying mechanism
Interlayer body and semiconductor crystal wafer are alternately transferred out from accommodating container by the mode of the upper surface of object
When, mistakenly overlap is accommodated with two identicals and takes out of object sometimes.Thus, in conventional conveying side
In method, the state of the upper surface taking out of object is measured to semiconductor crystal wafer using sensor and
Interlayer body is identified, to avoid for the interlayer body taking out of in object being transported to treatment process (with reference to specially
Sharp document 1).
Patent documentation 1：Japanese Unexamined Patent Publication 2012-248683 publication
Content of the invention
Problems to be solved by the invention
In conventional method, when object will to be taken out of transfer out from accommodating container, using sensor
Measure upper supernatant phase from the upper surface side taking out of object adsorbed, right therefore, it is possible to differentiate that this takes out of
As thing is semiconductor crystal wafer or interlayer body.However, exist leading to interlayer body fluid-tight engagement to exist because of electrostatic etc.
The lower surface of wafer and be transported to the such problem for the treatment of process.
In addition, having interlayer body in the lower surface fluid-tight engagement being confirmed wafer by operating personnel by visual observation
In the case of it is necessary to this interlayer be removed from the lower surface of wafer by operating personnel after temporarily ceasing conveying
Body.Thus, also produce and make working performance reduce such disadvantage.
The present invention be in view of this situation and complete, main purpose is to provide one kind can be from alternately weight
It is accommodated with semiconductor crystal wafer and the accommodating container of interlayer body foldedly and only semiconductor crystal wafer is transported to process
The carrying method of the semiconductor crystal wafer of operation and the conveyer device of semiconductor crystal wafer.
For solution to problem
The present invention takes following such structure to realize this purpose.
That is, a kind of carrying method of semiconductor crystal wafer, will be alternately stacked and as taking out of in accommodating container
The semiconductor crystal wafer of object and interlayer body take out from this accommodating container and that each is taken out of object is defeated
Deliver to assigned position, the carrying method of this semiconductor crystal wafer is characterised by, including procedure below：Take out of
Process, will take out of object from described using conveying mechanism in the way of keeping taking out of the upper surface of object
Take out of in accommodating container；Identification process, using the upper surface taking out of object described in first sensor detection
State, to be identified to taking out of object；Checking process, is being identified as by described identification process
It is semiconductor die bowlder, detect the state of the lower surface of this semiconductor crystal wafer using second sensor, to examine
Look into and have or not interlayer body；Pushing process, when detecting interlayer body by described inspection, using biasing member
From side to this layer projecting from the outer rim of this semiconductor crystal wafer with diameter greater than semiconductor die diameter of a circle
The outer rim of mesosome is pushed；And separation process, create fold due to pushing from nozzle direction
Described interlayer body blows gas, and this interlayer body is separated from semiconductor crystal wafer.
(effect/effect) according to said method, is taking out of in the case that object is semiconductor crystal wafer, is being based on
Whether the testing result of second sensor, check the lower surface as non-holding face of this semiconductor crystal wafer
Fluid-tight engagement has interlayer body.In the case that the lower surface fluid-tight engagement of semiconductor crystal wafer has interlayer body, profit
The interlayer body projecting from this semiconductor crystal wafer more than semiconductor crystal wafer is carried out from side with biasing member
Push, therefore interlayer body produces fold, and then form gap between semiconductor crystal wafer and interlayer body.It
Afterwards, blow gas from side towards interlayer body from nozzle, entered interlayer while this gap by this gas
Body separates from semiconductor crystal wafer.Thus, it is possible to reliably only semiconductor crystal wafer is transported to subsequent processing.
In the methods described above it is preferred that push during, to the side around semiconductor crystal wafer
Multiple biasing member that formula is equipped with equal intervals are pushed till interlayer body produces fold.
According to the method, by using biasing member, multiple positions of interlayer body are pushed, Neng Gourong
Change places and make the interlayer body between biasing member produce fold.In addition, by the pushing structure being equipped with equal intervals
Part is pushed till biasing member is abutted with the outer rim of semiconductor crystal wafer additionally it is possible to being in substantially circle
The semiconductor crystal wafer of shape is aligned.
In addition, the present invention takes following such structure to realize this purpose.
That is, a kind of conveyer device of semiconductor crystal wafer, will be alternately stacked and as taking out of in accommodating container
The semiconductor crystal wafer of object and interlayer body take out from this accommodating container and that each is taken out of object is defeated
Deliver to assigned position, the conveyer device of this semiconductor crystal wafer is characterised by possessing：Conveying mechanism, its
In the way of keeping taking out of the upper surface of object, this is taken out of object to convey from described accommodating container
Go out；First sensor, it detects to the upper surface of the conveying object being kept by described conveying mechanism；
Second sensor, the state of its lower surface to described semiconductor crystal wafer detects；Control unit, its base
Testing result in described first sensor semiconductor crystal wafer and interlayer body are identified, and is based on
The testing result of second sensor has or not interlayer body come the lower surface to check semiconductor crystal wafer；Dipper crowding gear,
Its utilize biasing member from side to diameter greater than described semiconductor die diameter of a circle from this semiconductor die
The prominent interlayer body of circle is pushed；And nozzle, it is from the interlayer body that be push against by described biasing member
Side blow gas.
