CN106413145A - High-tenacity carbon crystal heating plate and preparation method thereof - Google Patents
High-tenacity carbon crystal heating plate and preparation method thereof Download PDFInfo
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- CN106413145A CN106413145A CN201610805812.2A CN201610805812A CN106413145A CN 106413145 A CN106413145 A CN 106413145A CN 201610805812 A CN201610805812 A CN 201610805812A CN 106413145 A CN106413145 A CN 106413145A
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- preparation
- epoxy resin
- consumption
- crystal heating
- carbon crystal
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 67
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 48
- 238000010438 heat treatment Methods 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title claims abstract description 39
- 239000013078 crystal Substances 0.000 title claims abstract description 31
- 239000003822 epoxy resin Substances 0.000 claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims abstract description 18
- 239000010949 copper Substances 0.000 claims abstract description 18
- 239000010439 graphite Substances 0.000 claims abstract description 12
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 12
- 238000007731 hot pressing Methods 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 8
- 238000004806 packaging method and process Methods 0.000 claims abstract description 6
- 239000004033 plastic Substances 0.000 claims abstract description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 24
- -1 alcohol ester Chemical class 0.000 claims description 18
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims description 16
- 239000002002 slurry Substances 0.000 claims description 15
- 239000004843 novolac epoxy resin Substances 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000009719 polyimide resin Substances 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 238000000748 compression moulding Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 239000001856 Ethyl cellulose Substances 0.000 claims description 7
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 7
- 239000004115 Sodium Silicate Substances 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 7
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 7
- 229920001249 ethyl cellulose Polymers 0.000 claims description 7
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 7
- 229940116411 terpineol Drugs 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims 2
- 150000003949 imides Chemical class 0.000 claims 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 20
- 239000010425 asbestos Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/286—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an organic material, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/145—Carbon only, e.g. carbon black, graphite
Landscapes
- Carbon And Carbon Compounds (AREA)
Abstract
The invention discloses a high-tenacity carbon crystal heating plate. A preparation method of the high-tenacity carbon crystal heating plate comprises the steps of firstly fixing a copper bar onto the front of an epoxy resin plate in a hot-pressing manner, wherein one end of the copper bar extends to the exterior of the epoxy resin plate; then coating graphite carbon on the front of the epoxy resin plate and drying the coated graphite carbon, wherein the other end of the copper bar is wrapped in graphite carbon paste; and finally, performing plastic packaging to obtain the high-tenacity carbon crystal heating plate. The high-tenacity carbon crystal heating plate has good tenacity, stable heating performance, simple preparation process and strong applicability.
Description
Technical field
The present invention relates to carbon crystal heating panel is and in particular to high tenacity carbon crystal heating panel and preparation method thereof.
Background technology
Carbon crystal heating panel is to add far infrared transmission agent and the warm agent of limit etc. in microcrystal grain, with special process and preparation
Fabrication techniques form.Be applied to domestic heating, office building heating, school dormitory's office building, StoreFront heating, central heating auxiliary adopt
Warm, chess and card room, hospital, hotel, hotel, bath center, greenhouse booth thermal insulation, warehouse insulation etc..In addition, carbon crystal heating panel
Can be additionally used in some smallclothes warmers in irregular shape or physiotherapeutic instrumentss, but require carbon crystal heating panel used concrete
Good tough performance, and traditional carbon crystal heating panel great majority are slab constructions and fragility is very much not bent.
Content of the invention
It is an object of the invention to provide a kind of high tenacity carbon crystal heating panel, this high tenacity carbon crystal heating panel has good tough
Property, and heating property is stable, preparation process is simple, strong applicability.
To achieve these goals, the invention provides the preparation method of high tenacity carbon crystal heating panel, including：First by copper bar
Hot pressing is fixed on the front of epoxy resin board and one end of copper bar extends to the outside of described epoxy resin board；Then by graphite
Carbon slurry brushing and is dried on the front of epoxy resin board；And the other end of copper bar is coated in graphitic carbon slurry；Finally moulded
Envelope obtains high tenacity carbon crystal heating panel；
Wherein, graphitic carbon slurry allocates system by electrically conductive graphite powder, glass dust, zinc powder, terpineol, ethyl cellulose and sodium silicate
?；With respect to the electrically conductive graphite powder of 100 weight portions, the consumption of glass dust is 10-20 weight portion, and the consumption of zinc powder is 20-30 weight
Amount part, the consumption of terpineol is 15-20 weight portion, and the consumption of ethyl cellulose is 5-10 weight portion, and the consumption of sodium silicate is 1-5
Weight portion.
