CN106426575B - The disconnecting device of ceramic mouldings and the manufacturing method of monolithic ceramic electronic component - Google Patents
The disconnecting device of ceramic mouldings and the manufacturing method of monolithic ceramic electronic component Download PDFInfo
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- CN106426575B CN106426575B CN201610605601.4A CN201610605601A CN106426575B CN 106426575 B CN106426575 B CN 106426575B CN 201610605601 A CN201610605601 A CN 201610605601A CN 106426575 B CN106426575 B CN 106426575B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 249
- 238000000465 moulding Methods 0.000 title claims abstract description 100
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000005520 cutting process Methods 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims abstract description 51
- 238000009826 distribution Methods 0.000 claims abstract description 26
- 230000008569 process Effects 0.000 claims abstract description 24
- 230000009471 action Effects 0.000 claims description 6
- 229910052573 porcelain Inorganic materials 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 5
- 230000033228 biological regulation Effects 0.000 claims description 3
- 239000003985 ceramic capacitor Substances 0.000 description 11
- 238000012937 correction Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000002320 enamel (paints) Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/14—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting
- B28B11/145—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting for dividing block-shaped bodies of expanded materials, e.g. cellular concrete
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/02—Means for moving the cutting member into its operative position for cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/08—Means for actuating the cutting member to effect the cut
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/222—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by pressing, e.g. presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mining & Mineral Resources (AREA)
- Structural Engineering (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The present invention provides a kind of disconnecting device of ceramic mouldings and the manufacturing method of the monolithic ceramic electronic component using the disconnecting device, the disconnecting device does not need the process sensed to each cut off operation, ceramic mouldings can be inhibited diagonally to be cut off, prevent to cut bad, the form accuracy and dimensional accuracy of product can be improved.Its structure includes：The cutter (1) that ceramic mouldings (10) on platform (20) are cut off, the mobile unit for relatively moving platform and ceramic mouldings, cutter driving portion (30), and to the angle control unit that cutter is controlled to the entry angle of ceramic mouldings, cutter is controlled to the entry angle of ceramic mouldings, so that when cutting is repeated in another lateral side end (10b) of an end (10a) from ceramic mouldings, the angle (θ) that the interarea (10s) of the ceramic mouldings of the interarea (1s) and region more more rearward than cutter of cutter is constituted is changed according to predetermined distribution.
Description
Technical field
The present invention relates to such as laminated ceramic electronic member devices as manufacture laminated ceramic capacitor and stacking rheostat
The disconnecting device of the ceramic mouldings such as the ceramic layer stack used whens part etc. and via use the disconnecting device to multilayered ceramic
The process that body is cut off is come the manufacturing method of the monolithic ceramic electronic component manufactured.
Background technique
As one in representative ceramic electronic component, such as existing, there is the stacking of structure shown in Fig. 7 to make pottery
Porcelain condenser.The laminated ceramic capacitor 100 is as shown in fig. 7, have the following structure：Via dielectric layer, that is, ceramic layer 101
And the both ends of the surface of the ceramic main body 110 of multiple internal electrode 102a, 102b have been laminated, external electrode 105a, 105b are configured, so that
External electrode 105a, 105b are connected with internal electrode 102a, 102b.
However, as we all know there are for example as the method for manufacturing above-mentioned laminated ceramic capacitor by following process system
The method for making laminated ceramic capacitor：(a) unfired ceramic layers stack is made, thus the process for forming the ceramic layer stack,
The unfired ceramic layers stack has the structure that multiple internal electrode patterns are laminated with via unfired ceramic layer；(b) it is advising
Ceramic layer stack is cut in fixed position, to be divided into the main body pair with monolithic ceramic electronic component one by one
The process for the chip answered；(c) process that the chip one by one after segmentation is fired；(d) main by ceramics after firing
The conductive paste of the defined position coating external electrode formation of body is simultaneously calcined, to form the work of external electrode
Sequence.
However, (being cut in the manufacturing process of above-mentioned laminated ceramic capacitor as being split to ceramic layer stack
It is disconnected) one of method, there are following methods：By entering cutter towards the interarea of ceramic layer stack, to press cutting pottery
Enamel coating stack.
However, being had the following problems in the case where this method：If section is not vertical with the interarea of ceramic layer stack,
Inclined state then generates the positional shift and form accuracy reduction, internal electrode (internal electrode pattern) of internal conductor membrane
In undesirable position, exposing etc. is bad.
As described above, the section inclination of ceramic layer stack is as caused by a variety of causes, such as in cut off operation
In cutter decline, side (such as back side) and the other side (face side) in the interarea of cutter, the decline with cutter
The stress F1 and F2 in the orthogonal direction in direction work.Above-mentioned stress F1 and F2 is that cutter makes ceramic layer stack to interarea
Reaction force when face direction flexible deformation or plastic deformation.
However, stress F1 and F2 are not necessarily balanced, in the size imbalance of stress F1 and F2, by the imbalance
Cutter is caused to deform, to generate inclination dissengaged positions.In addition, cutter usually can be carried out high-precision cutting, therefore in fact
In most cases its thickness forms than relatively thin, to be easy to produce above-mentioned deformation.