(effect/effect), according to this structure, can be identified by first sensor using second sensor inspection
The lower surface as non-holding face of semiconductor crystal wafer whether fluid-tight engagement has interlayer body.And, half
In the case that the lower surface fluid-tight engagement of semiconductor wafer has interlayer body, will push against the pushing structure that mechanism possesses
Part pushes to the interlayer body prominent from semiconductor crystal wafer and makes interlayer body produce fold, afterwards, blows from nozzle
Supply gas body such that it is able to separate this interlayer body from semiconductor crystal wafer.That is, this structure can be real well
Apply said method.
Additionally, it is preferred that dipper crowding gear possesses with equal intervals around semiconductor die in said structure
Multiple biasing member of circle.
According to this structure, by using biasing member, multiple positions of interlayer body are pushed, Neng Gourong
Change places and make the interlayer body between biasing member produce fold.In addition, by making biasing member and semiconductor die
The outer rim of circle abuts, and can carry out the be aligned of semiconductor crystal wafer in the state that remain by conveying mechanism, and
And interlayer body can be made to produce fold.
In addition, it is preferred that possessing 3rd sensor in said structure, this 3rd sensor is to logical
Gap between the semiconductor crystal wafer crossed biasing member and produce and interlayer body is detected, control unit is constituted
Being testing result manipulating nozzles based on 3rd sensor to blow gas towards gap.
According to this structure, gas can be made reliably into the gap between semiconductor crystal wafer and interlayer body,
Therefore, it is possible to reliably interlayer body be separated from semiconductor crystal wafer.
The effect of invention
The carrying method of the semiconductor crystal wafer according to the present invention and the conveyer device of semiconductor crystal wafer, can
Reliably only be accommodated in alternately stacked in the semiconductor crystal wafer and interlayer body in accommodating container this half
Semiconductor wafer is transported to subsequent processing.
Brief description
Fig. 1 is the top view of the structure illustrating semiconductor crystal wafer paster apparatus.
Fig. 2 is the front view of semiconductor crystal wafer paster apparatus.
Fig. 3 is the front view of the part illustrating workpiece conveying mechanism.
Fig. 4 is the top view of the part illustrating workpiece conveying mechanism.
Fig. 5 is the front view of work transfer device.
Fig. 6 is the top view of the moving structure illustrating work transfer device.
Fig. 7 is the front view illustrating the part for movable construction in work transfer device.
Fig. 8 is the front view illustrating the part for movable construction in work transfer device.
Fig. 9 is the front view of frame conveyer device.
Figure 10 be including accommodating container around structure structure chart.
Figure 11 is the front view of the structure illustrating returnable and dipper crowding gear.
Figure 12 is the front view of the structure illustrating dipper crowding gear.
Figure 13 is to maintain the front view of platform.
Figure 14 is the top view of inverting units.
Figure 15 is the front view of inverting units.
Figure 16 is the top view of pusher.
Figure 17 is the front view of pusher.
Figure 18 is the top view with labelling machine.
Figure 19 is the front view with labelling machine.
Figure 20 is the front view of mechanism for stripping.
Figure 21 is the flow chart of the action that embodiment device is described.
Figure 22 is the top view of the inspection of the lower surface of wafer illustrating to carry out using second sensor.
Figure 23 is the front view of the inspection of the lower surface of wafer illustrating to carry out using second sensor.
Figure 24 is the top view illustrating to push the action of interlayer body using dipper crowding gear.
Figure 25 is the front view illustrating to push the action of interlayer body using dipper crowding gear.
Figure 26 is the front view illustrating the detached action of lower surface from wafer by interlayer body.
Figure 27 is the top view illustrating to push the action of interlayer body using the dipper crowding gear of variation device.
Description of reference numerals
2：Workpiece conveying mechanism；3：Accommodating container；4：Returnable；5：Paster frame recoverer；6：
Aligner；7：Holding station；8：Frame supply unit；9：Inverting units；10：Stripping table；12：Band is viscous
Attaching mechanism；13：Mechanism for stripping；52：First sensor；53：Second sensor；95：Control unit；
96：Memorizer；97：Upper surface judegment part；98：Lower surface judegment part；100：Dipper crowding gear；101：
Nozzle；102：Cylinder body；104：Roller (biasing member)；W：Semiconductor crystal wafer；f：Ring frame.
Specific embodiment
Below, it is explained with reference to embodiments of the invention.Additionally, in the present embodiment, half-and-half lead
The structure of the conveying mechanism that body wafer paster apparatus possess the present invention illustrates, this semiconductor crystal wafer paster
Device has the semiconductor crystal wafer of protection band for adding in circuit formation face, will via adhesive tape (cutting belt)
This semiconductor crystal wafer is fixed on ring frame.
The top view of semiconductor crystal wafer paster apparatus shown in Fig. 1, and, semiconductor crystal wafer shown in Fig. 2
The front view of paster apparatus.
As shown in figure 1, this semiconductor crystal wafer paster apparatus is configured to possess elementary cell and stripping unit
C, this elementary cell is configured to by laterally longer rectangular portion A and the central part in this rectangular portion A and this square
The convex that shape portion A connects and upwardly projecting protuberance B is formed, this stripping unit C is protuberance B's
Laterally the space in left side and elementary cell link.Additionally, in the following description, by the length of rectangular portion A
Edge direction is referred to as left and right directions, and the horizontal direction orthogonal with long side direction is referred to as downside and upside.
