CN106413254A - In-mold transfer printing multilayer circuit film and manufacturing method thereof - Google Patents
In-mold transfer printing multilayer circuit film and manufacturing method thereof Download PDFInfo
- Publication number
- CN106413254A CN106413254A CN201510466072.XA CN201510466072A CN106413254A CN 106413254 A CN106413254 A CN 106413254A CN 201510466072 A CN201510466072 A CN 201510466072A CN 106413254 A CN106413254 A CN 106413254A
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- Prior art keywords
- circuit
- layer
- transfer printing
- mold transfer
- printing
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Abstract
The invention discloses a method for producing an in-mold transfer printing multilayer circuit film. The method comprises a first step of printing a circuit layer; a second step of printing an insulating layer; a third step of adding printed circuit layers and insulating layers according to the number of circuit layers; the fourth step; a step 4 of printing an adhesive layer, and combining a multilayer circuit and a structural member into one body through in-mold transfer printing. The method has advantages of: 1, achieving cross-layer connection of the circuit through the gaps of the insulating layers, and simultaneously fabricating an NFC antenna and a wireless charging coil on the structural member; 2, completing the multi-layer circuit transfer printing at the same time of injection moulding, preventing chemical plating, electroplating and other processes, being simple and reliable in process and low degree in environmental pollution.
Description
Technical field
The present invention relates to in-mold decoration embedding and injection molding technology, i.e. IMD technology, more particularly, to a kind of in-mold transfer printing multilayer circuit film and preparation method thereof.
Background technology
The communication equipments such as mobile phone comprise multiple antennas, such as mobile communication main antenna, WiFi antenna, Bluetooth antenna, GPS and Beidou antenna, near-field communication NFC antenna etc., or even include Wireless charging coil.For small communication terminal, the clear space leaving antenna for is limited, and this brings challenges to Antenna Design and making.It is to solve one of method of this challenge using the conformal antenna directly making in shells.In recent years, laser direct forming LDS technology is applied on conformal antenna makes.Although LDS technology can make three-dimensional circuit on casing, its manufacturing cost is high, and is difficult to make multilayer circuit.On the other hand, IMD technology carries out mold insert while injection mo(u)lding and bands, and makes that both are laminating to be integrally formed.The functional layer of IMD generally adopts ink material, is currently used primarily in the incrustation of structural member.IMD functional layer is used instead conductive material, can be made into circuit film.Add insulating barrier in different circuit interlayers, can be made into multilayer circuit film, and be capable of parallel link, this is extremely important in terms of NFC antenna, Wireless charging coil making.By in-mold transfer printing technology, multilayer circuit just can be made on plastics shells.So, it is possible to make NFC antenna, Wireless charging coil, communication antenna and various electronic circuit on plastic structural part.
Content of the invention
The invention aims to solving above-mentioned the deficiencies in the prior art and providing a kind of in-mold transfer printing multilayer circuit film and preparation method thereof.This technology can make NFC antenna, Wireless charging coil, communication antenna and various electronic circuit on plastic structural part, and circuit trace is capable of parallel link.
Embodiments provide a kind of in-mold transfer printing multilayer circuit film production method, particular content comprises the following steps：
The first step, layer printed circuit board；
Second step, prints insulating barrier；
3rd step, adds layer printed circuit board and insulating barrier according to the circuit number of plies；
4th step, printing adhesion layer.
In the described first step, it is layer printed circuit board on substrate；Heat-resisting, impact resistance sheet material selected by substrate；
In described second step, if single circuit, then printing insulating barrier step can be omitted, if the circuit number of plies is more than or equal to two-layer, needs to print insulating barrier between described circuit layer and circuit layer；
In described 3rd step, layer printed circuit board and insulating barrier are added according to the circuit number of plies, for multilayer circuit, insulating barrier need to be printed in adjacent circuit interlayer；
In described 4th step, printing adhesion layer on last circuit layer, for the bonding with plastic components.
Further, a kind of in-mold transfer printing multilayer circuit film production method, described substrate can be selected for the sheet materials such as PET, PC.
Further, a kind of in-mold transfer printing multilayer circuit film production method, described circuit layer is conductive material.According to the requirement of electric conductivity, adhesion property and cost control, conductive material can adopt the material such as nanometer silver paste, nano copper slurry, Graphene, nanometer gold paste.
Further, a kind of in-mold transfer printing multilayer circuit film production method, described insulating barrier is provided with gap.In addition to the gap setting, cover the circuit layer of previous printing when printing insulating barrier.