In the present invention, epoxy resin board is prepared by following methods：First by novolac epoxy resin, polyimide resin,
Asbestos, ethylene glycol, alcohol ester 12, dibutyl phthalate, dimethyl siloxane and water mixing, are then carried out at heat
Reason, last compression molding epoxy resin board；
Wherein, with respect to the novolac epoxy resin of 100 weight portions, the consumption of polyimide resin is 50-80 weight portion, second
The consumption of glycol ether is 1-5 weight portion, and the consumption of alcohol ester 12 is 1-5 weight portion, and the consumption of dibutyl phthalate is
1-3 measures part, and the consumption of dimethyl siloxane measures part for 1-3, and the consumption of water is 80-150 weight portion.
Preferably, the weight average molecular weight of novolac epoxy resin be 2-4 ten thousand, polyimide resin weight average molecular weight be 3-5
Ten thousand.
Preferably, described mixing is carried out by the way of stirring, and the rotating speed of described stirring is 2000-3000rpm, stirring
Time is 1-2h.
Preferably, the temperature of described heat treatment is 180-200 DEG C, and the time of heat treatment is 0.5-1.5h.
Preferably, described compression molding temperature be 170-175 DEG C.
Preferably, the fixing temperature of described hot pressing is 170-175 DEG C, and hot pressing regular time is 3-4h, and hot pressing is fixed
Pressure is 13-14MPa.
Preferably, the temperature of described drying is 175-180 DEG C, and the time of drying is 0.3-0.8h.
Preferably, the degree of described graphite linings is 0.2-0.4mm.
Present invention also offers a kind of high tenacity carbon crystal heating panel being obtained by above-mentioned preparation method.
By technique scheme, the present invention passes through will be by electrically conductive graphite powder, glass dust, zinc powder, terpineol, ethyl cellulose
Element and sodium silicate allocate the graphite slurry being obtained as the graphite linings of carbon crystal heating panel, improve making of high tenacity carbon crystal heating panel
Use safety.Meanwhile, select with by novolac epoxy resin, polyimide resin, ethylene glycol, alcohol ester 12 (i.e. 2,2,4-
Trimethyl -1,3- pentanediol mono isobutyrate), dibutyl phthalate, dimethyl siloxane and water mixing, then carry out heat
Process, last compression molding epoxy resin board, as support plate, finally carries out plastic packaging and obtains high tenacity carbon crystal heating panel.Wherein,
Select novolac epoxy resin in the preparation of resin plate as main resin raw material, substantially increase high tenacity carbon crystal heating panel
Heat resistance, be simultaneously introduced asbestos, ethylene glycol, alcohol ester 12, dibutyl phthalate, dimethyl siloxane etc.
Auxiliary agent increased the thermostability of high tenacity carbon crystal heating panel and tough performance.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Specific embodiment
Hereinafter the specific embodiment of the present invention is described in detail.It should be appreciated that it is described herein concrete
Embodiment is merely to illustrate and explains the present invention, is not limited to the present invention.
Hereinafter will be described the present invention by embodiment.
Preparation example 1
The preparation of graphitic carbon slurry：By electrically conductive graphite powder, glass dust, zinc powder, terpineol, ethyl cellulose and sodium silicate according to
Weight proportion is 100：10：20：15：5：2 mixing preparations are obtained.
Preparation example 2
The preparation of graphitic carbon slurry：By electrically conductive graphite powder, glass dust, zinc powder, terpineol, ethyl cellulose and sodium silicate according to
Weight proportion is 100：20：30：20：10：5 mixing preparations are obtained.
Preparation example 3
The preparation of epoxy resin board：First by novolac epoxy resin (weight average molecular weight is 20,000), polyimide resin (weight average
Molecular weight is 30,000), ethylene glycol, alcohol ester 12, dibutyl phthalate, dimethyl siloxane and water joins according to weight
Than for 100：55：1：1：1：1：85 stir 2h heat treatment 0.5h followed by 200 DEG C under rotating speed is for 2000rpm, finally exist
Compression molding epoxy resin board at 175 DEG C.
Preparation example 4
The preparation of epoxy resin board：First by novolac epoxy resin (weight average molecular weight is 30,000), polyimide resin (weight average
Molecular weight is 40,000), ethylene glycol, alcohol ester 12, dibutyl phthalate, dimethyl siloxane and water joins according to weight
Than for 100：70：3：3：2：3：125 stir 2h heat treatment 1.0h followed by 190 DEG C under rotating speed is for 2500rpm, finally exist
Compression molding epoxy resin board at 170 DEG C.