Central authorities on the left and right directions of rectangular portion A are equipped with workpiece conveying mechanism 2.Under rectangular portion A
Keep right and be placed with accommodating container 3 and returnable 4 side by side in side.Left end in the downside of rectangular portion A equipped with
Paster frame recoverer 5.
The upside of rectangular portion A is from right successively equipped with aligner 6, holding station 7, frame supply unit 8, anti-
Turn unit 9.In the downside of inverting units 9 equipped with stripping table 10.In addition, with across rectangular portion A and stripping
The mode of unit C is equipped with pusher 11.
Protuberance B is equipped with the band labelling machine 12 that the adhesive tape DT of supporting is pasted onto ring frame f.
Stripping unit C equipped with by protection band PT from semiconductor crystal wafer W (hereinafter, appropriately referred to as " wafer
W ") circuit formed face peel off mechanism for stripping 13.
As shown in Fig. 2 workpiece conveying mechanism 2 possesses work transfer device 15 and frame conveyer device 16, this work
Part conveyer device 15 by can left and right move back and forth in the way of be supported in and flatly set up in left-right direction
In the right side of the guide rail 14 on the top of rectangular portion A, this frame conveyer device 16 is can back and forth move left and right
Dynamic mode is supported in the left side of guide rail 14.
Work transfer device 15 is configured to, can be by the wafer W taking out from accommodating container 3 and interlayer body
17 convey to the left and right and in front and back, and can carry out front and back reversion to the posture of wafer W.Fig. 3～figure
The detailed construction of work transfer device 15 shown in 9.
As shown in Figure 3 and Figure 5, work transfer device 15 is equipped with and can move left and right along guide rail 14
Move left and right movable table 18.It is equipped with and can move left and right, along this, the guide rail that movable table 18 possesses
The movable movable table 20 that road 19 moves forward and backward.It is also equipped with the holding unit 21 that can move up and down,
Wafer W and interlayer body 17 are held in the bottom of this movable movable table 20 by this holding unit 21.
As shown in Figure 3 and Figure 4, near the right-hand member of guide rail 14, e axle supporting has by motor 22 rotating
The driving wheel 23 driving, and the center side e axle supporting in guide rail 14 has idle pulley 24.Moving left and right can
The sliding engagement portion 18a of dynamic platform 18 and the belt 25 wound on these driving wheels 23 and idle pulley 24 link, left
Move right movable table 18 to move left and right by the positive and negative rotation of belt 25.
As shown in Figure 6 to 8, near the upper end moving left and right movable table 18, e axle supporting has by motor 26
The driving wheel 27 that rotating drives, and have idle pulley in the lower end e axle supporting moving left and right movable table 18
28.The sliding engagement portion 20a of movable movable table 20 with wound on these driving wheels 27 and idle pulley 28
Belt 29 links, and movable movable table 20 is moved forwards, backwards by the positive and negative rotation of belt 29.
As shown in figure 5, holding unit 21 includes being connected to the inverted L-shaped of the bottom of movable movable table 20
Supporting frame 30, by motor 31 along the vertical frame portion of this supporting frame 30 carry out leading screw feeding lifting
Lifting platform 32, by can via rotary shaft 33 around longitudinal supporting axle p rotation in the way of by e axle supporting in liter
Fall platform 32 turntable 34, wind via belt 35 and with rotary shaft 33 interlock rotation motor, with
The mode that can rotate around the reversion of horizontal direction support shaft q via rotary shaft 37 is supported in turntable 34
The holding arm 38 of bottom and wind via belt 39 and with rotary shaft 37 interlock reversion motor
40 etc..
Holding arm 38 is in the shape of a hoof.The holding face of holding arm 38 is provided with somewhat prominent pad 41.From this
The surface of pad 41 is formed with the through hole of path towards inside in concentric circumferences with prescribed distance.These
Multiple through holes are constituted and passing through that the same position of be internally formed stream in holding arm 38 connects
Group of holes.Each through hole in through hole group is formed as portion in face of the stream in holding arm is towards holding
The cone-shaped launching.Keeping the assigned position in face equipped with multiple pads 41 with this through hole group.
And, the connection that the stream via the portion that is formed within for the holding arm 38 and the base end side in this stream connect
Stream and be connected with blowing plant.
Blowing plant is driven switch by control unit.That is, being filled by making compressed air
Put negative pressure to drive, to keep the upper table as grinding surface of wafer W by the use of pad 41 absorption of holding arm 38
Face or the upper surface of interlayer body 17.In addition, can by make blowing plant malleation drive to remove into
Enter the interlayer body 17 of adsorption hole.
By using above-mentioned movable construction, the wafer W keeping and layer will be adsorbed using holding arm 38
Mesosome 17 moves forward and backward, moves left and right and in rotary moving around longitudinal supporting axle p, and can by around
The reversion of horizontal direction support shaft q shown in Fig. 5 rotates the front and back reversion of wafer W.
