CN106440898A - Flat heat pipe composited groove type fluid suction core and preparation method thereof - Google Patents
Flat heat pipe composited groove type fluid suction core and preparation method thereof Download PDFInfo
- Publication number
- CN106440898A CN106440898A CN201610922373.3A CN201610922373A CN106440898A CN 106440898 A CN106440898 A CN 106440898A CN 201610922373 A CN201610922373 A CN 201610922373A CN 106440898 A CN106440898 A CN 106440898A
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- Prior art keywords
- heat pipe
- metal substrate
- flat
- composite trench
- plate heat
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Laser Beam Processing (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a flat heat pipe composited groove type fluid suction core and discloses a preparation method thereof. The flat heat pipe composited groove type fluid suction core comprises a metal substrate; a composited groove capillary structure is processed in the surface of the metal substrate, and consists of main grooves and secondary grooves; the main grooves are formed by etching the surface of the metal substrate with focused laser; the secondary grooves are formed by adjacent slag deposits between the surfaces of the adjacent main grooves; and the main grooves and the secondary grooves have high depth-width ratios. The preparation method of the flat heat pipe composited groove type fluid suction core is simple and is easy to control, the production cost is low, capillary pressure is improved substantially, a sectional area of a fluid back flow is increased significantly, the fluid back flow resistance is reduced, and the heat transfer property of a flat heat pipe is improved substantially.
Description
Technical field
The present invention relates to a kind of heat pipe wicks, specifically a kind of flat-plate heat pipe composite trench formula liquid-sucking core.
Background technology
Sharply increase appearance the problems such as increasingly narrow and small with effective heat-dissipating space with microelectronic chip heat flow density, have
The micro heat pipe of high heat conductance becomes the ideal element of microelectronic chip heat conduction.The heat transfer property of heat pipe depends primarily on internal suction
Wick-containing structure.Although traditional copper powder sintering formula liquid-sucking core capillary pressure is stronger, liquid backflow resistance is big, and weight is inhaled than plough groove type
Wick-containing weighs 40%~60%.Plough groove type liquid-sucking core has the advantages that wall is thin, lightweight, liquid-sucking core is hardly damaged, and meets electronics device
The development trend of part compactization, but there is the less shortcoming of capillary pressure.Develop a kind of new very low power liquid sucting core structure
To improve adopting heat pipes for heat transfer ability, it is a strategic point difficult problem to be solved.
South China Science & Engineering University Chen Ping et al. proposes a kind of extruding-plow and shapes new method processing heat pipe inner wall very low power,
Extruding-plow the very low power generating is made up of main line and time groove, and this structure can significantly improve the heat transfer property of heat pipe.But make
During with the method processing very low power, multitooth tool planform is complicated, and design, manufacture are difficult, if multitooth tool design processing
Improper, not only the easy tipping of cutter damages, and is difficult to produce fine fin structure, and crudy is to the dependence of machined parameters very
Greatly.Importantly, being limited by multitooth tool working ability, heat pipe very low power is size-constrained, the tap drain that extruding-plow shapes
Groove and time groove depth-to-width ratio are all less.
Content of the invention
The purpose of the present invention is the defect overcoming above-mentioned prior art to exist, and proposes a kind of preparation process is simple easily-controllable, raw
Produce low cost and the strong flat-plate heat pipe composite trench formula liquid-sucking core of capillary pressure.
The technical scheme is that and be achieved in that:
A kind of flat-plate heat pipe composite trench formula liquid-sucking core, has the Metal Substrate of composite trench capillary structure including Surface Machining
Plate.Described composite trench capillary structure is made up of main line and time groove;Described main line is by focusing on laser in metal substrate table
Face etching is formed;Described time groove is formed by the adjacent slag deposit between adjacent main flute surfaces;Described main line and time
Groove is respectively provided with larger depth-to-width ratio.
Described composite trench capillary structure is evenly distributed on metal substrate along metal substrate length direction.
The cross sectional shape of described main line is V-arrangement;The cross sectional shape of described groove is trapezoidal.
The size of described main line and described groove is by laser pulse width, power, repetition rate, sweep speed, scanning time
Number, sweep span determine.
The material of described metal substrate is red copper, brass, aluminium or stainless steel.
The thickness of described metal substrate is 0.5~1mm.
A kind of flat-plate heat pipe composite trench formula liquid-sucking core preparation method is it is characterised in that comprise the following steps:
(1) by meeting flat-plate heat pipe size, the metal substrate of surfacing be placed in cleaning in supersonic cleaning machine, obtain clean
Metal substrate, then dry;
(2) metal substrate is placed on the workbench of laser-processing system, by Laser Focusing in metallic substrate surfaces, if
After putting suitable laser parameter, by galvanometer toward X/Y scanning direction, etch composite trench capillary structure on metallic substrates.