Preparation example 5
The preparation of epoxy resin board：First by novolac epoxy resin (weight average molecular weight is 40,000), polyimide resin (weight average
Molecular weight is 50,000), ethylene glycol, alcohol ester 12, dibutyl phthalate, dimethyl siloxane and water joins according to weight
Than for 100：80：5：5：3：3：150 stir 1h heat treatment 1.5h followed by 180 DEG C under rotating speed is for 3000rpm, finally exist
Compression molding epoxy resin board at 175 DEG C.
Embodiment 1
First by copper bar the pressure of 13MPa, at 175 DEG C the fixing 3h of hot pressing be fixed on the front of epoxy resin board and described
One end of copper bar extends to the outside of the epoxy resin board being obtained by preparation example 3；Then graphitic carbon slurry will be obtained by preparation example 1 to apply
Brush dries 0.8h on the front of described epoxy resin board and at 175 DEG C, and the graphite linings thickness obtaining after drying is 0.3mm；
The other end of copper bar is coated in described graphitic carbon slurry；Finally carry out plastic packaging and obtain high tenacity carbon crystal heating panel A1.
Embodiment 2
First by copper bar the pressure of 14MPa, at 170 DEG C the fixing 4h of hot pressing be fixed on the front of epoxy resin board and described
One end of copper bar extends to the outside of the epoxy resin board being obtained by preparation example 4；Then graphitic carbon slurry will be obtained by preparation example 2 to apply
Brush dries 0.8h on the front of described epoxy resin board and at 175 DEG C, and the graphite linings thickness obtaining after drying is 0.4mm；
The other end of copper bar is coated in described graphitic carbon slurry；Finally carry out plastic packaging and obtain high tenacity carbon crystal heating panel A2.
Embodiment 3
First by copper bar the pressure of 14MPa, at 175 DEG C the fixing 4h of hot pressing be fixed on the front of epoxy resin board and described
One end of copper bar extends to the outside of the epoxy resin board being obtained by preparation example 5；Then graphitic carbon slurry will be obtained by preparation example 2 to apply
Brush dries 0.3h on the front of described epoxy resin board and at 180 DEG C, and the graphite linings thickness obtaining after drying is 0.4mm；
The other end of copper bar is coated in described graphitic carbon slurry；Finally carry out plastic packaging and obtain high tenacity carbon crystal heating panel A3.
Detection example 1
Performance test is carried out by the high tenacity carbon crystal heating panel A1-A3 that embodiment is obtained, finds the arc of curvature of A1-A3
Spend appearance of no rupturing when being less than 80 degree more than 30 degree, and the resistance value of heating board does not change, and has no abnormal sound during bending.And
Its performance test in -60 DEG C and 150 DEG C shows that the resistance change rate of A1-A3 is below 4%.The surface temperature uniformity is surveyed
Test result shows that the temperature difference on its surface is less than 5 DEG C.It can be seen that the high tenacity carbon crystal heating panel that the present invention provides have good tough
Performance, and using safety coefficient height and generate heat stable.
The preferred embodiment of the present invention described in detail above, but, the present invention is not limited in above-mentioned embodiment
Detail, in the range of the technology design of the present invention, multiple simple variant can be carried out to technical scheme, this
A little simple variant belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned specific embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to various can
The compound mode of energy no longer separately illustrates.
Additionally, combination in any can also be carried out between the various different embodiment of the present invention, as long as it is without prejudice to this
The thought of invention, it equally should be considered as content disclosed in this invention.
Claims (10)
1. a kind of preparation method of high tenacity carbon crystal heating panel is it is characterised in that described preparation method includes：First by copper bar hot pressing
It is fixed on the front of epoxy resin board and one end of described copper bar extends to the outside of described epoxy resin board；Then by graphite
Carbon slurry brushing and is dried on the front of described epoxy resin board；And the other end of described copper bar is coated on described graphitic carbon slurry
Interior；Finally carry out plastic packaging and obtain high tenacity carbon crystal heating panel；
Wherein, described graphitic carbon slurry allocates system by electrically conductive graphite powder, glass dust, zinc powder, terpineol, ethyl cellulose and sodium silicate
?；With respect to the electrically conductive graphite powder of 100 weight portions, the consumption of described glass dust is 10-20 weight portion, and the consumption of described zinc powder is
20-30 weight portion, the consumption of described terpineol is 15-20 weight portion, and the consumption of described ethyl cellulose is 5-10 weight portion, institute
The consumption stating sodium silicate is 1-5 weight portion.