As shown in figure 9, frame conveyer device 16 includes being connected to the vertical frame of the bottom of movable movable table 43
44th, the crane 45 that is supported by the way of can sliding lifting along this vertical frame 44, make on crane 45
The the bending and stretching linkage 46, this is bent and stretched with linkage 46 carry out the positive and negative motor bending and stretching driving of lower movement
47th, be equipped in the lower end of crane 45 the adsorption plate 48 of absorption wafer W and in order to adsorb ring frame f and
Multiple adsorption gaskets 49 that the surrounding of this adsorption plate 48 is equipped with etc..Thus, frame conveyer device 16 can will carry
Put the paster frame MF absorption being held in holding station 7 and keep and lift conveying and left and right conveying forwards, backwards.
Can be with the size of ring frame f accordingly slidable adjustment adsorption gasket 49 in the horizontal direction.
With regard to accommodating container 3, as shown in Figure 10, in 2 positions of the relative side wall of this container, therefrom
The top of centre is formed with downward lacking of the access path of holding arm 38 becoming work transfer device 15
Mouth 50.Orlop within this accommodating container is equipped with the bolster 51 being formed by elastic component.In bolster
On 51 by interlayer body 17, wafer W successively alternately stacked together.Additionally, in the present embodiment, wafer
W is accommodated in accommodating container 3 in the face-up mode of grinding.As long as in addition, interlayer body 17 protection is brilliant
The interlayer body of the front and back of circle W, for example, can be interlayer paper, PET (polyethylene
terephthalate：Polyethylene terephthalate) etc. film, sheet material etc..The size of this interlayer body 17
Size more than wafer W.In the present embodiment, using the interlayer of diameter 2mm bigger than the diameter of wafer W
Body 17.
Equipped with the face-down first sensor 52 of detection above accommodating container 3.Additionally, in this reality
Apply in example, with regard to first sensor 52, make use of color sensor, but be not limited to this color sensing
The device or upper surface of the wafer W being accommodated in accommodating container 3 and interlayer body 17 can be carried out
Other sensors of identification, photographic camera.
Returnable 4 is that each corner on foursquare flat board is erect two pillars 99 of setting and constituted
Easy returnable.With regard to this pillar, it is provided to the distance between the pillar 99 in relative corner and is set
Be set to longer than the diameter of interlayer body 17 interlayer body 17 to be accommodated in the inside of returnable 4.In addition, simultaneously
Row ground is erect the interval being arranged between two pillars 99 in corner and is set to dipper crowding gear 100 described later
The distance that can not intrusively enter when carrying out lift adjustment.
As shown in Fig. 1 and Figure 10, the base station of accommodating container 3 and the right side area of returnable 4 is arranged
There is the face-up second sensor 53 of detection.That is, it is configured to, convey dress in the workpiece that remain wafer W
Put 15 holding arm 38 temporarily cease or pass through above second sensor 53 in a period of, to upper surface
The lower surface as non-holding face of the wafer W being kept by this holding arm 38 is checked.That is, to wafer
Whether the upper surface of W is attached with interlayer body 17 is checked.Additionally, in the present embodiment, with regard to second
Sensor 53, make use of color sensor, but is not limited to this color sensor or can
Other sensors that upper surface to wafer W and interlayer body 17 are identified, photographic camera.
Above returnable 4, equipped with multiple stage dipper crowding gear in the way of around this returnable 4
100 and a nozzle 101.Additionally, the number of nozzle 101 can also be more than 2.
When overlooking dipper crowding gear 100 in FIG, dipper crowding gear 100 is provided to dimetric returnable 4
Each corner top.As shown in figure 11,4 dipper crowding gears 100 are equipped on before link is fixed on arm 111
The holding plate 112 at end, this arm 111 is arranged on supporting frame 110 device base station in cantilever fashion from erectting
It is supported in the top of returnable 4.
As shown in figure 12, each dipper crowding gear 100 includes cylinder body 102, movable table 103 and biasing member 104
Deng.
Cylinder body 102 is provided to fixation by the front end of piston rod towards level in the way of the center of returnable 4
Frame.
The front end decurvation of movable table 103.Piston rod front end is linked with the front end of movable table 103, so that
This movable table 103 moves back and forth on guide rail 105, and this guide rail 105 is laid on and for cylinder body 102 to be fixed on ring-type
On the fixed mount of frame.
Biasing member 104 is the roller 104 rotating freely in the present embodiment.This roller 104 is in the lower end of arm 106
By support shaft directed downwardly in the way of freely rotatable e axle supporting, this arm 106 is supported in a cantilever fashion
Movable table 103 and from the front of this movable table 103 project.That is, each roller 104 is configured to towards returnable 4
Center advance or from central side retreat.Additionally, roller 104 both can be using the resilient insulator of tool
Cover metallic roll and formed, or can also be the rubber and spongy body being formed by elastomer roller or
It is the roller being formed by fluorocarbon resin.
Nozzle 101 is set in the relative side of the approach axis of the holding arm 38 with work transfer device 15
It is the height roughly the same with roller 104.The front end of this nozzle 101 is towards the center of returnable 4.Thus,
Nozzle 101 blows air or ion wind towards the periphery of the wafer W being kept by holding arm 38.
Holding station 7 position alignment to carry out ring frame f by movable movable pin.And, as Figure 13
Shown, possess and wafer W mounting is held in the wafer holding station 55 in central authorities and around this wafer holding station
55 frame maintaining part 56.