Therefore, in order to solve the above technical problems, in patent document 1, the ceramics as being described below are proposed
The cutting-off method of raw cook.
In the cutting-off method of the patent document 1, as shown in figure 8, firstly, the ceramic green sheet formed body of ceramic layer stack etc.
210 are positioned in the state of being after on being placed in desk 220.Then, by making cutter 201 towards ceramic mouldings 210
Interarea decline, to cut off ceramic mouldings 210 to press cutting method.
Later, when terminating above-mentioned cut off operation every time, desk 220 and cutter 201 are moved relatively, be repeated several times
These cut off operation and mobile process.
Moreover, in patent document 1, after terminating each cut off operation, extracting cutter 201 from ceramic mouldings 210
Moment senses the heeling condition for the cutting line that section is presented on side, the sensing result is based on, to cutter 201
It is controlled to the approach axis of ceramic mouldings 210, so that the state in the cutting line of next cut off operation is appropriate.
Moreover, being cut off according to the method for above-mentioned patent document 1 in the ceramic mouldings to ceramic layer stack etc.
When, it can inhibit, prevent inclination dissengaged positions.
Existing technical literature
Patent document
Patent document 1
Japanese Patent Laid-Open 2004-276139 bulletin
Summary of the invention
The technical problems to be solved by the invention
However, being had the following problems in the case where the cutting-off method of the ceramic mouldings of patent document 1：Due to for
Each cut off operation senses the heeling condition for the cutting line for being presented on side, based on sensing result determine cutter into
Enter direction, therefore cutting is carried out to ceramic mouldings such as ceramic layer stacks and expends the time, productivity can reduce.
The present invention solves above-mentioned technical problem, and the purpose is to provide a kind of disconnecting device of ceramic mouldings and use
The manufacturing method of the monolithic ceramic electronic component of the disconnecting device, the disconnecting device do not need to feel each cut off operation
Process is surveyed, productivity can be improved, and can inhibit obliquely to cut off the ceramic mouldings such as ceramic layer stack, prevents cutter
It is bad in sequence, to be able to achieve the form accuracy of product and the raising of dimensional accuracy.
Solve the technical solution of technical problem
In order to solve the above-mentioned technical problem, the disconnecting device of ceramic mouldings be in defined multiple positions to ceramics
Disconnecting device when formed body is cut off, which is characterized in that including：Platform, the platform place the ceramic mouldings；It cuts
Knife, the cutter are used to cut off the ceramic mouldings in the method for pressing cutting；Mobile unit, the mobile unit in order to
The ceramic mouldings are cut off in defined multiple positions, make the ceramic mouldings and the cutter along described
It is made a relative move on the defined direction of the interarea of ceramic mouldings；Cutter driving portion, the cutter driving portion make the cutter
It is moved on the direction towards the ceramic mouldings and the direction for leaving the ceramic mouldings；Angle control unit, for pair
Angle, that is, entry angle when the cutter enters the ceramic mouldings is controlled, which is controlled, and is made
Obtaining relatively moves the ceramic mouldings and the cutter in the defined direction using the mobile unit, and
When cutting is repeated to multiple positions of another end side from the end side of the ceramic mouldings, the cutter and
The angle, θ that the interarea of the ceramic mouldings is constituted is changed according to predetermined distribution, the ceramic mouldings
Interarea is the region of cutter rearward described in ratio on the moving direction of off-position.
In addition, the predetermined distribution is preferably with as follows in the disconnecting device of ceramic mouldings of the invention
The distribution that mode is controlled：With the cutting is repeated, the angle, θ is become larger.
If be illustrated referring to Fig. 2, for example, make to be placed on do not have on platform 20 especially carry out local restriction ceramics at
Type body 10 from the end side 10a to another end 10b lateral deviation pan position and in the case where cutting is repeated, cutting
Incipient stage than carry out position (off-position) P that ceramic mouldings 10 are cut off by the front of cutter 1 (right side in Fig. 2),
Become as the region ratio of workpiece (laminated body one by one after cutting) 11 (11b) in rear (left side in Fig. 2) after cutting
The region of workpiece 11 (11a) is relatively more, therefore cutter 1 is by from the biggish stress in front.
On the one hand, in the final stage of cutting, the workpiece 11 in the front in cutter 1 opposite with the incipient stage of cutting
(11b) is relatively fewer compared with the workpiece 11 (11a) at rear, therefore cutter 1 is come from behind biggish stress.
In the above cases, by being controlled with predetermined distribution, so that above-mentioned angle, θ, the i.e. master of cutter 1
Face 1s and on the moving direction of off-position P rearward than the cutter ceramic mouldings 10 in region interarea 10s constitute
Angle, θ become larger with cutting is repeated, thus keep cutter 1 from the side closer to the front position P than being cut off by
To stress and the stress being subject to from rear side balance, thus ceramic mouldings 10 is inhibited diagonally to be cut off.As a result, can
To carry out the cutting of following ceramic mouldings：It does not need to sense each cutting, prevents from reducing productivity, and improve
Form accuracy and dimensional accuracy.
