CN106404082A - High-temperature vortex-street stress-type conducting sensor with adhesive-free packaging - Google Patents
High-temperature vortex-street stress-type conducting sensor with adhesive-free packaging Download PDFInfo
- Publication number
- CN106404082A CN106404082A CN201610729066.3A CN201610729066A CN106404082A CN 106404082 A CN106404082 A CN 106404082A CN 201610729066 A CN201610729066 A CN 201610729066A CN 106404082 A CN106404082 A CN 106404082A
- Authority
- CN
- China
- Prior art keywords
- nickel
- stress
- disposed
- piezoelectric ceramics
- insulating ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 239000000919 ceramic Substances 0.000 claims abstract description 36
- 230000006835 compression Effects 0.000 claims abstract description 5
- 238000007906 compression Methods 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 25
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 8
- 229910052573 porcelain Inorganic materials 0.000 claims description 4
- 230000008878 coupling Effects 0.000 abstract description 4
- 238000010168 coupling process Methods 0.000 abstract description 4
- 238000005859 coupling reaction Methods 0.000 abstract description 4
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 abstract 5
- 229910001020 Au alloy Inorganic materials 0.000 abstract 4
- 239000003353 gold alloy Substances 0.000 abstract 4
- 239000000463 material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004153 renaturation Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
- G01F1/20—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow
- G01F1/32—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow using swirl flowmeters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F15/00—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus
- G01F15/006—Details of, or accessories for, apparatus of groups G01F1/00 - G01F13/00 insofar as such details or appliances are not adapted to particular types of such apparatus characterised by the use of a particular material, e.g. anti-corrosive material
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
A high-temperature vortex-street stress-type conducting sensor with adhesive-free packaging comprises a sensor shell body and a cantilever beam disposed on the bottom end of the shell body, wherein an insulating ceramic base is disposed above the cantilever beam inside the shell body; piezoelectric ceramics, an insulating ceramic sheet, and a compressing belleville spring are disposed successively on the insulating ceramic base from bottom to top; a nickel-gold alloy sheet is disposed between the piezoelectric ceramics and the insulating ceramic base; a signal ground wire is led out from the nickel-gold alloy sheet; a left nickel-gold alloy sheet and a right nickel-gold alloy sheet are disposed between the piezoelectric ceramics and the insulating ceramic sheet; a signal wire is led out from the left and right nickel-gold ally sheets respectively; and a belleville spring cap is disposed on the compressing belleville spring for fixation and compression of the belleville spring. Because of the adhesive-free packaging, expansion stress can be overcome effectively; effective electro-mechanical coupling is achieved; damage to the piezoelectric ceramics is avoided; and the structure is simple and compact.
Description
Technical field
Vortex-shedding meter can be used for all gas and low-viscosity (mobile) liquid, range ratio can exceed 400:1st, the linearity is good, heavy
The features such as renaturation error is extremely low, instrument coefficient is unrelated with fluid, in particular with the continuous innovation of technology, is constantly expanded using field
Big so as to become generally acknowledged, most development prospect " following " flow transducer.
Because the medium that industrial site uses is various, the temperature and pressure scope that medium uses also each not phase
With so that vortex street flowmeter sensor operating temperature range be -200 DEG C~400 DEG C between, due to traditional stress-type whirlpool
Street flow transducer carries out glue immersion type encapsulation using materials such as steel shell, glue, piezoelectric ceramics so that shell, glue, piezoelectricity are made pottery
The materials such as porcelain define an entirety, cannot exist with avoiding between various materials due to the difference of expansion rate aspect in use
Cause to produce each other stress, lead to the damage of piezoelectric ceramics, sensitivity fast-fading, or even reduce sensor and use the longevity
Life.
Content of the invention
The present invention is directed to the deficiency of present technology, there is provided one kind no glue encapsulation, effectively overcomes swelling stress, both achieved
Good mechanical-electric coupling, in turn ensure that piezoelectric ceramics from damage, simple, the compact no glue encapsulation high temperature vortex street stress-type of structure
Conduction sensor.
For realizing the object of the invention, there is provided technical scheme below:No glue encapsulation high temperature vortex street stress-type conduction sensor,
Including sensor housing, housing bottom cantilever beam it is characterised in that being provided with insulating ceramics base above housing internal cantilever beam,
Piezoelectric ceramics, insulating ceramic film, compression butterfly spring, piezoelectric ceramics and insulation pottery are disposed with from the bottom up on insulating ceramics base
It is provided with a nickel billon piece between porcelain base, a nickel billon piece is drawn a signal ground, piezoelectric ceramics and insulating ceramics
It is provided with left and right two panels nickel billon piece between piece, left and right two panels nickel billon piece draws a holding wire respectively, compress butterfly spring
Upper setting disc spring cap is fixed and compresses butterfly spring.
Preferably, compression butterfly spring is high temperature disc spring.
Beneficial effect of the present invention:The present invention adopts gold-plated Ni-based stress conduction technique, and folds spring encapsulation skill using high temperature
Art, so that each junction point leaves gap, is fitted close again, had both achieved good mechanical-electric coupling, and in turn ensure that piezoelectric ceramics was exempted from
Damaged, structure is simple, compact.Improve the high-temperature adaptability of vortex-shedding meter, enhance the stability of vortex-shedding meter.