The chuck table that wafer holding station 55 is made of metal, through be formed from inside stream and with outside
Vacuum equipment connection connects.In addition, wafer holding station 55 is lifted by cylinder body 57.Additionally, closing
In wafer holding station 55, it is not limited to metal system it is also possible to be formed by the pottery of Porous.
Frame maintaining part 56 is formed with the thickness stage portion suitable with frame thickness.That is, being configured to inciting somebody to action
When ring frame f is placed in this stage portion, make flat between the top of this frame maintaining part 56 and the upper surface of ring frame f.
Additionally, as shown in figure 1, holding station 7 is configured to by drive mechanism (not shown) along paving
The track 58 being located between the installation position of wafer W etc. and adhesive tape joining mechanism 12 moves back and forth.
Frame supply unit 8 accommodation layer overlapping received regulation number the drawer type of ring frame box.
In inverting units 9, as shown in Figure 14 and Figure 15, can be by revolving actuator 61 around level
What support shaft r rotated bears frame 62 with the cantilever-shaped vertical track being installed on and can arranging along setting and fix
The lifting platforms 60 of 59 liftings, and be respectively equipped with the base portion and leading section bearing frame 62 can be around supporting
The chuck jaw 63 that axle s rotates.Inverting units 9 from frame conveyer device 16 receive circuit formed face-down
Paster frame MF after being inverted this paster frame MF, circuit is formed face paster frame upward
MF is placed in stripping table 10.
Stripping table 10 accepts the position of paster frame and the stripping of stripping unit C in the underface of inverting units 9
Move back and forth between the position of protection band PT.
Pusher 11 makes the paster frame MF being placed on stripping table 10 be received into paster frame recoverer 5.Figure 16
Specific structure with pusher 11 shown in Figure 17.
In pusher 11, possess on the top of the movable table 65 along guide rail 64 left and right horizontal movement
Piece 66 and the chuck piece 68 being opened and closed by cylinder body 67 are born in fixation.It is configured to bear piece using these fixations
66 and chuck piece 68 seize an end of paster frame MF on both sides by the arms from above-below direction.In addition, passing through motor 69
And the belt 70 rotating and the bottom of movable table 65 link, made movably by the positive and negative work of motor 69
Platform 65 about moves back and forth.
Shown in Figure 18 and Figure 19, band labelling machine 12 possess band supply unit 71, Sticking roller 72, stripper roll 73,
Band shut-off mechanism 74 and band recoverer 75 etc., wherein, are incorporated with the wide cut of roller winding with supply unit 71
Adhesive tape DT.That is, pasting when the wafer W being placed in holding station 7 and ring frame f is moved to band
During position, so that Sticking roller 72 is moved from right to left in figure 18, adhesive tape DT is pasted on wafer W
Upper surface with ring frame f.
When the stickup of band completes, discoideus cutting knife is made to revolve in the state of making to decline with shut-off mechanism 74
Turn, the adhesive tape DT of stickup is cut off along ring frame f circular.Afterwards, it is configured to make stripper roll 73
Move from right to left in figure 18, the unwanted band remaining in the outside of cutting line is shelled from ring frame f
From, and this unwanted reeling is recovered to band recoverer 75.
As shown in figure 20, mechanism for stripping 13 is configured in the narrow stripping of the width ratio crystalline substance diameter of a circle winding roller
Guide to the stripping rod 81 of the edge of a knife shape reversion that carries out turning back from t via guide reel 80, afterwards using volume
Take axle 82 that this release band t is batched recovery.
As shown in Fig. 2 paster frame recoverer 5 is equipped with box 90, paster frame MF reclaims in a stacked fashion
In this box 90.This box 90 possesses the vertical track 92 being fixedly linked on device frame 91 and by motor 93
Carry out the lifting platform 94 of leading screw feeding lifting along this vertical track 92.Thus, paster frame recoverer 5 is constituted
It is paster frame MF to be placed in lifting platform 94 carry out pitch feeding decline.
Then, come to using above-described embodiment device profit according to the flow chart shown in Figure 21 and Figure 22 to Figure 25
Illustrated with the action that the wafer W transferring out from accommodating container 3 makes paster frame MF.
Execute simultaneously from frame supply unit 8 to holding station 7 transfer rings frame f and from wafer accommodating container 3 to guarantor
Hold platform 7 conveying wafer W.
The frame conveyer device 16 of one side in the way of adsorbing ring frame f by ring frame f from frame supply unit 8 transfer to guarantor
Hold platform 7 (step S1).When frame maintaining part 56 desorbs and rises, carry out ring frame f's by fulcrum post
Position alignment (step S20).That is, ring frame f is standby with the state that is placed in holding station 7, until wafer W quilt
Till conveying comes.
The work transfer device 15 of the opposing party makes holding arm 38 directed downwardly with pad 41 as shown in Figure 10
State moves on accommodating container 3, and drops to specified altitude.Compressed air is made to fill in this assigned position
Put negative pressure work come using holding arm 38 pad 41 adsorb topmost take out of object (hereinafter referred to as
" workpiece "), and rise to the specified altitude (step S10) of the top of accommodating container 3.