In addition, the predetermined distribution preferably comprises：Regulation time is carried out from the cutting is cut to described in beginning
Until number, the gradually smaller process of angle, θ；And the process that the angle, θ becomes larger later.
If being illustrated referring to Fig. 3, such as the drawing configured with positioning in the end side 10a of ceramic mouldings 10
In the state of leading device 21, make ceramic mouldings 10 from the end side 10a to another end 10b side position offset and
In the case where being cut off repeatedly to ceramic mouldings 10, in the incipient stage of cutting, exists and be guided device 21 from position
The influence of the stress of the defined end side 1a.
Therefore, by being controlled with predetermined distribution, so that the interarea 1s of cutter 1 and the shifting in off-position P
The angle, θ that the interarea 10s of the ceramic mouldings 10 in region is constituted rearward than the cutter 1 on dynamic direction is cut with being repeated
Disconnected, from beginning to switch off until cutting off stipulated number, angle, θ is gradually become smaller, and angle, θ becomes larger later, thus being cut
The balance of the stress that disconnected position (off-position) P keeps cutter 1 to be subject to from front side and the stress being subject to from rear side, can be with
Ceramic mouldings 10 are inhibited along inclined direction to be cut off.As a result, the cutting of following ceramic mouldings can be carried out：It does not need
Each cutting is sensed, prevents from reducing productivity, and improve form accuracy and dimensional accuracy.
In addition, the predetermined distribution preferably comprises：Regulation time is carried out from the cutting is cut to described in beginning
Until number, the angle, θ is less than 90 ° and gradually smaller process；And the process that the angle, θ becomes larger later.
In addition, by being controlled with predetermined distribution above-mentioned angle, θ, so that with cutting is repeated,
From beginning to switch off until cutting off stipulated number, angle, θ is less than 90 ° and gradually becomes smaller, and angle, θ becomes larger later, thus
The stress that can accurately keep cutter to be subject to from front side in the position cut off is flat with the stress that is subject to from rear side
Weighing apparatus can make the present invention more effective.
In addition, in the disconnecting device of ceramic mouldings of the invention, preferably when controlling the angle, θ,
Using the intersection point on the surface of the extended line of the point of a knife of the cutter and the platform as rotation center, by making the cutter to rule
Fixed direction rotates, to control the angle, θ.
It is being configured to make cutter using the intersection point on the surface of the extended line of the point of a knife of cutter and the platform as rotation center
Rotation is come in the case where making the angle, θ of cutter change, even for the different ceramic mouldings of thickness, can also make ceramics at
The incision starting position of the upper surface of type body optimizes, even if the case where cutting off to different types of ceramic mouldings
Under, also inclined cut amount can be made to become minimum not making to cut in the case that spacing accuracy is deteriorated.
In addition, in situation formed as described above, it is opposite for the knife by generating cutter inclination (making its rotation)
Error in the in-position of the upper surface of ceramic mouldings, for example, by according to make the inclined angle of cutter (rotation angle) and
Thickness information of ceramic mouldings etc. calculates correcting value, and is corrected to the relative position of platform and cutter, so as to this
Error is modified.
Furthermore it is preferred that the press section is cut by the action drives in the cutter driving portion with described to further include press section
The direction of action of knife driving portion itself is independently acted on the direction orthogonal with the surface of the platform, to the pottery
In the process that porcelain formed body is cut off, the ceramic mouldings are vertically pressed on the surface of the platform.
By having above structure, it can be reliably suppressed, prevent the positional shift of ceramic mouldings in cutting, it can
High-precision cutting is carried out by ground, therefore meaningful.
In addition, the manufacturing method of monolithic ceramic electronic component of the invention is characterised by comprising following process：It uses
The disconnecting device of the ceramic mouldings of aforementioned present invention cuts off the ceramic mouldings, that is, ceramic layer stack, thus point
It is cut into chip one by one.
Invention effect
As described above, the disconnecting device of ceramic mouldings of the invention includes：Platform, the platform placing ceramic formed body etc.
Ceramic mouldings；Cutter, the cutter are used to carry out cutting ceramic mouldings in the method for pressing cutting；Mobile unit, the movement
Unit makes a relative move ceramic mouldings and cutter on the defined direction of the interarea along ceramic mouldings；Cutter drives
Dynamic portion, the cutter driving portion move cutter on the direction towards ceramic mouldings and the direction for leaving ceramic mouldings；Angle
Control unit is spent, is controlled for entry angle when entering ceramic mouldings to cutter, the angle control unit is to cutter to pottery
The entry angle of enamel coating stack is controlled, so that making ceramic mouldings and the cutter in defined side using mobile unit
To relative movement, and when cutting is repeated to another end side from the end side of ceramic mouldings, the cutter
Interarea and on the moving direction of off-position rearward than the cutter ceramic mouldings in region interarea constitute
Angle, θ according to it is predetermined distribution be changed.