Brief description
Fig. 1 is the structural representation of the present invention.
Specific embodiment
No glue encapsulation high temperature vortex street stress-type conduction sensor, including the cantilever beam 2 of sensor housing 1, housing 1 bottom,
It is provided with insulating ceramics base 3 above housing 1 internal cantilever beam 2, insulating ceramics base 3 is disposed with piezoelectricity pottery from the bottom up
Porcelain 4, insulating ceramic film 5, high temperature disc spring 6, are provided with a nickel billon piece 7, a nickel between piezoelectric ceramics 4 and insulating ceramics base 3
Draw a signal ground 8 on billon piece 7, between piezoelectric ceramics 4 and insulating ceramic film 5, be provided with left and right two panels nickel billon
Piece 7, left and right two panels nickel billon piece 7 draws a holding wire 9 respectively, in high temperature disc spring 6 setting disc spring cap 10 be fixed and
Crimping high temperature disc spring 6.So both achieved good mechanical-electric coupling, in turn ensure that piezoelectric ceramics in various environment from damage,
Ensure that piezoelectric ceramic energy is accurately converted into the signal of telecommunication vortex street force signal, changed for vortex street sensor mainboard and process,
Meet the needs of each user.
Claims (2)
1. no glue encapsulates high temperature vortex street stress-type conduction sensor, including the cantilever beam of sensor housing, housing bottom, its feature
It is above housing internal cantilever beam to be provided with insulating ceramics base, insulating ceramics base is disposed with piezoelectricity pottery from the bottom up
Porcelain, insulating ceramic film, compression butterfly spring, are provided with a nickel billon piece, a nickel billon between piezoelectric ceramics and insulating ceramics base
Draw a signal ground on piece, between piezoelectric ceramics and insulating ceramic film, be provided with left and right two panels nickel billon piece, left and right two
Piece nickel billon piece draws a holding wire respectively, and in compression butterfly spring, setting disc spring cap is fixed and compresses butterfly spring.
2. no glue encapsulation high temperature vortex street stress-type conduction sensor according to claim 1 is it is characterised in that compress butterfly spring
For high temperature disc spring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610729066.3A CN106404082A (en) | 2016-08-26 | 2016-08-26 | High-temperature vortex-street stress-type conducting sensor with adhesive-free packaging |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610729066.3A CN106404082A (en) | 2016-08-26 | 2016-08-26 | High-temperature vortex-street stress-type conducting sensor with adhesive-free packaging |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106404082A true CN106404082A (en) | 2017-02-15 |
Family
ID=58004512
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610729066.3A Pending CN106404082A (en) | 2016-08-26 | 2016-08-26 | High-temperature vortex-street stress-type conducting sensor with adhesive-free packaging |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106404082A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110206552A (en) * | 2019-06-21 | 2019-09-06 | 中国电建集团成都勘测设计研究院有限公司 | Pressure sensitive system for rock tunnel(ling) machine shield body |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06258165A (en) * | 1993-03-09 | 1994-09-16 | Ngk Spark Plug Co Ltd | Piezoelectric sensor |
JPH11258016A (en) * | 1998-03-13 | 1999-09-24 | Yokogawa Electric Corp | Vortex flow meter |
CN1335488A (en) * | 2001-09-17 | 2002-02-13 | 陈宝荣 | Novel vortex street flowmeter sensor |
JP2002214006A (en) * | 2001-01-19 | 2002-07-31 | Yokogawa Electric Corp | Vortex flowmeter |
CN101334301A (en) * | 2008-06-24 | 2008-12-31 | 上海星空自动化仪表有限公司 | Vortex shedding flowmeter |
CN206056677U (en) * | 2016-08-26 | 2017-03-29 | 江苏伟屹电子有限公司 | High temperature vortex street stress-type conduction sensor is encapsulated without glue |
-
2016
- 2016-08-26 CN CN201610729066.3A patent/CN106404082A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06258165A (en) * | 1993-03-09 | 1994-09-16 | Ngk Spark Plug Co Ltd | Piezoelectric sensor |
JPH11258016A (en) * | 1998-03-13 | 1999-09-24 | Yokogawa Electric Corp | Vortex flow meter |
JP2002214006A (en) * | 2001-01-19 | 2002-07-31 | Yokogawa Electric Corp | Vortex flowmeter |
CN1335488A (en) * | 2001-09-17 | 2002-02-13 | 陈宝荣 | Novel vortex street flowmeter sensor |
CN101334301A (en) * | 2008-06-24 | 2008-12-31 | 上海星空自动化仪表有限公司 | Vortex shedding flowmeter |
CN206056677U (en) * | 2016-08-26 | 2017-03-29 | 江苏伟屹电子有限公司 | High temperature vortex street stress-type conduction sensor is encapsulated without glue |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110206552A (en) * | 2019-06-21 | 2019-09-06 | 中国电建集团成都勘测设计研究院有限公司 | Pressure sensitive system for rock tunnel(ling) machine shield body |
CN110206552B (en) * | 2019-06-21 | 2024-04-19 | 中国电建集团成都勘测设计研究院有限公司 | Pressure sensing system for shield body of tunnel boring machine |
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PB01 | Publication | ||
C10 | Entry into substantive examination | ||
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WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170215 |
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WD01 | Invention patent application deemed withdrawn after publication |