When reaching specified altitude, using the upper table to the workpiece being kept by holding arm 38 for the first sensor 52
(step S11) is detected in face.This testing result is sent to the upper surface judegment part 97 of control unit 95.Control
It is ground the back side of the wafer W after process in the memorizer 96 in portion 95 processed by the back side, define the crystalline substance of circuit
The surface of circle W, interlayer body 17 are preset with the reference range of different tone scale.Thus, upper table
Face judegment part 97 belongs to which part of the reference range in memorizer 96 to the tone scale of testing result
Differentiated.That is, for which in wafer W and interlayer body 17, (step S12) is differentiated to workpiece.
<Being determined as is the situation of interlayer body>
It is being determined as in the case that workpiece is interlayer body 17, interlayer body 17 is transported to by work transfer device 15
The top of returnable 4.Afterwards, work transfer device 15 stops negative pressure making to adsorb guarantor by holding arm 38
The interlayer body 17 held falls to (step S13) in returnable.
<Being determined as is the situation of wafer W>
Work transfer device 15 makes crystalline substance on one side as shown in Figure 22 and Figure 23 while retreating from accommodating container 3
The lower surface as non-holding face of circle W covers second sensor 53, to check the state of this lower surface.
The testing result of the lower surface of wafer W is sent to lower surface judegment part 98 by second sensor 53.
Which of the reference range in memorizer lower surface judegment part 98 belong to the tone scale of testing result
Individual part is differentiated.That is, to the lower face side of wafer W, whether fluid-tight engagement has interlayer body 17 to sentence
Not (step S15).As differentiate result, when lower surface judegment part 98 be determined as wafer W lower surface tight
It is close that control unit 95 makes work transfer device 15 move to the position of returnable 4 when being bonded to interlayer body 17,
Holding arm 38 is made to stop above returnable 4.
Control unit 95 makes 4 dipper crowding gears 100 synchronously work.I.e., as shown in figure 24, make cylinder body
102 work to make movable table 103 advance move, and makes roller 104 that the periphery from wafer W is slightly projected
Interlayer body 17 is pushed (step S16).Roller 104 moves predetermined distance (for example after contacting with interlayer body 17
The 1mm of prominent distance or be less than 1mm) after, stop the movement of this roller 104.Now, the layer being pushed
Mesosome 17 produces fold, forms gap between wafer W and this interlayer body 17.And, roller 104 with etc.
Interval is connected to the periphery of wafer W, and therefore wafer W is aligned with being kept the state that arm 38 remains
(core be aligned).
Afterwards, control unit 95 makes nozzle 101 work.I.e., as illustrated in figs. 25 and 26, from nozzle 101
Air enter gap between wafer W and interlayer body 17, thus interlayer body 17 is from the lower surface of wafer W
Separate.Detached interlayer body 17 drops and is recycled to (step S17) in returnable 4.
The wafer W of interlayer body 17 and detached with interlayer body 17 wafer are not detected by step S17
W is transported to aligner 6 (step S18) respectively.
Aligner 6 is adsorbed under wafer W by the adsorption gasket 77 shown in Fig. 1 prominent from its central authorities
Face center.Meanwhile, work transfer device 15 releases and keeps out of the way above the absorption backward of wafer W.Aligner
6 adsorption gasket 77 is received in platform, and otch based on wafer W etc. is carrying out position alignment (step S19).
Additionally, the wafer W having carried out the separating treatment of interlayer body 17 by step S17 has carried out core by roller 104
Be aligned, is therefore reduced to only carry out process based on the position alignment of otch detection.
When the position alignment of wafer W completes, make the adsorption gasket 77 adsorbing this wafer W from aligner
6 face projects.Work transfer device 15 moves to this position, and absorption keeps the upper surface of wafer W.Inhale
Attached pad 77 desorbs and declines.
Work transfer device 15 moves in holding station 7, so that the face-down state with protection band will
Wafer W is placed in wafer holding station 55 (step S20).
When wafer W and ring frame f completes to the arrangement of holding station 7, wafer holding station 55 declines, and makes crystalline substance
After the upper surface of circle both W and ring frame f is identical height, holding station 7 is viscous to band along track 58
Attaching mechanism 12 is mobile.
When holding station 7 reaches the move-in position with labelling machine 12, Sticking roller 72 is made to decline and in bonding
Rotate from right to left on band DT.Thus, paste adhesive tape DT in the grinding surface side of ring frame f and wafer W.
When Sticking roller 72 reaches terminal position, band shut-off mechanism 74 declines, make the cutter of circular knife along
Ring frame f rotation is while cut off adhesive tape DT.
When cut-out completes, while band shut-off mechanism 74 rises, stripper roll 73 moves from right to left, will cut
That has no progeny unwanted reels recovery (step S21).
When paster frame MF is when completing, after holding station 7 moves to the installation position of rectangular portion A of Fig. 1
Stop.In this position, made paster frame MF is passed in the way of adsorbing conveying by frame conveyer device 16
Deliver to inverting units 9.
Inverting units 9 make the front and back of paster frame MF invert, and make the rear bearing that faces up with protection band
It is placed in stripping table 10 (step S22).
Control unit 95 makes stripping table 10 move to the move-in position of mechanism for stripping 13.When stripping table 10 reaches stripping
Disembark structure 13 move-in position when, make stripping rod 81 drop to paster frame MF band paste initiating terminal.When
When by the pushing of stripping rod 81, release band t is adhered to protection band PT, stripping table 10 is mobile.With this
Release band t is synchronously batched by the movement of stripping table 10 around winding off spindle 82, by this protection band PT and release band t
Integratedly stripped down (step S23).