Thus, by changing above-mentioned angle, θ according to predetermined distribution and being cut using above-mentioned cutter, from
And the stress for being subject to cutter from the front side of ceramic mouldings in the position cut off and the stress being subject to from rear side are flat
Weighing apparatus, so as to inhibit diagonally to cut off ceramic mouldings.
As a result, by using the disconnecting device of ceramic mouldings of the invention, so as to carry out following ceramics at
The cutting of type body：It does not need to sense each cutting, prevents from reducing productivity, improve form accuracy and dimensional accuracy.
In addition, the manufacturing method of monolithic ceramic electronic component of the invention uses above-mentioned pottery of the invention due to having
The disconnecting device of porcelain formed body cuts off ceramic mouldings, that is, ceramic layer stack, and is divided into the work of chip one by one
Sequence, therefore sensing process can not be needed, efficiently ceramic layer stack is cut off, improves productivity, and can be efficiently
Manufacture the monolithic ceramic electronic component of higher form accuracy and dimensional accuracy.
Detailed description of the invention
Fig. 1 is the structure for schematically showing the disconnecting device of ceramic mouldings involved in embodiments of the present invention
Figure.
Fig. 2 be show one of the method that ceramic mouldings are cut off using disconnecting device of the invention it is exemplary
Figure.
Fig. 3 be show the method that ceramic mouldings are cut off using disconnecting device of the invention another is exemplary
Figure.
Fig. 4 is in disconnecting device of the invention, in the case where being cut off in the state of tilting cutter, to making to press
The interarea of portion and platform vertically carries out the figure that mobile method is illustrated, and (a) is to show that cutter is made to enter ceramic mouldings
The figure of preceding state is (b) figure for showing the state for just entering cutter.
Fig. 5 is to show in the case where cutting off in method shown in Fig. 3 to ceramic mouldings, the interarea and pottery of cutter
The figure of the control distribution for the angle, θ that the interarea of porcelain formed body is constituted.
Fig. 6 be in the case where being cut off using disconnecting device of the invention to ceramic mouldings, to be used for and ceramics
The figure that the method for adjustment of the in-position for the cutter that the thickness of formed body is mapped is illustrated.
Fig. 7 is to show the laminated ceramic electronic member manufactured using the manufacturing method of monolithic ceramic electronic component of the invention
One exemplary cross-sectional view of the structure of device (laminated ceramic capacitor).
Fig. 8 is the figure for showing the cutting-off method of existing ceramic green sheet formed body.
Specific embodiment
Embodiments of the present invention described below illustrate characteristic of the invention in further detail.In addition, conduct
One example of ceramic mouldings, using ceramic layer stack, embodiments of the present invention will be described.
Fig. 1 is the structure for schematically showing the disconnecting device of ceramic mouldings involved in embodiments of the present invention
Figure.The disconnecting device of the ceramic mouldings includes：The platform 20 of placing ceramic laminated body 10；Cutter 1, the cutter 1 are used for press
The method that crush-cutting is cut cuts off ceramic layer stack 10；And cutter driving portion 30, the cutter driving portion 30 make to be maintained at folder
The cutter 1 and fixture 2 of tool 2 move on the direction towards ceramic layer stack 10 and the direction for leaving ceramic layer stack 10 together.
In addition, platform 20 implements function such as：Make ceramic layer stack 10 to the rule of the interarea 10s along ceramic layer stack 10
Fixed direction (in Fig. 1,2,3, with direction shown by arrow X) is mobile, and has for moving platform 20 in the horizontal direction
Dynamic can numerically controlled axis.
Moreover, platform 20 is configured to play the following two kinds work in the disconnecting device of ceramic layer stack preferably
With：The effect of platform of the invention；And in order to cut off in defined multiple positions to ceramic layer stack 10, make ceramics
The work for the mobile unit that laminated body 10 and cutter 1 relatively move on the direction as defined in the interarea 10s along ceramic layer stack 10
With.
In addition, in the present invention, being also configured to not make the movement of platform 20, and keep cutter 1 mobile, in this case,
The mobile unit for keeping cutter 1 mobile is set, so that ceramic layer stack 10 and cutter 1 are in the interarea 10s along ceramic layer stack 10
Defined direction on relatively move.
In addition, the disconnecting device of the ceramic layer stack of the embodiment is also configured to as shown in Figure 2 by ceramic layer
Stack 10 is placed in the state of platform 20, such as with the methods of vacuum attraction (not shown), ceramic layer stack 10 is maintained at
Specified position, in addition it is also possible to be configured to as shown in figure 3, having the guidance abutted with an end side of ceramic layer stack 10
Device 21, so that ceramic layer stack 10 is maintained at the specified position on platform 20.
In addition, the disconnecting device of the ceramic layer stack of the embodiment includes：Cutter driving portion 30, the cutter driving portion 30
In the case where defined multiple positions (off-position) cut off ceramic layer stack 10, make cutter 1 towards ceramic layer
It is moved on the direction of stack 10 and the direction for leaving ceramic layer stack 10；And angle control unit (not shown), angle control
Portion controls cutter 1 to the entry angle of ceramic layer stack 10.