Further, a kind of in-mold transfer printing multilayer circuit film production method, on the insulating layer during printed circuit layer, described gap is filled by circuit layer material, and the conductive material passing through between adjacent circuit layer to insulate in layer gap connects.
Present invention also offers a kind of in-mold transfer printing technology of multilayer circuit film, its concrete grammar is as follows：
The first step, is rolled into cylindrical shape the multilayer circuit film band producing, is installed on the coil handling apparatus of injection machine, make film strip band be sent to by winding apparatus by mould；
Second step, completes transfer process while mould matched moulds is molded；
3rd step, scrolling film band during die sinking, complete an in-mold transfer printing, proceed transfer operation next time.
A kind of in-mold transfer printing multilayer circuit film production method that the present invention provides, IMD functional layer is used instead conductive material, can be made into circuit film.Add insulating barrier in different circuit interlayers, can be made into multilayer circuit film, and parallel link is realized by the layer gap that insulate, this is extremely important in terms of NFC antenna, Wireless charging coil making.By in-mold transfer printing technology, multilayer circuit film is laminating with plastics shells to be integrally formed.So, it is possible to make NFC antenna, Wireless charging coil, communication antenna and various electronic circuit on plastic structural part.
It is an advantage of the current invention that：1st, it is particularly suitable for making NFC antenna, Wireless charging coil on plastic structural part, and NFC antenna and Wireless charging coil can be made on plastic structural part simultaneously, make that three is laminating to be integrally formed.2nd, complete multilayer circuit transfer while structural member injection mo(u)lding, it is to avoid the processing procedure such as chemical plating, plating, its processing procedure is simple and reliable, and environmental is low.
Brief description
Fig. 1 is the multilayer circuit film layering schematic diagram of the embodiment of the present invention；
Fig. 2 is the circuit trace parallel link schematic diagram of the embodiment of the present invention.
101 represent substrate；102 represent circuit layer 1；103 represent insulating barrier；104 represent circuit layer 2；105 represent adhesive layer.
Specific embodiment
The present invention is further described with reference to the accompanying drawings and examples.
Embodiment：
The present invention implements to provide a kind of multilayer circuit film production method.Taking two-tier circuit as a example, Fig. 1 provides layering schematic diagram, is side view.A kind of circuit trace parallel link method that the present embodiment provides, as shown in Fig. 2 step is as follows：
Step S01, printed circuit layer 1 on substrate.White wire represents conductive material circuit trace, and black represents and do not print conductive material portion；
Step S02, prints insulating barrier on circuit layer 1.White represents insulating materials, and black represents insulation layer gap.Insulation layer gap is alignd with the circuit trace of circuit layer 1；
Step S03, printed circuit layer 2 on the insulating layer.White wire represents conductive material circuit trace, and black represents and do not print conductive material portion.Circuit trace is alignd with the gap of step S02.During printed circuit layer 2, conductive material fills up insulation layer gap, and is connected with the circuit trace of step S01 by gap；
Step S04, prints adhesive layer on circuit layer 2.White represents adhesive layer.Adhesive layer all covers printed portions.Readily appreciate, the circuit trace under adhesive layer is illustrated with black forms.
A kind of in-mold transfer printing multilayer circuit film of the present embodiment and preparation method thereof has following advantage：
The present embodiment realizes circuit trace parallel link by the layer gap that insulate, thus realizing circuit trace bridge joint, it is particularly suitable for making NFC antenna, Wireless charging coil on plastic structural part, NFC antenna and Wireless charging coil can be made on plastic structural part simultaneously, and combine together with structural member.
The present embodiment completes multilayer circuit transfer while injection mo(u)lding, it is to avoid the processing procedure such as the chemical plating of other technology, plating, and its processing procedure is simple and reliable, and environmental is low.
For general technical staff of the technical field of the invention; without departing from the inventive concept of the premise; its framework form can be flexible and changeable, simply makes some simple deduction or replace, all should be considered as belonging to the scope of patent protection that the present invention is determined by the claims submitted to.
Claims (7)
1. a kind of in-mold transfer printing multilayer circuit film production method it is characterised in that：Particular content comprises the following steps：
The first step, layer printed circuit board；
Second step, prints insulating barrier；
3rd step, adds layer printed circuit board and insulating barrier according to the circuit number of plies；
4th step, printing adhesion layer；
In the described first step, it is layer printed circuit board on substrate, heat-resisting, impact resistance sheet material selected by substrate；
In described second step, if single circuit, then printing insulating barrier step can be omitted；If the circuit number of plies is more than or equal to two-layer, need between described circuit layer and circuit layer to print insulating barrier；
In described 3rd step, layer printed circuit board and insulating barrier are added according to the circuit number of plies, for multilayer circuit, insulating barrier need to be printed in adjacent circuit interlayer；
In described 4th step, printing adhesion layer on last circuit layer, for the bonding with plastic components；
It is provided with gap on described insulating barrier, when printed circuit layer on the insulating layer, described gap is filled by the printing material of circuit layer, and described printing material is conductive material, and the printed circuit connection between layers of multilayer circuit is realized via the conductive material in this gap.