When the stripping of protection band PT completes, stripping rod 81 rises and returns to position of readiness.Meanwhile, shell
The position of readiness of the pusher 11 to rectangular portion A for the destage 10 moves.Paster frame MF is pushed out the chuck of device 11
Piece 68 absorption keeps, and is recycled to frame recoverer 9 (step S24).
Make a series of action knot of paster frame MF using the wafer W with protection band in above
Bundle, control unit 95 carry out this paster frame MF count value whether reach stated number comparison operation process (step
Rapid S25), without reaching stated number, then repeat step S1 to the process of step S25.
By above-described embodiment device, using second sensor to the wafer W taking out from accommodating container 3
The lower surface as non-holding face checked, whether the lower surface therefore, it is possible to differentiate this wafer W tight
Close it is bonded to interlayer body 17.In addition, in the case that the lower surface fluid-tight engagement of wafer W has interlayer body 17,
Pushed using the roller 104 of the dipper crowding gear 100 interlayer body 17 slightly prominent to the outer rim from wafer W, because
This this interlayer body 17 produces fold, and then forms gap between wafer W and interlayer body 17.In this state
Under, blow air from nozzle 101 towards the gap between wafer W and interlayer body 17, thus, it is possible to reliability
Interlayer body 17 is separated by ground from the lower surface of wafer W.Thus, it is possible to avoid that fluid-tight engagement is had interlayer body
17 wafer W is mistakenly transported to the subsequent processing that wafer W is processed.
In addition, at equal intervals equipped with multiple rollers 104 in the way of the periphery around wafer W, therefore passing through
Using this roller 104, interlayer body 17 is pushed, so that the interlayer body 17 between roller 104 is produced
Fold.In addition, by making multiple rollers 104 abut with the outer rim of wafer W additionally it is possible to by holding arm 38
The state that remain carries out the core be aligned of wafer W.Thus, being carried out by aligner 6 in subsequent processing
As long as position alignment detection otch is simultaneously based on this incision Rotating to assigned position.
Additionally, the present invention can also be implemented in the following manner.
(1) in above-described embodiment device, the number of units of dipper crowding gear 100 be not limited to 4 or
1 or multiple stage.In the case that dipper crowding gear 100 is 2, it is provided in wafer W's with 180 ° of interval
Periphery.That is, two rollers 104 are provided in relative position.In addition, being the feelings of 3 in dipper crowding gear 100
Under condition, it is provided in the periphery of wafer W with 120 ° of interval.
(2) in above-described embodiment device, outfit is fixed in the position of nozzle 101, but can also constitute
For can be to the front end of nozzle 101 to the left and right or to carrying out angle adjustment up and down.That is, using photo-optics
Machine, line sensor detect the gap between wafer W and interlayer body 17, should by the front end direction of nozzle 101
Gap blows air.
By this structure, air can be made reliably into the gap between wafer W and interlayer body 17, because
Interlayer body 17 can more precisely be separated by this from wafer W.
(3) in above-described embodiment device, can also make to be connected to the outer of wafer W as shown in figure 27
The roller 104 of edge rolls clockwise, counterclockwise or reciprocally along the periphery of this wafer W.
According to this structure, the pushing range expansion of the interlayer body 17 being pushed by roller 104, it is thus susceptible in crystalline substance
Form gap between circle W and interlayer body 17.
(4) in above-described embodiment device, can also be the structure possessing nozzle in accommodating container 3 side.That is,
Before check the lower surface of wafer W using second sensor, above accommodating container 3, from nozzle
Whole wafer W is blowed with air and to prepare enters to be about to interlayer body 17 from the detached process of wafer W.
By this structure, in the time point taking out wafer W from accommodating container 3, in wafer W and layer
Mesosome 17 does not have the complete fluid-tight engagement of entire surface but interlayer body 17 is outer somewhat to apply to this interlayer body 17
Power just can be in the case that detached degree be attached to the lower surface of wafer W, can be by interlayer body 17 from crystalline substance
The lower surface of circle W separates.But, tight with the substantially entire surface of the lower surface of wafer W in interlayer body 17
In conjunction with the case of, can not be kept completely separate from wafer W by the separating treatment of this preparation, therefore be configured to
Whether remain interlayer body 17 using the lower surface that second sensor carries out wafer W in course of conveying
Check.
In addition, according to this structure, the number of the separating treatment that returnable 4 side is carried out can be reduced, because
This can shorten time of delivery and the process time conveying wafer W to subsequent processing.
(5) above-described embodiment device can also be set to, and only conveyed interlayer body 17 using holding arm 38 and returning
When receiving returnable 4, in step S13 shown in Figure 21, whether inspection layer mesosome 17 is from holding arm 38
Depart from and be recycled to returnable 4.For example, the negative pressure making holding arm 38 only stop the scheduled time it
Afterwards, make negative pressure work to detect pressure change.If that is, pressure is higher than setting, can
It is determined as interlayer body 17 and residue in holding arm 38.Now, blowing plant is switched to malleation to make gas
Body is discharged from adsorption hole, thus, it is possible to separating interlayer body 17 from holding arm 38 and removing.