In addition, the ((figure of cutter module 5 in detail, formed by cutter 1, fixture 2 and cutter driving portion 30 of cutter 1
1) it) is configured to using the mechanism being not particularly illustrated, in the state of being kept as shown in Figure 1 by fixture 2, to arrow A or B
Direction rotates (rotation).
It is constituted moreover, the angle control unit controlled to the entry angle of ceramic layer stack 10 cutter 1 is (not shown)
To be controlled to the entry angle of ceramic layer stack 10 cutter 1, so that making ceramic layer stack 10 to rule using platform 20
Fixed direction (direction of arrow X) is mobile, repeatedly from the end side 10a of ceramic layer stack 10 to another end side 10b
When being cut off, the interarea 1s of cutter 1 and compare on the moving direction (direction shown by arrow Y in Fig. 1,2) of off-position P
Cutter 1 rearward the ceramic layer stack 10 in region interarea 10s constitute angle, θ according to it is predetermined distribution be changed.
Moreover, the disconnecting device of the ceramic layer stack of the embodiment includes press section 22, the press section 22 is to ceramics
In the process that laminated body 10 is cut off, ceramic layer stack 10 is vertically pressed to the surface 20a of platform 20.Although the press section 22
Not in conjunction with 30 mechanicalness of cutter driving portion, but by the action drives in cutter driving portion 30, with cutter driving portion 30 itself
Direction of action independently acted on the direction orthogonal with the surface of platform 20, cut off to ceramic layer stack 10
Process in, play the role of the surface 20a that ceramic layer stack 10 is vertically pressed to platform 20.
In addition, press section 22 is constructed so that as shown in Fig. 1, Fig. 4 (a), Fig. 4 (b)：The sliding that press section 22 has
Axis 23 and it is arranged in chimeric with sliding eye (not shown) on the sliding equipment 33 that cutter module 5 is provided independently from and slides,
Vertical with the surface 20a of platform 20 direction movement, by the press section drive shaft 31 that is arranged in cutter driving portion 30 with
Abutting part 24 that press section 22 has abuts, which has convex hemispheres face (imitating face), thus press section 22 towards
Ceramic layer stack 10 moves on the direction orthogonal with its interarea 10s (and surface 20a of platform 20).
Press section 22 is constituted as described above, and due to having abutting part 24, which there is convex hemispheres face (to imitate
Face), therefore (rotated to the direction of arrow A or B in the state that cutter 1 (cutter module 5) is inclined to defined angle
State), abutted with drive shaft 31 with abutting part 24 by press section come in the case where driving, press section 22 also with ceramic layer
It is moved on the interarea 10s (and surface 20a of platform 20) of stack 10 orthogonal direction, therefore press section 22 is by ceramic layer stack
The 10 surface 20a for vertically pressing to platform 20 can cut so as to prevent from generating positional shift in ceramic layer stack 10 defined
Disconnected position is cut off.
That is, can will also be made pottery by press section 22 in the case where entering cutter 1 obliquely relative to ceramic layer stack 10
Enamel coating stack 10 vertically presses to the surface 20a of platform 20, so as to be reliably suppressed ceramic layer stack 10 in the horizontal direction
Mobile (positional shift).
In addition, press section drive shaft 31 is configured to using spring 31a to 22 applied force of press section, and can be with defined power
Press section 22 is pressed to ceramic layer stack 10.
Then, the method for using the disconnecting device cutting ceramic layer stack of the ceramic layer stack of the embodiment is carried out
Explanation.It is described as follows situation first：As shown in Fig. 2, in the state that ceramic layer stack 10 is placed on platform 20, without using such as
Guide device 21 shown in Fig. 3 cuts off ceramic layer stack 10.
As shown in Fig. 2, the defined position placing ceramic laminated body 10 on platform 20.Then, make platform 20 in arrow X
Direction on intermittently move, to keep off-position mobile and decline cutter 1 in specified position, cut off multilayered ceramic
Body 10.
At this point, angle control unit (not shown) according to predetermined distributed controll cutter 1 to ceramic layer stack 10 into
Enter angle so that the interarea 1s of cutter 1 and on the moving direction (direction shown by arrow Y) of off-position rearward than cutter 1
The angle, θ that the interarea 10s of the ceramic layer stack 10 in square region is constituted is according to predetermined changes in distribution.
Specifically, the angle, θ of cutter 1 is controlled and cut off according to predetermined distribution, so that with
Cutting is repeated in defined off-position, the angle, θ of cutter 1 becomes larger.Specifically, when cutting starts
It carves, angle, θ is set as 88 °；Near the middle position of the moving direction of off-position, angle, θ is set as 89 °；In cutting
Angle, θ is set as 90.5 ° by final stage.That is, by angle, θ control (referring to Fig. 2) in the range of 88 ° to 90.5 °.
Cutter 1 keeps what is be subject to from the stress that side is subject on the front of the position than being cut off and from rear side to answer as a result,
The balance of power can inhibit along inclined direction to cut off ceramic layer stack 10.As a result, not needing to sense each cutting, no
Productivity can be made to reduce, can accurately cut off ceramic layer stack 10.