2. according to claim 1, a kind of in-mold transfer printing multilayer circuit film production method it is characterised in that：In addition to the gap setting, cover the circuit layer of previous printing when printing insulating barrier.
3. according to claim 1, a kind of in-mold transfer printing multilayer circuit film production method it is characterised in that：Described substrate can be selected for PET, PC sheet material, and described conductive material can adopt nanometer silver paste, nano copper slurry, Graphene, nm of gold pulp material.
4. a kind of in-mold transfer printing multilayer circuit film it is characterised in that：Specifically it is prepared from by a kind of above-mentioned in-mold transfer printing multilayer circuit film production method.
5. as claimed in claim 4, a kind of in-mold transfer printing multilayer circuit film it is characterised in that：There is multilayer circuit film structure, including substrate, circuit layer, insulating barrier and adhesive layer, described circuit film orlop is substrate, the superiors are adhesive layer, mid portion is circuit layer and insulating barrier alternating structure, described insulating barrier is provided with gap, described gap is filled by conductive material.
6. a kind of in-mold transfer printing technology of multilayer circuit film it is characterised in that：
The first step, is rolled into cylindrical shape the multilayer circuit film band producing, is installed on the coil handling apparatus of injection machine, make film strip band be sent to by winding apparatus by mould；
Second step, completes transfer process while mould matched moulds is molded；
3rd step, scrolling film band during die sinking, complete an in-mold transfer printing, proceed transfer operation next time.
7. a kind of laminating moulding having in-mold transfer printing multilayer circuit it is characterised in that：The laminating in-mold transfer printing multilayer circuit film having the right described in requirement 4 to 6 in this moulding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510466072.XA CN106413254A (en) | 2015-08-03 | 2015-08-03 | In-mold transfer printing multilayer circuit film and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510466072.XA CN106413254A (en) | 2015-08-03 | 2015-08-03 | In-mold transfer printing multilayer circuit film and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
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| CN106413254A true CN106413254A (en) | 2017-02-15 |
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| CN201510466072.XA Pending CN106413254A (en) | 2015-08-03 | 2015-08-03 | In-mold transfer printing multilayer circuit film and manufacturing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201124554Y (en) * | 2007-08-24 | 2008-10-01 | 达方电子股份有限公司 | Intra-mould transferring injection moulding device |
| US20080248148A1 (en) * | 2007-04-05 | 2008-10-09 | Hon Hai Precision Industry Co., Ltd. | Injection molding device |
| CN101614954A (en) * | 2008-06-26 | 2009-12-30 | 比亚迪股份有限公司 | A kind of preparation methods with hologram pattern |
| CN101752658A (en) * | 2008-12-05 | 2010-06-23 | 深圳富泰宏精密工业有限公司 | Antenna assembly, method for manufacturing antenna assembly and shell integrated with antenna assembly |
| CN103252867A (en) * | 2008-04-18 | 2013-08-21 | 英克-罗吉克斯有限公司 | In-molded resistive and shielding elements |
-
2015
- 2015-08-03 CN CN201510466072.XA patent/CN106413254A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080248148A1 (en) * | 2007-04-05 | 2008-10-09 | Hon Hai Precision Industry Co., Ltd. | Injection molding device |
| CN201124554Y (en) * | 2007-08-24 | 2008-10-01 | 达方电子股份有限公司 | Intra-mould transferring injection moulding device |
| CN103252867A (en) * | 2008-04-18 | 2013-08-21 | 英克-罗吉克斯有限公司 | In-molded resistive and shielding elements |
| CN101614954A (en) * | 2008-06-26 | 2009-12-30 | 比亚迪股份有限公司 | A kind of preparation methods with hologram pattern |
| CN101752658A (en) * | 2008-12-05 | 2010-06-23 | 深圳富泰宏精密工业有限公司 | Antenna assembly, method for manufacturing antenna assembly and shell integrated with antenna assembly |
Non-Patent Citations (1)
| Title |
|---|
| 范有发: "《塑料先进成型技术》", 31 May 2014, 机械工业出版社 * |
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Application publication date: 20170215 |