2. preparation method according to claim 1, wherein, described epoxy resin board is prepared by following methods：First will
Novolac epoxy resin, polyimide resin, ethylene glycol, alcohol ester 12, dibutyl phthalate, dimethyl siloxane and
Water mixes, and then carries out heat treatment, last compression molding epoxy resin board；
Wherein, with respect to the novolac epoxy resin of 100 weight portions, the consumption of described polyimide resin is 50-80 weight portion, institute
The consumption stating ethylene glycol is 1-5 weight portion, and the consumption of described alcohol ester 12 is 1-5 weight portion, described phthalic acid two
The consumption of butyl ester measures part for 1-3, and the consumption of described dimethyl siloxane measures part for 1-3, and the consumption of described water is 80-150 weight
Part.
3. preparation method according to claim 1, wherein, the weight average molecular weight of described novolac epoxy resin is 2-4 ten thousand, gathers
The weight average molecular weight of imide resin is 3-5 ten thousand.
4. preparation method according to claim 1, wherein, described mixing is carried out by the way of stirring, described stirring
Rotating speed is 2000-3000rpm, and the time of stirring is 1-2h.
5. the preparation method according to any one in claim 1-4, wherein, the temperature of described heat treatment is 180-200
DEG C, the time of heat treatment is 0.5-1.5h.
6. preparation method according to claim 5, wherein, described compression molding temperature be 170-175 DEG C.
7. preparation method according to claim 6, wherein, the fixing temperature of described hot pressing is 170-175 DEG C, and hot pressing is fixed
Time be 3-4h, the fixing pressure of hot pressing is 13-14MPa.
8. preparation method according to claim 7, wherein, the temperature of described drying is 175-180 DEG C, and the time of drying is
0.3-0.8h.
9. preparation method according to claim 8, wherein, the degree of described graphite linings is 0.2-0.4mm.
10. a kind of high tenacity carbon crystal heating panel is it is characterised in that described high tenacity carbon crystal heating panel is appointed by claim 1-9
Preparation method described in meaning one is prepared from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610805812.2A CN106413145A (en) | 2016-09-07 | 2016-09-07 | High-tenacity carbon crystal heating plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610805812.2A CN106413145A (en) | 2016-09-07 | 2016-09-07 | High-tenacity carbon crystal heating plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106413145A true CN106413145A (en) | 2017-02-15 |
Family
ID=57999649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610805812.2A Pending CN106413145A (en) | 2016-09-07 | 2016-09-07 | High-tenacity carbon crystal heating plate and preparation method thereof |
Country Status (1)
| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0409393A2 (en) * | 1989-07-17 | 1991-01-23 | Metal Manufactures Limited | Heating mats |
| CN103596303A (en) * | 2013-10-22 | 2014-02-19 | 江苏博肯碳晶材料科技有限公司 | Preparation method for graphene carbon crystal polymeric heating plate |
| CN203675344U (en) * | 2014-01-20 | 2014-06-25 | 郭长奇 | Infrared carbon crystal electronic heating plate |
| CN204806512U (en) * | 2015-06-15 | 2015-11-25 | 郭长奇 | Brilliant and infrared wall paper mural painting that generates heat of carbon fiber of negative oxygen ion carbon |
| CN105702384A (en) * | 2016-03-24 | 2016-06-22 | 广州市尤特新材料有限公司 | Sintered high-heating paste and preparation method thereof |
-
2016
- 2016-09-07 CN CN201610805812.2A patent/CN106413145A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0409393A2 (en) * | 1989-07-17 | 1991-01-23 | Metal Manufactures Limited | Heating mats |
| CN103596303A (en) * | 2013-10-22 | 2014-02-19 | 江苏博肯碳晶材料科技有限公司 | Preparation method for graphene carbon crystal polymeric heating plate |
| CN203675344U (en) * | 2014-01-20 | 2014-06-25 | 郭长奇 | Infrared carbon crystal electronic heating plate |
| CN204806512U (en) * | 2015-06-15 | 2015-11-25 | 郭长奇 | Brilliant and infrared wall paper mural painting that generates heat of carbon fiber of negative oxygen ion carbon |
| CN105702384A (en) * | 2016-03-24 | 2016-06-22 | 广州市尤特新材料有限公司 | Sintered high-heating paste and preparation method thereof |
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Application publication date: 20170215 |