Then, as shown in figure 3, being illustrated for following situation：Ceramic layer stack 10 is placed on platform 20, by making
Guide device 21 is abutted with the end side 10a of ceramic layer stack 10, thus ceramic layer stack 10 is maintained at platform 20
On defined position in the state of, carry out ceramic layer stack 10 cutting.
Firstly, being set as following state：The placing ceramic laminated body 10 on platform 20, guide device 21 are supported with one end side
It connects, ceramic layer stack 10 is positioned at the defined position on platform 20.
Then, it moves platform 20 intermittently in the direction of arrowx, so that it is mobile to make off-position, and is advising
Positioning, which is set, declines cutter 1, cuts off ceramic layer stack 10.
At this point, angle control unit (not shown) enters to ceramic layer stack 10 according to predetermined distributed controll cutter 1
When angle, that is, entry angle so that the interarea 1s of cutter 1 and comparing on the moving direction (direction of arrow Y) of off-position P
The angle, θ that the interarea 10s of the ceramic layer stack 10 in region rearward of cutter 1 is constituted is according to predetermined changes in distribution.
For example, as shown in figure 3, controlled with predetermined distribution so that above-mentioned angle, θ since cutting to rule
The incipient stage of cutting until determining number gradually becomes smaller, and angle, θ becomes larger later.Cutter is kept to be cut off as a result,
Position on the stress being subject to from front side and the stress equilibrium being subject to from rear side, can inhibit along inclined direction to cut off ceramic layer
Stack.
In the incipient stage of the cutting since cutting until stipulated number, such as it is preferably set to angle, θ sometimes and exists
It is gradually become smaller in the range of less than 90 °.In addition, Fig. 3 shows above-mentioned situation.
In addition, Fig. 5 is to show in the case where cutting off in method shown in Fig. 3 to ceramic layer stack 10, cutter 1
The figure of the control distribution for the angle, θ that the interarea 1s and interarea 10s of ceramic layer stack 10 is constituted.But the Fig. 5 is shown in cutting
Final stage, the case where making angle, θ become smaller again, (are not shown) in Fig. 3.As shown in figure 5, having period in the final stage of cutting
Prestige makes angle, θ become smaller again.
In addition, in this example, specifically, as shown in figure 5, control angle, θ so that cut off start when,
Angle, θ is about 88.2 °, since until breaks reach 15 times, angle, θ is gradually become smaller (in breaks 15 cutting
Angle, θ is about 87.8 ° when secondary), later until breaks reach about 130 times, angle, θ is become larger (in cutting time
When number is 127 times, angle, θ is about 91.2 °), angle, θ becomes smaller again later, and (when breaks are 140 times, angle, θ is big
About 91 °).
By being cut off in above-mentioned method, to can be carried out following ceramics into the cutting of laminated body：It does not need pair
Cutting is sensed every time, is prevented from reducing productivity, is improved form accuracy and dimensional accuracy.
<The determining method of the distribution of angle control>
The distribution of above-mentioned angle control can be determined and (be acquired) according to side for example described below.
(1) image processing apparatus is used, the dissengaged positions in each off-position is investigated, to the journey of cutting end slope
Degree (inclined cut amount) measures.That is, being carried out with image processing apparatus for calculating next off-position (in Fig. 2, figure
Next off-position in 3 arrow Y-direction) sensing while, also measurement inclined cut amount.
(2) according to the inclined cut amount measured with image processing apparatus, the upper of the cutter for not generating inclined cut is calculated
State angle, θ.That is, calculating the cutter (blanking punch for not generating inclined cut according to the inclined cut amount measured in above-mentioned (1)
Block) tilt angle theta (entry angle of cutter).
At this point, if considering deformation and characteristic of ceramic layer stack of cutter etc. invalid " image processing apparatus may be used
The angle that the inclined cut amount of measurement is 0 "=" tilt angle theta of cutter ", therefore, as explained below, to its correction coefficient
It is set, and carries out error correction.
<The error correction of the tilt angle theta of cutter>
In order to correspond to the thickness of ceramic layer stack extensively, as shown in fig. 6, preferably making the rotation of the leaning device of cutter 1
Center and the lower surface (the surface 20a of platform 20) of ceramic layer stack 10 are consistent.By constituting as described above, even for thickness
Different ceramic layer stacks 10 is spent, the incision starting position of the upper surface of ceramic layer stack 10 can also optimized, even if kind
It changes, will not make to cut spacing accuracy variation, inclined cut amount minimization can be made.
In addition, the cutter 1 generated for being tilted due to cutter 1 is relative to pottery in the case where being set as above-mentioned structure
The error of the in-position of the upper surface of enamel coating stack 10, according to the tilt angle theta of such as cutter and ceramic layer stack 10
Thickness information etc. calculates correcting value, and in the case where acting platform 20, can by the stop position to platform 20 into
Row correction is to correct：.In addition, correction can be passed through being configured to act platform in the case where keeping the position of cutter mobile
The stop position of cutter is corresponded to.