Compared to prior art, the beneficial effects of the present invention is:Do not need to manufacture and design special using Laser Processing
Process tool, preparation process is simple is easily-controllable, low production cost, and can process main line and time all larger hair of groove depth-to-width ratio
Fine texture, drastically increases capillary pressure, significantly increases the sectional area of liquid backflow, reduces liquid backflow resistance, from
And greatly improve the heat transfer property of flat-plate heat pipe.
Brief description
Fig. 1 is flat-plate heat pipe composite trench capillary structure schematic three dimensional views of the present invention;
Fig. 2 is flat-plate heat pipe composite trench capillary structure schematic cross-section of the present invention;
In figure:1st, metal substrate, 2, main line, 3, secondary groove, 4, slag deposit.
Specific embodiment
Below in conjunction with the accompanying drawings technical scheme is further described and describes.
Embodiment:
As shown in Figure 1 to Figure 2, a kind of flat-plate heat pipe composite trench formula liquid-sucking core, has composite trench hair including Surface Machining
The red copper substrate 1 of fine texture.Described composite trench capillary structure is made up of main line 2 and time groove 3;Described main line 2 is by red
Infrared optical fiber focuses on laser and is formed in red copper substrate 1 surface etch;Described groove 3 is by adjacent between adjacent main line 2 surface
Slag deposit 4 is formed;Described main line 2 and time groove 3 are respectively provided with larger depth-to-width ratio.
The composite trench capillary structure of this embodiment is evenly distributed on red copper substrate along red copper substrate 1 length direction.
The cross sectional shape of the main line 2 of this embodiment is V-arrangement;The cross sectional shape of secondary groove 3 is trapezoidal.
The size of the main line 2 of this embodiment and time groove 3 by laser pulse width, power, repetition rate, sweep speed, sweep
Retouch number of times, sweep span determines.
A kind of flat-plate heat pipe composite trench formula liquid-sucking core preparation method is it is characterised in that comprise the following steps:
(1) red copper substrate thick to one piece of surfacing, 0.5mm is placed in and fills the ultrasonic clear of absolute ethyl alcohol and plasma water
Clean five minutes in washing machine, obtain clean red copper substrate, then dry;
(2) red copper substrate is placed on the workbench of laser-processing system, by infrared optical fiber Laser Focusing in red copper base
Plate surface, setting laser pulse width is 100ns, and laser power is 20W, and repetition rate is 40KHZ, and sweep speed is 200mm/s, sweeps
Retouching number of times is 15 times, and sweep span is 80 μm, by galvanometer toward X/Y scanning direction, etches composite trench on red copper substrate
Capillary structure.
Present invention achieves prepared by the laser of flat-plate heat pipe composite trench formula liquid-sucking core, preparation process is simple is easily-controllable, produces
Low cost, drastically increases capillary pressure, significantly increases the sectional area of liquid backflow, reduces liquid backflow resistance, from
And greatly improve the heat transfer property of flat-plate heat pipe.
Claims (7)
1. a kind of flat-plate heat pipe composite trench formula liquid-sucking core it is characterised in that:There is composite trench capillary structure including Surface Machining
Metal substrate (1).Described composite trench capillary structure is made up of main line (2) and time groove (3);Described main line (2) by
Focus on laser to be formed in metal substrate (1) surface etch;Described groove (3) is by adjacent between adjacent main line (2) surface
Slag deposit (4) is formed;Described main line (2) and time groove (3) are respectively provided with larger depth-to-width ratio.
2. flat-plate heat pipe composite trench formula liquid-sucking core according to claim 1 it is characterised in that:Described composite trench capillary
Structure is evenly distributed on metal substrate along metal substrate (1) length direction.
3. flat-plate heat pipe composite trench formula liquid-sucking core according to claim 1 it is characterised in that:Described main line (2)
Cross sectional shape is V-arrangement;The cross sectional shape of described groove (3) is trapezoidal.
4. flat-plate heat pipe composite trench formula liquid-sucking core according to claim 3 it is characterised in that:Described main line (2) and
The size of described groove (3) is determined by laser pulse width, power, repetition rate, sweep speed, scanning times, sweep span.
5. flat-plate heat pipe composite trench formula liquid-sucking core according to claim 1 it is characterised in that:Described metal substrate (1)
Material be red copper, brass, aluminium or stainless steel.
6. flat-plate heat pipe composite trench formula liquid-sucking core according to claim 5 it is characterised in that:Described metal substrate (1)
Thickness be 0.5~1mm.