Claims (5)
1. a kind of carrying method of semiconductor crystal wafer, will be alternately stacked and as taking out of in accommodating container
The semiconductor crystal wafer of object and interlayer body take out from this accommodating container and that each is taken out of object is defeated
Deliver to assigned position, the carrying method of this semiconductor crystal wafer is characterised by, including procedure below：
Take out of process, object will be taken out of in the way of keeping taking out of the upper surface of object using conveying mechanism
Thing takes out of from described accommodating container；
Identification process, using the state of the upper surface taking out of object described in first sensor detection, it is right to come
Take out of object to be identified；
Checking process, is being identified as semiconductor die bowlder by described identification process, using the second sensing
Device detects the state of the lower surface of this semiconductor crystal wafer, to check for interlayer body；
Pushing process, when detecting interlayer body by described inspection, using biasing member from side to straight
The outer rim of this interlayer body that footpath is more than semiconductor die diameter of a circle and projects from the outer rim of this semiconductor crystal wafer
Pushed；And
Separation process, blows gas from nozzle towards the described interlayer body creating fold due to pushing,
This interlayer body is separated from semiconductor crystal wafer.
2. semiconductor crystal wafer according to claim 1 carrying method it is characterised in that
During described pushing, to the multiple pushings being equipped with equal intervals in the way of around semiconductor crystal wafer
Component is pushed till interlayer body produces fold.
3. a kind of conveyer device of semiconductor crystal wafer, will be alternately stacked and as taking out of in accommodating container
The semiconductor crystal wafer of object and interlayer body take out from this accommodating container and that each is taken out of object is defeated
Deliver to assigned position, the conveyer device of this semiconductor crystal wafer is characterised by possessing：
Conveying mechanism, this is taken out of object from described in the way of keeping taking out of the upper surface of object by it
Transfer out in accommodating container；
First sensor, it is examined to the upper surface of the conveying object being kept by described conveying mechanism
Survey；
Second sensor, the state of its lower surface to described semiconductor crystal wafer detects；
Control unit, its testing result based on described first sensor is entering to semiconductor crystal wafer and interlayer body
Row identification, and the testing result based on second sensor has or not layer come the lower surface checking semiconductor crystal wafer
Mesosome；
Dipper crowding gear, it utilizes biasing member from side to diameter greater than described semiconductor die diameter of a circle
The interlayer body projecting from this semiconductor crystal wafer is pushed；And
Nozzle, it blows gas from the side of the interlayer body that be push against by described biasing member.
4. semiconductor crystal wafer according to claim 3 conveyer device it is characterised in that
Described dipper crowding gear possesses with equal intervals around multiple biasing member of semiconductor crystal wafer.
5. the semiconductor crystal wafer according to claim 3 or 4 conveyer device it is characterised in that
It is also equipped with 3rd sensor, this 3rd sensor is to the quasiconductor producing by described biasing member
Gap between wafer and interlayer body is detected,
Described control unit is configured to testing result manipulating nozzles based on 3rd sensor and blows towards gap
Supply gas body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015157158A JP2017037910A (en) | 2015-08-07 | 2015-08-07 | Semiconductor wafer transfer method and semiconductor wafer transfer device |
| JP2015-157158 | 2015-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106449496A true CN106449496A (en) | 2017-02-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610638448.5A Pending CN106449496A (en) | 2015-08-07 | 2016-08-05 | Semiconductor wafer delivering method and semiconductor wafer delivering device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2017037910A (en) |
| KR (1) | KR20170017752A (en) |
| CN (1) | CN106449496A (en) |
| TW (1) | TW201715635A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111469046A (en) * | 2020-04-22 | 2020-07-31 | 华海清科股份有限公司 | Wafer loading cup |
| CN114007942A (en) * | 2019-06-10 | 2022-02-01 | 超微细技研有限公司 | Factory inspection device, packaging device with device and packaging system |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7312365B2 (en) * | 2018-11-08 | 2023-07-21 | 大日本印刷株式会社 | Card reversing transfer system |
| CN111383971A (en) * | 2018-12-29 | 2020-07-07 | 江苏鲁汶仪器有限公司 | Vacuum conveying piece device |
| CN113284834A (en) * | 2021-06-11 | 2021-08-20 | 中环领先半导体材料有限公司 | 12-inch semiconductor wafer rewinding machine based on sliding table robot |
| CN115938992A (en) * | 2022-12-28 | 2023-04-07 | 西安奕斯伟材料科技有限公司 | Material processing method and system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5639958B2 (en) | 2011-05-27 | 2014-12-10 | 日東電工株式会社 | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus |
-
2015
- 2015-08-07 JP JP2015157158A patent/JP2017037910A/en active Pending
-
2016
- 2016-07-29 TW TW105124003A patent/TW201715635A/en unknown
- 2016-08-02 KR KR1020160098382A patent/KR20170017752A/en unknown
- 2016-08-05 CN CN201610638448.5A patent/CN106449496A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114007942A (en) * | 2019-06-10 | 2022-02-01 | 超微细技研有限公司 | Factory inspection device, packaging device with device and packaging system |
| CN111469046A (en) * | 2020-04-22 | 2020-07-31 | 华海清科股份有限公司 | Wafer loading cup |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20170017752A (en) | 2017-02-15 |
| JP2017037910A (en) | 2017-02-16 |
| TW201715635A (en) | 2017-05-01 |
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