In addition, in the above-described embodiment, although the ceramic layer of multiple internal electrodes is laminated with via ceramic layer to cutting
The citing of the case where stack is illustrated, but the present invention is not for having the ceramic layer stack of internal electrode pattern and not having
The case where ceramic mouldings of stepped construction are cut off can also be applicable in.
<The manufacturing method of monolithic ceramic electronic component>
Then, for being manufactured via using the disconnecting device of above-mentioned ceramic layer stack to cut off the process of ceramic layer stack
The manufacturing method of monolithic ceramic electronic component when monolithic ceramic electronic component is illustrated.
In addition, herein, illustrate and be illustrated for the case where manufacture laminated ceramic capacitor 100, the laminated ceramic capacitors
Device 100 has structure as shown in Figure 7, that is, is being laminated with multiple internal electrodes via the ceramic layer 101 as dielectric layer
The both ends of the surface of the ceramic main body 110 of 102a, 102b, configure external electrode 105a, 105b so that external electrode 105a, 105b with
Internal electrode 102a, 102b conducting.
(1) firstly, ceramic green sheet of the production containing the organic matters such as adhesive and ceramics.(2) then, silk-screen printing is utilized
The methods of the conductive paste of internal electrode formation is printed on multiple positions as defined in the ceramic green sheet, in ceramic green sheet
It is upper to form internal electrode pattern rectangularly.(3) then, it is formed the ceramic green sheet for being formed with internal electrode pattern and not
The ceramic green sheet of the outer layer of internal electrode is laminated with defined sequence, to form ceramic mouldings i.e. multilayered ceramic
Body.Ceramic mouldings contain above-mentioned organic matter and ceramics.(4) by the ceramic layer stack disconnecting device of above-mentioned ceramic layer stack
It is cut off, is divided into chip unfired one by one.
In addition, when cutting off ceramic layer stack, although carry out along the length direction of chip one by one cutting and along
The cutting of width direction, but the cutting in the length direction along chip one by one and the cutting along width direction is any
It is essentially all the distribution that is controlled according to above-mentioned angle to be cut off in a kind of situation.But with along chip one by one
Width direction cutting the case where compare, the spacing that the case where cutting alongst usually switches off is longer, on the whole
The case where adjusting range of angle is smaller is more.
(5) after, unfired chip is fired with defined condition, by making ceramic green sheet and internal electrode
Pattern sintering, to obtain ceramic main body.(6) then, external terminal is formed in two end sides of ceramic main body.Had as a result,
The laminated ceramic capacitor of standby structure as shown in Figure 7.
In addition, in this embodiment, be illustrated although illustrating to the case where manufacture laminated ceramic capacitor,
The present invention is not limited to laminated ceramic capacitors, can be widely applicable for manufacture stacking rheostat, multilayer coil, the stacking compound member of LC
The case where device, multilager base plate etc., various monolithic ceramic electronic components.
The present invention is also not necessarily limited to above-described embodiment in other various aspects, for the tool of the ceramic layer stack as cutting object
The structure snd size of structure (size, characteristic, configuration mode of internal electrode pattern etc.) cutter of body, cutter driving portion and pressing
The structure in portion and other can be carried out within the scope of the invention and increase various application, deform.
Label declaration
1 cutter
2 fixtures
5 cutter modules
10 ceramic layer stacks
One end of 10a ceramic layer stack
Another end of 10b ceramic layer stack
The interarea of 10s ceramic layer stack
11 (11a, 11b) workpiece (laminated body one by one after cutting)
20 platforms
The surface of 20a platform
21 guide devices
22 press sections
23 sliding axles
24 abutting parts
30 cutter driving portions
31 press section drive shafts
31a spring
33 sliding equipments
P off-position
Y shows the arrow of cut direction
X shows the arrow of the moving direction of ceramic layer stack
The angle that the interarea of the ceramic layer stack in the interarea of θ cutter and rearward than cutter region is constituted
Claims (7)
1. a kind of disconnecting device of ceramic mouldings is for when defined multiple positions cut off ceramic mouldings
Disconnecting device, which is characterized in that including：
Platform, the platform place the ceramic mouldings；
Cutter, the cutter are used to cut off the ceramic mouldings in the method for pressing cutting；
Mobile unit, the mobile unit make the pottery to cut off in defined multiple positions to the ceramic mouldings
Porcelain formed body and the cutter make a relative move on the defined direction of the interarea along the ceramic mouldings；
Cutter driving portion, the cutter driving portion make the cutter in the direction towards the ceramic mouldings and leave the ceramics
It is moved on the direction of formed body；And
Angle control unit, angle, that is, entry angle when for entering the ceramic mouldings to the cutter control, should
Angle control unit is controlled, so that making the ceramic mouldings and the cutter in the regulation using the mobile unit
Direction on relatively move, and in the end side from the ceramic mouldings to multiple as defined in another end side
When cutting is repeated in position, the cutter and on the moving direction of off-position rearward than the cutter described in region
The angle (θ) that the interarea of ceramic mouldings is constituted is changed according to predetermined distribution.