7. a kind of flat-plate heat pipe composite trench formula liquid-sucking core preparation method is it is characterised in that comprise the following steps:
(1) by meeting flat-plate heat pipe size, the metal substrate of surfacing be placed in cleaning in supersonic cleaning machine, obtain clean gold
Belong to substrate, then dry;
(2) metal substrate is placed on the workbench of laser-processing system, by Laser Focusing in metallic substrate surfaces, setting is closed
After suitable laser parameter, by galvanometer toward X/Y scanning direction, etch composite trench capillary structure on metallic substrates.
Priority Applications (1)
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CN201610922373.3A CN106440898A (en) | 2016-10-13 | 2016-10-13 | Flat heat pipe composited groove type fluid suction core and preparation method thereof |
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CN201610922373.3A CN106440898A (en) | 2016-10-13 | 2016-10-13 | Flat heat pipe composited groove type fluid suction core and preparation method thereof |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109405610A (en) * | 2018-11-27 | 2019-03-01 | 华南理工大学 | A kind of wick structure and preparation method thereof |
CN110044192A (en) * | 2019-04-29 | 2019-07-23 | 深圳市尚翼实业有限公司 | A kind of heat pipe that can enhance capillary attraction |
CN111707116A (en) * | 2020-04-30 | 2020-09-25 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Microchannel heat exchanger with multistage microchannels and manufacturing method thereof |
CN116288374A (en) * | 2022-12-30 | 2023-06-23 | 东莞赛诺高德蚀刻科技有限公司 | Metal surface secondary processing method based on etching and electrodeposition |
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JPH11148747A (en) * | 1997-11-19 | 1999-06-02 | Kobe Steel Ltd | Heat exchanger tube for evaporator of absorption refrigerating machine |
US20090211095A1 (en) * | 2008-02-21 | 2009-08-27 | Wen-Chun Zheng | Microgrooves as Wick Structures in Heat Pipes and Method for Fabricating the Same |
CN101839662A (en) * | 2009-03-21 | 2010-09-22 | 富瑞精密组件(昆山)有限公司 | Heat pipe |
CN103344142A (en) * | 2013-06-05 | 2013-10-09 | 华南理工大学 | Vapour chamber evaporation imbibition core of fractal groove-hole structure and manufacturing method |
CN104567502A (en) * | 2014-12-25 | 2015-04-29 | 广东工业大学 | Laser preparation method of micro-heat pipe with discontinuous capillary structure |
CN206095014U (en) * | 2016-10-13 | 2017-04-12 | 广东工业大学 | Compound ditch slot type imbibition core of flat plate heat pipe |
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2016
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH11148747A (en) * | 1997-11-19 | 1999-06-02 | Kobe Steel Ltd | Heat exchanger tube for evaporator of absorption refrigerating machine |
US20090211095A1 (en) * | 2008-02-21 | 2009-08-27 | Wen-Chun Zheng | Microgrooves as Wick Structures in Heat Pipes and Method for Fabricating the Same |
CN101839662A (en) * | 2009-03-21 | 2010-09-22 | 富瑞精密组件(昆山)有限公司 | Heat pipe |
CN103344142A (en) * | 2013-06-05 | 2013-10-09 | 华南理工大学 | Vapour chamber evaporation imbibition core of fractal groove-hole structure and manufacturing method |
CN104567502A (en) * | 2014-12-25 | 2015-04-29 | 广东工业大学 | Laser preparation method of micro-heat pipe with discontinuous capillary structure |
CN206095014U (en) * | 2016-10-13 | 2017-04-12 | 广东工业大学 | Compound ditch slot type imbibition core of flat plate heat pipe |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109405610A (en) * | 2018-11-27 | 2019-03-01 | 华南理工大学 | A kind of wick structure and preparation method thereof |
CN110044192A (en) * | 2019-04-29 | 2019-07-23 | 深圳市尚翼实业有限公司 | A kind of heat pipe that can enhance capillary attraction |
CN111707116A (en) * | 2020-04-30 | 2020-09-25 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Microchannel heat exchanger with multistage microchannels and manufacturing method thereof |
CN111707116B (en) * | 2020-04-30 | 2021-08-31 | 哈尔滨工业大学(深圳)(哈尔滨工业大学深圳科技创新研究院) | Microchannel heat exchanger with multistage microchannels and manufacturing method thereof |
CN116288374A (en) * | 2022-12-30 | 2023-06-23 | 东莞赛诺高德蚀刻科技有限公司 | Metal surface secondary processing method based on etching and electrodeposition |
CN116288374B (en) * | 2022-12-30 | 2023-10-13 | 东莞赛诺高德蚀刻科技有限公司 | Metal surface secondary processing method based on etching and electrodeposition |
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