2. the disconnecting device of ceramic mouldings as described in claim 1, which is characterized in that it is predetermined it is described distribution be with
The distribution controlled such as under type：With the cutting is repeated, the angle (θ) is become larger.
3. the disconnecting device of ceramic mouldings as described in claim 1, which is characterized in that the predetermined distribution packet
It includes：Until being cut to the cutting progress stipulated number described in beginning, the gradually smaller process of the angle (θ)；And it
The process that the angle (θ) becomes larger afterwards.
4. the disconnecting device of ceramic mouldings as claimed in claim 3, which is characterized in that the predetermined distribution packet
It includes：Until being cut to the cutting progress stipulated number described in beginning, the angle (θ) is less than 90 ° and to gradually become smaller
Process；And the process that the angle (θ) becomes larger later.
5. the disconnecting device of the ceramic mouldings as described in any one of Claims 1-4, which is characterized in that described
When angle (θ) is controlled, using the intersection point on the surface of the extended line of the point of a knife of the cutter and the platform as rotation center,
By rotating the cutter to defined direction, to control the angle (θ).
6. the disconnecting device of the ceramic mouldings as described in any one of Claims 1-4, which is characterized in that further include by
Splenium, the press section is by the action drives in the cutter driving portion, independently with the direction of action in the cutter driving portion itself
It is acted on the direction orthogonal with the surface of the platform, it, will in the process cut off to the ceramic mouldings
The ceramic mouldings vertically press on the surface of the platform.
7. a kind of manufacturing method of monolithic ceramic electronic component,
It is characterised in that it includes following process：Use the cutting of ceramic mouldings described in any one of claim 1 to 6
Device cuts off the ceramic mouldings, that is, ceramic layer stack, to be divided into ceramic layer stack one by one.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015154268A JP2017034158A (en) | 2015-08-04 | 2015-08-04 | Cutting device for ceramic compact, and manufacturing method of multilayer ceramic electronic component |
| JP2015-154268 | 2015-08-04 |
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| Publication Number | Publication Date |
|---|---|
| CN106426575A CN106426575A (en) | 2017-02-22 |
| CN106426575B true CN106426575B (en) | 2018-11-23 |
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| CN201610605601.4A Active CN106426575B (en) | 2015-08-04 | 2016-07-28 | The disconnecting device of ceramic mouldings and the manufacturing method of monolithic ceramic electronic component |
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| Country | Link |
|---|---|
| JP (1) | JP2017034158A (en) |
| KR (1) | KR101860104B1 (en) |
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| TW (1) | TWI668089B (en) |
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| KR102391577B1 (en) * | 2020-01-22 | 2022-04-28 | 삼성전기주식회사 | Manufacturing method of ceramic component and apparatus for manufacturing the same |
| CN116901232B (en) * | 2023-09-14 | 2023-12-19 | 陶瓷工业设计研究院(福建)有限公司 | High-precision ceramic forming body cutting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6129114A (en) * | 1984-07-18 | 1986-02-10 | 関西日本電気株式会社 | Method of producing laminated ceramic part |
| JP3166924B2 (en) * | 1991-02-07 | 2001-05-14 | 株式会社村田製作所 | Manufacturing method of ceramic electronic components |
| JPH05205972A (en) * | 1992-01-29 | 1993-08-13 | Rohm Co Ltd | Cutting method of ceramic laminated sheet |
| JPH0997736A (en) * | 1995-09-29 | 1997-04-08 | Matsushita Electric Ind Co Ltd | Method of manufacturing laminated material chip component and laminated material chip component obtained by that method |
| JP3675199B2 (en) * | 1998-11-13 | 2005-07-27 | 株式会社村田製作所 | Cutting method of ceramic green block |
| JP4465733B2 (en) * | 1999-03-11 | 2010-05-19 | 株式会社村田製作所 | Green sheet cutting method |
| JP4048982B2 (en) * | 2003-03-13 | 2008-02-20 | 株式会社村田製作所 | Cutting method and cutting apparatus for ceramic green molded body |
| JP4581329B2 (en) * | 2003-03-13 | 2010-11-17 | 株式会社村田製作所 | Cutting method and cutting apparatus for ceramic green molded body |
| JP2007118145A (en) * | 2005-10-28 | 2007-05-17 | Asahi Glass Co Ltd | Flexible film cutting device and flexible film cutting method |
| JP2013000826A (en) * | 2011-06-15 | 2013-01-07 | Murata Mfg Co Ltd | Cutting blade, and method and device for manufacturing electronic component |
| JP2014060259A (en) * | 2012-09-18 | 2014-04-03 | Murata Mfg Co Ltd | Ceramic laminate cutting method, ceramic laminate cutting device, and method of manufacturing laminated ceramic electronic component |
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| JP2017034158A (en) | 2017-02-09 |
| TWI668089B (en) | 2019-08-11 |
| CN106426575A (en) | 2017-02-22 |
| KR20170016800A (en) | 2017-02-14 |
| TW201716199A (en) | 2017-05-16 |
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